Tseng; Yuan-Ping
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Yuan-Ping.The latest application filed is for "method for fabricating wafer-level chip scale packages".
- Tseng; Yuan-Ping - Hsinchu TW
- Tseng, Yuan-Ping - Chiunglin Shiang TW
| Patent | Date |
|---|---|
| Method for fabricating anisotropic conductive substrate Grant 7,140,101 - Cheng , et al. November 28, 2 | 2006-11-28 |
| Method for manufacturing probes of a probe card Grant 7,005,054 - Cheng , et al. February 28, 2 | 2006-02-28 |
| Method for fabricating anisotropic conductive substrate App 20050066521 - Cheng, S. J. ; et al. | 2005-03-31 |
| Method for fabricating wafer-level chip scale packages App 20050070049 - Cheng, S. J. ; et al. | 2005-03-31 |
| Probe card assembly Grant 6,853,205 - Cheng , et al. February 8, 2 | 2005-02-08 |
| Probe Card Assembly App 20050012513 - Cheng, Shih-Jye ; et al. | 2005-01-20 |
| Manufacturing process of memory module with direct die-attachment App 20050014308 - Tseng, Yuan-Ping ; et al. | 2005-01-20 |
| Modularized probe card with coaxial transmitters Grant 6,812,720 - Cheng , et al. November 2, 2 | 2004-11-02 |
| Modularized Probe Card With Coaxial Transmitters App 20040207420 - Cheng, S. J. ; et al. | 2004-10-21 |
| Modularized probe card with compressible electrical connection device Grant 6,781,392 - Cheng , et al. August 24, 2 | 2004-08-24 |
| Method and system for performing memory repair analysis Grant 6,751,760 - Tseng , et al. June 15, 2 | 2004-06-15 |
| Method for manufacturing probes of a probe card App 20040035706 - Cheng, S. J. ; et al. | 2004-02-26 |
| Flip-chip type semiconductor device for reducing signal skew Grant 6,686,615 - Cheng , et al. February 3, 2 | 2004-02-03 |
| Probe card with full wafer contact configuration App 20040012405 - Cheng, S. J. ; et al. | 2004-01-22 |
| Modular probe card assembly Grant 6,621,710 - Cheng , et al. September 16, 2 | 2003-09-16 |
| Wafer level packaging for making flip-chips Grant 6,605,480 - Liu , et al. August 12, 2 | 2003-08-12 |
| Wafer Level Packaging For Making Flip-chips App 20030098494 - Liu, An-Hong ; et al. | 2003-05-29 |
| System and method for avoiding waiting repair analysis for semiconductor testing equipment App 20030101388 - Tseng, Yuan-Ping ; et al. | 2003-05-29 |
| Method and system for performing memory repair analysis App 20030097626 - Tseng, Yuan-Ping ; et al. | 2003-05-22 |
| Semiconductor Wafer Designed To Avoid Probed Marks While Testing App 20020180026 - Liu, An-Hong ; et al. | 2002-12-05 |
| Manufacturing process of semiconductor devices Grant 6,395,622 - Liu , et al. May 28, 2 | 2002-05-28 |
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