CHIPBOND TECHNOLOGY CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHIPBOND TECHNOLOGY CORPORATION.The latest application filed is for "flexible circuit board".
Company Profile
33.103.92
- CHIPBOND TECHNOLOGY CORPORATION - Hsinchu TW
- Chipbond Technology Corporation; - US
- Chipbond Technology Corporation; - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Flexible Circuit Board App 20220225496 - Sheu; Gwo-Shyan ; et al. | 2022-07-14 |
| Grounding Structure App 20220210899 - Chuang; Tzu-Long ; et al. | 2022-06-30 |
| Method of attaching heat sinks to a circuit tape Grant 11,350,518 - Lin , et al. May 31, 2 | 2022-05-31 |
| Flip chip interconnection and circuit board thereof Grant 11,322,437 - Ma , et al. May 3, 2 | 2022-05-03 |
| Layout structure of a flexible circuit board Grant 11,309,238 - Ma , et al. April 19, 2 | 2022-04-19 |
| Storage Device For Flexible Circuit Packages And Carrier Thereof App 20220110209 - Chang; Shih-Chieh ; et al. | 2022-04-07 |
| Layout Structure Of A Flexible Circuit Board App 20220104354 - Ma; Yu-Chen ; et al. | 2022-03-31 |
| Circuit Board Tape And Joining Method Thereof App 20220087017 - Lin; Yin-Chen ; et al. | 2022-03-17 |
| Semiconductor Package And Method Of Fabricating The Same App 20220037166 - Kuo; Chih-Ming ; et al. | 2022-02-03 |
| Layout Structure Of A Flexible Circuit Board App 20220037238 - Ma; Yu-Chen ; et al. | 2022-02-03 |
| Circuit board Grant 11,234,328 - Fan , et al. January 25, 2 | 2022-01-25 |
| Flexible circuit board Grant 11,206,735 - Lin , et al. December 21, 2 | 2021-12-21 |
| Flexible circuit board Grant 11,178,756 - Lin , et al. November 16, 2 | 2021-11-16 |
| Double-sided flexible circuit board and layout structure thereof Grant 11,177,206 - Lee , et al. November 16, 2 | 2021-11-16 |
| Storage container for electronic devices Grant 11,148,864 - Shih , et al. October 19, 2 | 2021-10-19 |
| Flip Chip Interconnection And Circuit Board Thereof App 20210265255 - Ma; Yu-Chen ; et al. | 2021-08-26 |
| Flexible Circuit Board App 20210267049 - Lin; Yin-Chen ; et al. | 2021-08-26 |
| Circuit Board App 20210267047 - Fan; Chia-En ; et al. | 2021-08-26 |
| Chip Package And Circuit Board Thereof App 20210257287 - Ma; Yu-Chen ; et al. | 2021-08-19 |
| Restriction device for preventing deformation of restriction plate of reel Grant 11,084,684 - Chang August 10, 2 | 2021-08-10 |
| Method And Device Of Heat Sink Attachment To A Circuit Tape App 20210227679 - Lin; Chia-Sung ; et al. | 2021-07-22 |
| Semiconductor device having 3D inductor and method of manufacturing the same Grant 11,056,555 - Shih , et al. July 6, 2 | 2021-07-06 |
| Flip Chip Interconnection And Circuit Board Thereof App 20210202422 - Ma; Yu-Chen ; et al. | 2021-07-01 |
| Flexible Circuit Board Having A Stiffening Structure App 20210204401 - Ma; Yu-Chen ; et al. | 2021-07-01 |
| Circuit Board App 20210185800 - Lien; Yi-Chen ; et al. | 2021-06-17 |
| Double-sided Flexible Circuit Board And Layout Structure Thereof App 20210159159 - Lee; Chun-Te ; et al. | 2021-05-27 |
| Circuit board Grant 10,999,928 - Ma , et al. May 4, 2 | 2021-05-04 |
| Chip package and circuit board thereof Grant 10,993,319 - Ma , et al. April 27, 2 | 2021-04-27 |
| Method And Device For Compression Bonding Chip To Substrate App 20210035947 - Hsieh; Chin-Tang ; et al. | 2021-02-04 |
| Surface Acoustic Wave Device And Method Of Manufacturing The Same App 20210013865 - Shih; Cheng-Hung ; et al. | 2021-01-14 |
| Circuit board having a predetermined punch area and sheet separated from the same Grant 10,880,993 - Lien , et al. December 29, 2 | 2020-12-29 |
| Electroplating system and pressure device thereof Grant 10,808,331 - Shih , et al. October 20, 2 | 2020-10-20 |
| Chip package and chip thereof Grant 10,797,213 - Hsieh , et al. October 6, 2 | 2020-10-06 |
