U.S. patent application number 10/330705 was filed with the patent office on 2003-06-26 for sample separating apparatus and method, and substrate manufacturing method.
Invention is credited to Ohmi, Kazuaki, Sakaguchi, Kiyofumi, Yanagita, Kazutaka.
Application Number | 20030116275 10/330705 |
Document ID | / |
Family ID | 26550466 |
Filed Date | 2003-06-26 |
United States Patent
Application |
20030116275 |
Kind Code |
A1 |
Yanagita, Kazutaka ; et
al. |
June 26, 2003 |
Sample separating apparatus and method, and substrate manufacturing
method
Abstract
This invention is to provide a technique of separating bonded
substrate stacks having porous layers at a high yield. A separating
apparatus (100) has a pair of substrate holding portions (270,
280). A bonded substrate stack (50) is sandwiched from upper and
lower sides and horizontally held by the substrate holding portions
(270, 280) and rotated. A jet is ejected from a nozzle (260) and
injected into the porous layer of the bonded substrate stack (50),
thereby separating the bonded substrate stack (50) into two
substrates at the porous layer. Another separating apparatus (5000)
has a pair of substrate holding portions (270, 280), a nozzle (260)
of rejecting a fluid to the porous layer of a bonded substrate
stack (50), and an abrupt operation prevention mechanism (4000) for
preventing the lower substrate holding portion (280) from abruptly
moving downward but allowing it to moderately move when separating
the bonded substrate stack (50).
Inventors: |
Yanagita, Kazutaka;
(Yokohama-shi, JP) ; Ohmi, Kazuaki; (Yokohama-shi,
JP) ; Sakaguchi, Kiyofumi; (Yokohama-shi,
JP) |
Correspondence
Address: |
MORGAN & FINNEGAN, L.L.P.
345 Park Avenue
New York
NY
10154-0053
US
|
Family ID: |
26550466 |
Appl. No.: |
10/330705 |
Filed: |
December 27, 2002 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10330705 |
Dec 27, 2002 |
|
|
|
09434740 |
Nov 5, 1999 |
|
|
|
6527031 |
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Current U.S.
Class: |
156/708 ;
156/757 |
Current CPC
Class: |
Y10T 83/364 20150401;
Y10T 156/1939 20150115; Y10T 156/1137 20150115; Y10T 29/49821
20150115; H01L 21/67092 20130101 |
Class at
Publication: |
156/344 ;
156/584 |
International
Class: |
B32B 035/00 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 6, 1998 |
JP |
10-316574 |
Sep 27, 1999 |
JP |
11-272987 |
Claims
What is claimed is:
1. A separating apparatus for separating a plate-like sample having
a separation layer at the separation layer, comprising: a holding
mechanism for holding the plate-like sample in a substantially
horizontal state while rotating the sample; and an ejection portion
for ejecting a fluid to the separation layer of the plate-like
sample held by said holding mechanism to separate the plate-like
sample at the separation layer by the fluid.
2. The apparatus according to claim 1, characterized in that said
holding mechanism comprises a pair of sample holding mechanisms for
holding the plate-like sample by sandwiching the sample from upper
and lower sides.
3. The apparatus according to claim 2, characterized in that said
pair of holding mechanisms have chuck mechanisms for chucking the
plate-like sample, respectively.
4. The apparatus according to claim 2, characterized in that said
pair of holding mechanisms have an application portion for applying
a press force to the plate-like sample in an axial direction, and
hold the plate-like sample to which the press force is being
applied by said application portion.
5. The apparatus according to claim 2, characterized in that said
pair of holding mechanisms have an application portion for applying
a force to the plate-like sample in an axial direction, and hold
the plate-like sample to which the force is being applied by said
application portion.
6. The apparatus according to claim 4, characterized in that said
application portion presses the plate-like sample in the axial
direction using a force of a spring.
7. The apparatus according to claim 4, characterized in that said
application portion presses the plate-like sample in the axial
direction using a force generated by a cylinder.
8. The apparatus according to claim 4, characterized in that said
application portion presses the plate-like sample in the axial
direction using pressure of a fluid.
9. The apparatus according to claim 2, characterized in that at
least one of said pair of sample holding mechanisms comprises a
Bernoulli chuck.
10. The apparatus according to claim 4, characterized in that said
application portion supplies a fluid to a surface of the plate-like
sample and applies the press force to the plate-like sample using
the fluid.
11. The apparatus according to claim 10, characterized in that the
fluid supplied to the surface of the plate-like sample by said
application portion is a liquid.
12. The apparatus according to claim 10, characterized in that the
fluid supplied to the plate-like sample by said application portion
is a gas.
13. The apparatus according to claim 4, characterized in that at
least one of said pair of sample holding mechanisms comprises a
holding member that comes into contact with the plate-like sample
to hold the plate-like sample, and said application portion applies
the press force to the plate-like sample via said holding
member.
14. The apparatus according to claim 13, characterized in that said
application portion presses said holding member using a fluid and
applies the press force to the plate-like sample via said holding
member.
15. The apparatus according to claim 14, characterized in that the
fluid supplied to said holding member by said application portion
is a liquid.
16. The apparatus according to claim 14, characterized in that the
fluid supplied to said holding member by said application portion
is a gas.
17. The apparatus according to claim 2, characterized in that at
least one of said pair of sample holding mechanisms comprises a
holding member that comes into contact with the plate-like sample
to hold the plate-like sample and a Bernoulli chuck for supporting
said holding member.
18. The apparatus according to claim 13, characterized in that said
application portion presses said holding member using a magnetic
force and applies the press force to the plate-like sample via said
holding member.
19. The apparatus according to claim 4, characterized in that said
application portion applies the press force to the plate-like
sample from a lower sample holding mechanism of said pair of sample
holding mechanisms while fixing a vertical position of an upper
sample holding mechanism.
20. The apparatus according to claim 4, characterized in that said
application portion applies the press force to the plate-like
sample from an upper sample holding mechanism of said pair of
sample holding mechanisms while fixing a vertical position of a
lower sample holding mechanism.
21. The apparatus according to claim 4, characterized in that said
application portion applies the press force to the plate-like
sample from both of said pair of sample holding mechanisms.
22. The apparatus according to claim 4, characterized in that said
application portion applies the press force to the plate-like
sample using a weight.
23. The apparatus according to claim 22, characterized in that said
application portion changes stepwise the force for pressing the
plate-like sample using a plurality of weights.
24. The apparatus according to claim 22, characterized in that said
application portion presses the plate-like sample with a relatively
small force when a portion near a periphery of the plate-like
sample is to be separated, and presses the plate-like sample with a
relatively large force when a portion near the center of the
plate-like sample is to be separated.
25. The apparatus according to claim 22, characterized in that said
application portion presses the plate-like sample with a relatively
small force at a first step of separation of the plate-like sample,
and presses the plate-like sample with a relatively large force at
a second step of separation of the plate-like sample.
26. The apparatus according to claim 22, characterized in that said
application portion presses the portion near the center of the
plate-like sample.
27. The apparatus according to claim 4, characterized in that said
application portion presses the plate-like sample with a relatively
small force when a portion near a periphery of the plate-like
sample is to be separated, and presses the plate-like sample with a
relatively large force when a portion near the center of the
plate-like sample is to be separated.
28. The apparatus according to claim 4, characterized in that said
application portion presses the plate-like sample with a relatively
small force at a first step of separation of the plate-like sample,
and presses the plate-like sample with a relatively large force at
a second step of separation of the plate-like sample.
29. The apparatus according to claim 4, characterized in that said
application portion presses the portion near the center of the
plate-like sample.
30. The apparatus according to claims 1, characterized in that said
holding mechanism has a structure capable of transferring/receiving
the plate-like sample to/from a conveyor mechanism for chucking a
surface of the plate-like sample to hold the sample.
31. The apparatus according to claim 13, characterized in that said
holding mechanism comprises a convex support portion for holding
the plate-like sample while forming a gap between a predetermined
portion of a surface of the plate-like sample and a predetermined
portion of a surface of said holding member.
32. The apparatus according to claim 1, characterized in that said
holding mechanism holds a substantially central portion of the
plate-like sample.
33. The apparatus according to claim 1, characterized in that said
holding mechanism comprises a sample holding mechanism for holding
one surface of the plate-like sample.
34. The apparatus according to claim 33, characterized in that said
sample holding mechanism comprises a chuck mechanism for chucking
the plate-like sample.
35. The apparatus according to claim 34, characterized in that said
chuck mechanism chucks a plurality of portions of the plate-like
sample.
36. The apparatus according to claim 34, characterized in that said
chuck mechanism chucks a peripheral portion of the plate-like
sample.
37. The apparatus according to claim 34, characterized in that said
chuck mechanism chucks the plate-like sample to warp the plate-like
sample.
38. The apparatus according to claim 34, characterized in that said
holding mechanism has a structure capable of exchanging the
plate-like sample with a conveyor mechanism for chucking a surface
of the plate-like sample to hold the sample.
39. The apparatus according to claim 35, characterized in that said
sample holding mechanism comprises a convex support portion at a
substantially central portion.
40. The apparatus according to claim 34, characterized in that said
chuck mechanism chucks the plate-like sample when a portion near a
periphery of the plate-like sample is to be separated, and does not
chuck the plate-like sample when a portion near the center of the
plate-like sample is to be separated.
41. The apparatus according to claim 34, characterized in that said
chuck mechanism chucks the plate-like sample at a first step of
separation of the plate-like sample, and does not chuck the
plate-like sample at a second step of separation of the plate-like
sample.
42. The apparatus according to claim 1, characterized in that said
holding mechanism comprises an edge portion support member for
supporting an edge portion of the plate-like sample.
43. The apparatus according to claim 1, characterized in that said
holding mechanism comprises a plurality of edge portion support
members for supporting an edge portion of the plate-like sample and
a rotation source for rotating at least one of said plurality of
edge portion support members, and the plate-like sample is rotated
by transmitting a rotational force from said rotated edge portion
support member to the plate-like sample.
44. The apparatus according to claim 42, characterized in that said
holding mechanism comprises a table for supporting said edge
portion support member, and a rotation source for rotating said
table, and the plate-like sample is rotated by rotating said
table.
45. The apparatus according to claim 42, characterized in that said
holding mechanism further comprises a convex support portion for
partially supporting a lower surface of the plate-like sample.
46. The apparatus according to claim 43, characterized in that said
holding mechanism further comprises a convex support portion for
partially supporting a lower surface of the plate-like sample, said
convex support portion being rotated together with the plate-like
sample placed on said support portion.
47. The apparatus according to claim 42, further comprising a
driving mechanism for driving said edge portion support member
toward the center or outer periphery of the plate-like sample, and
when the plate-like sample is to be held, said edge portion support
member is driven toward the center by said driving mechanism.
48. The apparatus according to claim 42, characterized in that each
of said plurality of edge portion support members has a shape
obtained by bonding bottom portions of two cones.
49. The apparatus according to claim 1, further comprising a
spacing mechanism for, after the plate-like sample is separated
into two samples, spacing the separated plate-like samples apart
from each other.
50. The apparatus according to claim 49, characterized in that said
spacing mechanism spaces the separated plate-like samples apart
substantially in the axial direction.
51. The apparatus according to claim 49, characterized in that said
spacing mechanism spaces the separated plate-like samples apart
substantially in a planar direction.
52. The apparatus according to claim 1, further comprising a
cleaning portion for cleaning the plate-like sample which is being
separated or the separated plate-like samples.
53. A separating apparatus for separating a plate-like sample
having a separation layer at the separation layer, comprising: a
holding mechanism for holding the plate-like sample in a
substantially horizontal state while rotating the sample; and an
ejection portion for ejecting a fluid to the separation layer of
the plate-like sample held by said holding mechanism to separate
the plate-like sample at the separation layer by the fluid.
54. The apparatus according to claim 53, further comprising a
scanning portion for scanning said ejection portion or the
plate-like sample in separating the plate-like sample.
55. The apparatus according to claim 53, further comprising a pivot
portion for pivoting said ejection portion about an axis parallel
to an axis of the plate-like sample.
56. The apparatus according to claim 1, characterized in that the
plate-like sample to be processed has a fragile layer as the
separation layer.
57. The apparatus according to claim 56, characterized in that the
fragile layer is a porous layer.
58. The apparatus according to claim 56, characterized in that the
fragile layer is a microcavity layer.
59. The apparatus according to claim 1, characterized in that the
plate-like sample to be processed is a semiconductor substrate.
60. The apparatus according to claim 1, characterized in that the
plate-like sample to be processed is formed by bonding a first
substrate and a second substrate and has a fragile layer as the
separation layer.
61. The apparatus according to claim 1, characterized in that the
plate-like sample to be processed is formed by forming a porous
layer on a surface of a first semiconductor substrate, forming an
unporous layer on the porous layer, and bonding a second substrate
to the unporous layer.
62. A separating system comprising: a separating apparatus of claim
1; and a conveyor robot for transferring a plate-like sample to
said separating apparatus in a substantially horizontal state and
receiving in the substantially horizontal state plate-like samples
separated by said separating apparatus.
63. The system according to claim 62, characterized in that said
conveyor robot transfers the plate-like sample while supporting the
sample from a lower side to said separating apparatus.
64. The system according to claim 62, characterized in that said
conveyor robot receives a lower plate-like sample of two separated
plate-like samples from said separating apparatus while supporting
the sample from the lower side.
65. The system according to claim 62, characterized in that said
conveyor robot receives an upper plate-like sample of the two
separated plate-like samples from said separating apparatus while
supporting the sample from an upper side.
66. The system according to claim 62, characterized in that said
system further comprises a centering apparatus for aligning the
center of the plate-like sample at a predetermined position, and
said conveyor robot receives the plate-like sample from said
centering apparatus and transfers the sample to said separating
apparatus.
67. The system according to claim 62, characterized in that said
system further comprises a turning apparatus for rotating the
plate-like sample through 180.degree. to turn the sample, and said
conveyor robot transfers the upper plate-like sample, separated by
said separating apparatus, to said turning apparatus in the
horizontal state.
68. The system according to claim 62, further comprising a
cleaning/drying apparatus for cleaning and drying the plate-like
samples separated by said separating apparatus.
69. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
holding the plate-like sample by a holding mechanism in a
substantially horizontal state; ejecting a fluid from an election
portion to the separation layer of the plate-like sample while
rotating the plate-like sample held by said holding mechanism to
separate the plate-like sample at the separation layer using the
fluid; and removing separated plate-like samples from said holding
mechanism.
70. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
pressing and holding the plate-like sample by a holding mechanism
in a substantially horizontal state; ejecting a fluid from an
election portion to the separation layer of the plate-like sample
held by said holding mechanism to separate the plate-like sample at
the separation layer using the fluid; and removing separated
plate-like samples from said holding mechanism.
71. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a separating apparatus of
claim 1 in a horizontal state; separating the plate-like sample by
said separating apparatus; and receiving separated plate-like
samples from said separating apparatus.
72. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a centering apparatus in a
horizontal state and aligning the center of the plate-like sample
at a predetermined position by said centering apparatus; receiving
the plate-like sample from said centering apparatus and
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; and receiving separated plate-like
samples from said separating apparatus.
73. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a centering apparatus in a
horizontal state and aligning the center of the plate-like sample
at a predetermined position by said centering apparatus; receiving
the plate-like sample from said centering apparatus and
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; receiving an upper substrate of two
separated plate-like samples from said separating apparatus,
transferring the substrate to a turning apparatus, and rotating the
plate-like sample through 180.degree. to turn the substrate by said
turning apparatus; receiving the plate-like sample from said
turning apparatus; and receiving a lower substrate of the two
separated plate-like samples from said separating apparatus.
74. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a centering apparatus in a
horizontal state and aligning the center of the plate-like sample
at a predetermined position by said centering apparatus; receiving
the plate-like sample from said centering apparatus and
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; receiving an upper substrate of two
separated plate-like samples from said separating apparatus,
transferring the substrate to a turning apparatus, and rotating the
plate-like sample through 180.degree. to turn the substrate by said
turning apparatus; receiving the plate-like sample from said
turning apparatus, transferring the sample to a cleaning/drying
apparatus, and cleaning and drying the sample by said
cleaning/drying apparatus; and receiving a lower substrate of the
two separated plate-like samples from said separating apparatus,
transferring the substrate to said cleaning/drying apparatus, and
cleaning and drying the substrate by said cleaning/drying
apparatus.
75. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; receiving an upper substrate of two
separated plate-like samples from said separating apparatus,
transferring the substrate to a turning apparatus, and rotating the
plate-like sample through 180.degree. to turn the substrate by said
turning apparatus; receiving the plate-like sample from said
turning apparatus; and receiving a lower substrate of the two
separated plate-like samples from said separating apparatus.
76. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; receiving an upper substrate of two
separated plate-like samples from said separating apparatus,
transferring the substrate to a turning apparatus, and rotating the
plate-like sample through 180.degree. to turn the substrate by said
turning apparatus; receiving the plate-like sample from said
turning apparatus, transferring the sample to a cleaning/drying
apparatus, and cleaning and drying the sample by said
cleaning/drying apparatus; and receiving a lower substrate of the
two separated plate-like samples from said separating apparatus,
transferring the substrate to said cleaning/drying apparatus, and
cleaning and drying the substrate by said cleaning/drying
apparatus.
77. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the steps of:
transferring the plate-like sample to a separating apparatus of
claim 1 in the horizontal state to separate the plate-like sample
by said separating apparatus; and transferring each of separated
plate-like samples to a cleaning/drying apparatus and cleaning and
drying the sample by said cleaning/drying apparatus.
78. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the step of:
ejecting a fluid to the separation layer of the plate-like sample
while holding and rotating the plate-like sample in a substantially
horizontal state to separate the plate-like sample at the
separation layer using the fluid.
79. A separating method of separating a plate-like sample having a
separation layer at the separation layer, comprising the step of:
ejecting a fluid to the separation layer of the plate-like sample
while pressing and holding the plate-like sample in a substantially
horizontal state to separate the plate-like sample at the
separation layer using the fluid.
80. A method of manufacturing a substrate, comprising: the
preparation step of bonding a first substrate having a fragile
layer to a second substrate to prepare a bonded substrate stack;
the separation step of separating the bonded substrate stack at the
fragile layer using a fluid; and the removal step of removing the
fragile layer remaining on the second substrate after the
separation step, wherein the separation step comprises ejecting the
fluid to the fragile layer of the bonded substrate stack while
holding and rotating the bonded substrate stack in a substantially
horizontal state to separate the bonded substrate stack at the
fragile layer using the fluid.
81. A method of manufacturing a substrate, comprising: the
preparation step of bonding a first substrate having a fragile
layer to a second substrate to prepare a bonded substrate stack;
the separation step of separating the bonded substrate stack at the
fragile layer using a fluid; and the removal step of removing the
fragile layer remaining on the second substrate after the
separation step, wherein the separation step comprises ejecting the
fluid to the fragile layer of the bonded substrate stack while
pressing and holding the bonded substrate stack in a substantially
horizontal state to separate the bonded substrate stack at the
fragile layer using the fluid.
82. A separating apparatus for separating a plate-like sample
having a separation layer at the separation layer, comprising: a
holding mechanism for holding the plate-like sample; an ejection
portion for ejecting a fluid to the plate-like sample held by said
holding mechanism to separate the plate-like sample at the
separation layer using the fluid; and an abrupt operation
prevention mechanism for preventing said holding mechanism from
abruptly moving due to a force of the fluid acting in the
plate-like sample while allowing said holding mechanism to
moderately move when separating the plate-like sample.
83. The apparatus according to claim 82, characterized in that said
abrupt operation prevention mechanism comprises a damper
mechanism.
84. The apparatus according to claim 82, further comprising a
rotating mechanism for rotating said holding mechanism about an
axis substantially perpendicular to a fluid ejection direction of
said ejection portion when separating the plate-like sample.
85. The apparatus according to claim 84, characterized in that said
abrupt operation prevention mechanism is coaxial with said holding
mechanism.
86. The apparatus according to claim 82, characterized in that said
holding mechanism comprises a pair of sample holding portions for
sandwiching and holding the plate-like sample, at least one of said
pair of sample holding portions can move in a direction
substantially perpendicular to the fluid ejection direction of said
ejection portion, and said abrupt operation prevention mechanism
prevents said movable sample holding portion from abrupt movement
while allowing said movable sample holding portion to moderately
move when separating the plate-like sample.
87. The apparatus according to claim 86, characterized in that said
abrupt operation prevention mechanism comprises a movable portion
which moves in contact with said movable sample holding portion,
and a reaction generation portion for generating a reaction against
a force applied from said movable sample holding portion to said
movable portion.
88. The apparatus according to claim 87, characterized in that said
movable portion smoothly moves.
89. The apparatus according to claim 87, characterized in that said
movable portion comprises a piston, said reaction generation
portion comprises a frame member constructing a pressure chamber
for causing pressure to act on said piston, and said frame member
has a channel for discharging a fluid from said pressure
chamber.
90. The apparatus according to claim 89, characterized in that said
abrupt operation prevention mechanism has a valve for controlling
the fluid flowing through the channel.
91. The apparatus according to claim 89, characterized in that said
abrupt operation prevention mechanism further comprises a restoring
mechanism for extending said piston retracted into said frame
member and simultaneously filling said pressure chamber with the
fluid when separating the plate-like sample.
92. The apparatus according to claim 91, characterized in that said
restoring mechanism has a spring, and said piston is extended by a
force of the spring to fill said pressure chamber with the
fluid.
93. The apparatus according to claim 91, characterized in that said
restoring mechanism comprises a filling mechanism for filing said
pressure chamber with the fluid, and said piston is extended by
filling said pressure chamber with the fluid by said filling
mechanism.
94. The apparatus according to claim 82, characterized in that said
holding mechanism further comprises a press mechanism for applying
a press force to the plate-like sample in a direction substantially
perpendicular to the fluid ejection direction of said ejection
portion when holding the plate-like sample.
95. The apparatus according to claim 82, characterized in that said
apparatus further comprises a driving portion for changing a
position where the fluid ejected from said ejection portion is
injected into the plate-like sample, and the plate-like sample is
separated while changing the position.
96. The apparatus according to claim 95, characterized in that said
driving portion comprises a motor for rotating the plate-like
sample about an axis substantially perpendicular to the fluid
ejection direction of said ejection portion.
97. The apparatus according to claim 82, characterized in that the
separation layer is a fragile layer.
98. The apparatus according to claim 97, characterized in that the
fragile layer is a porous layer.
99. The apparatus according to claim 97, characterized in that the
fragile layer is a microcavity layer.
100. The apparatus according to claim 82, characterized in that the
plate-like sample to be separated is a semiconductor substrate.
101. The apparatus according to claim 82, characterized in that the
plate-like sample to be separated is formed by bonding a first
substrate and a second substrate.
