U.S. patent application number 10/442129 was filed with the patent office on 2003-10-30 for system and method of laser sintering dies and dies sintered by laser sintering.
This patent application is currently assigned to Chipbond Technology Corporation. Invention is credited to Hwan, Lu-Chen, Yiu, Dang-Cheng.
Application Number | 20030203209 10/442129 |
Document ID | / |
Family ID | 21678706 |
Filed Date | 2003-10-30 |
United States Patent
Application |
20030203209 |
Kind Code |
A1 |
Hwan, Lu-Chen ; et
al. |
October 30, 2003 |
System and method of laser sintering dies and dies sintered by
laser sintering
Abstract
A laser sintering system is provided for sintering a die having
a serrate edge. The laser sintering system comprises a laser
generator for generating a laser beam and a movable carriage for
carrying said die. The laser beam sinters the serrate edge of said
die into a smooth edge. A method of sintering a die, the die having
a serrate edge, comprises the following steps of providing a die
and using a laser beam sintering the serrate edge of said die into
a smooth edge. A die has a smooth edge sintered by a laser
beam.
Inventors: |
Hwan, Lu-Chen; (Hsinchu,
TW) ; Yiu, Dang-Cheng; (Hsinchu, TW) |
Correspondence
Address: |
NIXON PEABODY, LLP
8180 GREENSBORO DRIVE
SUITE 800
MCLEAN
VA
22102
US
|
Assignee: |
Chipbond Technology
Corporation
Hsinchu
TW
|
Family ID: |
21678706 |
Appl. No.: |
10/442129 |
Filed: |
May 21, 2003 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10442129 |
May 21, 2003 |
|
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|
10103971 |
Mar 25, 2002 |
|
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6602762 |
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Current U.S.
Class: |
428/409 |
Current CPC
Class: |
B23K 26/3576 20180801;
Y10S 438/964 20130101; H01L 21/78 20130101; Y10T 428/31 20150115;
Y10S 438/974 20130101 |
Class at
Publication: |
428/409 |
International
Class: |
B32B 001/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 5, 2001 |
TW |
090116454 |
Claims
What is claimed is:
1. A die, said die having a smooth edge sintered by a laser
beam.
2. The die of claim 1, wherein said die having a first surface and
a second surface respectively having a coating layer.
3. The die of claim 1, wherein said laser beam is a CO.sub.2 laser
beam.
4. The die of claim 1, wherein said laser beam is a Nd-YAG laser
beam.
5. The die of claim 1, wherein said laser beam is an Excimer laser
beam.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a sintering system, a
method of sintering a die and a die. More particularly, the
invention relates to a laser sintering system, a method of using a
laser beam sintering a die and a die sintered by a laser beam.
[0003] 2. Description of the Prior Art
[0004] Generally, the semiconductor fabrication process could be
sketchily divided into wafer fabrication process, wafer probe
process, wafer packaging process and wafer test process. After
finishing the fabrication process and the probe process, the wafer
will undergo the wafer packaging process.
[0005] Before beginning the wafer packaging process, the wafer has
to be sawed into dies by saw equipment. The purpose of the process
is to separate the dies of the wafer. Using a die saw to saw the
wafer during the process would obtain the individual dies.
[0006] The die saw is elaborate equipment. Since the distance
between dies is quite small, usually about 2 mil, and the die is
quite brittle, the die needs to be separated from each other by a
diamond saw blade applying grinding procedure.
[0007] Due to the diamond saw blade during the wafer dicing
process, the edge of each sawed die becomes serrate. As shown in
FIGS. 1 to 3, the dies of prior art have serrate edges. The die 1
and die 2 have no coating layers on their first surface and second
surface: Die 3 and die 4 have coating layers on their first surface
and second surface. Since the integrated circuit fabricated by
wafers is made of silicon single crystal, the serrate cracks of the
dies 1,2,3,4 of prior art expand easily. These serrate cracks will
cause the damage of the integrated circuit and decrease the yield
of the product.
[0008] Therefore, there is a demand to provide a die having a
smooth edge avoiding the damage of the integrated circuit and
increasing the yield of the product. Furthermore, it is more
demanding to provide an apparatus and a method of smoothing the
surface of the die.
SUMMARY OF THE INVENTION
[0009] In view of the disadvantage of the die having a serrate edge
of the prior art, the present invention provides a die having a
smooth edge avoiding the cracks of the die and increasing the yield
of the back-end process. In order to provide a die having a smooth
edge, the present invention further provides a laser sintering
system and a laser sintering method of smoothing the edge of the
die.
[0010] An object of the present invention is to provide a system
smoothing the edge of a die. For this purpose, the present
invention provides a laser sintering system of smoothing a serrate
edge of a die. The laser sintering system comprises a laser
generator for generating a laser beam and a movable carriage for
carrying the die. The laser beam sinters the serrate edges of the
dies into smooth edges.
[0011] In accordance with an embodiment of the laser sintering
system of the present invention, the first surface and the second
surface of the die respectively have a coating layer.
[0012] In accordance with an embodiment of the laser sintering
system of the present invention, the laser beam is a CO.sub.2 laser
beam, a Nd-YAG laser or an Excimer laser beam.
