U.S. patent application number 09/726064 was filed with the patent office on 2002-06-13 for abrasive article having a window system for polishing wafers, and methods.
Invention is credited to Bruxvoort, Wesley J., Fizel, Jerry J., Gagliardi, John J., Kim, Chong-Yong J., Muilenburg, Michael J., Pendergrass, Daniel B. JR., Streifel, Robert J., Webb, Richard J..
Application Number | 20020072296 09/726064 |
Document ID | / |
Family ID | 24917074 |
Filed Date | 2002-06-13 |
United States Patent
Application |
20020072296 |
Kind Code |
A1 |
Muilenburg, Michael J. ; et
al. |
June 13, 2002 |
Abrasive article having a window system for polishing wafers, and
methods
Abstract
A process for planarizing, polishing, or providing other
modification of a wafer surface or other workpiece. The process
includes using an abrasive article having a textured abrasive
coating affixed to a backing. The abrasive article includes a
monitoring element, such as a window, to allow transmission of
radiation therethrough. The radiation level is monitored throughout
the planarization process to determine the approach of the desired
endpoint. The window in the abrasive coating can be an area devoid
of abrasive coating or having minimal or a thinned abrasive
coating.
Inventors: |
Muilenburg, Michael J.;
(Minneapolis, MN) ; Kim, Chong-Yong J.;
(Shoreview, MN) ; Fizel, Jerry J.; (River Falls,
WI) ; Webb, Richard J.; (Inver Grove Heights, MN)
; Gagliardi, John J.; (Hudson, WI) ; Pendergrass,
Daniel B. JR.; (Mendota Heights, MN) ; Streifel,
Robert J.; (Woodbury, MN) ; Bruxvoort, Wesley J.;
(Woodbury, MN) |
Correspondence
Address: |
MERCHANT & GOULD PC
P.O. BOX 2903
MINNEAPOLIS
MN
55402-0903
US
|
Family ID: |
24917074 |
Appl. No.: |
09/726064 |
Filed: |
November 29, 2000 |
Current U.S.
Class: |
451/5 |
Current CPC
Class: |
B24B 37/205 20130101;
B24B 37/013 20130101; B24D 11/005 20130101 |
Class at
Publication: |
451/5 |
International
Class: |
B24B 049/00 |
Claims
We claim:
1. A method of modifying a workpiece surface comprising: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a textured abrasive coating having
a plurality of abrasive particles dispersed in a binder, the
textured abrasive coating adhered to a backing; (ii) a monitoring
element for passage of radiation therethrough; (b) moving the
abrasive article in relation to the workpiece surface to modify the
workpiece surface; and (c) determining a degree of surface
modification by: (i) measuring a first radiation level from the
workpiece surface through the monitoring element.
2. The method according to claim 1, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a plurality of abrasive composites
comprising abrasive particles dispersed in a binder, the abrasive
composites adhered to a backing.
3. The method according to claim 2, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a monitoring element for passage
of radiation therethrough, the monitoring element being an area
devoid of abrasive composites.
4. The method according to claim 2, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a monitoring element for passage
of radiation therethrough, the monitoring element being an area
having a thinned abrasive coating.
5. The method according to claim 1, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a textured abrasive coating having
a plurality of abrasive particles dispersed in a binder, the
textured abrasive coating adhered to a backing; and (ii) a
monitoring element for passage of radiation therethrough, the
monitoring element extending from a first edge of the abrasive
article to a second opposite edge of the abrasive article.
6. The method according to claim 5, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a monitoring element for passage
of radiation therethrough, the monitoring element oscillating
between the first edge of the abrasive article and the second
opposite edge of the abrasive article.
7. The method according to claim 5, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) an extended length of abrasive
article having a longitudinal length; and (ii) a monitoring element
for passage of radiation therethrough, the monitoring element
extending along the longitudinal length of the abrasive
article.
8. The method according to claim 1, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a monitoring element for passage
of radiation therethrough, the monitoring element being a discrete
area in the abrasive coating of the abrasive article.
9. The method according to claim 8, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article, the
abrasive article comprising: (i) a monitoring element for passage
of radiation therethrough, the discrete area having a shape
selected from a square, rectangle, circle, or ellipse.
10. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a first radiation level from the workpiece surface; (ii)
measuring a second radiation level from the workpiece surface; and
(iii) comparing the first radiation level and the second radiation
level.
11. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a first radiation level with a first sensor through a
first monitoring element; and (ii) measuring a second radiation
level with a second sensor through a second monitoring element.
12. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a thermal radiation level from the workpiece surface.
13. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a visible light level from the workpiece surface.
14. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring an ultraviolet light level from the workpiece
surface.
15. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a first radiation level emitted from the workpiece
surface.
16. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a first radiation level reflected by the workpiece
surface.
17. The method according to claim 1, wherein the step of
determining a degree of surface modification comprises: (i)
measuring a first radiation level passing through the
workpiece.
18. The method according to claim 1, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an elongate abrasive
article.
19. The method according to claim 1, wherein the step of contacting
the workpiece surface with an abrasive article comprises: (a)
contacting the workpiece surface with an abrasive article having a
shape selected from a disc, square, rectangle, daisy, pentagon,
hexagon, octagon, and ellipse.
20. A method of making an abrasive article for wafer planarization,
the method comprising: (a) providing an abrasive coating
composition; (b) bringing a backing into contact with the abrasive
coating composition, so that the abrasive coating composition
contacts a first portion of the backing, leaving a second portion
of the backing free of abrasive coating composition; and (c) at
least partially curing the abrasive coating composition.
21. The method according to claim 20, wherein the step of bringing
a backing into contact with the abrasive coating composition, so
that the abrasive coating composition contacts a first portion of
the backing, leaving a second portion of the backing free of
abrasive coating composition comprises: (a) bringing a backing into
contact with the abrasive coating composition, so that the abrasive
coating composition contacts a first portion of the backing,
leaving a second portion of the backing free of abrasive coating
composition, wherein the second portion of the backing free of
abrasive coating composition extends a length of the backing.
22. The method according to claim 20, wherein: (a) the step of
providing an abrasive coating composition comprises: (i) applying
the abrasive coating composition into a plurality of cavities in a
production tool; and wherein the method further comprises: (b)
removing the abrasive coating composition from the plurality of
cavities.