102. A separating method of ejecting a fluid to a separation layer
of a plate-like sample having the separation layer to separate the
plate-like sample at the separation layer, characterized by
comprising the step of: separating the plate-like sample while
preventing the plate-like sample from abruptly warping due to a
force of the fluid acting in the plate-like sample and allowing the
plate-like sample to moderately warp.
103. The method according to claim 102, characterized in that the
separation layer is a fragile layer.
104. The method according to claim 103, characterized in that the
fragile layer is a porous layer.
105. The method according to claim 103, characterized in that the
fragile layer is a microcavity layer.
106. The method according to claim 102, characterized in that the
plate-like sample to be separated is a semiconductor substrate.
107. The method according to claim 102, characterized in that the
plate-like sample to be separated is formed by bonding a first
substrate and a second substrate.
108. A method of manufacturing a substrate, comprising: the
preparation step of bonding a first substrate having a fragile
layer to a second substrate to prepare a bonded substrate stack;
the separation step of separating the bonded substrate stack at the
fragile layer using a fluid; and the removal step of removing the
fragile layer remaining on the second substrate after the
separation step, wherein the separation step comprises separating
the bonded substrate stack at the fragile layer while preventing
the bonded substrate stack from abruptly warping due to a force of
the fluid acting in the bonded substrate stack and allowing the
bonded substrate stack to moderately warp.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a sample separating
apparatus and method, and a substrate manufacturing method and,
more particularly, to a separating method and apparatus for
separating a plate-like sample having a separation layer at the
separation layer, and a substrate manufacturing method using the
method and apparatus.
[0003] 2. Description of the Related Art
[0004] A substrate (SOI substrate) having an SOI (Silicon On
Insulator) structure is known as a substrate having a
single-crystal Si layer on an insulating layer. A device using this
SOI substrate has many advantages that cannot be achieved by
ordinary Si substrates. Examples of the advantages are as
follows.
[0005] (1) The integration degree can be increased because
dielectric isolation is easy.
[0006] (2) The radiation resistance can be increased.
[0007] (3) The operating speed of the device can be increased
because the stray capacitance is small.
[0008] (4) No well step is necessary.
[0009] (5) Latch-up can be prevented.
[0010] (6) A complete depletion type field effect transistor can be
formed by thin film formation.
[0011] Since an SOI structure has the above various advantages,
researches have been made on its formation method for several
decades.
[0012] As one SOI technology, the SOS (Silicon On Sapphire)
technology by which Si is heteroepitaxially grown on a
single-crystal sapphire substrate by CVD (Chemical Vapor
Deposition) has been known for a long time. This SOS technology
once earned a reputation as the most matured SOI technology.
However, the SOS technology has not been put into practical use to
date because, e.g., a large amount of crystal defects are produced
by lattice mismatch in the interface between the Si layer and the
underlying sapphire substrate, aluminum that forms the sapphire
substrate mixes in the Si layer, the substrate is expensive, and it
is difficult to obtain a large area.
[0013] Various SOI technologies have appeared next to the SOS
technology. For these SOI technologies, various methods have been
examined to reduce crystal defects or manufacturing cost. The
methods include a method of ion-implanting oxygen into a substrate
to form a buried oxide layer, a method of bonding two wafers via an
oxide film and polishing or etching one wafer to leave a thin
single-crystal Si layer on the oxide film, and a method of
ion-implanting hydrogen to a predetermined depth from the surface
of an Si substrate having an oxide film, bonding the substrate to
another substrate, leaving a thin single-crystal Si layer on the
oxide film by heating or the like, and peeling one (the other
substrate) of the bonded substrates.
[0014] The present applicant has disclosed a new SOI technology in
Japanese Patent Laid-Open No. 5-21338. In this technology, a first
substrate prepared by forming an unporous single-crystal layer
(including a single-crystal Si layer) on a single-crystal
semiconductor substrate having a porous layer is bonded to a second
substrate via an insulating layer. After this, the substrates are
separated at the porous layer, thereby transferring the unporous
single-crystal layer to the second substrate. This technique is
advantageous because the film thickness uniformity of the SOI layer
is good, the crystal defect density in the SOI layer can be
decreased, the surface planarity of the SOI layer is good, no
expensive manufacturing apparatus with special specifications is
required, and SOI substrates having about several hundred .ANG. to
10-.mu.m thick SOI films can be manufactured by a single
manufacturing apparatus.
[0015] The present applicant has also disclosed a technique in
Japanese Patent Laid-Open No. 7-302889, in which first and second
substrates are bonded, the first substrate is separated from the
second substrate without being broken, the surface of the separated
first substrate is planarized, a porous layer is formed again, and
the porous layer is reused. Since the first substrate is not
wasted, this technique is advantageous in greatly reducing the
manufacturing cost and simplifying the manufacturing process.
[0016] In the above technique, when a substrate (to be referred to
as a bonded substrate stack hereinafter) obtained by bonding two
substrates is to be separated at the porous layer, it is desired to
separate the bonded substrate stack with good reproducibility
without damaging the substrates.
SUMMARY OF THE INVENTION
[0017] The present invention has been made in consideration of the
above situation, and has as its object to provide a technique for
separating plate-like samples such as bonded substrate stacks at a
high yield.
[0018] According to the first aspect of the present invention,
there is provided a separating apparatus for separating a
plate-like sample having a separation layer at the separation
layer, characterized by comprising a holding mechanism for holding
the plate-like sample in a substantially horizontal state while
rotating the sample, and an ejection portion for ejecting a fluid
to the separation layer of the plate-like sample held by the
holding mechanism to separate the plate-like sample at the
separation layer by the fluid.
[0019] In the separating apparatus according to the first aspect of
the present invention, the holding mechanism preferably comprises,
e.g., a pair of sample holding mechanisms for holding the
plate-like sample by sandwiching the sample from upper and lower
sides.
[0020] In the separating apparatus according to the first aspect of
the present invention, the pair of holding mechanisms preferably
have, e.g., chuck mechanisms for chucking the plate-like sample,
respectively.
[0021] In the separating apparatus according to the first aspect of
the present invention, preferably, the pair of holding mechanisms
have, e.g., an application portion for applying a press force to
the plate-like sample in an axial direction, and hold the
plate-like sample to which the press force is being applied by the
application portion.
[0022] In the separating apparatus according to the first aspect of
the present invention, preferably, the pair of holding mechanisms
have, e.g., an application portion for applying a force to the
plate-like sample in an axial direction, and hold the plate-like
sample to which the force is being applied by the application
portion.
[0023] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably presses the plate-like sample in the axial direction
using a force of a spring.
[0024] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably presses the plate-like sample in the axial direction
using a force generated by a cylinder.
[0025] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably presses the plate-like sample in the axial direction
using pressure of a fluid.
[0026] In the separating apparatus according to the first aspect of
the present invention, for example, at least one of the pair of
sample holding mechanisms preferably comprises a Bernoulli
chuck.
[0027] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion supplies a fluid to a surface of the plate-like sample and
applies the press force to the plate-like sample using the
fluid.
[0028] In the separating apparatus according to the first aspect of
the present invention, the fluid supplied to the surface of the
plate-like sample by the application portion is preferably, e.g., a
liquid.
[0029] In the separating apparatus according to the first aspect of
the present invention, the fluid supplied to the plate-like sample
by the application portion is preferably, e.g., a gas.
[0030] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, at least one of the
pair of sample holding mechanisms comprises a holding member that
comes into contact with the plate-like sample to hold the
plate-like sample, and the application portion applies the press
force to the plate-like sample via the holding member.
[0031] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion presses the holding member using a fluid and applies the
press force to the plate-like sample via the holding member.
[0032] In the separating apparatus according to the first aspect of
the present invention, the fluid supplied to the holding member by
the application portion is preferably, e.g., a liquid.
[0033] In the separating apparatus according to the first aspect of
the present invention, the fluid supplied to the holding member by
the application portion is preferably, e.g., a gas.
[0034] In the separating apparatus according to the first aspect of
the present invention, for example, at least one of the pair of
sample holding mechanisms preferably comprises a holding member
that comes into contact with the plate-like sample to hold the
plate-like sample and a Bernoulli chuck for supporting the holding
member.
[0035] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion presses the holding member using a magnetic force and
applies the press force to the plate-like sample via the holding
member.
[0036] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion applies the press force to the plate-like sample from a
lower sample holding mechanism of the pair of sample holding
mechanisms while fixing a vertical position of an upper sample
holding mechanism.
[0037] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion applies the press force to the plate-like sample from an
upper sample holding mechanism of the pair of sample holding
mechanisms while fixing a vertical position of a lower sample
holding mechanism.
[0038] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably applies the press force to the plate-like sample from
both of the pair of sample holding mechanisms.
[0039] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably applies the press force to the plate-like sample using a
weight.
[0040] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably changes stepwise the force for pressing the plate-like
sample using a plurality of weights.
[0041] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion presses the plate-like sample with a relatively small force
when a portion near a periphery of the plate-like sample is to be
separated, and presses the plate-like sample with a relatively
large force when a portion near the center of the plate-like sample
is to be separated.
[0042] In the separating apparatus according to the first aspect of
the present invention, preferably, for example,, the application
portion presses the plate-like sample with a relatively small force
at a first step of separation of the plate-like sample, and presses
the plate-like sample with a relatively large force at a second
step of separation of the plate-like sample.
[0043] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably presses the portion near the center of the plate-like
sample.
[0044] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion presses the plate-like sample with a relatively small force
when a portion near a periphery of the plate-like sample is to be
separated, and presses the plate-like sample with a relatively
large force when a portion near the center of the plate-like sample
is to be separated.
[0045] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the application
portion presses the plate-like sample with a relatively small force
at a first step of separation of the plate-like sample, and presses
the plate-like sample with a relatively large force at a second
step of separation of the plate-like sample.
[0046] In the separating apparatus according to the first aspect of
the present invention, for example, the application portion
preferably presses the portion near the center of the plate-like
sample.
[0047] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably has a structure capable of transferring/receiving the
plate-like sample to/from a conveyor mechanism for chucking a
surface of the plate-like sample to hold the sample.
[0048] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably comprises a convex support portion for holding the
plate-like sample while forming a gap between a predetermined
portion of a surface of the plate-like sample and a predetermined
portion of a surface of the holding member.
[0049] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably holds a substantially central portion of the plate-like
sample.
[0050] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably comprises a sample holding mechanism for holding one
surface of the plate-like sample.
[0051] In the separating apparatus according to the first aspect of
the present invention, for example, the sample holding mechanism
preferably comprises a chuck mechanism for chucking the plate-like
sample.
[0052] In the separating apparatus according to the first aspect of
the present invention, for example, the chuck mechanism preferably
chucks a plurality of portions of the plate-like sample.
[0053] In the separating apparatus according to the first aspect of
the present invention, for example, the chuck mechanism preferably
chucks a peripheral portion of the plate-like sample.
[0054] In the separating apparatus according to the first aspect of
the present invention, for example, the chuck mechanism preferably
chucks the plate-like sample to warp the plate-like sample.
[0055] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably has a structure capable of exchanging the plate-like
sample with a conveyor mechanism for chucking a surface of the
plate-like sample to hold the sample.
[0056] In the separating apparatus according to the first aspect of
the present invention, for example, the sample holding mechanism
preferably comprises a convex support portion at a substantially
central portion.
[0057] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the chuck mechanism
chucks the plate-like sample when a portion near a periphery of the
plate-like sample is to be separated, and does not chuck the
plate-like sample when a portion near the center of the plate-like
sample is to be separated.
[0058] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the chuck mechanism
chucks the plate-like sample at a first step of separation of the
plate-like sample, and does not chuck the plate-like sample at a
second step of separation of the plate-like sample.
[0059] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably comprises an edge portion support member for supporting
an edge portion of the plate-like sample.
[0060] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the holding
mechanism comprises a plurality of edge portion support members for
supporting an edge portion of the plate-like sample and a rotation
source for rotating at least-one of the plurality of edge portion
support members, and the plate-like sample is rotated by
transmitting a rotational force from the rotated edge portion
support member to the plate-like sample.
[0061] In the separating apparatus according to the first aspect of
the present invention, preferably, for example, the holding
mechanism comprises a table for supporting the edge portion support
member, and a rotation source for rotating the table, and the
plate-like sample is rotated by rotating the table.
[0062] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism
preferably further comprises a convex support portion for partially
supporting a lower surface of the plate-like sample.
[0063] In the separating apparatus according to the first aspect of
the present invention, for example, the holding mechanism further
preferably comprises a convex support portion for partially
supporting a lower surface of the plate-like sample, the convex
support portion being rotated together with the plate-like sample
placed on the support portion.
[0064] Preferably, for example, the separating apparatus according
to the first aspect of the present invention further comprises a
driving mechanism for driving the edge portion support member
toward the center or outer periphery of the plate-like sample, and
when the plate-like sample is to be held, the edge portion support
member is driven toward the center by the driving mechanism.
[0065] In the separating apparatus according to the first aspect of
the present invention, for example, each of the plurality of edge
portion support members preferably has a shape obtained by bonding
bottom portions of two cones.
[0066] The separating apparatus according to the first aspect of
the present invention preferably further comprises, e.g., a spacing
mechanism for, after the plate-like sample is separated into two
samples, spacing the separated plate-like samples apart from each
other.
[0067] In the separating apparatus according to the first aspect of
the present invention, for example, the spacing mechanism
preferably spaces the separated plate-like samples apart
substantially in the axial direction.
[0068] In the separating apparatus according to the first aspect of
the present invention, for example, the spacing mechanism
preferably spaces the separated plate-like samples apart
substantially in a planar direction.
[0069] The separating apparatus according to the first aspect of
the present invention preferably further comprises, e.g., a
cleaning portion for cleaning the plate-like sample which is being
separated or the separated plate-like samples.
[0070] According to the second aspect of the present invention,
there is provided a separating apparatus for separating a
plate-like sample having a separation layer at the separation
layer, characterized by comprising a holding mechanism for holding
the plate-like sample in a substantially horizontal state while
rotating the sample, and an ejection portion for ejecting a fluid
to the separation layer of the plate-like sample held by the
holding mechanism to separate the plate-like sample at the
separation layer by the fluid.
[0071] The separating apparatus according to the second aspect of
the present invention preferably further comprises, e.g., a
scanning portion for scanning the ejection portion or the
plate-like sample in separating the plate-like sample.
[0072] The separating apparatus according to the second aspect of
the present invention preferably further comprises, e.g., a pivot
portion for pivoting the ejection portion about an axis parallel to
an axis of the plate-like sample.
[0073] In the separating apparatus according to the first or second
aspect of the present invention, the plate-like sample to be
processed preferably has, e.g., a fragile layer as the separation
layer.
[0074] In the separating apparatus according to the first or second
aspect of the present invention, the fragile layer is preferably,
e.g., a porous layer.
[0075] In the separating apparatus according to the first or second
aspect of the present invention, the fragile layer is preferably,
e.g., a microcavity layer.
[0076] In the separating apparatus according to the first or second
aspect of the present invention, the plate-like sample to be
processed is preferably, e.g., a semiconductor substrate.
[0077] In the separating apparatus according to the first or second
aspect of the present invention, the plate-like sample to be
processed is preferably formed by, e.g., bonding a first substrate
and a second substrate and has a fragile layer as the separation
layer.
[0078] In the separating apparatus according to the first or second
aspect of the present invention, the plate-like sample to be
processed is preferably formed by, e.g., forming a porous layer on
a surface of a first semiconductor substrate, forming an unporous
layer on the porous layer, and bonding a second substrate to the
unporous layer.
[0079] According to the third aspect of the present invention,
there is provided a separating system characterized by comprising a
separating apparatus of the first or second aspect, and a conveyor
robot for transferring a plate-like sample to the separating
apparatus in a substantially horizontal state and receiving in the
substantially horizontal state plate-like samples separated by the
separating apparatus.
[0080] In the separating system according to the third aspect of
the present invention, for example, the conveyor robot preferably
transfers the plate-like sample while supporting the sample from a
lower side to the separating apparatus.
[0081] In the separating system according to the third aspect of
the present invention, for example, the conveyor robot preferably
receives a lower plate-like sample of two separated plate-like
samples from the separating apparatus while supporting the sample
from the lower side.
[0082] In the separating system according to the third aspect of
the present invention, for example, the conveyor robot preferably
receives an upper plate-like sample of the two separated plate-like
samples from the separating apparatus while supporting the sample
from an upper side.
[0083] The separating system according to the third aspect of the
present invention, preferably, for example, further comprises a
centering apparatus for aligning the center of the plate-like
sample at a predetermined position, and the conveyor robot receives
the plate-like sample from the centering apparatus and transfers
the sample to the separating apparatus.
[0084] The separating system according to the third aspect of the
present invention, preferably, for example, further comprises a
turning apparatus for rotating the plate-like sample through
180.degree. to turn the sample, and the conveyor robot transfers
the upper plate-like sample, separated by the separating apparatus,
to the turning apparatus in the horizontal state.
[0085] The separating system according to the third aspect of the
present invention preferably further comprises, e.g., a
cleaning/drying apparatus for cleaning and drying the plate-like
samples separated by the separating apparatus.
[0086] According to the fourth aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of holding the plate-like
sample by a holding mechanism in a substantially horizontal state,
ejecting a fluid from an election portion to the separation layer
of the plate-like sample while rotating the plate-like sample held
by the holding mechanism to separate the plate-like sample at the
separation layer using the fluid, and removing separated plate-like
samples from the holding mechanism.
[0087] According to the fifth aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of pressing and holding the
plate-like sample by a holding mechanism in a substantially
horizontal state, ejecting a fluid from an election portion to the
separation layer of the plate-like sample held by the holding
mechanism to separate the plate-like sample at the separation layer
using the fluid, and removing separated plate-like samples from the
holding mechanism.
[0088] According to the sixth aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of transferring the
plate-like sample to the above separating apparatus in a horizontal
state, separating the plate-like sample by the separating
apparatus, and receiving separated plate-like samples from the
separating apparatus.
[0089] According to the seventh aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of transferring the
plate-like sample to a centering apparatus in a horizontal state
and aligning the center of the plate-like sample at a predetermined
position by the centering apparatus, receiving the plate-like
sample from the centering apparatus and transferring the plate-like
sample to the above separating apparatus in the horizontal state to
separate the plate-like sample by the separating apparatus, and
receiving separated plate-like samples from the separating
apparatus.
[0090] According to the eighth aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of transferring the
plate-like sample to a centering apparatus in a horizontal state
and aligning the center of the plate-like sample at a predetermined
position by the centering apparatus, receiving the plate-like
sample from the centering apparatus and transferring the plate-like
sample to the above separating apparatus in the horizontal state to
separate the plate-like sample by the separating apparatus,
receiving an upper substrate of two separated plate-like samples
from the separating apparatus, transferring the substrate to a
turning apparatus, and rotating the plate-like sample through
180.degree. to turn the substrate by the turning apparatus,
receiving the plate-like sample from the turning apparatus, and
receiving a lower substrate of the two separated plate-like samples
from the separating apparatus.
[0091] According to the ninth aspect of the present invention,
there is provided a separating method of separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising the steps of transferring the
plate-like sample to a centering apparatus in a horizontal state
and aligning the center of the plate-like sample at a predetermined
position by the centering apparatus, receiving the plate-like
sample from the centering apparatus and transferring the plate-like
sample to the above separating apparatus in the horizontal state to
separate the plate-like sample by the separating apparatus,
receiving an upper substrate of two separated plate-like samples
from the separating apparatus, transferring the substrate to a
turning apparatus, and rotating the plate-like sample through
180.degree. to turn the substrate by the turning apparatus,
receiving the plate-like sample from the turning apparatus,
transferring the sample to a cleaning/drying apparatus, and
cleaning and drying the sample by the cleaning/drying apparatus,
and receiving a lower substrate of the two separated plate-like
samples from the separating apparatus, transferring the substrate
to the cleaning/drying apparatus, and cleaning and drying the
substrate by the cleaning/drying apparatus.
[0092] According to the 10th aspect of the present invention, there
is provided a separating method of separating a plate-like sample
having a separation layer at the separation layer, characterized by
comprising the steps of transferring the plate-like sample to the
above separating apparatus in the horizontal state to separate the
plate-like sample by the separating apparatus, receiving an upper
substrate of two separated plate-like samples from the separating
apparatus, transferring the substrate to a turning apparatus, and
rotating the plate-like sample through 180.degree. to turn the
substrate by the turning apparatus, receiving the plate-like sample
from the turning apparatus, and receiving a lower substrate of the
two separated plate-like samples from the separating apparatus.
[0093] According to the 11th aspect of the present invention, there
is provided a separating method of separating a plate-like sample
having a separation layer at the separation layer, characterized by
comprising the steps of transferring the plate-like sample to the
above separating apparatus in the horizontal state to separate the
plate-like sample by the separating apparatus, receiving an upper
substrate of two separated plate-like samples from the separating
apparatus, transferring the substrate to a turning apparatus, and
rotating the plate-like sample through 180.degree. to turn the
substrate by the turning apparatus, receiving the plate-like sample
from the turning apparatus, transferring the sample to a
cleaning/drying apparatus, and cleaning and drying the sample by
the cleaning/drying apparatus, and receiving a lower substrate of
the two separated plate-like samples from the separating apparatus,
transferring the substrate to the cleaning/drying apparatus, and
cleaning and drying the substrate by the cleaning/drying
apparatus.
[0094] According to the 12th aspect of the present invention, there
is provided a separating method of separating a plate-like sample
having a separation layer at the separation layer, characterized by
comprising the steps of transferring the plate-like sample to the
above separating apparatus in the horizontal state to separate the
plate-like sample by the separating apparatus, and transferring
each of separated plate-like samples to a cleaning/drying apparatus
and cleaning and drying the sample by the cleaning/drying
apparatus.
[0095] According to the 13th aspect of the present invention, there
is provided a separating method of separating a plate-like sample
having a separation layer at the separation layer, characterized by
comprising the step of ejecting a fluid to the separation layer of
the plate-like sample while holding and rotating the plate-like
sample in a substantially horizontal state to separate the
plate-like sample at the separation layer using the fluid.
[0096] According to the 14th aspect of the present invention, there
is provided a separating method of separating a plate-like sample
having a separation layer at the separation layer, characterized by
comprising the step of ejecting a fluid to the separation layer of
the plate-like sample while pressing and holding the plate-like
sample in a substantially horizontal state to separate the
plate-like sample at the separation layer using the fluid.