[0013] In accordance with an embodiment of the laser sintering
system of the present invention, the laser sintering system further
comprises a laser control unit for transmitting the first signal to
the laser generator; a server engine for moving said carriage and a
computer controller. The computer controller transmits the second
signal to the laser control unit and the third signal to the servo
engine.
[0014] Another object of the present invention is to provide a
method of sintering a die having a serrate edge. The method
comprises the following steps: providing a die and using a laser
beam sintering the serrate edge of the die into smooth edges.
[0015] In accordance with an embodiment of the method of sintering
the die, the first surface and the second surface of the die
respectively have a coating layer.
[0016] In accordance with an embodiment of the method of sintering
the die, the laser beam is a CO.sub.2 laser beam, a Nd-YAG laser
beam or an Excimer laser.
[0017] Still another purpose of the present invention is to provide
a die having a smooth edge sintered by the laser beam.
[0018] In accordance with an embodiment of the die, the first
surface and the second surface of the die respectively have a
coating layer.
[0019] In accordance with an embodiment of the die, the laser beam
is a CO.sub.2 laser beam, a Nd-YAG laser beam or an Excimer
laser.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 shows the cross-section of the die of prior art.
[0021] FIG. 2 shows the top-view of the die of prior art.
[0022] FIG. 3 shows the cross-section of the die having coating
layers on its first surface and second surface of prior art.
[0023] FIG. 4 shows the laser sintering system of the present
invention.
[0024] FIG. 5 shows the cross-section of the die processed by the
laser sintering system and method of the present invention.
[0025] FIG. 6 shows the top-view of the die processed by the laser
sintering system and method of the present invention.
[0026] FIG. 7 shows the cross-section of the die having coating
layers on its first surface and second surface processed by the
laser sintering system and method of the present invention.
[0027] FIG. 8 shows the flowchart of the method of laser sintering
of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0028] The present invention provides a laser sintering system as
shown in FIG. 4. The laser sintering system includes a laser
generator 41, a carriage 42, a laser control unit 43, a servo
engine 44 and a computer controller 45.
[0029] As shown in FIG. 4, the computer controller 45 controls the
laser control unit 43 by transmitting a control signal "a" to the
laser control unit 43 through a signal line 451. The computer
controller 45 also controls the servo engine 44 by transmitting a
control signal "b" to the server engine 44 through a signal line
452. After receiving the control signal "a" from the computer
controller 45, the laser control unit 43 controls the generation of
the laser beam by transmitting a control signal "c" to the laser
generator 41 through a signal line 431. The servo engine 44
receives the control signal "b" form the computer controller 45 and
controls the movement of the carriage 42.
[0030] There is a plurality of dies 47 having serrate edges shown
in FIGS. 1 to 3 being put on the carriage 42. The servo engine 44
receiving the signal "b" from the computer controller 45 controls
the movement of the carriage 42. And the laser generator 41
receiving the control signal "c" form the laser control unit 43
generates a laser beam 46. Thus, the laser beam 46 sinters the
serrate edges of the plurality of the dies 47 into smooth edges,
shown in FIGS. 5 to 7.
[0031] The laser sintering system 40 of the present invention
sinters the dies 5, 6 without a coating layer on their first and
second surface as shown in FIGS. 5, 6. Further, the laser sintering
system 40 of the present invention sinters the dies 7, 8 with a
coating layer on their first and second surface as shown in FIGS.
7, 8.
[0032] Furthermore, the laser beam of the laser sintering system of
the present invention could be a CO.sub.2 laser beam, a Nd-YAG
laser beam or an Excimer laser beam.
[0033] As shown in FIGS. 5 to 7, the present invention provides a
die 5, 6, 7, 8, each having a smooth edge after the sinter process
by a laser beam.
[0034] As shown in FIG. 7, in accordance with an embodiment of the
present invention, the die 7, 8 have coating layers on their first
and second surface. Furthermore, in accordance with an embodiment
of the present invention, the laser beam is a CO.sub.2 laser beam,
a Nd-YAG laser beam or an Excimer laser beam.
[0035] After sintering the serrate edges of the dies 1, 2, 3, 4 by
the laser energy and high temperature, the present invention obtain
dies 5, 6, 7, 8 having smooth edges. The sinter process won't crack
the dies and increases the yield of the back-end process.
[0036] With reference to FIG. 8, the present invention provides a
method of sintering a die having a serrate edge. The present
invention first provides a die having serrate edges in the step 81.
In the step 82, the present invention uses a laser beam to sinter
the serrate edge into a smooth edge.
[0037] In accordance with an embodiment of the present invention,
the first surface and second surface of the die respectively have a
coating layer.
[0038] In accordance with an embodiment of the present invention,
the laser beam is a CO.sub.2 laser beam, a Nd-YAG laser beam or an
Excimer laser beam.
[0039] While this invention has been described with reference to an
illustrative embodiment, this embodiment is not intended to be
construed in a limiting sense. Various modifications of the
illustrative embodiment, as well as other embodiments of the
invention, will be apparent to persons skilled in the art upon
reference to this description. It is therefore contemplated that
the appended claims will cover any such modifications or
embodiments as fall within the true scope of the invention.
* * * * *