23. The method according to claim 22, wherein the step of applying
the abrasive coating composition into a plurality of cavities in a
production tool comprises: (a) applying the abrasive coating
composition into a plurality of cavities in a production tool, the
production tool further comprising an area devoid of cavities.
24. The method according to claim 23, wherein the step of applying
the abrasive coating composition into a plurality of cavities in a
production tool, the production tool further comprising an area
devoid of cavities comprises: (a) applying the abrasive coating
composition into a plurality of cavities in a production tool, the
production tool further comprising a length of the production tool
devoid of cavities.
25. The method according to claim 23, wherein the step of applying
an abrasive coating composition into a plurality of cavities in a
production tool, the production tool further comprising an area
devoid of cavities comprises: (a) applying an abrasive coating
composition into a plurality of cavities in a production tool, the
production tool further comprising discrete areas of the production
tool devoid of cavities.
26. The method according to claim 20, wherein the step of bringing
a backing into contact with the abrasive coating composition
comprises: (a) bringing an extended length of backing into contact
with the abrasive coating composition.
27. The method according to claim 20, wherein the step of bringing
a backing into contact with the abrasive coating composition
comprises: (a) providing a backing comprising a primer in the first
portion of the backing and no primer in the second portion of the
backing.
28. The method according to claim 20, wherein the step of bringing
a backing into contact with the abrasive coating composition
comprises: (a) providing a backing comprising a release element in
the second portion of the backing.
29. The method according to claim 28, wherein the step of providing
a backing comprising a release element in the second portion of the
backing comprises: (a) providing a backing comprising a removable
strip in the second portion of the backing.
30. The method according to claim 20, wherein the step of providing
an abrasive coating composition comprises: (a) providing an
abrasive coating composition via a gravure roll.
Description
[0001] The present disclosure relates to an abrasive article used
for polishing or otherwise conditioning wafers, such as silicon
wafers. In particular, the disclosure relates to abrasive articles
having a window system for monitoring the polishing process.
BACKGROUND
[0002] In the course of integrated circuit manufacture, a
semiconductor wafer typically undergoes numerous processing steps,
including deposition, patterning, and etching steps. Additional
details on how semiconductor wafers are manufactured can be found
in the article "Abrasive Machining of Silicon" by Tonshoff, H. K.;
Scheiden, W. V.; Inasaki, I.; Koning. W.; Spur, G. published in the
Annals of the International Institution for Production Engineering
Research Volume 39/2/1990, pages 621 to 635. At each step in the
process, it is often desirable to achieve a pre-determined level of
surface "planarity," "uniformity," and/or "roughness." It is also
desirable to minimize surface defects such as pits and scratches.
Such surface irregularities may affect the performance of the final
semiconductor device and/or create problems during subsequent
processing steps.
[0003] One accepted method of reducing surface irregularities is to
treat the wafer surface with a slurry containing a plurality of
loose abrasive particles, dispersed in a liquid, and a polishing
pad; this is commonly referred to as "planarizing" or
"planarization". The planarization process is typically a
chemical-mechanical polishing (CMP) process. One problem with CMP
slurries, however, is that the process must be carefully monitored
in order to achieve the desired amount of planarization. It is
important that the planarization process be stopped when the
correct thickness of layer material has been removed; that is, when
the proper endpoint has been reached. Removing too much of the
layer results in loss of wafer yield, which could require
redepositing of the circuitry, and not removing a sufficient amount
of the layer may require continued planarization. Various methods
have been used to attempt to detect the endpoint for stopping the
CMP process. These methods include: straight timing, friction,
optical results, acoustical results, and conductive
characteristics. There have been references related to endpoint
detection by chemical analysis; see for example, U.S. Pat. Nos.
6,021,679 and 6,066,564, and PCT Published application WO 99/56972.
These references disclose detecting the endpoint by monitoring a
chemical reaction product caused by the reaction of a component
from the abrasive slurry and the wafer.
[0004] Additionally, there have been references that disclose using
visual or optical techniques for in-situ monitoring of the CMP
process; see for example, U.S. Pat. No. 6,068,538 which discloses
using a polishing device having a moveable window positioned below
the wafer being processed to view the wafer surface. During
polishing, the window is removed from the wafer surface, but is
moved to be adjacent the wafer during the visual inspection.
[0005] Improvements in real-time endpoint detection methods and
processes for determining when the desired level of planarization
of the wafers has been obtained, are desired.
SUMMARY OF THE DISCLOSURE
[0006] The present disclosure is directed to fixed abrasive
articles used for polishing or planarization of semiconductor
wafers, and methods of using those abrasive articles for detection
of the endpoint of the CMP process.
[0007] The abrasive article is a fixed abrasive article having an
element or feature therein that allows monitoring of a wafer
surface therethrough. By the term "fixed abrasive article", it is
meant that the abrasive article has an abrasive coating adhered to
a backing or other carrier layer. The monitoring element allows
monitoring of the wafer surface through a portion of the abrasive
article; this monitoring element can be referred to as a "window".
This window may be an area free of abrasive coating, an area having
a decreased amount of abrasive coating, or any other area that
allows monitoring of the wafer surface through the abrasive
article. The benefits of using a fixed abrasive article include the
lack of freely moving abrasive particles, such as is encountered
when using an abrasive slurry, which can interfere with the
endpoint measurements through the monitoring element.
[0008] In one embodiment, the window allows transmission of
radiation therethrough, the radiation having a decrease of no
greater than about 50% as it passes through the window. The term
"radiation" is intended to all types of radiation, including
electromagnetic radiation, gamma rays, radio frequencies,
microwaves, x-rays, infrared radiation, ultraviolet radiation,
visible light, and the like. The radiation may be reflected by the
wafer surface or may be emitted by the surface. In one embodiment,
the window allows transmission of visible light therethrough, the
transmission having a decrease no greater than about a 50% as it
passes through the window.
[0009] In another embodiment, the window allows transmission of
radiation therethrough, with the amount of radiation passing
therethrough sufficient to allow for quantitative evaluation of
changes of the wafer surface. That is, the amount of radiation lost
during passing through the window of the abrasive article is
irrelevant, as long as the level is sufficient to monitor changes
in the wafer surface.