[0097] According to the 15th aspect of the present invention, there
is provided a method of manufacturing a substrate, characterized by
comprising the preparation step of bonding a first substrate having
a fragile layer to a second substrate to prepare a bonded substrate
stack, the separation step of separating the bonded substrate stack
at the fragile layer using a fluid, and the removal step of
removing the fragile layer remaining on the second substrate after
the separation step, wherein the separation step comprises ejecting
the fluid to the fragile layer of the bonded substrate stack while
holding and rotating the bonded substrate stack in a substantially
horizontal state to separate the bonded substrate stack at the
fragile layer using the fluid.
[0098] According to the 16th aspect of the present invention, there
is provided a method of manufacturing a substrate, characterized by
comprising the preparation step of bonding a first substrate having
a fragile layer to a second substrate to prepare a bonded substrate
stack, the separation step of separating the bonded substrate stack
at the fragile layer using a fluid, and the removal step of
removing the fragile layer remaining on the second substrate after
the separation step, wherein the separation step comprises ejecting
the fluid to the fragile layer of the bonded substrate stack while
pressing and holding the bonded substrate stack in a substantially
horizontal state to separate the bonded substrate stack at the
fragile layer using the fluid.
[0099] According to the 17th aspect of the present invention, there
is provided a separating apparatus for separating a plate-like
sample having a separation layer at the separation layer,
characterized by comprising a holding mechanism for holding the
plate-like sample, an ejection portion for ejecting a fluid to the
plate-like sample held by the holding mechanism to separate the
plate-like sample at the separation layer using the fluid, and an
abrupt operation prevention mechanism for preventing the holding
mechanism from abruptly moving due to a force of the fluid acting
in the plate-like sample while allowing the holding mechanism to
moderately move when separating the plate-like sample.
[0100] In the separating apparatus according to the 17th aspect of
the present invention, the abrupt operation prevention mechanism
preferably comprises, e.g., a damper mechanism.
[0101] The separating apparatus according to the 17th aspect of the
present invention preferably further comprises, e.g., a rotating
mechanism for rotating the holding mechanism about an axis
substantially perpendicular to a fluid ejection direction of the
ejection portion when separating the plate-like sample.
[0102] In the separating apparatus according to the 17th aspect of
the present invention, the abrupt operation prevention mechanism is
preferably, e.g., coaxial with the holding mechanism.
[0103] In the separating apparatus according to the 17th aspect of
the present invention, preferably, for example, the holding
mechanism comprises a pair of sample holding portions for
sandwiching and holding the plate-like sample, at least one of the
pair of sample holding portions can move in a direction
substantially perpendicular to the fluid ejection direction of the
ejection portion, and the abrupt operation prevention mechanism
prevents the movable sample holding portion from abrupt movement
while allowing the movable sample holding portion to moderately
move when separating the plate-like sample.
[0104] In the separating apparatus according to the 17th aspect of
the present invention, for example, the abrupt operation prevention
mechanism preferably comprises a movable portion which moves in
contact with the movable sample holding portion, and a reaction
generation portion for generating a reaction against a force
applied from the movable sample holding portion to the movable
portion.
[0105] In the separating apparatus according to the 17th aspect of
the present invention, for example, the movable portion preferably
smoothly moves.
[0106] In the separating apparatus according to the 17th aspect of
the present invention, preferably, for example, the movable portion
comprises a piston, the reaction generation portion comprises a
frame member constructing a pressure chamber for causing pressure
to act on the piston, and the frame member has a channel for
discharging a fluid from the pressure chamber.
[0107] In the separating apparatus according to the 17th aspect of
the present invention, the abrupt operation prevention mechanism
preferably has, e.g., a valve for controlling the fluid flowing
through the channel.
[0108] In the separating apparatus according to the 17th aspect of
the present invention, the abrupt operation prevention mechanism
preferably further comprises, e.g., a restoring mechanism for
extending the piston retracted into the frame member and
simultaneously filling the pressure chamber with the fluid when
separating the plate-like sample.
[0109] In the separating apparatus according to the 17th aspect of
the present invention, preferably, for example, the restoring
mechanism has a spring, and the piston is extended by a force of
the spring to fill the pressure chamber with the fluid.
[0110] In the separating apparatus according to the 17th aspect of
the present invention, preferably, for example, the restoring
mechanism comprises a filling mechanism for filing the pressure
chamber with the fluid, and the piston is extended by filling the
pressure chamber with the fluid by the filling mechanism.
[0111] In the separating apparatus according to the 17th aspect of
the present invention, the holding mechanism preferably further
comprises, e.g., a press mechanism for applying a press force to
the plate-like sample in a direction substantially perpendicular to
the fluid ejection direction of the ejection portion when holding
the plate-like sample.
[0112] The separating apparatus according to the 17th aspect of the
present invention, preferably, for example, further comprises a
driving portion for changing a position where the fluid ejected
from the ejection portion is injected into the plate-like sample,
and the plate-like sample is separated while changing the
position.
[0113] In the separating apparatus according to the 17th aspect of
the present invention, the driving portion preferably comprises,
e.g., a motor for rotating the plate-like sample about an axis
substantially perpendicular to the fluid ejection direction of the
ejection portion.
[0114] In the separating apparatus according to the 17th aspect of
the present invention, the separation layer is preferably, e.g., a
fragile layer.
[0115] In the separating apparatus according to the 17th aspect of
the present invention, the fragile layer is preferably, e.g., a
porous layer.
[0116] In the separating apparatus according to the 17th aspect of
the present invention, the fragile layer is preferably, e.g., a
microcavity layer.
[0117] In the separating apparatus according to the 17th aspect of
the present invention, the plate-like sample to be separated is
preferably, e.g., a semiconductor substrate.
[0118] In the separating apparatus according to the 17th aspect of
the present invention, the plate-like sample to be separated is
preferably formed by, e.g., bonding a first substrate and a second
substrate.
[0119] According to the 18th aspect of the present invention, there
is provided a separating method of ejecting a fluid to a separation
layer of a plate-like sample having the separation layer to
separate the plate-like sample at the separation layer,
characterized by comprising the step of separating the plate-like
sample while preventing the plate-like sample from abruptly warping
due to a force of the fluid acting in the plate-like sample and
allowing the plate-like sample to moderately warp.
[0120] In the separating method according to the 18th aspect of the
present invention, the separation layer is preferably, e.g., a
fragile layer.
[0121] In the separating method according to the 18th aspect of the
present invention, the fragile layer is preferably, e.g., a porous
layer.
[0122] In the separating method according to the 18th aspect of the
present invention, the fragile layer is preferably, e.g., a
microcavity layer.
[0123] In the separating method according to the 18th aspect of the
present invention, the plate-like sample to be separated is
preferably, e.g., a semiconductor substrate.
[0124] In the separating method according to the 18th aspect of the
present invention, the plate-like sample to be separated is
preferably formed by, e.g., bonding a first substrate and a second
substrate.
[0125] According to the 19th aspect of the present invention, there
is provided a method of manufacturing a substrate, characterized by
comprising the preparation step of bonding a first substrate having
a fragile layer to a second substrate to prepare a bonded substrate
stack, the separation step of separating the bonded substrate stack
at the fragile layer using a fluid, and the removal step of
removing the fragile layer remaining on the second substrate after
the separation step, wherein the separation step comprises
separating the bonded substrate stack at the fragile layer while
preventing the bonded substrate stack from abruptly warping due to
a force of the fluid acting in the bonded substrate stack and
allowing the bonded substrate stack to moderately warp.
[0126] Further objects, features and advantages of the present
invention will become apparent from the following detailed
description of the embodiments of the present invention with
reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0127] FIGS. 1A to 1E are sectional views for explaining the steps
in manufacturing an SOI substrate according to a preferred
embodiment of the present invention;
[0128] FIG. 2 is a view showing the schematic arrangement of a
separating apparatus according to the first embodiment of the
present invention;
[0129] FIG. 3 is a perspective view showing the schematic
arrangement of a substrate holding portion shown in FIG. 2;
[0130] FIG. 4 is a view showing the schematic arrangement of a
separating apparatus according to the second embodiment of the
present invention;
[0131] FIG. 5 is a view showing the schematic arrangement of a
separating apparatus according to the third embodiment of the
present invention;
[0132] FIG. 6 is a view showing the schematic arrangement of a
separating apparatus according to the fourth embodiment of the
present invention;
[0133] FIG. 7 is a view showing the schematic arrangement of a
separating apparatus according to the fifth embodiment of the
present invention;
[0134] FIG. 8 is a view showing the schematic arrangement of a
separating apparatus according to the sixth embodiment of the
present invention;
[0135] FIG. 9 is a view showing the schematic arrangement of a
separating apparatus according to the seventh embodiment of the
present invention;
[0136] FIG. 10 is a view showing the schematic arrangement of a
separating apparatus according to the eighth embodiment of the
present invention;
[0137] FIG. 11 is a view showing the schematic arrangement of a
separating apparatus according to the ninth embodiment of the
present invention;
[0138] FIG. 12 is a view showing the schematic arrangement of a
separating apparatus according to the 10th embodiment of the
present invention;
[0139] FIG. 13 is a view showing the schematic arrangement of a
separating apparatus according to the 11th embodiment of the
present invention;
[0140] FIG. 14 is a view showing the schematic arrangement of a
separating apparatus according to the 12th embodiment of the
present invention;
[0141] FIG. 15 is a view showing the schematic arrangement of a
separating apparatus according to the 13th embodiment of the
present invention;
[0142] FIG. 16 is a view showing the schematic arrangement of a
separating apparatus according to the 14th embodiment of the
present invention;
[0143] FIG. 17 is a view showing the schematic arrangement of the
separating apparatus according to the 14th embodiment of the
present invention;
[0144] FIG. 18 is a view showing the schematic arrangement of the
separating apparatus according to the 14th embodiment of the
present invention;
[0145] FIG. 19 is a view showing the schematic arrangement of the
separating apparatus according to the 14th embodiment of the
present invention;
[0146] FIG. 20 is a perspective view showing the schematic
arrangement of an operation section shown in FIGS. 16 to 19;
[0147] FIG. 21 is a view showing the schematic arrangement of a
separating apparatus according to the 15th embodiment of the
present invention;
[0148] FIG. 22 is a view showing the schematic arrangement of a
separating apparatus according to the 16th embodiment of the
present invention;
[0149] FIG. 23 is a view showing the schematic arrangement of the
separating apparatus according to the 16th embodiment of the
present invention;
[0150] FIG. 24 is a view showing the schematic arrangement of the
separating apparatus according to the 16th embodiment of the
present invention;
[0151] FIG. 25 is a view showing the schematic arrangement of a
separating apparatus according to the 17th embodiment of the
present invention;
[0152] FIG. 26 is a view showing the schematic arrangement of the
separating apparatus according to the 17th embodiment of the
present invention;
[0153] FIG. 27 is a view showing the schematic arrangement of a
separating apparatus according to the 18th embodiment of the
present invention;
[0154] FIG. 28 is a view showing the schematic arrangement of a
separating apparatus according to the 19th embodiment of the
present invention;
[0155] FIG. 29 is a view showing the schematic arrangement of the
separating apparatus according to the 19th embodiment of the
present invention;
[0156] FIG. 30 is a view showing the schematic arrangement of a
separating apparatus according to the 20th embodiment of the
present invention;
[0157] FIG. 31 is a view showing the schematic arrangement of a
separating apparatus according to the 22nd embodiment of the
present invention;
[0158] FIG. 32 is a view showing the schematic arrangement of the
separating apparatus according to the 22nd embodiment of the
present invention;
[0159] FIG. 33 is a view showing the schematic arrangement of a
separating apparatus according to the 23rd embodiment of the
present invention;
[0160] FIG. 34 is a view showing the schematic arrangement of a
separating apparatus according to the 24th embodiment of the
present invention;
[0161] FIG. 35 is a view showing an example of various separating
methods with an emphasis on the relationship between a bonded
substrate stack and a nozzle for ejecting a jet;
[0162] FIG. 36 is a view showing an example of various separating
methods with an emphasis on the relationship between a bonded
substrate stack and a nozzle for ejecting a jet;
[0163] FIGS. 37A and 37B are views showing another example of
various separating methods with an emphasis on the relationship
between a bonded substrate stack and a nozzle for ejecting a
jet;
[0164] FIG. 38 is a view showing still another example of various
separating methods with an emphasis on the relationship between a
bonded substrate stack and a nozzle for ejecting a jet;
[0165] FIG. 39 is a plan view showing the schematic arrangement of
a separating system according to the 25th embodiment of the present
invention;
[0166] FIG. 40 is a view showing the schematic arrangement of a
separating apparatus according to the 21st embodiment of the
present invention;
[0167] FIG. 41 is a view showing the arrangement of an abrupt
operation prevention mechanism using a damper mechanism;
[0168] FIG. 42 is a view showing the first modification of the
abrupt operation prevention mechanism shown in FIG. 41; and
[0169] FIG. 43 is a view showing the second modification of the
abrupt operation prevention mechanism shown in FIG. 41.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0170] Preferred embodiments of the present invention will be
described below with reference to the accompanying drawings.
[0171] FIGS. 1A to 1E are sectional views for explaining steps in
manufacturing an SOI substrate according a preferred embodiment of
the present invention.
[0172] In the step shown in FIG. 1A, a single-crystal Si substrate
11 is prepared, and a porous Si layer 12 is formed on the surface
of the single-crystal Si substrate 11 by, e.g., anodizing. In the
step shown in FIG. 1B, an unporous single-crystal Si layer 13 is
formed on the porous Si layer 12 by epitaxial growth. An insulating
layer (e.g., an SiO.sub.2 layer) 15 is formed on the unporous
single-crystal Si layer 13. With this process, a first substrate 10
is formed.
[0173] In the step shown in FIG. 1C, a second substrate 20 is
prepared and brought into tight contact with the first substrate 10
at room temperature while making the insulating layer 15 oppose the
second substrate 20. After this, the first substrate 10 and second
substrate 20 are bonded by anodic bonding, pressing, heating, or a
combination thereof. The insulating layer 15 and second substrate
20 are firmly bonded to form the bonded substrate stack 50. The
insulating layer 15 may be formed on the unporous single-crystal Si
layer 13, as described above. Alternatively, the insulating layer
15 maybe formed either on the second substrate 20 or on both the
unporous single-crystal Si layer 13 and second substrate 20 as far
as the state shown in FIG. 1C is obtained upon bringing the first
and second substrates into tight contact with each other.
[0174] In the step shown in FIG. 1D, the two bonded substrates are
separated at the porous Si layer 12. The second substrate side
(10"+20) has a multilayered structure of porous Si layer
12"/single-crystal Si layer 13/insulating layer 15/single-crystal
Si substrate 20. The first substrate side (10') has a structure
wherein a porous Si layer 12' is formed on the single-crystal Si
substrate 11.
[0175] After the remaining porous Si layer 12' is removed, and the
surface of the porous Si layer 12' is planarized as needed, the
separated substrate (10') is used as a single-crystal Si substrate
11 for forming a first substrate (10) again.
[0176] After the bonded substrate stack is separated, in the step
shown in FIG. 1E, the porous layer 12" on the surface on the second
substrate side (10"+20) is selectively removed. With this process,
a substrate having a multilayered structure of a single-crystal Si
layer 13/insulating layer 15/single-crystal Si substrate 20, i.e.,
an SOI structure is obtained.
[0177] As the second substrate, for example, not only a
single-crystal Si substrate but also an insulating substrate (e.g.,
quartz substrate) or a transparent substrate (e.g., quartz
substrate) can be used.
[0178] In this embodiment, to facilitate the process of bonding two
substrates and separating them, a porous Si layer 12 having a
fragile structure is formed in the separation region. In place of
the porous layer, for example, a microcavity layer may be formed.
The microcavity layer can be formed by, e.g., implanting ions into
a semiconductor substrate.
[0179] In this embodiment, for part of the step shown in FIG. 1D,
i.e., the step of separating the bonded substrate stack, a
separating apparatus which ejects a liquid or gas (fluid) to the
porous Si layer as the separation layer to separate the bonded
substrate stack into two substrates at the separation layer is
used.
[0180] [Basic Arrangement of Separating Apparatus]
[0181] This separating apparatus uses the water jet method.
Generally, the water jet method ejects a high-speed, high-pressure
stream of water to an object to, e.g., cut or process a ceramic,
metal, concrete, resin, rubber, or wood, remove a coating film from
the surface, or clean the surface ("Water Jet", Vol. 1, No. 1, page
4 (1984)).
[0182] This separating apparatus ejects a stream of fluid to the
porous layer (separation region) as a fragile structure of a bonded
substrate stack to selectively break the porous layer, thereby
separating the substrate stack at the porous layer. The stream will
be referred to as a "jet" hereinafter. The fluid forming a jet will
be referred to as a "jet medium". As the jet medium, it is possible
to use water, an organic solvent such as alcohol, an acid such as
hydrofluoric acid or nitric acid, an alkali such as potassium
hydroxide, a gas such as air, nitrogen gas, carbonic acid gas, a
rare gas, or an etching gas, or a plasma.
[0183] When this separating apparatus is applied to manufacture a
semiconductor device or separate, e.g., a bonded substrate stack,
pure water with minimum impurity metals or particles is preferably
used as the jet medium.
[0184] The jet ejecting conditions can be determined in accordance
with, e.g., the type of separation region (e.g., a porous layer) or
the shape of the side surfaces of the bonded substrate stack. As
the jet ejecting conditions, for example, pressure to be applied to
the jet medium, jet scanning speed, nozzle width or diameter (the
diameter is substantially the same as the jet diameter), nozzle
shape, distance between the nozzle and the separation region, and
flow rate of the jet are used as important parameters.
[0185] According to the separating method using the water jet
method, a bonded substrate stack can be separated into two
substrates without damaging the bonded substrate stack.
[0186] Each of separating apparatuses according to the preferred
embodiments of the present invention holds a sample such as a
bonded substrate stack while setting the sample surface
substantially horizontally, and in this state, separates the sample
at the fragile structure (e.g., a porous layer). When the sample is
held with its surface set horizontally, for example, (1) the sample
can be prevented from dropping, (2) the sample can be easily held,
(3) the sample can be easily conveyed, (4) the sample can be
efficiently transferred between the separating apparatus and
another apparatus, and (5) the projection area (occupation area) of
the separating apparatus can be reduced because the constituent
elements can be disposed in the vertical direction.
[0187] Preferred embodiments of the present invention will be
described below. The separating apparatuses according to the
embodiments are suitable for separating a bonded substrate stack
having a porous layer or microcavity layer as a fragile structure.
The separating apparatuses are also suitable for separating another
sample having a fragile structure. The following embodiments are
particularly suitable for separating a sample having, as a
separation region, a region more fragile than the remaining
regions. For example, the separating apparatuses can be used to
separate a sample having a uniform structure using an arbitrary
portion as a separation region. In the following description,
however, the bonded substrate stack 50 as shown in FIG. 1C is used
as the sample to be separated, for the descriptive convenience.
[0188] [First Embodiment]
[0189] FIG. 2 is a view showing the schematic arrangement of a
separating apparatus according to the first embodiment of the
present invention. A separating apparatus 100 has a pair of
substrate holding portions 270 and 280. The substrate holding
portions 270 and 280 horizontally hold and rotate a bonded
substrate stack 50 by sandwiching it from the upper and lower
sides. A jet is ejected from a nozzle 260 and injected toward the
porous layer of the bonded substrate stack 50, thereby separating
the bonded substrate stack 50 into two substrates at the porous
layer.
[0190] The upper substrate holding portion 270 is coupled to one
end of a rotating shaft 140. The other end of the rotating shaft
140 is coupled to the rotating shaft of a motor 110 via a coupling
130. The motor 110 and rotating shaft 140 may be coupled not via
the coupling 130 but via, e.g., a belt or another mechanism. The
motor 110 is fixed to a support member 120 fixed on an upper table
170. The motor is controlled by a control section.
[0191] A vacuum line 141 for vacuum-chucking the bonded substrate
stack 50 on the substrate holding portion 270 extends through the
rotating shaft 140. The vacuum line 141 is connected to an external
vacuum line via a ring 150. The external vacuum line has a solenoid
valve (not shown) The solenoid valve is ON/OFF-controlled by the
control section as needed. The substrate holding portion 270 has a
suction hole 271 for vacuum-chucking the bonded substrate stack 50.
The suction hole 271 is connected to the vacuum line 141. The
suction hole 271, vacuum line 141, and solenoid valve construct the
vacuum chuck mechanism of the substrate holding portion 270. The
rotating shaft 140 is supported by the upper table 170 via a
bearing 160.
[0192] The lower substrate holding portion 280 is coupled to one
end of a rotating shaft 180. A handle 220 is coupled to the other
end of the rotating shaft 180. This handle 220 is operated either
manually or by a driving mechanism (not shown). A compression
spring 200 for extending the substrate holding portion 280 upward
is inserted between the rotating shaft 180 and a support member 210
and attached to the rear end side of the rotating shaft 180. In
separation processing, the bonded substrate stack 50 is held by a
press force applied by the compression spring 200.
[0193] A vacuum line 181 for vacuum-chucking the bonded substrate
stack 50 on the substrate holding portion 280 extends through the
rotating shaft 180. The vacuum line 181 is connected to an external
vacuum line via a ring 190. The external vacuum line has a solenoid
valve (not shown) The solenoid valve is ON/OFF-controlled by the
control section as needed. The substrate holding portion 280 has a
suction hole 281 for vacuum-chucking the bonded substrate stack 50.
The suction hole 281 is connected to the vacuum line 181. The
suction hole 281, vacuum line 181, and solenoid valve construct the
vacuum chuck mechanism of the substrate holding portion 280. The
rotating shaft 180 is supported by a lower table 240 via a
reciprocal/rotational guide 230.
[0194] The lower table 240 is supported by a plurality of leg
members 310. The upper table 170 is supported on the lower table
240.
[0195] The nozzle 260 is attached to, e.g., the lower table 240 via
a support member (not shown). In the separating apparatus 100 of
the first embodiment, the position of the nozzle 260 is controlled
with reference to the position of the upper substrate holding
portion 270. A shutter 251 driven by a motor 250 is inserted
between the nozzle 260 and the substrate holding portions 270 and
280. When the shutter 251 is open, and a jet is ejected from the
nozzle 260, the jet can be injected into the bonded substrate stack
50. When the shutter 251 is closed, jet injection into the bonded
substrate stack 50 can be stopped.
[0196] FIG. 3 is a perspective view showing the schematic
arrangement of the substrate holding portion shown in FIG. 2. The
substrate holding portions 270 and 280 have, e.g., a symmetrical
structure. The substrate holding portions 270 and 280 have, at
their outer peripheral portions, a plurality of guide members 273
and 283 for preventing a bonded substrate stack from causing a
positional shift or projecting from the substrate holding portions
during separation, respectively.
