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Patent applications and USPTO patent grants for Cheng; S. J..The latest application filed is for "modularized probe head".
Patent | Date |
---|---|
Method for manufacturing probes of a probe card Grant 7,005,054 - Cheng , et al. February 28, 2 | 2006-02-28 |
Modularized probe head App 20050088190 - Cheng, S.J. ;   et al. | 2005-04-28 |
Method for fabricating anisotropic conductive substrate App 20050066521 - Cheng, S. J. ;   et al. | 2005-03-31 |
Method for fabricating wafer-level chip scale packages App 20050070049 - Cheng, S. J. ;   et al. | 2005-03-31 |
Modularized Probe Card With Coaxial Transmitters App 20040207420 - Cheng, S. J. ;   et al. | 2004-10-21 |
Method for manufacturing probes of a probe card App 20040035706 - Cheng, S. J. ;   et al. | 2004-02-26 |
Flip-chip type semiconductor device for reducing signal skew Grant 6,686,615 - Cheng , et al. February 3, 2 | 2004-02-03 |
Probe card with full wafer contact configuration App 20040012405 - Cheng, S. J. ;   et al. | 2004-01-22 |
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