[0010] The surface of the wafer can be monitored for changes such
as temperature, visible light spectrum patterns, radiation
scattering effects, and the like.
[0011] The window, through which the wafer surface is monitored,
can be continuous along an extended length of abrasive article; for
example, the window can extend along the length of a roll of
abrasive article. The window can be positioned in essentially the
same position along the length of the abrasive article, or the
position of the window can vary. In another embodiment, the window
is a discrete window bounded by abrasive coating on all sides.
Alternately, the abrasive article can have a specific shape and
size, such as an abrasive disc; the window can extend from one edge
of the abrasive disc to an opposite edge, or the window can be a
discrete window bounded by abrasive coating on all sides.
[0012] The fixed abrasive article of the present disclosure can be,
and preferably is, a textured or three-dimensional abrasive
article. By the terms "textured" and "three-dimensional", it is
meant that the abrasive coating has a discernible surface pattern.
The pattern or texture may be random or precisely placed on the
backing. In some embodiments, the abrasive coating is a plurality
of abrasive composites on the backing; the abrasive composites may
be precisely or irregularly shaped. Preferably, the abrasive
composites are precisely shaped. The abrasive composites, whether
precisely or irregularly shaped, can be of any geometrical shape
defined by a substantially distinct and discernible boundary; such
shapes include pyramidal, truncated pyramidal, and the like.
[0013] The abrasive coating is a plurality of abrasive particles
held to the backing by a binder. The binder can be any material,
such as a metal or ceramic binder, but is generally and preferably
an organic binder. In most embodiments, the binder is formed from a
binder precursor. In the embodiments where the binder is an organic
binder, the binder is formed by the curing or polymerization of the
binder precursor.
[0014] In one preferred embodiment, the binder is formed by an
addition polymerization, that is, a free-radical or cationic
polymerization, of a binder precursor. Additionally, the binder
precursor can be polymerized by exposure to radiation or radiant
energy, along, if necessary, with an appropriate curing agent.
Preferably, the binder precursor includes multi-functional acrylate
resin(s), mono-functional acrylate resin(s), or mixtures
thereof.
[0015] Methods of making an abrasive article having a window are
disclosed. Generally, the abrasive article can be made by any
method known for making abrasive articles, except that the present
disclosure includes the addition of a window within the abrasive
coating. The window can be formed by various methods, including:
leaving a portion of the backing without the abrasive coating,
eliminating the abrasive coating on a portion of the backing after
the abrasive coating has been applied, modifying the abrasive
coating to provide the desired transmission properties, or removing
portions of the abrasive article and applying onto a carrier
backing.
[0016] Methods of using the abrasive article to planarize the wafer
and monitor the endpoint of the planarization process without
removal of the abrasive article are also disclosed. The abrasive
article is brought into contact with the wafer surface at a desired
pressure, preferably in the presence of a coolant or lubricant,
such as water or any aqueous or non-aqueous chemistry, and the
abrasive article and wafer are moved in relation to each other.
After a prescribed period of planarization, the surface of the
wafer is optically examined through the window in the abrasive
article. In another embodiment, the surface of the wafer can be
continuous monitored through the window in the abrasive
article.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Other features, advantages, and further methods of
practicing the disclosure will be better understood from the
following description of figures and the preferred embodiments of
the present disclosure.
[0018] FIG. 1 is a schematic side view of a process for modifying a
wafer surface using a fixed abrasive article, according to the
present disclosure;
[0019] FIG. 2 is perspective view of one embodiment of an abrasive
article according to the present disclosure;
[0020] FIG. 3 is a perspective view of a second embodiment of an
abrasive article according to the present disclosure;
[0021] FIG. 4 is a perspective view of a third embodiment of an
abrasive article according to the present disclosure;
[0022] FIG. 5 is a perspective view of a fourth embodiment of an
abrasive article according to the present invention;
[0023] FIG. 6 is a top view of a fifth embodiment of an abrasive
article according to the present invention;
[0024] FIG. 7 is a top view of a sixth embodiment of an abrasive
article according to the present invention;
[0025] FIG. 8 is a top view of a seventh embodiment of an abrasive
article according to the present invention;
[0026] FIG. 9 is a top view of a eighth embodiment of an abrasive
article according to the present invention;
[0027] FIG. 10 is a top view of a ninth embodiment of an abrasive
article according to the present invention;
[0028] FIG. 11 is an enlarged cross-sectional view of one
embodiment of an abrasive article according to the present
invention;
[0029] FIG. 12 is an enlarged cross-sectional view of an
alternative embodiment of an abrasive article according to the
present invention;
[0030] FIG. 13 is an enlarged cross-sectional view of yet an
another alternative embodiment of an abrasive article according to
the present invention;
[0031] FIG. 14 is a schematic side view of a system for making an
abrasive article such as those depicted in FIGS. 2 through 13;
and
[0032] FIG. 15 is a schematic perspective view of a system an
abrasive article such as those depicted in FIGS. 2 and 7.
DETAILED DESCRIPTION
[0033] Referring now to the drawings, FIG. 1 illustrates a
polishing or planarization process 10 for modifying the surface 22
of a wafer 20, generally a silicon wafer. Surface 22 of wafer 20,
as used throughout this disclosure, is intended to include silicon
wafers having no circuitry, a wafer having multiple layers of
circuitry, and any and all intermediate layers, which include any
and all metal and dielectric layers and features. Examples of
materials generally polished or planarized by process 10 include,
but are not limited to, silicon, silicon oxide, copper, tungsten,
and aluminum.
[0034] Process 10 is preferably a chemical-mechanical polishing
(CMP) process, but it is understood that any device or process
capable of modifying a surface of a workpiece can be used in
conjunction with the present invention. As shown in FIG. 1, wafer
20, in particular surface 22, is positioned in preparation of being
brought into contact with abrasive surface 106 of abrasive article
100. What is desired is to planarize, polish, or otherwise alter or
modify surface 22 of wafer 20.