[0197] To make it possible for a robot hand 400 of a conveyor robot
to transfer the bonded substrate stack 50 to the substrate holding
portion 270 or 280 while supporting the bonded substrate stack 50
from the lower side or to chuck the back side surface, i.e., the
opposite surface of the separated surface, of each separated
substrate and allow the robot hand 400 to receive the substrates
from the substrate holding portions 270 and 280, for example, the
plurality of guide members 273 and 283 are preferably arranged at
an appropriate interval such that the robot hand 400 can
enter/leave.
[0198] When the bonded substrate stack 50 supported from the lower
side is transferred to the substrate holding portion 270 or 280,
the bonded substrate stack 50 can be effectively prevented from
dropping.
[0199] When the robot hand 400 receives the separated substrates
from the substrate holding portions 270 and 280 while chucking the
back side surfaces of the substrates, any contamination of the
robot hand 400 or drop of the substrate can be effectively
prevented. The reason for this is as follows. When the separated
surface of a substrate is chucked, chips may stick to the robot
hand 400, and the chucking force may weaken because of unevenness
or chips on the separated surface. In addition, when the robot hand
400 receives the separated substrates from the substrate holding
portions 270 and 280 while chucking the back side surfaces, the
risk of damaging the substrates due to chips can be reduced.
[0200] The substrate holding portions 270 and 280 have convex
support portions 272 and 282 near their central portions,
respectively. The support portions 272 and 282 have shift
prevention members 290 and 300 around them, respectively. The shift
prevention members 290 and 300 formed from, e.g., rubber or a resin
prevent the bonded substrate stack 50 from moving in the planar
direction. With the shift prevention members 290 and 300, the
bonded substrate stack 50 can be held with a small press force.
[0201] Procedures of separation processing by the separating
apparatus 100 will be described below. First, the handle 220 is
moved downward against the force of the compression spring 200 to
form an appropriate gap between the substrate holding portions 270
and 280. In this state, the bonded substrate stack 50 is
horizontally supported by the robot hand 400 from the lower side
and inserted to a predetermined position between the substrate
holding portions 270 and 280.
[0202] The handle 220 is released to cause the compression spring
200 to act and move the lower substrate holding portion 280 upward,
thereby causing the substrate holding portion 280 to press the
bonded substrate stack 50.
[0203] The motor 110 is actuated to transmit the rotational force
to the rotating shaft 140. The rotating shaft 140, substrate
holding portion 270, bonded substrate stack 50, substrate holding
portion 280, and rotating shaft 180 rotate integrally.
[0204] While keeping the shutter 251 closed, a pump (not shown)
connected to the nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0205] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0206] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0207] The handle 220 is moved downward against the force of the
compression spring 200 and the surface tension between the two
separated substrates to form a predetermined gap between the
substrate holding portions 270 and 280. The two separated
substrates are spaced apart from each other.
[0208] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0209] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0210] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0211] [Second Embodiment]
[0212] FIG. 4 is a view showing the schematic arrangement of a
separating apparatus according to the second embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 4.
[0213] A separating apparatus 500 of the second embodiment has an
air cylinder 320 as a driving mechanism for driving a lower
substrate holding portion 280 in place of the compression spring
200 of the first embodiment (FIG. 2). A rotating shaft 180 is
coupled to the piston rod of the air cylinder 320 via a coupling
330. The air cylinder 320 is controlled by a control section (not
shown).
[0214] Procedures of separation processing by the separating
apparatus 500 will be described below. First, the air cylinder 320
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 280. In this state, a bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side and inserted to a predetermined position
between the substrate holding portions 270 and 280.
[0215] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 280 upward. The substrate holding
portion 280 presses and holds the bonded substrate stack 50.
[0216] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
280, and rotating shaft 180 rotate integrally.
[0217] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0218] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0219] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0220] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0221] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0222] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0223] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0224] [Third Embodiment]
[0225] FIG. 5 is a view showing the schematic arrangement of a
separating apparatus according to the third embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 5.
[0226] A separating apparatus 600 holds a bonded substrate stack 50
by pressure of a fluid during separation. This separating apparatus
600 has a pair of substrate holding portions 270 and 610 for
holding the bonded substrate stack 50. The upper substrate holding
portion 270 and constituent elements thereof are the same as those
described above.
[0227] The lower substrate holding portion 610 is coupled to one
end of an elevating shaft 620. The substrate holding portion 610
has a fluid blow portion 611 for causing pressure of a fluid to act
on the bonded substrate stack 50 to press and hold the bonded
substrate stack 50. This blow portion 611 is connected to an
external pressure line via a pressure line 622 in the elevating
shaft 620. The external pressure line has a solenoid valve (not
shown). The solenoid valve is ON/OFF-controlled by a control
section as needed. The elevating shaft 620 is supported by a lower
table 240 via a reciprocal guide 631.
[0228] The lower substrate holding portion 610 has a suction hole
612 for vacuum-chucking the bonded substrate stack 50. The suction
hole 612 is connected to an external vacuum line via a vacuum line
621 in the elevating shaft 620. The external vacuum line has a
solenoid valve (not shown). The solenoid valve is ON/OFF-controlled
by the control section as needed.
[0229] The lower substrate holding portion 610 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion 610,
like the above-described guide members 283 (273).
[0230] With this above arrangement, when the bonded substrate stack
50 is pressed and held by pressure of a fluid during separation
processing, an already separated portion of the bonded substrate
stack 50 is allowed to warp due to the pressure of the jet medium
injected into the bonded substrate stack 50. In addition, the warp
amount can be appropriately limited. The fluid used to hold the
bonded substrate stack 50 may be a gas such as air or a liquid such
as water.
[0231] The elevating shaft 620 is coupled to the piston rod of an
air cylinder 320 via a coupling 330. Vertical movement of the
elevating shaft 620 is controlled by the air cylinder 320. In place
of the air cylinder 320, another driving mechanism (e.g., a spring)
may be employed.
[0232] Procedures of separation processing by the separating
apparatus 600 will be described below. First, the air cylinder 320
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 610. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 610, and placed on the
substrate holding portion 610.
[0233] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 610 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0234] The solenoid valve of the external pressure line is opened
to blow a fluid from the blow portion 611 of the substrate holding
portion 610. The bonded substrate stack 50 is floated, pressed
against the upper substrate holding portion 270, and held.
[0235] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, and bonded substrate stack 50 rotate integrally.
[0236] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0237] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0238] The vacuum chuck mechanisms of the substrate holding
portions 270 and 610 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 610 to
vacuum-chuck the lower separated substrate.
[0239] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
610. The two separated substrates are spaced apart from each
other.
[0240] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0241] The robot hand 400 is inserted between the substrate and the
substrate holding portion 610. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 610 is canceled. The substrate is
transferred from the substrate holding portion 610 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0242] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0243] [Fourth Embodiment]
[0244] FIG. 6 is a view showing the schematic arrangement of a
separating apparatus according to the fourth embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 6.
[0245] A separating apparatus 700 of the fourth embodiment roughly
has an upside-down arrangement of the separating apparatus 600 of
the third embodiment. More specifically, the separating apparatus
700 has a pair of substrate holding portions 710 and 280. The
substrate holding portions 710 and 280 horizontally hold a bonded
substrate stack 50 by sandwiching it from the upper and lower
sides. A jet is ejected from a nozzle 260 and injected to a portion
near the porous layer of the bonded substrate stack 50 to separate
it into two substrates at the porous layer.
[0246] The upper substrate holding portion 710 is coupled to one
end of an elevating shaft 720. The substrate holding portion 710
causes pressure of a fluid to act on the bonded substrate stack 50
and holds the bonded substrate stack 50 by the pressure of the
fluid.
[0247] The upper substrate holding portion 710 is coupled to one
end of the elevating shaft 720. The substrate holding portion 710
has a fluid blow portion 711 for causing pressure of a fluid to act
on the bonded substrate stack 50 to press and hold the bonded
substrate stack 50. This blow portion 711 is connected to an
external pressure line via a pressure line 722 in the elevating
shaft 720. The external pressure line has a solenoid valve (not
shown) The solenoid valve is ON/OFF-controlled by a control section
as needed. The elevating shaft 720 is supported by an upper table
170 via a reciprocal guide 723.
[0248] The substrate holding portion 710 has a suction hole 712 for
vacuum-chucking the bonded substrate stack 50. This suction hole is
connected to an external vacuum line via a vacuum line 721 in the
elevating shaft 720. The external vacuum line has a solenoid valve
(not shown). The solenoid valve is ON/OFF-controlled by the control
section (not shown) as needed.
[0249] The upper substrate holding portion 710 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion 710,
like the above-described guide members 283 (273).
[0250] With this above arrangement, when the bonded substrate stack
50 is pressed and held by pressure of a fluid during separation
processing, an already separated portion of the bonded substrate
stack 50 is allowed to warp due to the pressure of the jet medium
injected into the bonded substrate stack 50. In addition, the warp
amount can be appropriately limited. The fluid used to hold the
bonded substrate stack 50 may be a gas such as air or a liquid such
as water.
[0251] The other end of the elevating shaft 720 is coupled to the
piston rod of an air cylinder 740 via a coupling 730. The air
cylinder 740 is fixed to the upper table 170.
[0252] The lower substrate holding portion 280 is coupled to one
end of a rotating shaft 750. The other end of the rotating shaft
750 is coupled to a motor 790 via a coupling 770. The rotating
shaft 750 is supported by a lower table 240 via a bearing 230. The
motor 790 is fixed to a support member 780 fixed to the lower table
240.
[0253] A vacuum line 751 connected to a suction hole 281 of the
substrate holding portion 280 extends through the rotating shaft
750. The vacuum line 751 is connected to an external vacuum line
via a ring 760. The external vacuum line has a solenoid valve (not
shown). The solenoid valve is ON/OFF-controlled by the control
section (not shown) as needed.
[0254] Procedures of separation processing by the separating
apparatus 700 will be described below. First, the air cylinder 740
retracts the piston rod to form an appropriate gap between
substrate holding portions 710 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 710 and 280, and placed on the
substrate holding portion 280.
[0255] The air cylinder 740 extends the piston rod to move the
upper substrate holding portion 710 downward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 710.
[0256] The solenoid valve of the external pressure line is opened
to blow a fluid from the blow portion 711 of the substrate holding
portion 710. The bonded substrate stack 50 is pressed against the
lower substrate holding portion 280 and held.
[0257] The motor 790 is actuated to transmit the rotational force
to the rotating shaft 750. The rotating shaft 750, substrate
holding portion 280, and bonded substrate stack 50 rotate
integrally.
[0258] While keeping a shutter 251 closed, a pump (not shown)
connected to the nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0259] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 790 is also stopped.
[0260] The vacuum chuck mechanisms of the substrate holding
portions 710 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 710 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0261] The air cylinder 740 retracts the piston rod to form a
predetermined gap between the substrate holding portions 710 and
280. The two separated substrates are spaced apart from each
other.
[0262] The robot hand 400 is inserted between the substrate and the
substrate holding portion 710. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 710 is canceled. The substrate is
transferred from the substrate holding portion 710 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0263] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0264] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0265] [Fifth Embodiment]
[0266] FIG. 7 is a view showing the schematic arrangement of a
separating apparatus according to the fifth embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 7.
[0267] A separating apparatus 800 holds a bonded substrate stack 50
by pressure of a fluid during separation. The separating apparatus
800 has a pair of substrate holding portions 270 and 810 for
holding the bonded substrate stack 50. The upper substrate holding
portion 270 and constituent elements thereof are the same as those
described above.
[0268] The lower substrate holding portion 810 is coupled to one
end of an elevating shaft 820. The other end of the elevating shaft
820 is coupled to the piston rod of an air cylinder 320 via a
coupling 330. The elevating shaft 820 is supported by a lower table
240 via a reciprocal guide The lower substrate holding portion 810
has a fluid blow portion 812 for causing pressure of a fluid to act
on the bonded substrate stack 50 to press and hold the bonded
substrate stack 50. This blow portion 812 is connected to an
external pressure line. The external pressure line has a solenoid
valve (not shown). The solenoid valve is ON/OFF-controlled by a
control section as needed.
[0269] The lower substrate holding portion 810 has a discharge line
811 for externally discharging the fluid blown from the blow
portion 812. The lower substrate holding portion 810 also has a
suction hole 814 for vacuum-chucking the bonded substrate stack 50.
The suction hole 814 has a solenoid valve 813 near its inlet to
prevent the fluid blown from the blow portion 812 from being drawn
from the suction hole 814. The suction hole 814 is connected to a
vacuum line 815 in the elevating shaft 820 via the solenoid valve
813. The suction hole 814, solenoid valve 813, and vacuum line 815
construct the vacuum chuck mechanism of the substrate holding
portion 810.
[0270] The lower substrate holding portion 810 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion 810,
like the above-described guide members 283 (273).
[0271] With this above arrangement, when the bonded substrate stack
50 is pressed and held by pressure of a fluid during separation
processing, an already separated portion of the bonded substrate
stack 50 is allowed to warp due to the pressure of the jet medium
injected into the bonded substrate stack 50. In addition, the warp
amount can be appropriately limited. The fluid used to hold the
bonded substrate stack 50 may be a gas such as air or a liquid such
as water.
[0272] Procedures of separation processing by the separating
apparatus 800 will be described below. First, the air cylinder 320
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 810. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 810, and placed on the
substrate holding portion 810.
[0273] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 810 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0274] The solenoid valve of the external pressure line is opened
to blow a fluid from the blow portion 812 of the substrate holding
portion 810. The bonded substrate stack 50 is floated, pressed
against the upper substrate holding portion 270, and held.
[0275] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, and bonded substrate stack 50 rotate integrally.
[0276] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0277] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0278] The vacuum chuck mechanisms of the substrate holding
portions 270 and 810 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 810 to
vacuum-chuck the lower separated substrate.
[0279] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
810. The two separated substrates are spaced apart from each
other.
[0280] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0281] The robot hand 400 is inserted between the substrate and the
substrate holding portion 810. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 810 is canceled. The substrate is
transferred from the substrate holding portion 810 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0282] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0283] [Sixth Embodiment]
[0284] FIG. 8 is a view showing the schematic arrangement of a
separating apparatus according to the sixth embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 8.
[0285] A separating apparatus 900 has a pair of substrate holding
portions 920 and 280. The upper substrate holding portion 920 has a
Bernoulli chuck 923. The lower substrate holding portion 280 and
constituent elements thereof are the same as those described
above.
[0286] The Bernoulli chuck 923 ejects a gas from the center of the
shade-shaped chuck radially along the shade and chucks a sample
such as a bonded substrate stack using the fact that the central
portion of the chuck has negative pressure.
[0287] The substrate holding portion 920 having the Bernoulli chuck
923 is coupled to one end of an elevating shaft 910. A gas
introduction portion 921 of the Bernoulli chuck 923 is coupled to a
pressure line 911 in the elevating shaft 910. The pressure line 911
is connected to an external pressure line via a ring 912. The
external pressure line has a solenoid valve (not shown). The
solenoid valve is ON/OFF-controlled by a control section as
needed.
[0288] The upper substrate holding portion 920 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion 920,
like the above-described guide members 283 (273).
[0289] The other end of the elevating shaft 910 is coupled to the
piston rod of an air cylinder 740 via a coupling 730. The elevating
shaft 910 is supported by an upper table 170 via a
reciprocal/rotational guide 913.
[0290] Procedures of separation processing by the separating
apparatus 900 will be described below. First, the air cylinder 740
retracts the piston rod to form an appropriate gap between
substrate holding portions 920 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 920 and 280, and placed on the
substrate holding portion 280.
[0291] The air cylinder 740 extends the piston rod to move the
upper substrate holding portion 920 downward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the Bernoulli chuck 923 of the upper substrate holding
portion 920.
[0292] The solenoid valve of the external pressure line is opened
to blow a fluid radially from the center of the Bernoulli chuck 923
of the substrate holding portion 920. The bonded substrate stack 50
is chucked.
[0293] A motor 790 is actuated to transmit the rotational force to
a rotating shaft 750. The rotating shaft 750, substrate holding
portion 280, bonded substrate stack 50, substrate holding portion
920, and rotating shaft 910 rotate integrally.
[0294] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0295] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 790 is also stopped.
[0296] While keeping the Bernoulli chuck 923 of the substrate
holding portion 920 actuating, the vacuum chuck mechanism of the
substrate holding portion 280 is actuated to cause the substrate
holding portion 920 to vacuum-chuck the upper separated substrate
and the substrate holding portion 280 to vacuum-chuck the lower
separated substrate.
[0297] The air cylinder 740 retracts the piston rod to form a
predetermined gap between the substrate holding portions 920 and
280. The two separated substrates are spaced apart from each
other.
[0298] The robot hand 400 is inserted between the substrate and the
substrate holding portion 920. The robot hand 400 chucks the
substrate. After that, chuck by the Bernoulli chuck 923 of the
substrate holding portion 920 is canceled. The substrate is
transferred from the substrate holding portion 920 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0299] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0300] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0301] As described above, when the substrate holding portion 920
uses the Bernoulli chuck 923, and the distance between the
substrate holding portion 920 and the bonded substrate stack 50 is
adjusted, the force (press force or suction force) applied to the
bonded substrate stack 50 by the substrate holding portion 920 can
be adjusted.
[0302] [Seventh Embodiment]
[0303] FIG. 9 is a view showing the schematic arrangement of a
separating apparatus according to the seventh embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 9.
[0304] A separating apparatus 1000 has a pair of substrate holding
portions 270 and 1010. The lower substrate holding portion 1010 has
a Bernoulli chuck 1013. The upper substrate holding portion 270 and
constituent elements thereof are the same as those described
above.
[0305] The Bernoulli chuck 1013 ejects a gas from the center of the
shade-shaped chuck radially along the shade and chucks a sample
such as a bonded substrate stack using the fact that the central
portion of the chuck has negative pressure.
[0306] The substrate holding portion 1010 having the Bernoulli
chuck 1013 is coupled to one end of an elevating shaft 1020. A gas
introduction portion 1011 of the Bernoulli chuck 1013 is coupled to
a pressure line 1021 in the elevating shaft 1020. The pressure line
1021 is connected to an external pressure line via a ring 1022. The
external pressure line has a solenoid valve (not shown) The
solenoid valve is ON/OFF-controlled by a control section as
needed.
[0307] The lower substrate holding portion 1010 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion
1010, like the above-described guide members 283 (273).
[0308] The other end of the elevating shaft 1020 is coupled to the
piston rod of an air cylinder 320 via a coupling 330. The elevating
shaft 1020 is supported by a lower table 240 via a
reciprocal/rotational guide 1030.
[0309] Procedures of separation processing by the separating
apparatus 1000 will be described below. First, the air cylinder 320
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 1010. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 1010, and placed on the
substrate holding portion 1010.
[0310] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 1010 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0311] The solenoid valve of the external pressure line is opened
to blow a fluid radially from the center of the Bernoulli chuck
1013 of the substrate holding portion 1010. The bonded substrate
stack 50 is chucked.
[0312] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
1010, and rotating shaft 1020 rotate integrally.
[0313] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0314] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0315] While keeping the Bernoulli chuck 1013 of the substrate
holding portion 1010 actuating, the vacuum chuck mechanism of the
substrate holding portion 270 is actuated to cause the substrate
holding portion 270 to vacuum-chuck the upper separated substrate
and the Bernoulli chuck of the substrate holding portion 1010 to
vacuum-chuck the lower separated substrate.
[0316] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
1010. The two separated substrates are spaced apart from each
other.
[0317] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, vacuum chuck by the substrate holding
portion 270 is canceled. The substrate is transferred from the
substrate holding portion 270 to the robot hand 400. The robot hand
400 conveys the substrate to a predetermined position (e.g., a
cassette).
[0318] The robot hand 400 is inserted between the substrate and the
Bernoulli chuck 1013 of the substrate holding portion 1010. The
robot hand 400 chucks the substrate. After that, chuck by the
Bernoulli chuck 1013 of the substrate holding portion 1010 is
canceled. The substrate is transferred from the substrate holding
portion 1010 to the robot hand 400. The robot hand 400 conveys the
substrate to a predetermined position (e.g., a cassette). The two
separated substrates may be received by the robot hand in the
reverse order or simultaneously received by two robot hands (not
shown).
[0319] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0320] As described above, when the substrate holding portion 1010
uses the Bernoulli chuck 1013, and the distance between the
substrate holding portion 1010 and the bonded substrate stack 50 is
adjusted, the force (press force or suction force) applied to the
bonded substrate stack 50 by the substrate holding portion 1010 can
be adjusted.
[0321] [Eighth Embodiment]
[0322] FIG. 10 is a view showing the schematic arrangement of a
separating apparatus according to the eighth embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 10.
[0323] A separating apparatus 1100 has a pair of substrate holding
portions 270 and 280. Both the pair of substrate holding portions
270 and 280 are brought into contact with a bonded substrate stack
50 to press and hold the bonded substrate stack 50. As the force
for pressing the bonded substrate stack 50, pressure of a fluid (a
gas or a liquid) is used.
[0324] The lower substrate holding portion 280 is coupled to a
rotating shaft 1113. The rotating shaft 1113 is supported by a
lower support 1110 via a reciprocal/rotational guide 1112. The
substrate holding portion 280 has a suction hole 281 for
vacuum-chucking the bonded substrate stack 50. The suction hole 281
is connected to a vacuum line 1116 in the rotating shaft 1113. The
vacuum line 1116 is connected to an external vacuum line via a ring
1114. The external vacuum line has a solenoid valve (not shown).
The solenoid valve is ON/OFF-controlled by a control section as
needed.
[0325] The lower support 1110 has a fluid blow portion 1111. The
blow portion 1111 is connected to an external pressure line. The
external pressure line has a solenoid valve (not shown). The
solenoid valve is ON/OFF-controlled by the control section as
needed.
[0326] The lower support 1110 is coupled to an elevating table 1115
fixed to the piston rod of an air cylinder 1101 and vertically
moves in accordance with the vertical movement of the elevating
table 1115. The air cylinder 1101 is fixed to a support table
1102.
[0327] The upper substrate holding portion 270 and constituent
elements thereof are the same as those described above.
[0328] When the bonded substrate stack 50 is held by the above
arrangement, warp of the bonded substrate stack 50 during
separation is more limited than in the separating apparatus shown
in FIG. 5 or 6. The stability of the bonded substrate stack 50 in
separation can be increased, and for example, swing of the bonded
substrate stack 50 can be prevented.
[0329] Procedures of separation processing by the separating
apparatus 1100 will be described below. First, the air cylinder
1101 retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 280, and placed on the
substrate holding portion 280.
[0330] The air cylinder 1101 extends the piston rod to move the
lower substrate holding portion 280 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0331] The solenoid valve of the external pressure line is opened
to blow a fluid from the blow portion 1111 of the lower support
1110. The lower substrate holding portion 280 is moved upward to
press and hold the bonded substrate stack 50.