| Semiconductor Device Having 3d Inductor And Method Of Manufacturing The Same App 20200295123 - Shih; Cheng-Hung ; et al. | 2020-09-17 |
| Semiconductor Device Having 3d Inductor And Method Of Manufacturing The Same App 20200266262 - Shih; Cheng-Hung ; et al. | 2020-08-20 |
| Restriction Device For Preventing Deformation Of Restriction Plate Of Reel App 20200231406 - Chang; Chung-Yi | 2020-07-23 |
| Method And Device For Compression Bonding Chip To Substrate App 20200105712 - Hsieh; Chin-Tang ; et al. | 2020-04-02 |
| Chip Package And Chip Thereof App 20200091385 - Hsieh; Chin-Tang ; et al. | 2020-03-19 |
| Chip on film package and flexible substrate thereof Grant 10,580,729 - Hsieh , et al. | 2020-03-03 |
| Semiconductor package and circuit substrate thereof Grant 10,504,828 - Hsieh Dec | 2019-12-10 |
| Semiconductor Package And Circuit Substrate Thereof App 20190279926 - Hsieh; Chin-Tang | 2019-09-12 |
| Chip On Film Package And Flexible Substrate Thereof App 20190252298 - Hsieh; Chin-Tang ; et al. | 2019-08-15 |
| Semiconductor Substrate And Processing Method Thereof App 20190252207 - Hsieh; Chin-Tang | 2019-08-15 |
| Semiconductor Device Having A Bump Structure And Method For Manufacturing The Same App 20190214357 - Lee; Chun-Te ; et al. | 2019-07-11 |
| Semiconductor package and circuit substrate thereof Grant 10340216 - | 2019-07-02 |
| Electroplating System And Pressure Device Thereof App 20190186037 - Shih; Cheng-Hung ; et al. | 2019-06-20 |
| Layout structure of flexible circuit board Grant 10,327,334 - Hsieh | 2019-06-18 |
| Wafer cassette Grant 10,242,899 - Kuo , et al. | 2019-03-26 |
| Chip package having a flexible substrate Grant 10,168,582 - Su , et al. J | 2019-01-01 |
| Wafer Cassette App 20180211860 - Kuo; Chien-Ming ; et al. | 2018-07-26 |
| Flexible substrate Grant 9,961,759 - Hsieh , et al. May 1, 2 | 2018-05-01 |
| Wafer Dicing Method App 20180090379 - Tu; Chia-Jung ; et al. | 2018-03-29 |
| Wafer dicing method Grant 9,929,051 - Tu , et al. March 27, 2 | 2018-03-27 |
| Heat dissipation package structure Grant 9,653,376 - Hsieh May 16, 2 | 2017-05-16 |
| Flexible Substrate App 20170019984 - Hsieh; Chin-Tang ; et al. | 2017-01-19 |
| Flexible substrate Grant 9,510,441 - Hsieh , et al. November 29, 2 | 2016-11-29 |
| Semiconductor package structure having hollow chamber and bottom substrate and package process thereof Grant 9,508,676 - Shih , et al. November 29, 2 | 2016-11-29 |
| Process For Manufacturing Semiconductor Package Having Hollow Chamber App 20160318756 - Shih; Cheng-Hung ; et al. | 2016-11-03 |
| Flexible Substrate App 20160234927 - Hsieh; Chin-Tang ; et al. | 2016-08-11 |
| Flexible substrate Grant 9,247,635 - Chen , et al. January 26, 2 | 2016-01-26 |
| Trace Structure Of Fine-pitch Pattern App 20160020166 - Hsieh; Yung-Wei ; et al. | 2016-01-21 |
| Method of photoresist strip Grant 9,230,823 - Shih , et al. January 5, 2 | 2016-01-05 |
| Flexible Substrate App 20150359085 - Chen; Yi-Wen ; et al. | 2015-12-10 |
| Substrate with bump structure and manufacturing method thereof Grant 9,177,830 - Wu , et al. November 3, 2 | 2015-11-03 |
| Semiconductor package structure and method for making the same Grant 9,159,660 - Hsieh , et al. October 13, 2 | 2015-10-13 |
| Semiconductor manufacturing method and semiconductor structure thereof Grant 9,059,260 - Kuo , et al. June 16, 2 | 2015-06-16 |
| Semiconductor structure Grant 9,000,569 - Hsieh , et al. April 7, 2 | 2015-04-07 |
| Semiconductor Structure App 20150091141 - Hsieh; Chin-Tang ; et al. | 2015-04-02 |
| Semiconductor structure Grant 8,981,536 - Hsieh , et al. March 17, 2 | 2015-03-17 |
| Semiconductor Structure App 20150069584 - Hsieh; Chin-Tang ; et al. | 2015-03-12 |
| Method for fabricating a carrier with a three dimensional inductor and structure thereof Grant 8,963,675 - Kuo , et al. February 24, 2 | 2015-02-24 |