[0035] In most embodiments wafer 20 is held by a carrier 25 above
abrasive article 100. Abrasive article 100 is supported by a platen
30 on which is positioned a conformable pad 40. Pad 40 supports
abrasive article 100 and provides a cushioning effect for abrasive
article 100. Generally, pad 40 is a urethane or urethane composite
pad, and such pads are well known in wafer processing.
[0036] In most embodiments, carrier 25 with wafer 20 rotates in
relation to abrasive article 100, however, in some embodiments,
carrier 25 and wafer 20 are stationary and abrasive article 100 on
pad 40 and platen 30 rotate or otherwise move. In most processes, a
coolant or lubricant, such as water, alcohol, oil, or the like, is
used at the interface between wafer 20 and abrasive article 100. In
some embodiments, the coolant may be an etchant, in that it reacts
with or otherwise affects the surface 22.
[0037] Platen 30 has an aperture 35 therethrough and pad 40 also
has an aperture 45 therethrough. Together, aperture 35 and aperture
45 form receptacle 55 for receiving a measurement sensor 50, which
measures a desired characteristic of surface 22 of wafer 20 through
abrasive article 100, in particular, through a monitoring element,
as will be described in detail below.
[0038] Sensor 50 is generally configured to measure radiation such
as electromagnetic radiation, gamma rays, radio frequencies,
microwaves, x-rays, infrared radiation, ultraviolet radiation,
visible light, and the like. This radiation may be either emitted
by wafer 20 or may be radiation from a separate source that is
reflected by or passed through wafer 20. The changes of radiation
levels measured by sensor 50 correlate to the degree of
planarization of surface 22 completed by the planarization
process.
[0039] In another embodiment, sensor 50, combined with any control
system or electronic equipment, may be designed to monitor average
levels or relative levels of reflection or absorption spectra from
the wafer surface 22. For example, if it is known the final desired
surface is 25% copper circuitry and 75% dielectric, the levels of
reflection or adsorption spectra from the two materials can be
monitored until their levels are present in a 1:3 ratio. It is
understood that this can be done with any materials and at any
percentage levels.
[0040] In some embodiments it is desired that sensor 50 is
generally flush with the top of pad 40 so that little or no gap
exists between sensor 50 and abrasive article 100. Sensor 50 may be
removable and replaceable within receptacle 55 to allow for
changing sensor 50 as needed.
[0041] Sensor 50 is positioned within process 10 so that sensor 50
is aligned with a monitoring element within abrasive article 100
(as will be described below), so that sensor 50 is able to monitor
the processing of wafer 20.
[0042] Abrasive Article Used for Polishing
[0043] In accordance with the present disclosure, the fixed
abrasive article 100 used for planarizing, planarization, or
otherwise modifying wafer 20 has a monitoring element to allow
passage of the radiation therethrough. This monitoring element can
be referred to as a "window", in that the monitoring element allows
the transmission of radiation through that area of the abrasive
article having the monitoring element; the amount of radiation
passing through the window should be of a level sufficient so that
the sensor 50 is able to qualify and quantify radiation level
changes.
[0044] The window area of abrasive article 100 is generally an area
that is void of abrasive coating 106 or has a decreased amount of
abrasive coating thereon. In some embodiments, an abrasive coating
is present in the monitoring element area, but the pattern or
texture of the abrasive coating is such that it allows sufficient
light transmission therethrough. Throughout the planarization
process, the window area generally has a constant concentration of
abrasive coating. The abrasive coating does not freely move, such
as would a loose abrasive slurry or paste. It is understood that
occasionally abrasive particles or pieces of coating may break free
from the abrasive article; however, this amount will typically not
affect or interfere with the transmission of radiation through the
monitoring element or window.
[0045] Generally, the area of the window is no greater than about
50% of the area of the abrasive article used for the CMP process.
In most embodiments, the area of the window is no greater than
about 25% of the abrasive article area. In processes where the
abrasive article has continuous longitudinal motion in respect to
the wafer during the planarization process, the percentage of
window area in contact with the wafer surface will generally remain
relatively constant as the abrasive article is moved in relation to
the wafer.
[0046] The monitoring element or window can be continuous along an
extended length of abrasive article; for example, the window can
extend along the length of a roll of abrasive article. The window
can be positioned in essentially the same position along the length
of the abrasive article, or the position of the window can vary in
respect to an edge of the abrasive article. In an alternative
embodiment, the window is a discrete window bounded by abrasive
coating and does not extend the length of the abrasive article.
Another embodiment is to have a window extend across the width of
an abrasive article.
[0047] Referring now to FIGS. 2, 3, 4 and 5, four variations of
abrasive articles having an extended length are shown. In FIGS. 2
and 3, the windows are continuous along the length of the abrasive
article, in FIG. 4, the windows are individual discrete windows,
and in FIG. 5 the windows extend across the width of the abrasive
article.
[0048] In FIG. 2, an extended length of abrasive article 110 having
a width WI between first side edge 111 and second side edge 112 is
shown rolled on a spool or core 114. Abrasive article 110 has an
abrasive coating 116 on a backing (not shown). Extending along the
length of abrasive article 110 is an elongate window 118. Window
118 has characteristics that allow for the transmission of
radiation through window 118 with no more than approximately a 50%
decrease in transmission properties. In another embodiment, window
118 allows sufficient transmission of radiation therethrough to
enable detection of differences in the radiation reflectance or
emission. The distance between window 118 and second side edge 112
along the length of abrasive article 110 is essentially
constant.
[0049] In FIG. 3, an extended length of abrasive article 120 having
a width W2 between first side edge 121 and second side edge 122 is
shown rolled on a spool or core 124. Abrasive article 120 has an
abrasive coating 126 on a backing (not shown). Extending along the
length of abrasive article 120 is an elongate window 128. The
distance between window 128 and second side edge 122 varies along
the length of abrasive article 120. Window 128 is a sinusoidal
pattern extending the length of abrasive article 120.
[0050] In FIG. 4, an extended length of abrasive article 130 having
a width W3 between first side edge 131 and second side edge 132 is
shown rolled on a spool or core 134. Abrasive article 130 has an
abrasive coating 136 on a backing (not shown). Extending along the
length of abrasive article 130, in close proximity to first side
edge 131 and second side edge 132, are discrete windows 138a and
138b. The distance between window 138a and first side edge 131
along the length of abrasive article 130 is essentially constant,
and the distance between window 138b and second side edge 138b is
essentially constant.