[0332] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
280, and rotating shaft 1113 rotate integrally.
[0333] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0334] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0335] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0336] The air cylinder 1101 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0337] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0338] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0339] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0340] [Ninth Embodiment]
[0341] FIG. 11 is a view showing the schematic arrangement of a
separating apparatus according to the ninth embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 11.
[0342] A separating apparatus 1200 has a pair of substrate holding
portions 270 and 280. Both the pair of substrate holding portions
270 and 280 are brought into contact with a bonded substrate stack
50 to press and hold the bonded substrate stack 50. As the force
for pressing the bonded substrate stack 50, pressure of a fluid (a
gas or a liquid) is used.
[0343] The lower substrate holding portion 280 is coupled to a
rotating shaft 1220. The rotating shaft 1220 is supported by a
lower support 1210 via a reciprocal/rotational guide 1213. The
substrate holding portion 280 has a suction hole 281 for
vacuum-chucking the bonded substrate stack 50. The suction hole 281
is connected to a vacuum line 1221 in the rotating shaft 1220. The
vacuum line 1221 is connected to an external vacuum line via a ring
1222. The external vacuum line has a solenoid valve (not shown).
The solenoid valve is ON/OFF-controlled by a control section as
needed.
[0344] The lower support 1210 has a fluid blow portion 1212. The
blow portion 1212 is connected to an external pressure line. The
external pressure line has a solenoid valve (not shown) . The
solenoid valve is ON/OFF-controlled by the control section (not
shown) as needed. The lower support 1210 has a discharge line 1211
for externally discharging the fluid blown from the blow portion
1212.
[0345] The lower support 1210 is coupled to an elevating table 1115
fixed to the piston rod of an air cylinder 1101 and vertically
moves in accordance with the vertical movement of the elevating
table 1115.
[0346] The arrangement of the upper substrate holding portion 270
and constituent elements thereof is the same as described
above.
[0347] When the bonded substrate stack 50 is held by the above
arrangement, warp of the bonded substrate stack 50 during
separation is more limited than in the separating apparatus shown
in FIG. 7. The stability of the bonded substrate stack 50 in
separation can be increased, and for example, swing of the bonded
substrate stack 50 can be prevented.
[0348] Procedures of separation processing by the separating
apparatus 1200 will be described below. First, the air cylinder
1101 retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 280, and placed on the
substrate holding portion 280.
[0349] The air cylinder 1101 extends the piston rod to move the
lower substrate holding portion 280 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0350] The solenoid valve of the external pressure line is opened
to blow a fluid from the blow portion 1212 of the lower support
1210. The lower substrate holding portion 280 is moved upward to
press and hold the bonded substrate stack 50.
[0351] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
280, and rotating shaft 1220 rotate integrally.
[0352] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0353] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0354] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0355] The air cylinder 1101 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0356] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0357] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0358] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0359] [10th Embodiment]
[0360] FIG. 12 is a view showing the schematic arrangement of a
separating apparatus according to the 10th embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 12.
[0361] A separating apparatus 1300 has a pair of substrate holding
portions 270 and 1310. Both the pair of substrate holding portions
270 and 1310 are brought into contact with a bonded substrate stack
50 to press and hold the bonded substrate stack 50. The force
applied to the bonded substrate stack 50 is controlled by a
Bernoulli chuck 1320.
[0362] The lower substrate holding portion 1310 has a suction hole
1312 for vacuum-chucking the bonded substrate stack 50. The suction
hole 1312 is coupled to one end of a solenoid valve 1311 controlled
by a control section (not shown). The solenoid valve 1311 is
attached to the substrate holding portion 1310 via a bearing 1313.
This allows the substrate holding portion 1310 to rotate while
fixing the solenoid valve 1311. When the substrate holding portion
1310 is rotated while fixing the solenoid valve 1311, the control
line for controlling the solenoid valve 1311 can be prevented from
winding as the substrate holding portion 1310 rotates. The other
end of the solenoid valve 1311 communicates with the downside.
[0363] The lower substrate holding portion 1310 has, at its outer
peripheral portion, a plurality of guide members for preventing a
bonded substrate stack from causing a positional shift or
projecting from the substrate holding portions during separation,
like the substrate holding portion shown in FIG. 3. The guide
members are preferably arranged such that the robot hand can be
inserted between a substrate and the substrate holding portion
1310, like the above-described guide members 283 (273).
[0364] The lower substrate holding portion 1310 is supported by a
support formed from the Bernoulli chuck 1320. The Bernoulli chuck
1320 ejects a gas from the center of the shade-shaped chuck
radially along the shade and applies a force to the substrate
holding portion 1310 using the fact that the central portion of the
chuck has negative pressure.
[0365] The Bernoulli chuck 1320 is coupled to one end of an
elevating shaft 1020. A gas introduction portion 1321 of the
Bernoulli chuck 1320 is connected to a pressure line 1021 in the
elevating shaft 1020. The pressure line 1021 is connected to an
external pressure line via a ring 1022. The external pressure line
has a solenoid valve (not shown) The solenoid valve is
ON/OFF-controlled by a control section as needed.
[0366] The other end of the elevating shaft 1020 is coupled to the
piston rod of an air cylinder 320 via a coupling 330. The elevating
shaft 1020 is supported by a lower table 240 via a
reciprocal/rotational guide 1030.
[0367] Procedures of separation processing by the separating
apparatus 1300 will be described below. First, the air cylinder 320
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 1310. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 1310, and placed on the
substrate holding portion 1310.
[0368] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 1310 upward until a predetermined
gap is formed between the upper surface of the bonded substrate
stack 50 and the support portion of the upper substrate holding
portion 270.
[0369] The solenoid valve of the external pressure line is opened
to blow a fluid from the gas introduction portion 1321 of the
Bernoulli chuck 1320. A predetermined force is applied to the lower
substrate holding portion 1310 such that the substrate holding
portions 270 and 1310 sandwiches and holds the bonded substrate
stack 50 from both sides. At this time, to make the bonded
substrate stack 50 freely warp, the solenoid valve 1311 is
preferably closed. However, the solenoid valve 1311 may be
opened.
[0370] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
1310, Bernoulli chuck 1320, and rotating shaft 1020 rotate
integrally.
[0371] While keeping a shutter 251 closed, a pump (not shown)
connected to the nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0372] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0373] The vacuum chuck mechanism of the substrate holding portion
270 is actuated, and the solenoid valve 1311 of the Bernoulli chuck
1320 is opened to cause the substrate holding portion 270 to chuck
the upper separated substrate and the substrate holding portion
1310 to chuck the lower separated substrate. When the solenoid
valve 1311 is open, the substrate holding portion 1310 can chuck
the substrate because the space under the solenoid valve 1311 has
negative pressure due to the Bernoulli chuck 1320.
[0374] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
1310. The two separated substrates are spaced apart from each
other.
[0375] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, vacuum chuck by the substrate holding
portion 270 is canceled. The substrate is transferred from the
substrate holding portion 270 to the robot hand 400. The robot hand
400 conveys the substrate to a predetermined position (e.g., a
cassette).
[0376] The robot hand 400 is inserted between the substrate and the
substrate holding portion 1310. The robot hand 400 chucks the
substrate. After that, the solenoid valve 1311 of the Bernoulli
chuck 1320 is closed to cancel chuck of the substrate by the
substrate holding portion 1310. The substrate is transferred from
the substrate holding portion 1310 to the robot hand 400. The robot
hand 400 conveys the substrate to a predetermined position (e.g., a
cassette). The two separated substrates may be received by the
robot hand in the reverse order or simultaneously received by two
robot hands (not shown).
[0377] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0378] [11th Embodiment]
[0379] FIG. 13 is a view showing the schematic arrangement of a
separating apparatus according to the 11th embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 13.
[0380] A separating apparatus 1400 has a pair of substrate holding
portions 270 and 280. Both the pair of substrate holding portions
270 and 280 are brought into contact with a bonded substrate stack
50 to press and hold the bonded substrate stack 50. As the force
for pressing the bonded substrate stack 50, a magnetic force is
used.
[0381] The lower substrate holding portion 280 is coupled to a
rotating shaft 1113. The rotating shaft 1113 is supported by a
lower support 1401 via a reciprocal/rotational guide 1112. The
substrate holding portion 280 has a suction hole 281 for
vacuum-chucking the bonded substrate stack 50. The suction hole 281
is connected to a vacuum line 1116 in the rotating shaft 1113. The
vacuum line 1116 is connected to an external vacuum line via a ring
1114. The external vacuum line has a solenoid valve (not shown) The
solenoid valve is ON/OFF-controlled by a control section as
needed.
[0382] A magnet 1402 is attached to the lower substrate holding
portion 280. A magnet 1403 is attached to the upper surface of the
lower support 1401 at a position opposing the magnet 1402. An
upward force acts on the lower substrate holding portion 280 due to
the magnetic force acting between the magnets 1402 and 1403. As a
consequence, the bonded substrate stack 50 is pressed.
[0383] At least one of the magnets 1402 and 1403 may be an
electromagnet. In this case, the force for pressing the bonded
substrate stack 50 can be easily adjusted. In addition, the press
force can be appropriately changed as separation progresses.
[0384] Procedures of separation processing by the separating
apparatus 1400 will be described below. First, an air cylinder 1101
retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 280, and placed on the
substrate holding portion 280.
[0385] The air cylinder 1101 extends the piston rod to move the
lower support 1401 upward. Accordingly, the lower substrate holding
portion 280 is moved upward by the magnetic force. The substrate
holding portion 280 presses and holds the bonded substrate stack
50.
[0386] A motor 110 is actuated to transmit the rotational force to
a rotating shaft 140. The rotating shaft 140, substrate holding
portion 270, bonded substrate stack 50, substrate holding portion
280, and rotating shaft 1113 rotate integrally.
[0387] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0388] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0389] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0390] The air cylinder 1101 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0391] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0392] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0393] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are separated. Instead, a mechanism for ejecting a jet
used to space the two substrates apart from each other may be
independently prepared.
[0394] [12th Embodiment]
[0395] FIG. 14 is a view showing the schematic arrangement of a
separating apparatus according to the 12th embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 14.
[0396] A separating apparatus 1500 has a pair of substrate holding
portions 270 and 280. The substrate holding portions 270 and 280
horizontally hold a bonded substrate stack 50 by sandwiching it
from the upper and lower sides. A jet is ejected from a nozzle 260
and injected to a portion near the porous layer of the bonded
substrate stack 50, thereby separating the bonded substrate stack
50 into two substrates at the porous layer. The separating
apparatus 1500 controls the position of the nozzle 260 with
reference to the lower substrate holding portion 280.
[0397] The upper substrate holding portion 270 is coupled to one
end of a rotating shaft 1503. The other end of the rotating shaft
1503 is coupled to the piston rod of an air cylinder 1501 via a
coupling 1502. A vacuum line 1504 for vacuum-chucking the bonded
substrate stack 50 on the substrate holding portion 270 extends
through the rotating shaft 1503. The vacuum line 1504 is connected
to an external vacuum line via a ring 1505. The external vacuum
line has a solenoid valve (not shown). The solenoid valve is
ON/OFF-controlled by the control section as needed. The substrate
holding portion 270 has a suction hole 271 for vacuum-chucking the
bonded substrate stack 50. The suction hole 271 is connected to the
vacuum line 1504. The suction hole 271, vacuum line 1504, and
solenoid valve construct the vacuum chuck mechanism of the
substrate holding portion 270. The rotating shaft 1503 is supported
by an upper table 170 via a reciprocal/rotational guide 1506.
[0398] The lower substrate holding portion 280 is coupled to one
end of a rotating shaft 750. The other end of the rotating shaft
750 is coupled to the rotating shaft of a motor 790 via a coupling
770. The motor 790 is fixed to a support member 780 fixed to a
lower table 240. The motor 790 is controlled by the control
section.
[0399] A vacuum line 751 for vacuum-chucking the bonded substrate
stack 50 on the substrate holding portion 280 extends through the
rotating shaft 750. The vacuum line 751 is connected to an external
vacuum line via a ring 760. The external vacuum line has a solenoid
valve (not shown). The solenoid valve is ON/OFF-controlled by the
control section as needed. The substrate holding portion 280 has a
suction hole 281 for vacuum-chucking the bonded substrate stack 50.
The suction hole 281 is connected to the vacuum line 751. The
suction hole 281, vacuum line 751, and solenoid valve construct the
vacuum chuck mechanism of the substrate holding portion 280. The
rotating shaft 750 is supported by the lower table 240 via a
bearing 230.
[0400] The nozzle 260 is attached to, e.g., the lower table 240 via
a support member (not shown). In the separating apparatus 1500 of
the 12th embodiment, the position of the nozzle 260 is controlled
with reference to the position of the lower substrate holding
portion 280. A shutter 251 driven by a motor 250 is inserted
between the nozzle 260 and the substrate holding portions 270 and
280. When the shutter 251 is open, and a jet is ejected from the
nozzle 260, the jet can be injected into the bonded substrate stack
50. When the shutter 251 is closed, jet injection into the bonded
substrate stack 50 can be stopped.
[0401] Procedures of separation processing by the separating
apparatus 1500 will be described below. First, the air cylinder
1501 retracts the piston rod to form an appropriate gap between
substrate holding portions 270 and 280. In this state, the bonded
substrate stack 50 is horizontally supported by a robot hand 400
from the lower side, inserted to a predetermined position between
the substrate holding portions 270 and 280, and placed on the
substrate holding portion 280.
[0402] The air cylinder 1501 extends the piston rod to move the
upper substrate holding portion 270 downward. The substrate holding
portions 270 and 280 press and hold the bonded substrate stack
50.
[0403] The motor 790 is actuated to transmit the rotational force
to the rotating shaft 750. The rotating shaft 750, substrate
holding portion 280, bonded substrate stack 50, substrate holding
portion 270, and rotating shaft 1503 rotate integrally.
[0404] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0405] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 790 is also stopped.
[0406] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0407] The air cylinder 1501 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0408] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0409] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0410] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0411] [13th Embodiment]
[0412] FIG. 15 is a view showing the schematic arrangement of a
separating apparatus according to the 13th embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 15.
[0413] A separating apparatus 1600 has a pair of substrate holding
portions 270 and 280. A press force is applied to both of the pair
of substrate holding portions 270 and 280 such that a bonded
substrate stack is pressed and held from both sides.
[0414] The upper substrate holding portion 270 is coupled to one
end of a rotating shaft 1503. The other end of the rotating shaft
1503 is coupled to a gear 1601. The gear 1601 is coupled to the
piston rod of an air cylinder 1501 via a coupling 1502. A vacuum
line 1504 for vacuum-chucking a bonded substrate stack 50 on the
substrate holding portion 270 extends through the rotating shaft
1503. The vacuum line 1504 is connected to an external vacuum line
via a ring 1505. The external vacuum line has a solenoid valve (not
shown). The solenoid valve is ON/OFF-controlled by the control
section as needed. The substrate holding portion 270 has a suction
hole 271 for vacuum-chucking the bonded substrate stack 50. The
suction hole 271 is connected to the vacuum line 1504. The suction
hole 271, vacuum line 1504, and solenoid valve construct the vacuum
chuck mechanism of the substrate holding portion 270. The rotating
shaft 1503 is supported by an upper table 170 via a
reciprocal/rotational guide 1506.
[0415] The gear 1601 engages with a gear 1604 axially supported by
a bearing 1605. The gear 1604 is coupled to a motor 1602 via a
coupling 1603. The motor 1602 is controlled by the control section.
The rotational force generated by the motor 1602 is transmitted to
the rotating shaft 1503 via the gears 1604 and 1601 to rotate the
substrate holding portion 270.
[0416] The lower substrate holding portion 280 is coupled to one
end of a rotating shaft 180. The other end of the rotating shaft
180 is coupled to the piston rod of an air cylinder 320 via a
coupling 330. A vacuum line 181 for vacuum-chucking the bonded
substrate stack 50 on the substrate holding portion 280 extends
through the rotating shaft 180. The vacuum line 181 is connected to
an external vacuum line via a ring 190. The external vacuum line
has a solenoid valve (not shown). The solenoid valve is
ON/OFF-controlled by the control section as needed. The substrate
holding portion 280 has a suction hole 281 for vacuum-chucking the
bonded substrate stack 50. The suction hole 281 is connected to the
vacuum line 181. The suction hole 281, vacuum line 181, and
solenoid valve construct the vacuum chuck mechanism of the
substrate holding portion 280. The rotating shaft 140 is supported
by a lower table 240 via a reciprocal/rotational guide 230.
[0417] Procedures of separation processing by the separating
apparatus 1600 will be described below. First, the air cylinder
1501 and/or air cylinder 320 retracts the piston rod to form an
appropriate gap between substrate holding portions 270 and 280. In
this state, the bonded substrate stack 50 is horizontally supported
by a robot hand 400 from the lower side and inserted to a
predetermined position between the substrate holding portions 270
and 280.
[0418] The air cylinder 1501 and/or air cylinder 320 extends the
piston rod. The substrate holding portions 270 and 280 press and
hold the bonded substrate stack 50 from both sides.
[0419] The motor 1602 is actuated to transmit the rotational force
to the rotating shaft 1503. The rotating shaft 1503, substrate
holding portion 270, bonded substrate stack 50, substrate holding
portion 280, and rotating shaft 180 rotate integrally.
[0420] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0421] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0422] The vacuum chuck mechanisms of the- substrate holding
portions 270 and 280 are actuated (solenoid valves are opened) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0423] The air cylinder 1501 and/or air cylinder 320 retracts the
piston rod to form a predetermined gap between the substrate
holding portions 270 and 280. The two separated substrates are
spaced apart from each other.
[0424] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0425] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0426] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0427] [14th Embodiment]
[0428] FIGS. 16 to 19 are views showing the schematic arrangement
of a separating apparatus according to the 14th embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIGS. 16 to
19.
[0429] A separating apparatus 1700 places a weight on a bonded
substrate stack 50 to press the bonded substrate stack 50 from the
upper side, and in this state, separates the bonded substrate stack
50. In this embodiment, two weights 1705 and 1706 are used, and the
press force to be applied to the bonded substrate stack 50 is
switched as separation progresses. It is also effective to use
three or more weights and switch stepwise the press force to be
applied to the bonded substrate stack 50 as separation progresses.
Alternatively, only one weight may be used such that a
predetermined press force is applied to the bonded substrate stack
50 during separation processing.
[0430] The separating apparatus 1700 has an operation section 1703.
Application of a press force to the bonded substrate stack 50 is
controlled by vertically moving the operation section 1703. The
operation section 1703 has a first hanger portion 1703a for
supporting the first weight 1705 in a suspended state, and a second
hanger portion 1703b for supporting the second weight 1706 in the
suspended state.
[0431] The operation section 1703 is coupled to the piston rod of
an air cylinder 1701 via a coupling 1702 and vertically moved by
the air cylinder 1701. When the operation section 1703 is moved
downward to the first step, the total gravity acting on the first
weight 1705 is applied to the bonded substrate stack 50. When the
operation section 1703 is moved downward to the second step, the
total gravity acting on the second weight 1706 is applied to the
first weight 1705. At this time, the total gravity acting on the
first weight 1705 and second weight 1706 is applied to the bonded
substrate stack 50. With this arrangement, the press force to be
applied to the bonded substrate stack 50 can be controlled in two
steps. When the numbers of weights and hanger portions are
increased, the press force to be applied to the bonded substrate
stack 50 can be controlled in more steps.
[0432] The operation section 1703 has, at its lower end, a suction
hole 1704 for vacuum-chucking the bonded substrate stack 50. The
suction hole 1704 is connected to an external vacuum line. The
external vacuum line has a solenoid valve (not shown). The solenoid
valve is ON/OFF-controlled by the control section as needed.
[0433] A lower substrate holding portion 280 is coupled to one end
of a rotating shaft 750. The other end of the rotating shaft 750 is
coupled to a motor 790 via a coupling 770. The rotating shaft 750
is supported by a lower table 240 via a bearing 230. The motor 790
is fixed to a support member 780 fixed to the lower table 240.
[0434] A vacuum line 751 connected to a suction hole 281 of the
substrate holding portion 280 extends through the rotating shaft
750. The vacuum line 751 is connected to an external vacuum line
via a ring 760. The external vacuum line has a solenoid valve (not
shown). The solenoid valve is ON/OFF-controlled by the control
section as needed.
[0435] FIG. 20 is a perspective view showing the schematic
arrangement of the operation section 1703 shown in FIGS. 16 to 19.
The operation section 1703 has, at its outer peripheral portion, a
plurality of guide members 1703c for preventing a bonded substrate
stack from causing a positional shift or projecting from the
operation section 1703 and substrate holding portion 280 during
separation.
[0436] To make it possible for a robot hand 400 of a conveyor robot
to chuck the back side surface of the upper separated substrate and
receive the substrate from the operation section 1703, the
plurality of guide members 1703c are preferably arranged at an
appropriate interval such that the robot hand 400 can
enter/leave.
[0437] The operation section 1703 also has convex support portions
1703d such that the robot hand 400 can be inserted between the
substrate and the lower end of the operation section 1703 while
chucking the substrate.
[0438] Procedures of separation processing by the separating
apparatus 1700 will be described below sequentially with reference
to FIGS. 16 to 19. First, the air cylinder 1701 retracts the piston
rod to form an appropriate gap between the substrate holding
portion 280 and the lower end of the operation section 1703. The
bonded substrate stack 50 is horizontally supported by the robot
hand 400 from the lower side, inserted to a predetermined position
between the substrate holding portion 280 and the lower end of the
operation section 1703, and placed on the substrate holding portion
280.
[0439] As shown in FIG. 17, the air cylinder 1701 extends the
piston rod to move the operation section 1703 downward to the first
step, thereby applying the total gravity acting on the first weight
1705 to the bonded substrate stack 50.
[0440] While keeping a shutter 251 closed, a pump (not shown)
connected to a nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50 (first step of
separation).
[0441] When separation of the outer peripheral portion (portion
around the central portion) of the bonded substrate stack 50 is
ended, the air cylinder 1701 further extends the piston rod to move
the operation section 1703 to the second step, as shown in FIG. 18,
while continuing separation. The total gravity acting on the first
weight 1705 and second weight 1706 is applied to the bonded
substrate stack 50 (second step of separation) . The bonded
substrate stack 50 is pressed by a force larger than that in the
first step of separation. The first weight 1705 preferably weighs,
e.g., about 100 g, and the second weight 1706 preferably weighs,
e.g., about 150 g.