| Semiconductor Manufacturing Process And Structure Thereof App 20140367856 - Shih; Cheng-Hung ; et al. | 2014-12-18 |
| Semiconductor manufacturing process and structure thereof Grant 8,877,629 - Shih , et al. November 4, 2 | 2014-11-04 |
| Bumping process and structure thereof Grant 8,841,767 - Hsieh , et al. September 23, 2 | 2014-09-23 |
| Semiconductor manufacturing method and semiconductor structure thereof Grant 8,823,169 - Kuo , et al. September 2, 2 | 2014-09-02 |
| Semiconductor Package Process And Structure Thereof App 20140217578 - Ho; Lung-Hua ; et al. | 2014-08-07 |
| Semiconductor structure Grant 8,796,824 - Hsieh , et al. August 5, 2 | 2014-08-05 |
| Carrier with three-dimensional capacitor Grant 8,772,644 - Kuo , et al. July 8, 2 | 2014-07-08 |
| Semiconductor Manufacturing Process And Structure Thereof App 20140159234 - Shih; Cheng-Hung ; et al. | 2014-06-12 |
| Semiconductor Manufacturing Method And Semiconductor Structure Thereof App 20140141606 - Kuo; Chih-Ming ; et al. | 2014-05-22 |
| Semiconductor Manufacturing Method, Semiconductor Structure And Package Structure Thereof App 20140120715 - Kuo; Chih-Ming ; et al. | 2014-05-01 |
| Semiconductor Manufacturing Method And Semiconductor Structure Thereof App 20140117540 - Kuo; Chih-Ming ; et al. | 2014-05-01 |
| Semiconductor package and lead frame thereof Grant 8,704,345 - Kuo , et al. April 22, 2 | 2014-04-22 |
| Semiconductor Structure App 20140097540 - Chiu; Hsiang-Chin ; et al. | 2014-04-10 |
| Pyramid bump structure Grant 8,692,390 - Wu , et al. April 8, 2 | 2014-04-08 |
| Tray cleaning apparatus for electronic components Grant 8,657,125 - Hsieh , et al. February 25, 2 | 2014-02-25 |
| Bumping process and structure thereof Grant 8,658,528 - Kuo , et al. February 25, 2 | 2014-02-25 |
| Semiconductor package structure and method for making the same Grant 8,658,466 - Hsieh , et al. February 25, 2 | 2014-02-25 |
| Semiconductor Manufacturing Method, Semiconductor Structure And Package Structure Thereof App 20140035125 - Kuo; Chih-Ming ; et al. | 2014-02-06 |
| Semiconductor Manufacturing Method And Semiconductor Structure Thereof App 20140035126 - Kuo; Chih-Ming ; et al. | 2014-02-06 |
| Semiconductor Package Structure And Method For Making The Same App 20140027905 - Hsieh; Chin-Tang ; et al. | 2014-01-30 |
| Semiconductor Manufacturing Method And Semiconductor Structure Thereof App 20140021601 - Kuo; Chih-Ming ; et al. | 2014-01-23 |
| Carrier With Three-dimensional Capacitor App 20140008111 - Kuo; Chih-Ming ; et al. | 2014-01-09 |
| Semiconductor Package And Lead Frame Thereof App 20130334671 - Kuo; Chih-Ming ; et al. | 2013-12-19 |
| Semiconductor Package Structure And Method For Making The Same App 20130334681 - Hsieh; Chin-Tang ; et al. | 2013-12-19 |
| Package structure and semiconductor structure thereof Grant 8,581,239 - Shih , et al. November 12, 2 | 2013-11-12 |
| Semiconductor package structure Grant 8,581,384 - Hsieh , et al. November 12, 2 | 2013-11-12 |
| Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130256882 - Shih; Cheng-Hung ; et al. | 2013-10-03 |
| Semiconductor Package Structure App 20130249070 - Hsieh; Chin-Tang ; et al. | 2013-09-26 |
| Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249089 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
| Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249081 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
| Semiconductor Packaging Method And Structure Thereof App 20130252374 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
| Method for manufacturing fine-pitch bumps and structure thereof Grant 8,530,344 - Shih , et al. September 10, 2 | 2013-09-10 |
| Semiconductor Packaging Method And Structure Thereof App 20130214407 - Shih; Cheng-Hung ; et al. | 2013-08-22 |
| Bumping Process And Structure Thereof App 20130213702 - Hsieh; Chin-Tang ; et al. | 2013-08-22 |