[0051] In FIG. 5, an extended length of abrasive article 140 having
a width W4 between first side edge 141 and second side edge 142 is
shown rolled on a spool or core 144. Abrasive article 140 has an
abrasive coating 146 on a backing (not shown). Extending between
first side edge 141 and second side edge 142 are discrete windows
148.
[0052] FIGS. 6 through 10 show various embodiments of specifically
shaped abrasive articles, in particular, abrasive discs, having at
least one window therein. Although five various embodiments of
abrasive discs with windows are shown, it is understood that the
abrasive article can be any shape, such as a square, rectangle,
"daisy" shaped, and other shapes, and that the window or windows
can be positioned in any orientation on the abrasive article. It is
further understood that any window can have any shape.
[0053] Referring now to FIG. 6, an abrasive article 150 is shown.
Abrasive article 150 has an abrasive coating 156 and two windows
158. Windows 158 are rectangular windows and are positioned with
their long axes aligned. Windows 158 are positioned fairly close to
the outer edge of abrasive article 150.
[0054] The process according to the present invention may include
one sensor 50 (referring again to FIG. 1) for each abrasive
article, or may include multiple sensors 50, such as one sensor 50
for each window 158, as shown in FIG. 6. It is not necessary that
each of the multiple sensors is aligned with a window 158 at all
instances; rather, in some embodiments, only one sensor may be
aligned within a window to provide an endpoint monitoring reading.
As the abrasive article shifts or progresses across platen 30 and
pad 40, another sensor 50 will typically align with its respective
window 158. It is understood that continuous monitoring is not
required, that is, with a sensor aligned with a window at all
periods during the planarization or polishing. Rather, as long the
interval between alignment of the window and the sensor is short
with respect to the total planarization or polishing time,
intermittent monitoring is acceptable.
[0055] In FIG. 7, an abrasive article 160 having an abrasive
coating 166 and a single window 168 is shown. Window 168 is a
narrow strip that extends across the diameter of abrasive article
160.
[0056] An abrasive article 170 having an abrasive coating 176 and a
circular or ring-like window 178 is shown in FIG. 8. Window 178 is
displaced from the edge of abrasive article 170 an equal distance
around the circumference of abrasive article 170. Abrasive coating
176 is present both inside and outside of the ring window 178.
[0057] In FIG. 9, the windows 188 are similar to rectangular
windows 158 of abrasive article 150 of FIG. 6, except that in FIG.
9, abrasive article 180 has four windows 188 positioned equally
spaced along the circumference of abrasive article 180. Windows 180
are positioned so that their minor axes are aligned and intersect
at a right angle in the center of the abrasive article 180. It is
understood that in some embodiments, multiple window 180 may not be
equally spaced along the circumference or edge of the abrasive
article.
[0058] In each of the embodiments shown in FIGS. 2 through 10, the
window in the abrasive article is an area within the abrasive
article that is free of abrasive coating, an area having a
decreased amount of abrasive coating, or any other area that allows
for monitoring of the wafer surface through the abrasive article.
In one embodiment, the window allows radiation transmission
therethrough, the transmission having a decrease of no greater than
about 50% caused by the window. It should be noted that the backing
is present in the area of the window.
[0059] The abrasive article of the present invention is preferably
a textured or three-dimensional abrasive article; it is called a
"three-dimensional" abrasive article because it has a
three-dimensional abrasive coating generally formed by an array of
individual abrasive composites each having abrasive particles
dispersed in a binder system. It is preferred that the composites
are three dimensional, having work surfaces which do not form part
of an integral layer, thus providing portions of the abrasive
coating that are recessed from the working surface. These recesses
provide room for debris removal and provide room for fluid
interaction between the abrasive article and wafer surface.
[0060] The abrasive article used in this disclosure may be a so
called "structured abrasive article". A structured abrasive article
means an abrasive article having a plurality of individual shaped
composites, such as precisely-shaped composites, positioned on a
backing, each composite comprising abrasive particles dispersed in
a binder.
[0061] Other examples of three-dimensional abrasive articles usable
for the method of the present disclosure include: (1) "beaded-type
abrasive articles" which have beads (generally spherical and
usually hollow) of binder and abrasive particles; these beads are
then bonded to a backing with a binder; (2) abrasive agglomerates
bonded to a backing, where the abrasive agglomerates include
abrasive particles bonded together with a first binder; these
agglomerates are then bonded to a backing with a second binder; (3)
abrasive coating applied by rotogravure roll or other embossed
roll; (4) abrasive coating applied through screen to generate a
pattern; (5) abrasive coating on a contoured or embossed backing.
These examples are not limiting to the types of three-dimensional
abrasive articles that can be used for the abrasive articles and
the various methods of the present invention; rather, the list
provided is merely a sampling of abrasive articles that have a
three-dimensional or textured coating. Various other methods to
provide abrasive coatings having a texture can used, and these
abrasive articles can be used in the present planarization
method.
[0062] Various three-dimensional, fixed, abrasive articles in
accordance with the present invention will be described in detail
in relation to FIGS. 11, 12 and 13. Referring to FIG. 11, one
embodiment of a three-dimensional abrasive article 200 is
illustrated. Abrasive article 200 has a backing 202 having a front
surface 204 and a back surface 206. An abrasive coating, in this
embodiment a plurality of individual abrasive composites 210, is
bonded to front surface 204 of backing 202. The abrasive composites
210 include abrasive particles 212 dispersed in a binder 214. The
abrasive composites 210 have a precise shape, shown here as
truncated pyramids. On the back surface 206 is an attachment layer
215, such as a pressure-sensitive adhesive, that is used to secure
abrasive article 200 to a surface of the platen (as shown in FIG.
1).
[0063] Abrasive article 200 also has an associated monitoring
element, such as window 208, which is positioned between abrasive
composites 210 on backing 202 and is void of abrasive coating.