[0442] In this embodiment in which the bonded substrate stack 50 is
separated while rotating it, at the step (first step of separation)
of separating the outer peripheral portion of the bonded substrate
stack 50, the bonded substrate stack 50 is pressed by a relatively
small force. At the step (second step of separation) of separating
the central portion of the bonded substrate stack 50, the bonded
substrate stack 50 is pressed by a relatively large force. The
reason for this is as follows.
[0443] When the outer peripheral portion of the bonded substrate
stack 50 is to be separated (first step), the area of the separated
portion is small, and the jet medium injected into the bonded
substrate stack 50 is efficiently discharged. For this reason, the
force (separation force) acting to space the already separated
portions apart from each other is relatively small. On the other
hand, when the central portion of the bonded substrate stack 50 is
to be separated (second step), the area of the separated portion is
large, and the jet medium injected into the bonded substrate stack
50 is hardly discharged. Hence, the press force required to stably
hold the bonded substrate stack 50 is larger in the second step
than in the first step. At the final stage of the second step,
i.e., final stage of separation, defects may be generated because
the unseparated portion is separated at once. Hence, separation
preferably progresses moderately at the final stage of
separation.
[0444] In separating the bonded substrate stack 50 without rotating
it, when the outer peripheral portion of the bonded substrate stack
50 is to be separated (first step of separation), the bonded
substrate stack is preferably pressed by a relatively large force.
When the central portion of the bonded substrate stack 50 is to be
separated (second step of separation), the bonded substrate stack
is preferably pressed by a relatively small force.
[0445] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. When the motor 110 is being actuated, the operation of the
motor 110 is also stopped.
[0446] The vacuum chuck mechanisms of the operation section 1703
and substrate holding portion 280 are actuated to cause the
operation section 1703 to chuck the upper separated substrate and
the substrate holding portion 280 to chuck the lower separated
substrate.
[0447] As shown in FIG. 19, the air cylinder 1701 retracts the
piston rod to form an appropriate gap between the substrate holding
portion 280 and the lower end of the operation section 1703. The
two separated substrates are spaced apart from each other.
[0448] The robot hand 400 is inserted between the substrate and the
lower end of the operation section 1703. The robot hand 400 chucks
the substrate. After that, chuck by the vacuum chuck mechanism of
the operation section 1703 is canceled. The substrate is
transferred from the operation section 1703 to the robot hand 400.
The robot hand 400 conveys the substrate to a predetermined
position (e.g., a cassette).
[0449] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0450] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates may be
independently prepared.
[0451] [15th Embodiment]
[0452] FIG. 21 is a view showing the schematic arrangement of a
separating apparatus according to the 15th embodiment of the
present invention. A separating apparatus 1800 has a first
substrate holding portion 1801 having, at its outer peripheral
portion, a plurality of suction holes 1802 for chucking a bonded
substrate stack, and a second substrate holding portion 1809
opposing the first substrate holding portion 1801.
[0453] The lower substrate holding portion 1801 has a convex
support portion 1803 for forming a gap between a bonded substrate
stack 50 and the surface of the substrate holding portion 1801 to
receive a robot hand 400. To effectively chuck the bonded substrate
stack 50 on the substrate holding portion 1801 even at the initial
stage of separation, the convex support portion 1803 preferably has
a suction hole.
[0454] The support portion 1803 is preferably located, e.g., near
the central portion of the surface of the substrate holding portion
1801. When the support portion 1803 is formed, the robot hand 400
can horizontally support the bonded substrate stack 50 from the
lower side and transfer it to the substrate holding portion 1801.
In addition, when the support portion 1803 is formed, after
separation is ended, the robot hand 400 can be inserted between the
lower substrate and the substrate holding portion 1801. The robot
hand 400 can support the substrate from the lower side and receive
it. Hence, the risk of dropping the substrate can be minimized.
[0455] The substrate holding portion 1801 is coupled to one end of
a rotating shaft 1804. The rotating shaft 1804 is supported by a
support table 1820 via a bearing 1806. The bearing 1806 has, at its
upper portion, a sealing member 1805 for sealing the opening
portion formed in the support table 1820 to pass the rotating shaft
1804. A vacuum line 1807 extends through the rotating shaft 1804.
The vacuum line 1807 is connected to the plurality of suction holes
1802 of the substrate holding portion 1801. The vacuum line 1807 is
also connected to an external vacuum line via a ring 1808. The
rotating shaft 1804 is coupled to a rotation source (not shown) to
be rotated by a rotational force applied from the rotation
source.
[0456] The substrate holding portion 1809 is located above the
substrate holding portion 1801. The substrate holding portion 1809
is driven by a driving mechanism 1810 to vertically move and also
rotatably axially supported by the driving mechanism 1810. The
substrate holding portion 1809 preferably has a chuck mechanism for
chucking the bonded substrate stack 50 or separated substrate.
[0457] A nozzle 1811 is attached to, e.g., the support table 1820
via a support member (not shown). In the separating apparatus 1800,
the position of the nozzle 1811 is controlled with reference to the
position of the substrate holding portion 1801. A shutter 1812 is
inserted between the nozzle 1811 and the substrate holding portion
1801. When the shutter 1812 is open, and a jet is ejected from the
nozzle 1811, the jet can be injected into the bonded substrate
stack 50. When the shutter 1812 is closed, jet injection into the
bonded substrate stack 50 can be stopped.
[0458] Procedures of separation processing by the separating
apparatus 1800 will be described below. First, the driving
mechanism 1810 moves the substrate holding portion 1809 upward to
form an appropriate gap between the substrate holding portions 1809
and 1801. In this state, the bonded substrate stack 50 is
horizontally supported by the robot hand 400 from the lower side
and placed on the support portion 1803 of the substrate holding
portion 1801. The driving mechanism 1810 moves the substrate
holding portion 1809 downward to cause it to press the bonded
substrate stack 50. The bonded substrate stack 50 is pressed and
held by the substrate holding portions 1809 and 1801 from both
sides.
[0459] The pressure in the suction holes 1802 of the substrate
holding portion 1801 is reduced via the vacuum line 1807 to cause
the substrate holding portion 1801 to chuck the bonded substrate
stack 50. The chuck mechanism of the substrate holding portion 1809
may be actuated at this time.
[0460] The rotation source (not shown) is actuated to transmit the
rotational force to the rotating shaft 1804. The rotating shaft
1804, substrate holding portion 1801, bonded substrate stack 50,
and substrate holding portion 1809 rotate integrally.
[0461] While keeping the shutter 1812 closed, a pump (not shown)
connected to the nozzle 1811 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 1811. A high-pressure jet is
ejected from the nozzle 1811. When the jet stabilizes, the shutter
1812 is opened. The jet ejected from the nozzle 1811 is
continuously injected into the porous layer of the bonded substrate
stack 50 to start separating the bonded substrate stack 50.
[0462] When the outer peripheral portion of the bonded substrate
stack 50 is separated, the separated portions warp and are spaced
apart from each other. The separated portion is chucked by the
substrate holding portion 1801. When the entire outer peripheral
portion of the bonded substrate stack 50 is separated, the lower
substrate of the bonded substrate stack 50 is chucked by the
substrate holding portion 1801 in a shade form. In this state,
since the force for holding the bonded substrate stack 50 is
sufficient, holding by the substrate holding portion 1809 can be
canceled by moving the substrate holding portion 1809 upward.
[0463] When separation of the bonded substrate stack 50 is ended,
the shutter 1812 is closed, and the pump connected to the nozzle
1811 is stopped to stop jet injection into the bonded substrate
stack 50. Rotation of the bonded substrate stack 50 is stopped by
stopping driving the rotating shaft 1804.
[0464] In a state wherein the chuck mechanisms of the substrate
holding portions 1809 and 1801 are actuated, i.e., the substrate
holding portion 1809 is caused to chuck the upper separated
substrate, and the substrate holding portion 1801 is caused to
chuck the lower separated substrate, the substrate holding portion
1809 is moved upward by the driving mechanism 1810. The two
separated substrates are spaced apart from each other.
[0465] The robot hand 400 receives the substrate held by the
substrate holding portion 1809 and conveys the substrate to a
predetermined position (e.g., a cassette).
[0466] Chuck of the substrate by the vacuum chuck mechanism of the
substrate holding portion 1801 is canceled. The robot hand 400 is
inserted between the substrate and the substrate holding portion
1801. The substrate is transferred from the substrate holding
portion 1801 to the robot hand 400. The robot hand 400 conveys the
substrate to a predetermined position (e.g., a cassette). The two
separated substrates may be received by the robot hand in the
reverse order or simultaneously received by two robot hands (not
shown).
[0467] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to separate the two substrates with a
small force, a jet is preferably supplied from the nozzle 1811 to
the gap between the two substrates. In this case, the jet from the
nozzle 1811 is stopped after the two substrates are separated.
Instead, a mechanism for ejecting a jet used to separate the two
substrates may be independently prepared.
[0468] [16th Embodiment]
[0469] FIGS. 22 to 24 are views showing the schematic arrangement
of a separating apparatus according to the 16th embodiment of the
present invention. A separating apparatus 1900 has a pair of
substrate holding portions 1909 and 1901. The substrate holding
portions 1909 and 1901 horizontally hold a bonded substrate stack
50 by sandwiching it from the upper and lower sides. A jet is
ejected from a nozzle 1921 and injected to a portion near the
porous layer of the bonded substrate stack 50, thereby separating
the bonded substrate stack 50 into two substrates at the porous
layer.
[0470] In the separating apparatus 1900, when the outer peripheral
portion (portion around the central portion) of the bonded
substrate stack 50 is to be separated, the bonded substrate stack
50 is preferably chucked by the substrate holding portions 1909 and
1901. When the central portion is to be separated, chuck of the
bonded substrate stack 50 is preferably canceled. This effectively
prevents any defects in separation. However, this embodiment does
not negate the embodiments that have been described above. In the
above-described embodiments as well, samples such as bonded
substrate stacks can be separated at a high yield. The 16th
embodiment intends to prevent any defects in separating the bonded
substrate stack 50 under a specific condition using substrate
holding portions having specific shapes and dimensions.
[0471] The lower substrate holding portion 1901 has a convex
support portion 1903 for forming a gap between the bonded substrate
stack 50 and the surface of the substrate holding portion 1901 to
receive a robot hand 400. The support portion 1903 has a suction
hole 1902 for vacuum-chucking the bonded substrate stack 50. The
substrate holding portion 1901 has a shift prevention member 1911
around the support portion 1903. The shift prevention member 1911
formed from, e.g., rubber or a resin prevents the bonded substrate
stack 50 from moving in the planar direction. With the shift
prevention member 1911, the bonded substrate stack 50 can be held
by a small press force or suction force.
[0472] The substrate holding portion 1901 is coupled to one end of
a rotating shaft 1904. The rotating shaft 1904 is supported by a
support table 1920 via a bearing 1906. The bearing 1906 has, at its
upper portion, a sealing member 1905 for sealing the opening
portion formed in the support table 1920 to pass the rotating shaft
1904. A vacuum line 1907 extends through the rotating shaft 1904.
The vacuum line 1907 is connected to the suction hole 1902 of the
substrate holding portion 1901. The vacuum line 1907 is also
connected to an external vacuum line via a ring 1908. The rotating
shaft 1904 is coupled to a rotation source (not shown) to be
rotated by a rotational force applied from the rotation source.
[0473] The substrate holding portion 1909 is located above the
substrate holding portion 1901. The substrate holding portion 1909
is driven by a driving mechanism 1910 to vertically move and also
rotatably axially supported by the driving mechanism 1910.
[0474] The upper substrate holding portion 1909 has a convex
support portion 1912 for forming a gap between the bonded substrate
stack 50 and the surface of the substrate holding portion 1901 to
receive the robot hand 400. The support portion 1912 has a suction
hole 1914 for vacuum-chucking the bonded substrate stack 50. The
substrate holding portion 1909 has a shift prevention member 1913
around the support portion 1912. The shift prevention member 1913
formed from, e.g., rubber or a resin prevents the bonded substrate
stack 50 from moving in the planar direction. With the shift
prevention member 1913, the bonded substrate stack 50 can be held
by a small press force or suction force.
[0475] The nozzle 1921 is attached to, e.g., the support table 1920
via a support member (not shown). In the separating apparatus 1900,
the position of the nozzle 1921 is controlled with reference to the
position of the substrate holding portion 1901. A shutter 1922 is
inserted between the nozzle 1921 and the substrate holding portion
1901. When the shutter 1922 is open, and a jet is ejected from the
nozzle 1921, the jet can be injected into the bonded substrate
stack 50. When the shutter 1922 is closed, jet injection into the
bonded substrate stack 50 can be stopped.
[0476] Procedures of separation processing by the separating
apparatus 1900 will be described below. First, the driving
mechanism 1910 moves the substrate holding portion 1909 upward to
form an appropriate gap between the substrate holding portions 1909
and 1901. In this state, the bonded substrate stack 50 is
horizontally supported by the robot hand 400 from the lower side
and placed on the support portion 1903 of the substrate holding
portion 1901. The driving mechanism 1910 moves the substrate
holding portion 1909 downward to cause it to press the bonded
substrate stack 50. The bonded substrate stack 50 is pressed and
held by the substrate holding portions 1909 and 1901 from both
sides.
[0477] The bonded substrate stack 50 is vacuum-chucked by the
vacuum chuck mechanisms of the substrate holding portions 1901 and
1909.
[0478] The rotation source (not shown) is actuated to transmit the
rotational force to the rotating shaft 1904. The rotating shaft
1904, substrate holding portion 1901, bonded substrate stack 50,
and substrate holding portion 1909 rotate integrally.
[0479] While keeping the shutter 1922 closed, a pump (not shown)
connected to the nozzle 1921 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 1921. A high-pressure jet is
ejected from the nozzle 1921. When the jet stabilizes, the shutter
1922 is opened. As shown in FIG. 23, the jet ejected from the
nozzle 1921 is continuously injected into the porous layer of the
bonded substrate stack 50 to start separating the bonded substrate
stack 50. In this state, the outer peripheral portion of the bonded
substrate stack 50 is separated.
[0480] When the outer peripheral portion is separated, chuck of the
bonded substrate stack 50 by the vacuum chuck mechanisms of the
substrate holding portions 1901 and 1909 is canceled, as shown in
FIG. 24. In this state, the bonded substrate stack 50 is completely
separated. Under a specific condition, when the central portion of
the bonded substrate stack 50 is to be separated, chuck of the
bonded substrate stack 50 is canceled, thereby preventing any
defects in the substrate in separation.
[0481] When separation of the bonded substrate stack 50 is ended,
the shutter 1922 is closed, and the pump connected to the nozzle
1921 is stopped to stop jet injection into the bonded substrate
stack 50. Rotation of the bonded substrate stack 50 is stopped by
stopping driving the rotating shaft 1904.
[0482] The vacuum chuck mechanisms of the substrate holding
portions 1901 and 1909 are actuated. The upper separated substrate
is chucked by the substrate holding portion 1909, and the lower
separated substrate is chucked by the substrate holding portion
1901. The substrate holding portion 1909 is moved upward by the
driving mechanism 1910. The two separated substrates are spaced
apart from each other.
[0483] The robot hand 400 is inserted between the substrate and the
substrate holding portion 1909. The substrate is chucked by the
robot hand 400. Chuck by the vacuum chuck mechanism of the
substrate holding portion 1909 is canceled. The substrate is
transferred from the substrate holding portion 1909 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0484] The robot hand 400 is inserted between the substrate and the
substrate holding portion 1901. The substrate is chucked by the
robot hand 400. Chuck by the vacuum chuck mechanism of the
substrate holding portion 1901 is canceled. The substrate is
transferred from the substrate holding portion 1901 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0485] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 1921 to the gap between the two substrates. In this
case, the jet from the nozzle 1921 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0486] [17th Embodiment]
[0487] FIGS. 25 and 26 are views showing the schematic arrangement
of a separating apparatus according to the 17th embodiment of the
present invention. In a separating apparatus 2000, a convex support
portion 2015 for supporting the central portion of a bonded
substrate stack 50, one or a plurality of rotational force
transmission rollers 2004 for transmitting a rotational force to
the edge portion of the bonded substrate stack 50 to rotate the
bonded substrate stack 50, and one or a plurality of guide rollers
2002 for regulating movement of the bonded substrate stack 50 in
the planar direction horizontally hold the bonded substrate stack
50 while rotating it. A jet is ejected from a nozzle 2021 and
injected to a portion near the porous layer of the bonded substrate
stack 50, thereby separating the bonded substrate stack 50 into two
substrates at the porous layer.
[0488] The central support portion 2015 is rotatably axially
supported by a table 2001 via a bearing 2017. The support portion
2015 has a suction hole 2016 for vacuum-chucking the bonded
substrate stack 50. The table 2001 is fixed to a support table 2020
via a support member 2009. A vacuum line 2010 extends through the
support member 2009. When the pressure in the suction hole 2016 is
reduced via the vacuum line 2010, the bonded substrate stack 50 can
be chucked on the central support portion 2015.
[0489] The rotational force transmission roller 2004 is rotatably
axially supported by the table 2001 via a bearing 2005 and also
coupled to the rotating shaft of a rotation source 2011. When the
rotation source 2011 rotates the rotational force transmission
roller 2004, the bonded substrate stack 50 rotates. A plurality of
rotational force transmission rollers 2004 may be arranged.
Especially, when the bonded substrate stack 50 has an orientation
flat, at least two rotational force transmission rollers 2004 are
required to continuously rotate the bonded substrate stack 50. The
rotational force transmission roller 2004 is preferably located on
the opposite side of the nozzle 2021. In this case, since the
bonded substrate stack 50 is pressed by the jet ejected from the
nozzle 2021, the frictional force acting between the bonded
substrate stack 50 and the rotational force transmission roller
2004 becomes large, and the bonded substrate stack 50 can be
efficiently rotated.
[0490] The guide roller 2002 is rotatably axially supported by the
table 2001 via a bearing 2003. A plurality of guide rollers 2002
are preferably arranged to stably hold the bonded substrate stack
50.
[0491] Each of the rotational force transmission roller 2004 and
guide roller 2002 can have an engaging portion (e.g., a groove)
conforming to the shape of the edge portion of the bonded substrate
stack 50. Such an engaging portion effectively prevents, e.g.,
vertical swing of the bonded substrate stack 50.
[0492] The nozzle 2021 is attached to, e.g., the support table 2020
via a support member (not shown). In the separating apparatus 2000,
the position of the nozzle 2021 is controlled with reference to the
position of the central support portion 2015. A shutter 2022 is
inserted between the nozzle 2021 and the table 2001. When the
shutter 2022 is open, and a jet is ejected from the nozzle 2021,
the jet can be injected into the bonded substrate stack 50. When
the shutter 2022 is closed, jet injection into the bonded substrate
stack 50 can be stopped.
[0493] A substrate holding portion 2014 is located above the
central support portion 2015. The substrate holding portion 2014 is
driven by a driving mechanism 2013 to move in the vertical
direction. The substrate holding portion 2014 has a chuck mechanism
for chucking a separated substrate.
[0494] Procedures of separation processing by the separating
apparatus 2000 will be described below. First, the bonded substrate
stack 50 is horizontally supported by a robot hand 400 from the
lower side and placed on the support portion 2015 at the center of
the table 2001. At this time, the bonded substrate stack 50 is
preferably positioned by bringing it into contact with rollers 2002
and 2004. In this state, the vacuum chuck mechanism of the central
support portion 2015 is preferably actuated to cause it to chuck
the bonded substrate stack 50.
[0495] The rotation source 2011 is actuated to rotate the
rotational force transmission roller 2004. The rotational force is
transmitted to the bonded substrate stack 50, so the bonded
substrate stack 50 rotates together with the central support
portion 2015.
[0496] While keeping the shutter 2022 closed, a pump (not shown)
connected to the nozzle 2021 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 2021. A high-pressure jet is
ejected from the nozzle 2021. When the jet stabilizes, the shutter
2022 is opened. The jet ejected from the nozzle 2021 is
continuously injected into the porous layer of the bonded substrate
stack 50 to start separating the bonded substrate stack 50.
[0497] When separation of the bonded substrate stack 50 is ended,
the shutter 2022 is closed, and the pump connected to the nozzle
2021 is stopped to stop jet injection into the bonded substrate
stack 50. The operation of the rotation source 2011 is also
stopped.
[0498] The substrate holding portion 2014 is moved downward by the
driving mechanism 2013 to abut against the upper separated
substrate. The chuck mechanism of the substrate holding portion
2014 is actuated to chuck the upper separated substrate. In this
state, the substrate holding portion 2014 is moved upward by the
driving mechanism 2013. The two separated substrates are spaced
apart from each other.
[0499] The robot hand 400 receives the substrate held by the
substrate holding portion 2014 and conveys the substrate to a
predetermined position (e.g. a cassette).
[0500] Chuck of the substrate by the vacuum chuck mechanism of the
central support portion 2015 is canceled. The robot hand 400 is
inserted between the substrate and the substrate central support
portion 2015. The substrate is transferred from the central support
portion 2015 to the robot hand 400. The robot hand 400 conveys the
substrate to a predetermined position (e.g., a cassette). The two
separated substrates may be received by the robot hand in the
reverse order or simultaneously received by two robot hands (not
shown).
[0501] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 2021 to the gap between the two substrates. In this
case, the jet from the nozzle 2021 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0502] In the above separation processing, the bonded substrate
stack 50 is separated without pressing it by the substrate holding
portion 2014. However, the bonded substrate stack 50 may be
separated while being pressed by the substrate holding portion
2014. In this case, the driving mechanism 2013 preferably rotatably
supports the substrate holding portion 2014.
[0503] [18th Embodiment]
[0504] FIG. 27 is a view showing the schematic arrangement of a
separating apparatus according to the 18th embodiment of the
present invention. A separating apparatus 2100 has a plurality of
chuck pins 2102 for chucking the outer peripheral portion of a
bonded substrate stack 50. The plurality of chuck pins 2102
horizontally hold the bonded substrate stack 50. A jet is ejected
from a nozzle 2107 and injected to a portion near the porous layer
of the bonded substrate stack 50, thereby separating the bonded
substrate stack 50 into two substrates at the porous layer.
[0505] The separating apparatus 2100 has a table 2101. The table
2101 has the plurality of chuck pins 2102 for supporting the outer
peripheral portion of the bonded substrate stack 50. The number of
chuck pins 2102 is preferably three or more. When the bonded
substrate stack 50 has an orientation flat, the number of chuck
pins 2102 is preferably four or more. Each of the chuck pins 2102
can have an engaging portion (e.g., a groove) conforming to the
shape of the edge portion of the bonded substrate stack 50. Such an
engaging portion effectively prevents, e.g., vertical swing of the
bonded substrate stack 50.
