loadpatents
name:-0.027102947235107
name:-0.03540301322937
name:-0.002331018447876
Ohmi; Kazuaki Patent Filings

Ohmi; Kazuaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohmi; Kazuaki.The latest application filed is for "exposure apparatus and device manufacturing method".

Company Profile
0.29.19
  • Ohmi; Kazuaki - Yokohama JP
  • Ohmi; Kazuaki - Yokohama-shi JP
  • Ohmi; Kazuaki - Kyoto JP
  • Ohmi; Kazuaki - Kanagawa JP
  • Ohmi, Kazuaki - Kanagawa-ken JP
  • Ohmi; Kazuaki - Ohta-ku JP
  • Ohmi; Kazuaki - Hadano JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Exposure apparatus and device manufacturing method
Grant 8,035,668 - Sugita , et al. October 11, 2
2011-10-11
Sample separating apparatus and method, and substrate manufacturing method
Grant 7,579,257 - Yanagita , et al. August 25, 2
2009-08-25
Exposure apparatus and device manufacturing method
App 20060158504 - Sugita; Mitsuro ;   et al.
2006-07-20
Process for producing single crystal silicon wafers
Grant 7,077,901 - Nakagawa , et al. July 18, 2
2006-07-18
Method and apparatus for processing composite member
Grant 6,979,629 - Yanagita , et al. December 27, 2
2005-12-27
Sample processing system
Grant 6,971,432 - Yanagita , et al. December 6, 2
2005-12-06
Sample processing system
App 20050236114 - Yanagita, Kazutaka ;   et al.
2005-10-27
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
Grant 6,900,114 - Ohmi , et al. May 31, 2
2005-05-31
Sample separating apparatus and method, and substrate manufacturing method
App 20050045274 - Yanagita, Kazutaka ;   et al.
2005-03-03
Method and apparatus for separating composite member using fluid
App 20040171233 - Ohmi, Kazuaki ;   et al.
2004-09-02
Method and apparatus for separating composite member using fluid
Grant 6,746,559 - Ohmi , et al. June 8, 2
2004-06-08
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
App 20040082146 - Ohmi, Kazuaki ;   et al.
2004-04-29
Method and apparatus for processing composite member
App 20040067621 - Yanagita, Kazutaka ;   et al.
2004-04-08
Sample processing system
App 20040045679 - Yanagita, Kazutaka ;   et al.
2004-03-11
Sample processing system
Grant 6,672,358 - Yanagita , et al. January 6, 2
2004-01-06
Method of manufacturing semiconductor wafer method of using and utilizing the same
Grant 6,656,271 - Yonehara , et al. December 2, 2
2003-12-02
Composite member separating method, thin film manufacturing method, and composite member separating apparatus
Grant 6,653,205 - Yanagita , et al. November 25, 2
2003-11-25
Method and apparatus for processing composite member
Grant 6,653,206 - Yanagita , et al. November 25, 2
2003-11-25
Semiconductor Substrate And Process For Producing The Same Using A Composite Member Having Porous Layers And Varying Thickness And Porosity
App 20030190794 - OHMI, KAZUAKI ;   et al.
2003-10-09
Sample processing system
Grant 6,629,539 - Yanagita , et al. October 7, 2
2003-10-07
Process for producing single crystal silicon wafers
App 20030183159 - Nakagawa, Katsumi ;   et al.
2003-10-02
Substrate and method of manufacturing the same
Grant 6,624,047 - Sakaguchi , et al. September 23, 2
2003-09-23
Method Of Manufacturing Semiconductor Wafer Method Of Using And Utilizing The Same
App 20030159644 - YONEHARA, TAKAO ;   et al.
2003-08-28
Separating apparatus, separating method, and method of manufacturing semiconductor substrate
Grant 6,609,446 - Ohmi , et al. August 26, 2
2003-08-26
Method of separating composite member and process for producing thin film
Grant 6,605,518 - Ohmi , et al. August 12, 2
2003-08-12
Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof
Grant 6,597,039 - Ohmi , et al. July 22, 2
2003-07-22
Sample separating apparatus and method, and substrate manufacturing method
App 20030116275 - Yanagita, Kazutaka ;   et al.
2003-06-26
Method and apparatus for separating composite member using fluid
App 20020179243 - Ohmi, Kazuaki ;   et al.
2002-12-05
Method and apparatus for separating composite member using fluid
Grant 6,475,323 - Ohmi , et al. November 5, 2
2002-11-05
Method of producing semiconductor member
Grant 6,468,923 - Yonehara , et al. October 22, 2
2002-10-22
Sample processing system
App 20020148570 - Yanagita, Kazutaka ;   et al.
2002-10-17
Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof
App 20020093047 - Ohmi, Kazuaki ;   et al.
2002-07-18
Method and apparatus for separating composite member using fluid
App 20020088558 - Ohmi, Kazuaki ;   et al.
2002-07-11
Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
App 20020081822 - Yanagita, Kazutaka ;   et al.
2002-06-27
Method and apparatus for producing photoelectric conversion device
Grant 6,391,743 - Iwane , et al. May 21, 2
2002-05-21
Method and apparatus for separating composite member using fluid
Grant 6,382,292 - Ohmi , et al. May 7, 2
2002-05-07
Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method
Grant 6,376,332 - Yanagita , et al. April 23, 2
2002-04-23
Method And Apparatus For Separating Composite Member Using Fluid
App 20020029849 - OHMI, KAZUAKI ;   et al.
2002-03-14
Method and apparatus for processing composite member
App 20020025652 - Yanagita, Kazutaka ;   et al.
2002-02-28
Composite member separating method, thin film manufacturing method, and composite member separating apparatus
App 20010003668 - Yanagita, Kazutaka ;   et al.
2001-06-14
Process for forming an SOI substrate
Grant 6,140,209 - Iwane , et al. October 31, 2
2000-10-31
Chemical vapor deposition apparatus
Grant 5,776,255 - Asaba , et al. July 7, 1
1998-07-07
Process for forming hydrogenated amorphous silicon film
Grant 5,723,034 - Ohmi March 3, 1
1998-03-03
Photoelectric conversion apparatus
Grant 5,723,877 - Sugawa , et al. March 3, 1
1998-03-03
Method of producing a substrate for an amorphous semiconductor
Grant 5,563,092 - Ohmi October 8, 1
1996-10-08
Process for forming metal deposited film containing aluminum as main component by use of alkyl aluminum hydride
Grant 5,154,949 - Shindo , et al. October 13, 1
1992-10-13
Process for forming deposited film and process for producing semiconductor device
Grant 5,134,092 - Matsumoto , et al. July 28, 1
1992-07-28
Luminescing member, process for preparation thereof, and electroluminescent device employing same
Grant 4,931,692 - Takagi , et al. June 5, 1
1990-06-05

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