[0064] Referring to FIG. 12, another embodiment of a
three-dimensional abrasive article 200' is illustrated. Abrasive
article 200' has a backing 202' having a front surface 204' and a
back surface 206'. An abrasive coating, in this embodiment a
plurality of individual abrasive composites 210' having an
imprecise or irregular shape, is bonded to the front surface 204 of
the backing 202'. The irregular abrasive composites 210' are not
bounded by well-defined shaped edges with distinct edge lengths
having distinct endpoints, as are the composites 210 of abrasive
article 200 of FIG. 11. Rather, the abrasive composites 210' are
slumped composites of abrasive particles 212' dispersed in a binder
214'. On the back surface 206' of backing 202' is an attachment
layer 215', such as a pressure-sensitive adhesive.
[0065] Abrasive article 200' also has a monitoring element, shown
as window 208'. Window 208' is positioned between abrasive
composites 210' on backing 202' and includes a thin or thinned
layer of abrasive coating on first surface 204'. The abrasive
coating present in the area of window 208' is sufficiently thin to
allow sufficient radiation transmission through window 208'. In
most embodiments, abrasive particles are present in the thinned
layer of abrasive coating.
[0066] Referring to FIG. 13, yet another embodiment of a
three-dimensional abrasive article 300 is illustrated. Abrasive
article 300 has a backing 302 having a front surface 304 and a back
surface 306. An abrasive coating, in this embodiment a plurality of
precisely shaped individual abrasive composites 310, is bonded to
the front surface 304 of the backing 302. Similar to the other
abrasive composites, composites 310 comprise abrasive particles 312
dispersed in a binder 314.
[0067] Abrasive article 300 also has a monitoring element, such as
a window 308. Window 308 is positioned on front surface 304 of
backing 302 between abrasive composites 310. The area of window 308
includes a plurality of precisely shaped individual structures 318.
Structures 318 have a similar shape to abrasive composites 310,
however, structures 318 generally do not include abrasive particles
312. Rather, structures 318 may be optically clear or at least
partially transparent, in order to allow passage of light or other
radiation therethrough. In some embodiments, it is desired that
structures 318 have a refractive index similar to that of any
coolant or liquid that is present at the abrasive article-wafer
interface. In another embodiment, structures 318 can be water
soluble structures which soften and dissolve upon contact with any
coolant used during the planarization process.
[0068] The various embodiments of abrasive articles shown in FIGS.
2 through 13 can be made by a variety of methods, as will be
described below. However, prior to describing methods of making the
abrasive articles, the various elements of the abrasive articles
will be described.
[0069] As understood, the abrasive article of the present invention
is a fixed abrasive article, meaning that the abrasive coating is
present on a backing. The backing used can be any backing material
generally used for abrasive articles, such as polymeric film
(including primed polymeric film), cloth, paper, nonwovens
(including lofty nonwovens), treated versions thereof and
combinations thereof. Generally, metal backings are not used
because of their resistance to passage of radiation therethrough.
The backing can have a treatment to improve the adhesion of the
abrasive coating onto the backing. Paper and cloth backings can
have a water proofing treatment so that the backing does not
appreciably degrade during the planarization or polishing
operation, as some water is used during the process. In one
preferred embodiment, the backing is at least partially transparent
to visible light, so that at least some amount of visible light is
able to be transmitted through the backing.
[0070] The backing can have one half of an attachment system on its
back surface to secure the abrasive article to the support pad or
back-up pad. This attachment system half can be a pressure
sensitive adhesive (PSA) or tape, a loop fabric for a hook and loop
attachment, a hook structure for a hook and loop attachment, or an
intermeshing attachment system.
[0071] The abrasive article can have any suitable shape, such as
round, oval or rectangular depending on the particular shape of the
lap pad (that is, the support pad) being employed. In many
instances, the abrasive article will be slightly larger in size
than the lap pad. In some embodiments, the abrasive article is
provided as an extended length on a roll or reel. An abrasive
article may be formed into an endless belt by conventional methods
by splicing the abutted ends of an elongated strip of the sheet
material. Additionally, the abrasive article may be die cut and/or
slit to any desired configuration or shape.
[0072] The abrasive coating of the abrasive article includes
abrasive particles dispersed in a binder. The abrasive particles
are preferably aluminum oxide (alumina), silicon oxide (silica),
cerium oxide (ceria), rare earth compounds, or mixtures thereof,
although it is understood that any abrasive particle can be used.
The particular abrasive particle used will generally depend on the
material being polished or planarized. Examples of rare earth
compounds suitable for planarization can be found in U.S. Pat. No.
4,529,410 (Khaladji et al.). It is believed that some abrasive
particles may provide a chemo-mechanical element to the
planarization procedure. As used herein, chemo-mechanical refers to
a dual mechanism where corrosion chemistry and fracture mechanics
both play a role in wafer polishing. In particular, it is believed
that abrasive particles such as cerium oxide and zirconium oxide,
for example, provide a chemical element to the polishing phenomenon
for SiO.sub.2 substrates.
[0073] The abrasive particles may be uniformly dispersed in the
binder or alternatively the abrasive particles may be non-uniformly
dispersed. It is preferred that the abrasive particles are
uniformly dispersed so that the resulting abrasive coating provides
a consistent cutting/polishing ability.
[0074] The average size of the abrasive particles is at least about
0.001 micrometer; the average size is no greater than about 20
micrometers. Typically, the average size is about 0.01 to 10
micrometers. In some instances, the abrasive particles preferably
have an average particle size less than 0.1 micrometer. In other
instances, it is preferred that the particle size distribution
results in no or relatively few abrasive particles that have a
particle size greater than about 2 micrometers, preferably less
than about 1 micrometer and more preferably less than about 0.75
micrometer. At these relatively small particle sizes, the abrasive
particles may tend to aggregate by interparticle attraction forces.
Thus, these aggregates may have a particle size greater than about
1 or 2 micrometers and even as high as 5 or 10 micrometers. It is
then preferred to break up these aggregates to an average size of
about 2 micrometers or less. In some instances, it is preferred
that the particle size distribution be tightly controlled such that
the resulting abrasive article provides a very consistent surface
finish on the wafer surface.
[0075] To form an abrasive composite or coating, the abrasive
particles are dispersed in a binder precursor to form an abrasive
slurry, which is then exposed to an energy source to aid in the
initiation of the polymerization or curing process of the binder
precursor. Examples of energy sources include thermal energy and
radiation energy, which includes electron beam, ultraviolet light,
and visible light. The cured binder precursor forms the binder.