[0506] The table 2101 has a driving mechanism for moving the chuck
pins 2102 in the radial direction (toward the center or toward the
outer periphery) of the table 2101 along moving guides 2103 formed
in the table 2101. To hold the bonded substrate stack 50, first,
the bonded substrate stack 50 is placed on the table 2101. After
this, the chuck pins 2102 are moved toward the center of the table
2101, thereby supporting the bonded substrate stack 50 by the chuck
pins 2102. A driving mechanism for moving not all the chuck pins
2102 but only some of the chuck pins 2102 may be employed.
[0507] The table 2101 preferably has a convex support portion 2104
for forming a gap between the bonded substrate stack 50 and the
surface of the table 2101 to receive a robot hand 400.
[0508] The table 2101 is coupled to one end of a rotating shaft
2106. The rotating shaft 2106 is supported by a support table 2110
via a bearing 2109. The bearing 2109 has, at its upper portion, a
sealing member 2105 for sealing the opening portion formed in the
support table 2110 to pass the rotating shaft 2106. The rotating
shaft 2106 is coupled to a rotation source (not shown) to be
rotated by the rotational force transmitted from the rotation
source.
[0509] The nozzle 2107 is attached to, e.g., the support table 2110
via a support member (not shown). In the separating apparatus 2100,
the position of the nozzle 2107 is controlled with reference to the
position of the table 2101. A shutter 2108 is inserted between the
nozzle 2107 and the table 2101. When the shutter 2108 is open, and
a jet is ejected from the nozzle 2107, the jet can be injected into
the bonded substrate stack 50. When the shutter 2108 is closed, jet
injection into the bonded substrate stack 50 can be stopped.
[0510] Procedures of separation processing by the separating
apparatus 2100 will be described below. First, the chuck pins 2102
are moved toward the outer periphery by the driving mechanism to
form a space on the table 2101 where the bonded substrate stack 50
is to be placed.
[0511] The bonded substrate stack 50 is horizontally supported by
the robot hand 400 from the lower side and placed on the support
portion 2104 of the table 2101. The chuck pins 2102 are moved
toward the center by the driving mechanism to fix the bonded
substrate stack 50. According to the separating apparatus 2100, the
bonded substrate stack 50 is positioned by moving the chuck pins
2102 toward the center.
[0512] The rotation source (not shown) is actuated to transmit the
rotational force to the rotating shaft 2106. The table 2101 and
bonded substrate stack 50 rotate together.
[0513] While keeping the shutter 2108 closed, a pump (not shown)
connected to the nozzle 2107 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 2107. A high-pressure jet is
ejected from the nozzle 2107. When the jet stabilizes, the shutter
2108 is opened. The jet ejected from the nozzle 2107 is
continuously injected into the porous layer of the bonded substrate
stack 50 to start separating the bonded substrate stack 50.
[0514] When separation of the bonded substrate stack 50 is ended,
the shutter 2108 is closed, and the pump connected to the nozzle
2107 is stopped to stop jet injection into the bonded substrate
stack 50. Rotation of the bonded substrate stack 50 is stopped by
stopping driving the rotating shaft 2106.
[0515] The robot hand 400 is inserted between the table 2101 and
the lower substrate and chucks the substrate. Simultaneously, the
upper substrate is chucked by another robot to space the two
substrates apart from each other. The substrates are conveyed to
predetermined positions (e.g., cassettes).
[0516] The separating apparatus 2100 may have a substrate transfer
mechanism formed from the substrate holding portion 2014 and
driving mechanism 2013 shown in FIG. 25 such that the two separated
substrates are separated by the transfer mechanism.
[0517] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 2107 to the gap between the two substrates. In this
case, the jet from the nozzle 2107 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0518] [19th Embodiment]
[0519] FIGS. 28 and 29 are views showing the schematic arrangement
of a separating apparatus according to the 19th embodiment of the
present invention. In a separating apparatus 2200, one or a
plurality of rotational force transmission rollers 2202 for
transmitting a rotational force to the edge portion of a bonded
substrate stack 50 to rotate the bonded substrate stack 50 and one
or a plurality of guide rollers 2204 and 2207 for regulating
movement of the bonded substrate stack 50 in the planar direction
horizontally hold the bonded substrate stack 50 while rotating it.
A jet is ejected from a nozzle 2209 and injected to a portion near
the porous layer of the bonded substrate stack 50, thereby
separating the bonded substrate stack 50 into two substrates at the
porous layer.
[0520] The rotational force transmission roller 2202 is rotatably
axially supported by a table 2201 via a bearing 2206 and also
coupled to the rotating shaft of a rotation source 2203. When the
rotation source 2203 rotates the rotational force transmission
roller 2202, the bonded substrate stack 50 rotates. A plurality of
rotational force transmission rollers 2202 may be arranged.
Especially, when the bonded substrate stack 50 has an orientation
flat, at least two rotational force transmission rollers 2202 are
required to continuously rotate the bonded substrate stack 50.
[0521] Each of the guide rollers 2204 is rotatably axially
supported by the table 2201 via a bearing 2205. Each of the guide
rollers 2207 is rotatably axially supported by a bearing 2208. The
table 2201 has a driving mechanism for moving the bearings 2208 in
the radial direction (toward the center or toward the outer
periphery) of the table 2201. To hold the bonded substrate stack
50, first, the bonded substrate stack 50 is placed on the table
2201. After this, the guide rollers 2207 are moved toward the
center of the table. The table 2201 is supported on a support table
2213.
[0522] The table 2201 preferably has a convex support portion 2211
for forming a gap between the bonded substrate stack 50 and the
surface of the table 2201 to receive a robot hand 400. The support
portion 2211 is preferably rotatably axially supported by the table
2201 via, e.g., a bearing 2212 not to impede rotation of the bonded
substrate stack 50.
[0523] The nozzle 2209 is attached to, e.g., the table 2201 via a
support member (not shown). In the separating apparatus 2200, the
position of the nozzle 2209 is controlled with reference to the
position of the table 2201. A shutter 2210 is inserted between the
nozzle 2209 and the table 2201. When the shutter 2210 is open, and
a jet is ejected from the nozzle 2209, the jet can be injected into
the bonded substrate stack 50. When the shutter 2210 is closed, jet
injection into the bonded substrate stack 50 can be stopped.
[0524] Procedures of separation processing by the separating
apparatus 2200 will be described below. First, the guide rollers
2207 are moved toward the outer periphery by the driving mechanism
to form a space on the table 2101 where the bonded substrate stack
50 is to be placed.
[0525] The bonded substrate stack 50 is horizontally supported by
the robot hand 400 from the lower side and placed on the central
support portion 2211 of the table 2201. The guide rollers 2207 are
moved toward the center to fix the bonded substrate stack 50.
According to the separating apparatus 2200, the bonded substrate
stack 50 is positioned by moving the guide rollers 2207 toward the
center.
[0526] The rotation source 2203 is actuated to transmit the
rotational force to the rotational force transmission roller 2202,
so the bonded substrate stack 50 rotates.
[0527] While keeping the shutter 2210 closed, a pump (not shown)
connected to the nozzle 2209 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 2209. A high-pressure jet is
ejected from the nozzle 2209. When the jet stabilizes, the shutter
2210 is opened. The jet ejected from the nozzle 2209 is
continuously injected into the porous layer of the bonded substrate
stack 50 to start separating the bonded substrate stack 50.
[0528] When separation of the bonded substrate stack 50 is ended,
the shutter 2210 is closed, and the pump connected to the nozzle
2209 is stopped to stop jet injection into the bonded substrate
stack 50. Rotation of the bonded substrate stack 50 is stopped by
stopping driving the rotation source 2203.
[0529] The robot hand 400 is inserted between the table 2201 and
the lower substrate and chucks the substrate. Simultaneously, the
upper substrate is chucked by another robot to space the two
substrates apart from each other. The substrates are conveyed to
predetermined positions (e.g., cassettes).
[0530] The separating apparatus 2200 may have a substrate spacing
mechanism formed from the substrate holding portion 2014 and
driving mechanism 2013 shown in FIG. 25 such that the two separated
substrates are separated by the spacing mechanism.
[0531] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 2209 to the gap between the two substrates. In this
case, the jet from the nozzle 2209 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0532] [20th Embodiment]
[0533] FIG. 30 is a view showing the schematic arrangement of a
separating apparatus according to the 20th embodiment of the
present invention. In a separating apparatus 2300, one or a
plurality of rotational force transmission members 2306 for
transmitting a rotational force to a bonded substrate stack 50 from
its edge portion and one or a plurality of guide members 2307 for
regulating movement of the bonded substrate stack 50 in the planar
direction horizontally hold the bonded substrate stack 50 while
rotating it. A jet is ejected from a nozzle 2309 and injected to a
portion near the porous layer of the bonded substrate stack 50,
thereby separating the bonded substrate stack 50 into two
substrates at the porous layer. Each of the rotational force
transmission member 2306 and guide member 2307 preferably has a
shape (rhombic shape) obtained by, e.g., bonding the bottom
portions of two cones.
[0534] The rotational force transmission member 2306 is rotatably
axially supported by a table 2301 via a bearing 2305 and also
coupled to the rotating shaft of a rotation source 2303. When the
rotation source 2303 rotates the rotational force transmission
member 2306, the bonded substrate stack 50 rotates. A plurality of
rotational force transmission members 2306 may be arranged.
Especially, when the bonded substrate stack 50 has an orientation
flat, at least two rotational force transmission members 2306 are
required to continuously rotate the bonded substrate stack 50. The
guide member 2307 is rotatably axially supported by the table 2301
via a bearing (not shown). A plurality of guide members 2307 may be
arranged.
[0535] The separating apparatus 2300 has a driving mechanism (not
shown) for moving the rotational force transmission member 2306
and/or the guide member 2307 in the radial direction (toward the
center or toward the outer periphery) of the table 2301.
[0536] When a member having a shape obtained by bonding the bottom
portions of two cones, as described above, is employed as the
rotational force transmission member 2306 or guide member 2307, the
bonded substrate stack 50 can be held by inserting the outer
peripheral portion of the member into the bonding surfaces of the
bonded substrate stack 50 or already separated portions. This
prevents, e.g., vertical swing of the bonded substrate stack 50 and
also allows the already separated portions of the bonded substrate
stack 50 to warp and be spaced apart from each other. As a result,
the bonded substrate stack 50 can be stably held, and the
separation efficiency can be increased.
[0537] The table 2301 preferably has a convex support portion 2310
for forming a gap between the bonded substrate stack 50 and the
surface of the table 2301 to receive a robot hand 400. The support
portion 2310 is preferably rotatably axially supported by the table
2301 via, e.g., a bearing 2311 not to impede rotation of the bonded
substrate stack 50.
[0538] The nozzle 2309 is attached to, e.g., the table 2301 via a
support member (not shown) . In the separating apparatus 2300, the
position of the nozzle 2309 is controlled with reference to the
position of the table 2301. A shutter 2308 is inserted between the
nozzle 2309 and the bonded substrate stack 50. When the shutter
2308 is open, and a jet is ejected from the nozzle 2309, the jet
can be injected into the bonded substrate stack 50. When the
shutter 2308 is closed, jet injection into the bonded substrate
stack 50 can be stopped.
[0539] Procedures of separation processing by the separating
apparatus 2300 will be described below. First, the rotational force
transmission member 2306 and/or guide member 2307 is moved toward
the outer periphery to form a space on the table 2301 where the
bonded substrate stack 50 is to be placed.
[0540] The bonded substrate stack 50 is horizontally supported by
the robot hand 400 from the lower side and placed on the central
support portion 2310 of the table 2301. The-rotational force
transmission member 2306 and/or guide member 2307 is moved toward
the center to fix the bonded substrate stack 50. With this
operation, the bonded substrate stack 50 is positioned.
[0541] The rotation source 2303 is actuated to rotate the
rotational force transmission member 2306. The bonded substrate
stack 50 rotates.
[0542] While keeping the shutter 2308 closed, a pump (not shown)
connected to the nozzle 2309 is actuated to feed a high-pressure
jet medium (e.g., water) to the nozzle 2309. A high-pressure jet is
ejected from the nozzle 2309. When the jet stabilizes, the shutter
2308 is opened. The jet ejected from the nozzle 2309 is
continuously injected into the porous layer of the bonded substrate
stack 50 to start separating the bonded substrate stack 50.
[0543] When separation of the bonded substrate stack 50 is ended,
the shutter 2308 is closed, and the pump connected to the nozzle
2309 is stopped to stop jet injection into the bonded substrate
stack 50. Rotation of the bonded substrate stack 50 is stopped by
stopping driving the rotation source 2303.
[0544] The robot hand 400 is inserted between the table 2301 and
the lower substrate and chucks the substrate. Simultaneously, the
upper substrate is chucked by another robot to space the two
substrates apart from each other. The substrates are conveyed to
predetermined positions (e.g., cassettes).
[0545] The separating apparatus 2300 may have a substrate spacing
mechanism formed from the substrate holding portion 2014 and
driving mechanism 2013 shown in FIG. 25 such that the two separated
substrates are separated by the spacing mechanism.
[0546] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 2309 to the gap between the two substrates. In this
case, the jet from the nozzle 2309 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0547] [21st Embodiment]
[0548] FIG. 40 is a view showing the schematic arrangement of a
separating apparatus according to the 21st embodiment of the
present invention. The same reference numerals as in other drawings
substantially denote the same constituent elements in FIG. 40.
[0549] A separating apparatus 5000 has a pair of substrate holding
portions 270 and 280. The substrate holding portions 270 and 280
horizontally hold and rotate a bonded substrate stack 50 by
sandwiching it from the upper and lower sides. A jet is ejected
from a nozzle 260 and injected to a portion near the porous layer
of the bonded substrate stack 50, thereby separating the bonded
substrate stack 50 into two substrates at the porous layer.
[0550] The upper substrate holding portion 270 is coupled to one
end of a rotating shaft 140. The other end of the rotating shaft
140 is coupled to the rotating shaft of a motor 110 via a coupling
130. The motor 110 and rotating shaft 140 may be coupled not via
the coupling 130 but via, e.g., a belt or another mechanism. The
motor 110 is fixed to a support member 120 fixed on an upper table
170. The motor is controlled by a control section.
[0551] A vacuum line 141 for vacuum-chucking the bonded substrate
stack 50 on the substrate holding portion 270 extends through the
rotating shaft 140. The vacuum line 141 is connected to an external
vacuum line via a ring 150. The external vacuum line has a solenoid
valve (not shown) The solenoid valve is ON/OFF-controlled by the
control section as needed. The substrate holding portion 270 has a
suction hole 271 for vacuum-chucking the bonded substrate stack 50.
The suction hole 271 is connected to the vacuum line 141. The
suction hole 271, vacuum line 141, and solenoid valve construct the
vacuum chuck mechanism of the substrate holding portion 270. The
rotating shaft 140 is supported by the upper table 170 via a
bearing 160.
[0552] The lower substrate holding portion 280 is coupled to a
rotating shaft 180. The rotating shaft 180 is supported by a lower
table 240 via a reciprocal/rotational guide 230. The lower table
240 has, at its upper portion, a sealing member 231 for preventing
the jet medium from entering the reciprocal/rotational guide
230.
[0553] The rotating shaft 180 is coupled to the piston rod of an
air cylinder 320 via a coupling 330 having a radial bearing 340 for
rotatably axially supporting the rotating shaft 180. The rotating
shaft 180 has a flange 182 for regulating the positional
relationship between the rotating shaft 180 and the coupling 330.
Hence, when the coupling 330 is driven upward or downward by the
air cylinder 320, the rotating shaft 180 moves upward or downward
accordingly. In addition, when separation of the bonded substrate
stack 50 progresses, and the already separated portions warp in the
axial direction of the bonded substrate stack 50 to move the lower
substrate holding portion 280 and rotating shaft 180 downward, the
coupling 330 moves downward accordingly.
[0554] The separating apparatus 5000 has an abrupt operation
prevention mechanism 4000 which prevents the lower substrate
holding portion 280 and rotating shaft 180 from abruptly moving
downward (i.e., in the direction in which they are separated from
the upper substrate holding portion 270) during separation of the
bonded substrate stack 50, and also allows the lower substrate
holding portion 280 and rotating shaft 180 to moderately move. The
abrupt operation prevention mechanism 4000 is supported by a
support member 351 fixed on the lower table 240.
[0555] The abrupt operation prevention mechanism 4000 is formed
from, e.g., a damper mechanism. FIG. 41 is a view showing the
arrangement of the abrupt operation prevention mechanism 4000 using
a damper mechanism. The abrupt operation prevention mechanism 4000
of this example has a frame member (e.g., a cylinder) 4440, movable
portion 4480, restoring portion 4470, channel 4450, and valve
4460.
[0556] The movable portion 4480 has a piston (partition plate) 4430
which forms a pressure chamber 4490 between the piston and the
inner wall of the frame member 4440, a piston rod 4420, and a
contact member 4410. These members have an integrated structure.
The pressure chamber 4490 communicates with one end of the valve
4460 via the channel 4450. Before the start of separation
processing of the bonded substrate stack 50, the pressure chamber
4490 is filled with a fluid (e.g., a gas such as air or a liquid
such as oil). The piston 4430 has an area sufficiently larger than
the sectional area of the channel 4450.
[0557] The other end of the valve 4460 is connected to a vessel
storing, e.g., a fluid. The volume of this vessel is preferably
sufficiently larger than that of the pressure chamber 4490. When
air at the atmospheric pressure is used as the fluid, the other end
of the valve 4460 may be open to the air. The valve 4460 preferably
has a function of adjusting the opening degree (flow rate).
[0558] In separation processing of the bonded substrate stack 50,
already separated portions of the bonded substrate stack 50 warp in
the axial direction of the bonded substrate stack 50 due to the
pressure of the jet medium continuously injected into the gap
formed by separation. The lower substrate holding portion 280 and
rotating shaft 180 receive a force in the direction in which they
are spaced apart from the upper substrate holding portion 270,
i.e., downward. Hence, the movable portion 4480 of the abrupt
operation prevention mechanism 4000 also receives the downward
force from the rotating shaft 180.
[0559] At this time, the abrupt operation prevention mechanism 4000
generates a reaction against the force applied from the rotating
shaft 180. The magnitude of this reaction depends on the
acceleration of the lower substrate holding portion 280 and
rotating shaft 180, i.e., the acceleration of the movable portion
4480.
[0560] More specifically, the abrupt operation prevention mechanism
4000 has the channel 4450 for discharging the fluid from the
pressure chamber 4490 and the valve 4460 for adjusting the fluid
discharge amount. As the movable portion 4480 moves downward, the
fluid in the pressure chamber 4490 is discharged. When the movable
portion 4480 moderately moves downward, the fluid in the pressure
chamber 4490 is discharged in accordance with the movement, and the
pressure in the pressure chamber 4490 less increases. Hence, the
reaction applied from the movable portion 4480 to the rotating
shaft 180 is small. On the other hand, when the movable portion
4480 abruptly moves downward, discharge of the fluid in the
pressure chamber 4490 cannot follow the movement, and the pressure
in the pressure chamber 4490 abruptly increases. Hence, the
reaction applied from the movable portion 4480 to the rotating
shaft is large.
[0561] The abrupt operation prevention mechanism 4000 prevents the
lower substrate holding portion 280 from abruptly moving downward
but allows it to moderately move downward. In other words, the
abrupt operation prevention mechanism 4000 prevents the bonded
substrate stack 50 from abruptly warping in the axial direction but
allows it to moderately warp.
[0562] When separation of one bonded substrate stack 50 is ended,
and separation processing of the next bonded substrate stack 50 is
to be executed, the lower substrate holding portion 280 and
rotating shaft 180 are driven upward by the air cylinder 320 to
hold the new bonded substrate stack 50. At this time, the restoring
portion 4470 presses the movable portion 4480 upward to bring the
contact member 4410 of the movable portion 4480 into contact with
the rotating shaft 180.
[0563] The restoring portion 4470 extends the piston 4430 to fill
the pressure chamber 4490 with the fluid or fills the pressure
chamber 4490 with the fluid to extend the piston 4430. In the
arrangement shown in FIG. 41, the restoring portion 4470 comprises
a spring. The piston 4430 is extended by the restoring force of the
spring. With this operation, the pressure chamber 4490 is filled
with the fluid via the channel 4450 and valve 4460.
[0564] Conversely, another arrangement may be employed, in which
the pressure chamber 4490 is filled with the fluid via the channel
4450 and valve 4460, as shown in FIG. 42, or the pressure chamber
4490 is filled with the fluid via another channel, as shown in FIG.
43, to extend the piston 4430.
[0565] FIG. 42 is a view showing a modification of the abrupt
operation prevention mechanism 4000 shown in FIG. 41. FIG. 42 shows
an abrupt operation prevention mechanism in which the pressure
chamber 4490 is filled with the fluid via the channel 4450 used to
discharge the fluid from the pressure chamber 4490. In the abrupt
operation prevention mechanism 4000 with this arrangement, when
separation processing is to be executed, a valve 4530 is opened,
and a valve 4510 is closed to discharge the fluid in the pressure
chamber 4490 via the channel 4450, valve 4460, channel 4500, and
valve 4530. To extend the movable portion 4480, the valve 4530 is
closed, and the valve 4510 is opened to fill the pressure chamber
4490 with the fluid by a pressure source 4520.
[0566] FIG. 43 is a view showing another modification of the abrupt
operation prevention mechanism 4000 shown in FIG. 41. FIG. 43 shows
an abrupt operation prevention mechanism having a channel 4600 for
filling the pressure chamber 4490 with the fluid in addition to the
channel 4450 used to discharge the fluid from the pressure chamber
4490. In the abrupt operation prevention mechanism 4000 with this
arrangement, when separation processing is to be executed, the
valve 4460 is adjusted to a desired opening degree, and a valve
4610 is closed to discharge the fluid in the pressure chamber 4490
via the channel 4450 and valve 4460. To extend the movable portion
4480, the valve 4460 is closed, and the valve 4610 is opened to
fill the pressure chamber 4490 with the fluid by a pressure source
4620.
[0567] This abrupt operation prevention mechanism 4000 prevents the
bonded substrate stack 50 from abruptly warping in the axial
direction but allows it to moderately warp, as described above. The
abrupt operation prevention mechanism 4000 effectively prevents any
defects on the first substrate side or second substrate side in
separation processing of the bonded substrate stack 50 and, more
particularly, at the final stage of separation processing. The
reason for this will be described below.
[0568] Already separated portions of the bonded substrate stack 50
warp in the axial direction of the bonded substrate stack 50 due to
the pressure of the jet medium injected between the already
separated portions. In accordance with the degree of this warp, the
lower substrate holding portion 280 moves in the direction in which
it is separated from the upper substrate holding portion 270, i.e.,
downward. As separation progresses and reaches the central portion
of the bonded substrate stack 50, the warp amount becomes large,
and the moving amount of the lower substrate holding portion 280
increases accordingly.
