HWAN; Lu-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for HWAN; Lu-Chen.The latest application filed is for "light-emitting diode structure".

Company Profile

1.17.20

HWAN; Lu-Chen - Taoyuan County TW
Hwan; Lu-Chen - Taipei TW
HWAN; Lu-Chen - Zhongli City TW
Hwan; Lu-Chen - Taipei City TW
Hwan; Lu-Chen - Xinzhuang TW
Hwan; Lu-Chen - Xinzhuang City TW
Hwan, Lu-Chen - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting Diode Structure App 20190348589 - HWAN; Lu-Chen ; et al.	2019-11-14
Radio frequency identification tag Grant 9,136,585 - Hwan , et al. September 15, 2	2015-09-15
Light emitting diode and method of the same Grant 9,105,814 - Hwan August 11, 2	2015-08-11
Chip Element And Chip Package App 20150171041 - CHEN; Po Ching ; et al.	2015-06-18
Radio Frequency Identification Tag App 20130140368 - Hwan; Lu-Chen ; et al.	2013-06-06
Test module for radio frequency identification chips and method of the same Grant 8,344,734 - Hwan January 1, 2	2013-01-01
Integrated circuit package module and method of the same Grant 8,344,500 - Hwan , et al. January 1, 2	2013-01-01
Method for making cable with a conductive bump array, and method for connecting the cable to a task object Grant 7,999,191 - Hwan August 16, 2	2011-08-16
Package structure for integrated circuit device and method of the same Grant 7,943,426 - Hwan May 17, 2	2011-05-17
Method for manufacturing integrated circuit device having antenna conductors Grant 7,886,421 - Hwan , et al. February 15, 2	2011-02-15
Package Structure For Integrated Circuit Device And Method Of The Same App 20100267204 - Hwan; Lu-Chen ; et al.	2010-10-21
Method For Manufacturing Integrated Circuit Device Having Antenna Conductors App 20100229375 - Hwan; Lu-Chen ; et al.	2010-09-16
Package structure for integrated circuit device Grant 7,772,698 - Hwan , et al. August 10, 2	2010-08-10
Method for manufacturing integrated circuit device having antenna conductors Grant 7,698,805 - Hwan , et al. April 20, 2	2010-04-20
Test Module For Radio Frequency Identification Chips And Method Of The Same App 20100090707 - Hwan; Lu-Chen	2010-04-15
Light Emitting Diode And Method Of The Same App 20100012963 - Hwan; Lu-Chen	2010-01-21
Integrated Circuit Package Module And Method Of The Same App 20090294953 - Hwan; Lu-Chen ; et al.	2009-12-03
Package Structure For Integrated Circuit Device And Method Of The Same App 20090267230 - Hwan; Lu-Chen	2009-10-29
Packaging method for an electronic element Grant 7,459,345 - Hwan December 2, 2	2008-12-02
Package Structure For Integrated Circuit Device And Method Of The Same App 20080277785 - Hwan; Lu-Chen ; et al.	2008-11-13
Method for forming wiring on a substrate Grant 7,413,670 - Hwan August 19, 2	2008-08-19
Method For Manufacturing Integrated Circuit Device Having Antenna Conductors App 20080184550 - Hwan; Lu-Chen ; et al.	2008-08-07
Method For Making Cable With A Conductive Bump Array, And Method For Connecting The Cable To A Task Object App 20080066945 - Hwan; Lu-Chen	2008-03-20
Method for making cable with a conductive bump array, and method for connecting the cable to a task object Grant 7,312,142 - Hwan December 25, 2	2007-12-25
Wafer-level package and IC module assembly method for the wafer-level package Grant 7,273,768 - Hwan September 25, 2	2007-09-25
Wafer-level package and IC module assembly method for the wafer-level package App 20070048901 - Hwan; Lu-Chen	2007-03-01
Method for making cable with a conductive bump array, and method for connecting the cable to a task object App 20060234460 - Hwan; Lu-Chen	2006-10-19
Packaging method for an electronic element App 20060084191 - Hwan; Lu-Chen	2006-04-20
Method for forming wiring on a substrate App 20050284841 - Hwan, Lu-Chen	2005-12-29
Compound filled in lead IC packaging product Grant 6,940,183 - Hwan September 6, 2	2005-09-06
System and method of laser sintering dies and dies sintered by laser sintering App 20030203209 - Hwan, Lu-Chen ; et al.	2003-10-30
System and method of laser sintering dies and dies sintered by laser sintering Grant 6,602,762 - Hwan , et al. August 5, 2	2003-08-05
System and method of laser sintering dies and dies sintered by laser sintering App 20030008529 - Hwan, Lu-Chen ; et al.	2003-01-09
Metallized surface wafer level package structure App 20020180064 - Hwan, Lu-Chen ; et al.	2002-12-05

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