[0076] Examples of suitable binder precursors which are curable via
an addition (chain reaction) mechanism include binder precursors
that polymerize via a free radical mechanism or, alternatively, via
a cationic mechanism. These binder precursors include acrylated
urethanes, acrylated epoxies, ethylenically unsaturated compounds
including acrylate monomer resin(s), aminoplast derivatives having
pendant .alpha., .beta.-unsaturated carbonyl groups, isocyanurate
derivatives having at least one pendant acrylate group, isocyanate
derivatives having at least one pendant acrylate group, epoxy
resins, vinyl ethers, and mixtures and combinations thereof. The
term acrylate encompasses acrylates and methacrylates.
[0077] Various methods for producing abrasive articles having
either precisely or irregularly shaped abrasive composites are
taught, for example, in U.S. Pat. No. 5,152,917 (Pieper et al.),
U.S. Pat. No. 5,435,816 (Spurgeon et al.), U.S. Pat. No. 5,667,541
(Klun et al.), U.S. Pat. Nos. 5,876,268 and 5,989,111 (Lamphere et
al.), and U.S. Pat. No. 5,958,794 (Bruxvoort et al.), each of which
is incorporated herein by reference.
[0078] FIG. 14 is a schematic illustration of one method of
manufacturing an abrasive article having abrasive composites and a
monitoring element, such as a window. Generally the first step to
making the abrasive article is to prepare the abrasive slurry,
which is made by combining together by any suitable mixing
technique the binder precursor, the abrasive particles and any
optional additives. Examples of mixing techniques include low shear
and high shear mixing, with high shear mixing being preferred.
Pulling a vacuum during the mixing step can minimize the presence
of air bubbles in the abrasive slurry. The abrasive slurry should
have a rheology that coats well and in which the abrasive particles
and other additives do not settle out of the abrasive slurry. Any
known techniques to improve the coatability, such as ultrasonics or
heating can be used.
[0079] To obtain an abrasive composite with a precise shape, the
binder precursor is solidified or cured while the abrasive slurry
is present in cavities of a production tool. To form an abrasive
composite which has an irregular shape, the production tool is
removed from the binder precursor prior to curing, resulting in a
slumped, irregular shape.
[0080] One method of producing a three dimensional abrasive article
is illustrated in FIG. 14. Backing 51 leaves an unwind station 52
and at the same time a production tool (cavitied tool) 56 leaves an
unwind station 55. Production tool 56 is coated with abrasive
slurry by means of coating station 54 so that the cavities are at
least partially filled with abrasive slurry. The coating station
can be any conventional coater such as drop die coater, knife
coater, curtain coater, vacuum die coater, or a die coater. It may
be desired to minimize the formation of air bubbles during coating.
One coating technique is a vacuum fluid bearing die, such as
described in U.S. Pat. Nos. 3,594,865; 4,959,265 and 5,077,870.
[0081] After the production tool 56 is filled, backing 51 and the
abrasive slurry on production tool 56 are brought into contact so
that the abrasive slurry wets the front surface of backing 51. In
FIG. 14, the abrasive slurry filled tool 56 is brought into contact
with backing 51 by a contact nip roll 57. Next, contact nip roll 57
also forces the resulting construction against support drum 53.
Next, some form of radiant energy is transmitted into the abrasive
slurry by energy source 63 to at least partially cure the binder
precursor. The production tool 56 can be transparent material (such
as polyester, polyethylene or polypropylene) to transmit visible or
UV radiation to the slurry contained in the cavities in production
tool 56 as tool 56 and backing 51 pass over roll 53. The term
"partially cure" means that the binder precursor is polymerized to
such a state that the abrasive slurry does not flow when the
abrasive slurry is removed from production tool 56. The binder
precursor can be fully cured by any energy source after it is
removed from the production tool, if desired. The abrasive article
60 (comprising backing 51 and the at least partially cured abrasive
slurry) is removed from production tool 56 and tool 56 is rewound
on mandrel 59 so that production tool 56 can be reused again.
Additionally, abrasive article 60 is wound on mandrel 61. If the
binder precursor is not fully cured, the binder precursor can then
be fully cured by either time and/or exposure to an energy source
such as radiant energy.
[0082] In another variation of this first method, the abrasive
slurry can be coated onto the backing rather than into the cavities
of the production tool. The abrasive slurry coated backing is then
brought into contact with the production tool such that the
abrasive slurry flows into the cavities of the production tool. The
remaining steps to make the abrasive article are the same as
detailed above. Other variations include using a continuous belt or
a drum as a production tool.
[0083] The cavities in the production tool provide the inverse
shape of the three dimensional composites in the abrasive article.
Additionally, the cavities provide a close approximation of the
size of the abrasive composites. One example of a three-dimensional
composite includes a truncated pyramid about 914 micrometers tall,
about 2030 micrometers wide at the base, and about 635 micrometers
wide at the distal end.
[0084] Additional details on the use of a production tool to make a
three-dimensional abrasive article according to these methods are
further described in U.S. Pat. No. 5,152,917 (Pieper et al.) and
U.S. Pat. No. 5,435,816 (Spurgeon et al.), both of which are
incorporated herein by reference.
[0085] The window in the abrasive article can be made by any number
of methods. The window may be made by preventing application of the
abrasive composites to the desired area, or removal of abrasive
composites (or uncured or partially cured abrasive composites) from
the desired area. Yet further, a window can be made by altering the
composition of the composites in the desired window area.
[0086] In the first general method, either no or very little
abrasive slurry is provided to the area where the eventual window
is desired. In a first embodiment, the production tool may be void
of cavities in the area where the window is desired, thus resulting
in little or no abrasive slurry positioned in that area. Abrasive
slurry would be coated over the expanse of tooling, including the
area devoid of cavities. When the slurry coated tooling is
contacted with the backing, no slurry or very little slurry
transfers to the backing in that area devoid of cavities. It is
understood that instead of having a backing that is devoid of
cavities, it is also possible to have a portion of the cavities
filled with a material so that the abrasive slurry cannot enter the
cavities. The cavities can be permanently filled, for example with
a material such as a epoxy, or can be temporarily filled, for
example, with wax or a water soluble material.