| Semiconductor Packaging Method And Structure Thereof App 20130214419 - Shih; Cheng-Hung ; et al. | 2013-08-22 |
| Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof Grant 8,513,772 - Kuo , et al. August 20, 2 | 2013-08-20 |
| Method for manufacturing fine-pitch bumps and structure thereof Grant 8,501,614 - Shih , et al. August 6, 2 | 2013-08-06 |
| Bumping Process And Structure Thereof App 20130193570 - Kuo; Chih-Ming ; et al. | 2013-08-01 |
| Bumping Process And Structure Thereof App 20130196498 - Kuo; Chih-Ming ; et al. | 2013-08-01 |
| Thin flip chip package structure Grant 8,497,571 - Hsieh , et al. July 30, 2 | 2013-07-30 |
| Semiconductor packaging method and structure thereof Grant 8,497,579 - Shih , et al. July 30, 2 | 2013-07-30 |
| Package Structure And Semiconductor Structure Thereof App 20130187265 - Shih; Cheng-Hung ; et al. | 2013-07-25 |
| Bumping Process And Structure Thereof App 20130181346 - Kuo; Chih-Ming ; et al. | 2013-07-18 |
| Bumping Process App 20130183823 - Kuo; Chih-Ming ; et al. | 2013-07-18 |
| Substrate structure with compliant bump and manufacturing method thereof Grant 8,476,159 - Hsieh July 2, 2 | 2013-07-02 |
| Bumping process and structure thereof Grant 8,450,203 - Hsieh , et al. May 28, 2 | 2013-05-28 |
| Process for forming an anti-oxidant metal layer on an electronic device Grant 8,450,049 - Kuo , et al. May 28, 2 | 2013-05-28 |
| Method For Fabricating A Three-dimensional Inductor Carrier With Metal Core And Structure Thereof App 20130127578 - Kuo; Chih-Ming ; et al. | 2013-05-23 |
| Bump structure and process of manufacturing the same Grant 8,437,142 - Shih , et al. May 7, 2 | 2013-05-07 |
| Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof Grant 8,432,017 - Kuo , et al. April 30, 2 | 2013-04-30 |
| Substrate structure with compliant bump and manufacturing method thereof Grant 8,426,984 - Hsieh April 23, 2 | 2013-04-23 |
| Bumping process and structure thereof Grant 8,415,243 - Kuo , et al. April 9, 2 | 2013-04-09 |
| Method For Fabricating A Three-dimensional Inductor Carrier With Metal Core And Structure Thereof App 20130075860 - Kuo; Chih-Ming ; et al. | 2013-03-28 |
| Substrate Structure With Compliant Bump And Manufacturing Method Thereof App 20130062756 - Hsieh; Chin-Tang | 2013-03-14 |
| Substrate Structure With Compliant Bump And Manufacturing Method Thereof App 20130065388 - Hsieh; Chin-Tang | 2013-03-14 |
| Method For Fabricating A Carrier With A Three Dimensional Inductor And Structure Thereof App 20130027172 - Kuo; Chih-Ming ; et al. | 2013-01-31 |
| Bumping Process And Structure Thereof App 20130022830 - Hsieh; Chin-Tang ; et al. | 2013-01-24 |
| Method for fabricating a carrier with a three dimensional inductor Grant 8,347,490 - Kuo , et al. January 8, 2 | 2013-01-08 |
| Tray Cleaning Aparatus For Electronic Components App 20120312765 - Hsieh; Wen-I ; et al. | 2012-12-13 |
| Bump structure and process of manufacturing the same Grant 8,330,280 - Shih , et al. December 11, 2 | 2012-12-11 |
| Package, packaging method and substrate thereof for sliding type thin fingerprint sensor Grant 8,050,467 - Yang , et al. November 1, 2 | 2011-11-01 |
| Sliding type thin fingerprint sensor package Grant 7,953,257 - Chen , et al. May 31, 2 | 2011-05-31 |
| System and method of laser sintering dies and dies sintered by laser sintering App 20030203209 - Hwan, Lu-Chen ; et al. | 2003-10-30 |
| System and method of laser sintering dies and dies sintered by laser sintering Grant 6,602,762 - Hwan , et al. August 5, 2 | 2003-08-05 |
| System and method of laser sintering dies and dies sintered by laser sintering App 20030008529 - Hwan, Lu-Chen ; et al. | 2003-01-09 |
| Metallized surface wafer level package structure App 20020180064 - Hwan, Lu-Chen ; et al. | 2002-12-05 |
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