[0569] When separation further progresses and reaches the final
stage, the bonding force of the unseparated portions of the bonded
substrate stack 50 (force for bonding the first substrate side and
the second substrate side) abruptly becomes smaller than the
separation force of the bonded substrate stack by the jet medium
(force acting to peel the bonded substrate stack into two
substrates).
[0570] In a separating apparatus without any abrupt operation
prevention mechanism 4000, the bonding force cannot stand the
separation force, and the lower substrate holding portion 280
instantaneously abruptly moves. At this time, the unseparated
regions of the bonded substrate stack 50 are peeled at once, and
this may generate a defect on the first or second substrate
side.
[0571] The separating apparatus 5000 according to the 21st
embodiment has the abrupt operation prevention mechanism 4000 that
prevents the above-described abrupt operation of the substrate
holding portion 280. As a consequence, any defect on the first or
second substrate side can be prevented. The abrupt operation
prevention mechanism 4000 allows the substrate holding portion 280
to moderately move in separation. Hence, already separated portions
of the bonded substrate stack 50 warp in the axial direction of the
bonded substrate stack 50 in separation, and the bonded substrate
stack 50 can be efficiently separated.
[0572] The abrupt operation prevention mechanism 4000 preferably
has a structure capable of preventing knocking when the movable
portion 4480 moves, i.e., a structure having less frictional
resistance. When knocking occurs, the lower substrate holding
portion 280 moves stepwise. For this reason, separation of the
bonded substrate stack 50 progresses stepwise, and this may
generate a defect on the first or second substrate side.
[0573] The abrupt operation prevention mechanism 4000 is preferably
coaxial with the rotating shaft 180. With this arrangement, the
substrate holding portion 280 and substrate holding portion 280 can
be smoothly rotated.
[0574] A vacuum line 181 for vacuum-chucking the bonded substrate
stack 50 on the substrate holding portion 280 extends through the
rotating shaft 180. The vacuum line 181 is connected to an external
vacuum line via a ring 190. The external vacuum line has a solenoid
valve (not shown) The solenoid valve is ON/OFF-controlled by the
control section (not shown) as needed.
[0575] The substrate holding portion 280 has a suction hole 281 for
vacuum-chucking the bonded substrate stack 50. The suction hole 281
is connected to the vacuum line 181. The suction hole 281, vacuum
line 181, and solenoid valve construct the vacuum chuck mechanism
of the substrate holding portion 280.
[0576] The lower table 240 is supported by a plurality of leg
members 310. The upper table 170 is supported on the lower table
240.
[0577] The nozzle 260 is attached to, e.g., the lower table 240 via
a support member (not shown). In the separating apparatus 5000 of
the 21st embodiment, the position of the nozzle 260 is controlled
with reference to the position of the upper substrate holding
portion 270. A shutter 251 driven by a motor 250 is inserted
between the nozzle 260 and the substrate holding portions 270 and
280. When the shutter 251 is open, and a jet is ejected from the
nozzle 260, the jet can be injected into the bonded substrate stack
50. When the shutter 251 is closed, jet injection into the bonded
substrate stack 50 can be stopped.
[0578] In the separating apparatus 5000, since the upper substrate
holding portion 270 does not move in the vertical direction, an
abrupt operation prevention mechanism for preventing the abrupt
operation of the upper substrate holding portion 270 is
unnecessary. However, when a substrate holding portion moving in
the vertical direction is employed as the upper substrate holding
portion 270, an abrupt operation prevention mechanism for
preventing the abrupt operation of the upper substrate holding
portion 270 is preferably prepared.
[0579] Procedures of separation processing of a bonded substrate
stack by the separating apparatus 5000 will be described below.
First, the air cylinder 320 retracts the piston rod to form an
appropriate gap between substrate holding portions 270 and 280. In
this state, the bonded substrate stack 50 is horizontally supported
by the robot hand 400 from the lower side and inserted to a
predetermined position between the substrate holding portions 270
and 280.
[0580] The air cylinder 320 extends the piston rod to move the
lower substrate holding portion 280 upward. The substrate holding
portion 280 presses and holds the bonded substrate stack 50.
[0581] The movable portion 4480 of the abrupt operation prevention
mechanism 4000 is moved upward to abut the contact member 4410 of
the movable portion 4480 against the lower end of the rotating
shaft 180.
[0582] The motor 110 is actuated to transmit the rotational force
to the rotating shaft 140. The rotating shaft 140, substrate
holding portion 270, bonded substrate stack 50, substrate holding
portion 280, and rotating shaft 180 rotate integrally.
[0583] While keeping the shutter 251 closed, a pump (not shown)
connected to the nozzle 260 is actuated to feed a high-pressure jet
medium (e.g., water) to the nozzle 260. A high-pressure jet is
ejected from the nozzle 260. When the jet stabilizes, the shutter
251 is opened. The jet ejected from the nozzle 260 is continuously
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0584] Separation of the bonded substrate stack 50 progresses
spirally from the outer peripheral portion to the central portion.
More specifically, separation of the bonded substrate stack 50
progresses such that the boundary between the already separated
region (separated region) and the region that has not been
separated (unseparated region) draws a spiral locus.
[0585] The separated region warps due to the pressure of the
injected jet medium. When separation progresses, and the warp
becomes large to some degree, the substrate holding portion 280 is
pressed by the bonded substrate stack and starts moving downward.
Movement of the substrate holding portion 280 is controlled by the
abrupt operation prevention mechanism 4000, as described above.
More specifically, the substrate holding portion 280 moderately
moves but does not move abruptly. Hence, the above-described defect
due to abrupt movement of the substrate holding portion 280 can be
effectively prevented.
[0586] The characteristics of the abrupt operation prevention
mechanism 4000 may be changed in accordance with the progress of
separation by controlling the opening degree of the valve 4460 in
accordance with the progress of separation. The opening degree of
the valve 4460 may be adjusted in accordance with the
characteristics (e.g., the diameter or thickness) of the bonded
substrate stack 50 to be processed or separation processing
condition (e.g., jet pressure or jet diameter).
[0587] When separation of the bonded substrate stack 50 is ended,
the shutter 251 is closed, and the pump connected to the nozzle 260
is stopped to stop jet injection into the bonded substrate stack
50. The operation of the motor 110 is also stopped.
[0588] The vacuum chuck mechanisms of the substrate holding
portions 270 and 280 are actuated (solenoid valves are open) to
cause the substrate holding portion 270 to vacuum-chuck the upper
separated substrate and the substrate holding portion 280 to
vacuum-chuck the lower separated substrate.
[0589] The air cylinder 320 retracts the piston rod to form a
predetermined gap between the substrate holding portions 270 and
280. The two separated substrates are spaced apart from each
other.
[0590] The robot hand 400 is inserted between the substrate and the
substrate holding portion 270. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 270 is canceled. The substrate is
transferred from the substrate holding portion 270 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette).
[0591] The robot hand 400 is inserted between the substrate and the
substrate holding portion 280. The robot hand 400 chucks the
substrate. After that, chuck by the vacuum chuck mechanism of the
substrate holding portion 280 is canceled. The substrate is
transferred from the substrate holding portion 280 to the robot
hand 400. The robot hand 400 conveys the substrate to a
predetermined position (e.g., a cassette). The two separated
substrates may be received by the robot hand in the reverse order
or simultaneously received by two robot hands (not shown).
[0592] After the bonded substrate stack 50 is separated into two
substrates, the jet medium is present between the two substrates.
When the jet medium is a liquid (e.g., water), the surface tension
is considerably large. Hence, to space the two substrates apart
from each other with a small force, a jet is preferably supplied
from the nozzle 260 to the gap between the two substrates. In this
case, the jet from the nozzle 260 is stopped after the two
substrates are spaced apart from each other. Instead, a mechanism
for ejecting a jet used to space the two substrates apart from each
other may be independently prepared.
[0593] [22nd Embodiment]
[0594] FIGS. 31 and 32 are views showing the schematic arrangement
of a separating apparatus according to the 22nd embodiment of the
present invention. A separating apparatus 2400 combines a
separating apparatus represented by one of the above-described
embodiments with a cleaning apparatus.
[0595] As a representative separating apparatus, a separating
apparatus will be exemplified in which a pair of substrate holding
portions 2401 and 2402 horizontally hold and rotate a bonded
substrate stack 50, and a jet is ejected from a nozzle 2405 toward
the porous layer of the bonded substrate stack 50, thereby
separating the bonded substrate stack 50 into two substrates at the
porous layer. In this separating apparatus, the substrate holding
portions 2401 and 2402 are coupled to rotating shafts 2403 and
2404, respectively. A rotational force is transmitted to the
substrate holding portions via at least one of the rotating
shafts.
[0596] A shutter 2406 is inserted between the nozzle 2405 and the
substrate holding portions 2401 and 2402. The shutter 2406 need not
always be prepared. Jet injection into the bonded substrate stack
50 can be controlled not by using the shutter 2406 but by, e.g.,
moving the nozzle 2405 or controlling a pump connected to the
nozzle 2405 (this also applies to the remaining embodiments).
[0597] The cleaning apparatus ejects a cleaning solution supplied
from a supply line 2408 of the cleaning solution (e.g., water) from
a cleaning nozzle 2407 to the bonded substrate stack 50.
[0598] An example of processing procedures by this separating
apparatus will be described below. First, the pair of substrate
holding portions 2401 and 2402 horizontally hold and rotate the
bonded substrate stack 50. As shown in FIG. 31, a jet is ejected
from the nozzle 2405, and the shutter 2406 is open. The jet is
injected into the porous layer of the bonded substrate stack 50 to
start separating the bonded substrate stack 50.
[0599] The bonded substrate stack 50 may be separated while the
cleaning solution is ejected from the cleaning nozzle 2407 to clean
the bonded substrate stack 50.
[0600] When separation of, the bonded substrate stack 50 is ended,
the shutter 2406 is closed. After that, jet ejection from the
nozzle 2405 is stopped (operation of the pump is stopped).
[0601] As shown in FIG. 32, in the state wherein the substrate
holding portions 2401 and 2402 are rotated or stopped, the
separated substrates are chucked by the substrate holding portions
2401 and 2402 and spaced apart from each other.
[0602] The cleaning solution is ejected from the cleaning nozzle
2407 to clean the two separated substrates.
[0603] According to this separating apparatus, separation
processing of the bonded substrate stack 50 and cleaning of the
separated substrates can be efficiently performed.
[0604] [23rd Embodiment]
[0605] FIGS. 33 and 34 are views showing the schematic arrangement
of a separating apparatus according to the 23rd embodiment of the
present invention. In a separating apparatus 2500, a pair of
holding portions 2501 and 2502 horizontally hold a bonded substrate
stack 50. After the bonded substrate stack 50 is separated into two
substrates by a jet ejected from a nozzle 2505, one or both of the
substrate holding portions 2501 and 2502 are moved in the
horizontal direction to space the separated substrates apart from
each other.
[0606] The substrate holding portions 2501 and 2502 are coupled to
rotating shafts 2503 and 2504, respectively. A rotational force is
transmitted to the substrate holding portions via at least one of
the rotating shafts. The substrate holding portions 2501 and 2502
have suction holes 2501a and 2502a for vacuum-chucking the bonded
substrate stack 50, respectively. The suction holes 2501a and 2502a
are connected to vacuum lines 2503a and 2504a in the rotating
shafts 2503 and 2504, respectively. A shutter 2506 is inserted
between the nozzle 2505 and the substrate holding portions 2501 and
2502.
[0607] Procedures of separation processing by the separating
apparatus 2500 will be described below. First, as shown in FIG. 33,
the pair of substrate holding portions 2501 and 2502 horizontally
hold the bonded substrate stack 50. At least one of the rotating
shafts 2503 and 2504 is rotated to rotate the bonded substrate
stack 50. Next, as shown in FIG. 33, a jet is ejected from the
nozzle 2505, and the shutter 2506 is opened. The jet is injected
into the porous layer of the bonded substrate stack 50 to start
separating the bonded substrate stack 50.
[0608] When separation of the bonded substrate stack 50 is ended,
the shutter 2506 is closed. After that, jet ejection from the
nozzle 2505 is stopped (operation of the pump is stopped).
[0609] As shown in FIG. 34, in the state wherein the substrate
holding portions 2501 and 2502 are rotated or stopped, one or both
of the pair of substrate holding portions 2501 and 2502 are moved
in the horizontal direction to space the separated substrates apart
from each other. When one or both of the pair of substrate holding
portions 2501 and 2502 are moved in the horizontal direction along
the separated surface of the bonded substrate stack 50, the two
substrates can be easily spaced apart from each other independently
of the influence of the surface tension acting between the two
substrates.
[0610] [24th Embodiment]
[0611] This embodiment provides various separating methods with an
emphasis on the relationship between a bonded substrate stack and a
nozzle for ejecting a jet in separation processing. Although the
following separating methods are suitable for separating a
horizontally held bonded substrate stack, they can be applied to
separate a bonded substrate stack held at another angle (e.g.,
vertically).
[0612] In the first separating method, a jet is injected into the
porous layer of a bonded substrate stack in parallel to the porous
layer, and simultaneously, the bonded substrate stack is rotated
about substantially the center of the bonded substrate stack, as
described in the above embodiments.
[0613] In the second separating method, as shown in FIG. 35 (plan
view), a jet is injected into the porous layer of a bonded
substrate stack 50 in parallel to the porous layer, and
simultaneously, a nozzle 51 is scanned along the porous layer by a
driving mechanism 2601.
[0614] In the third separating method, as shown in FIG. 36 (plan
view), a jet is injected into the porous layer of a bonded
substrate stack 50 in parallel to the porous layer, and
simultaneously, a table 2602 on which a holding portion 52 of the
bonded substrate stack 50 is mounted is moved by a driving
mechanism 2603 to scan the bonded substrate stack 50.
[0615] In the fourth separating method, as shown in FIGS. 37A and
37B (plan views), a jet is injected into the porous layer of a
bonded substrate stack 50 in parallel to the porous layer, and
simultaneously, a rotating shaft 2604 is pivoted to pivot the
nozzle 51 fixed to the rotating shaft 2604 and scan the jet such
that the jet draws a sector-shaped locus.
[0616] In the fifth separating method, as shown in FIG. 38 (plan
view), a jet is injected into the porous layer of a bonded
substrate stack 50 in parallel to the porous layer, and
simultaneously, the nozzle 51 is scanned along the porous layer by
the driving mechanism 2601 while the holding portion 52 is rotated
to rotate the bonded substrate stack 50.
[0617] All the above separating methods can be applied to the
separating apparatuses of the above embodiments. However, another
separating method may be applied.
[0618] [25th Embodiment]
[0619] FIG. 39 is a plan view showing the schematic arrangement of
a separating system according to the 25th embodiment of the present
invention. A separating system 3000 of this embodiment has, as a
separating apparatus 3020, a separating apparatus represented by
one of the above embodiments.
[0620] A separating system 3000 has a scalar robot 3150 at a
predetermined position (e.g., at the center) on a support table
3200. Various processing apparatuses are disposed around the scalar
robot 3150 at substantially equidistant positions separated from
the scalar robot 3150. More specifically, in this embodiment, a
loader 3080, centering apparatus 3070, separating apparatus 3020,
turning apparatus 3130, cleaning/drying apparatus 3120, third
unloader 3110, second unloader 3100, and first unloader 3090 are
disposed at substantially equidistant positions separated from the
scalar robot 3150.
[0621] Before processing, a first cassette 3081 storing one or a
plurality of bonded substrate stacks is placed on the loader 3080.
Before processing, empty cassettes 3091, 3101, and 3111 are placed
on the first unloader 3090, second unloader 3100, and third
unloader 3110, respectively.
[0622] The centering apparatus 3070 receives a bonded substrate
stack from the scalar robot 3150, executes processing (centering)
for aligning the center of the bonded substrate stack at a
predetermined position, and then transfers the bonded substrate
stack to the scalar robot 3150.
[0623] The separating apparatus 3020 is disposed in a chamber 3010
to prevent the jet medium (e.g., water) to be described later from
scattering to the peripheral portion. The chamber 3010 has a
shutter 3060 through which the robot hand of the scalar robot 3150
enters/leaves the chamber. The separating apparatus 3020 has a
nozzle 3040 for ejecting a jet. The position of the nozzle 3040 is
controlled by an orthogonal robot 3050.
[0624] The turning apparatus 3130, rotates the upper substrate of
two separated substrates through 180.degree. to turn the substrate
(direct the separated surface upward). The cleaning/drying
apparatus 3120 cleans and dries separated substrates.
[0625] The separating system 3000 executes separation processing of
a bonded substrate stack on the basis of an instruction from an
operation panel 3140.
[0626] Procedures of separation processing by this processing
system 3000 will be described below. First, the cassette 3081
storing bonded substrate stacks to be processed is placed at a
predetermined position on the loader 3080 manually or
automatically. The empty cassettes 3091, 3101, and 3111 are placed
on the first unloader 3090, second unloader 3100, and third
unloader 3110, respectively. In this embodiment, the cassette 3091
is used to store upper separated substrates, the cassette 3101 is
used to store lower separated substrates, and the cassette 3111 is
used to store bonded substrate stacks (or separated substrates) for
which separation has failed. The cassette 3081 is placed on the
loader 3080 such that the stored bonded substrate stacks become
horizontal. The cassette 3091, 3101, and 3111 are placed on the
first unloader 3090, second unloader 3100, and third unloader 3120,
respectively, such that substrates can be stored in a horizontal
state.
[0627] The scalar robot 3150 chucks the lowermost bonded substrate
stack in the cassette 3081, extracts the bonded substrate stack,
and transfers it to the centering apparatus 3070 while maintaining
the horizontal state. The centering apparatus 3070 centers the
bonded substrate stack and transfers it to the scalar robot
3150.
[0628] The shutter 3060 of the chamber 3010 is opened to transfer
the centered bonded substrate stack from the scalar robot 3150 to
the separating apparatus 3020 while maintaining the horizontal
state. The bonded substrate stack has already been centered. For
this reason, when the robot hand of the scalar robot 3150 is moved
to a predetermined position to transfer the bonded substrate stack
to the separating apparatus 3020, the bonded substrate stack can be
positioned to the separating apparatus.
[0629] The shutter 3060 of the chamber 3010 is closed, and
separation processing is executed by the separating apparatus 3020.
More specifically, the separating apparatus 3020 ejects a jet from
the nozzle 3040 to the porous layer of the bonded substrate stack
while rotating the bonded substrate stack held in the horizontal
state, and separates the bonded substrate stack into two substrates
at the porous layer by the jet.
[0630] The shutter 3060 of the chamber 3010 is opened, and the
scalar robot 3150 receives the upper separated substrate from the
separating apparatus 3020 and transfers the substrate to the
turning apparatus 3130. The scalar robot 3150 preferably receives
the upper separated substrate and transfers it to the turning
apparatus 3130 while chucking the upper portion of the substrate.
With this arrangement, chips sticking to the separated surface
rarely stick to the robot hand of the scalar robot 3150. The
turning apparatus 3130 rotates the received substrate through
180.degree., i.e., turns the substrate and transfers it to the
scalar robot 3150. In place of the turning apparatus 3130, a
mechanism for rotating the robot hand of the scalar robot 3150
through 180.degree. may be prepared, and the substrate may be
turned by rotating the robot hand through 180.degree..
[0631] The scalar robot 3150 transfers the turned substrate to the
cleaning/drying apparatus 3120. The scalar robot 3150 preferably
receives the substrate from the turning apparatus 3130 and
transfers the substrate to the cleaning/drying apparatus 3120 while
supporting the substrate from the lower surface in the horizontal
state. This prevents the substrate from dropping. The
cleaning/drying apparatus 3120 cleans and dries the received
substrate and transfers it to the scalar robot 3150 in the
horizontal state.
[0632] The scalar robot 3150 stores the cleaned and dried substrate
in the cassette 3091 on the first unloader 3090. The scalar robot
3150 preferably receives the substrate from the cleaning/drying
apparatus 3120 and stores it in the cassette 3091 while supporting
the substrate from the lower side in the horizontal state. This
prevents the substrate from dropping.
[0633] The scalar robot 3150 receives the lower separated substrate
from the separating apparatus 3020 and transfers the substrate to
the cleaning/drying apparatus 3120. The scalar robot 3150
preferably receives the substrate and transfers it to the
cleaning/drying apparatus 3120 while supporting the substrate from
the lower side in the horizontal state. This prevents the substrate
from dropping. The cleaning/drying apparatus 3120 cleans and dries
the received substrate and transfers it to the scalar robot 3150 in
the horizontal state.
[0634] The scalar robot 3150 stores the cleaned and dried substrate
in the cassette 3111 on the second unloader 3100. The scalar robot
3150 preferably receives the substrate from the cleaning/drying
apparatus 3120 and stores the substrate in the cassette 3111 while
supporting the substrate from the lower side in the horizontal
state. This prevents the substrate from dropping.
[0635] Operation of the separating system 3000 for one bonded
substrate stack has been described above. In the separating system
3000, a plurality of bonded substrate stacks can be parallelly
processed. For example, while the first bonded substrate stack is
transferred from the centering apparatus 3070 to the separating
apparatus 3020 and is being separated by the separating apparatus
3020, the second bonded substrate stack is extracted from the
cassette 3081 on the loader 3080, transferred to the centering
apparatus 3070, and centered. That is, in the separating system
3000, centering processing by the centering apparatus 3070,
separation processing by the separating apparatus 3020, turning
processing by the turning apparatus 3130, and cleaning/drying
processing by the cleaning/drying apparatus 3120 can be parallelly
executed.
[0636] In the separating system 3000, the scalar robot 3150 stores
a substrate for which separation has failed in the cassette 3111 on
the third unloader 3110 in accordance with an instruction input
from the operator via the operation panel 3140. Instead of
recognizing a separation failure in accordance with an instruction
from the operator, a separation state monitor apparatus may be
prepared to detect a separation failure.
[0637] According to this embodiment, since the bonded substrate
stack or separated substrate is conveyed in the horizontal state,
the scalar robot 3150 having a relatively simple structure can be
employed as the conveyor mechanism.
[0638] In addition, according to this embodiment, since the
apparatuses are disposed at substantially equidistant positions
separated from the scalar robot 3150, the bonded substrate stack or
separated substrate can be efficiently conveyed among the
apparatuses.
[0639] According to the present invention, since the sample is
horizontally held, drop of, e.g., a plate-like sample can be
prevented, and separation processing can executed at a high
yield.
[0640] The present invention is not limited to the above
embodiments and various changes and modifications can be made
within the spirit and scope of the present invention. Therefore, to
apprise the public of the scope of the present invention, the
following claims are made.
* * * * *