[0087] In a variation of this first embodiment, abrasive slurry can
be coated over the expanse of a backing. When the slurry coated
backing is contacted with the production tooling and the cavities,
the area devoid of cavities will not result in composites; rather,
that area will have little or no abrasive slurry present. These
methods can provide any or all of the abrasive articles of FIGS. 2
through 12.
[0088] In another embodiment, the production tool has cavities
throughout, but no abrasive slurry is provided to the cavities in
the desired window area. This may be done in any number of ways.
For example, if it is desired that the window extend from one edge
of the abrasive article to another edge, such as in abrasive
article 110 of FIG. 2 or abrasive article 160 of FIG. 7, the
coating die used to apply the slurry to the production tool or the
backing may be blocked in the desired area. For example, one or
more delivery ports from the die may be blocked to provide a width
of the die that does not provide a coating of the abrasive slurry.
This method may be used for coating processes that use a rolling
bank or bead of slurry or for process that do not use the bank or
bead. As another example, a dam or other blocking device may be
positioned in the area where the extended window is desired. Thus,
although slurry exits the coating die, the slurry is redirected
away from the area of the window. Referring to FIG. 15, an extended
length of backing 71 is provided on roll 72. Backing 71 progresses
under coating die 74, which applies abrasive slurry across the
width of backing 71. A slurry diverter 70 is positioned downweb of
coating die 74, thus diverting a portion of the abrasive slurry.
The slurry coated area 76, after the abrasive slurry has been
cured, will provide abrasive coating 116 of abrasive article 110 of
FIG. 2 and abrasive coating 166 of abrasive article 160 of FIG. 7.
Area 78, free of abrasive slurry, will provide window 118 of
abrasive article 110 and window 168 of abrasive article 160.
[0089] In another embodiment, either the backing or the production
tool, typically the backing, is treated with a surface coating or
similar feature to minimize the amount of abrasive slurry that
adheres thereto. Conversely, if a primer to improve the adhesion of
the abrasive slurry to the backing is used, this primer can be
removed or not applied to areas where a window is desired, thus
minimizing the amount of abrasive slurry that adheres thereto.
[0090] In a second general method, the abrasive slurry is removed
from the backing after the composites have been molded; the slurry
can be removed either prior to being cured or after being at least
partially cured. In a first embodiment, the abrasive slurry or
abrasive composites can be scraped off from the backing after being
shaped into composites. This may be done by a knife, blade, or any
item that will remove the desired material. For example, a knife
oscillating across the width of the coated backing as the backing
is moving in its longitudinal direction will provide an abrasive
article such as abrasive article 120 of FIG. 3.
[0091] In another embodiment, the backing, prior to being coated
with abrasive slurry, can have patches or stripes that are
removable; a pressure-sensitive adhesive tape can be used as the
patch or stripe material. After the composites are provided on the
surface of the patches or stripes, they can be removed, thus also
removing the composites.
[0092] In yet another embodiment, the desired window area can be
masked after the composites are molded but before cured. The
unmasked area can be exposed to conditions to cure the slurry. The
masked, uncured area can be removed, for example, by a solvent,
such as water if the uncured slurry is water soluble.
[0093] In a further embodiment, a continuous abrasive coating can
be provided on the backing and cured to form an abrasive article.
Prior to use in a planarization or polishing process, sections of
the abrasive article, including both the backing and the abrasive
coating thereon, can be removed, leaving a discontinuous abrasive
article. This discontinuous abrasive article can be positioned, for
example by lamination, on a carrier backing. The areas from which
the sections were removed will be the window area of the abrasive
article during the wafer processing. To clarify this embodiment,
two detailed examples are provided. In the first example, an
abrasive article having a continuous abrasive coating on a backing
is slit to provide thin, elongate sections. These sections are
positioned on a carrier backing so that the abrasive sections have
non-abrasive sections therebetween. The areas where only the
carrier backing is present are the monitoring elements or windows
that provide transmission of radiation therethrough. These windows
extend the length of the abrasive article. As a second example, an
abrasive article having a continuous abrasive coating on a backing
is die cut or punched to provide discrete areas void of abrasive
article. That is, the abrasive article has holes or apertures
therethrough. The abrasive article is positioned on a carrier
backing, and the areas having the holes or apertures are the
monitoring elements or windows that would provide transmission of
radiation therethrough. With this process of making the windowed
abrasive article, the abrasive article has two backings (i.e., the
abrasive backing and the carrier backing) in the areas having the
abrasive coating, and the areas of the monitoring element have one
backing (i.e., the carrier backing).
[0094] Referring again to the figures, a monitoring element, such
as window 308 of abrasive article 300 in FIG. 13, can be made by
coating two different slurry compositions onto the backing. The
composition provided to the window area has less, preferably no,
abrasive particles. Alternately, the binder used to form the
composites can be varied. An abrasive article made from two or more
different slurries can be made by the teachings of U.S. Pat. No.
6,080,215 (Stubbs et al.), which is incorporated herein by
reference.
[0095] In another example, an abrasive article can be made having a
decreased density of abrasive composites in the monitoring element
or window area. For example, the spacing between adjacent
composites may be greater, or the shape of the composites may
differ to allow more passage of radiation therethrough. In another
embodiment, the height of the abrasive composites may be
significantly less, almost to the point of resembling window 208'
of FIG. 12.
[0096] Although the majority of the description above has been
directed to using a cavitied tool to make the abrasive composites,
it is understood that other methods for making textured or
three-dimensional coatings can be used. For example, gravure roll
coating or other coating techniques can make abrasive articles
having a monitoring element or window area. One skilled in the art
of abrasive articles will derive additional methods for making
abrasive articles having a monitoring element therein. No matter
how constructed or manufactured, the abrasive article of the
present invention includes an area through which processing of a
workpiece, such as a wafer, can be monitored.
[0097] The complete disclosures of all patents, patent
applications, and publications listed herein are incorporated by
reference as if individually incorporated. Various modifications
and alterations of this invention will become apparent to those
skilled in the art without departing from the scope and spirit of
this invention, and it should be understood that this invention is
not to be unduly limited to the illustrative embodiments set forth
herein.
* * * * *