Webb; Richard J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Webb; Richard J..The latest application filed is for "earplug with stem comprising a sleeve".
- Webb; Richard J. - St. Paul MN
- Webb; Richard J. - Inver Grove Heights MN
- Webb; Richard J. - Oklahoma City OK
| Patent | Date |
|---|---|
| Earplug with stem comprising a sleeve Grant 11,173,069 - Meree , et al. November 16, 2 | 2021-11-16 |
| Earplug With Stem Comprising A Sleeve App 20200100942 - Meree; Caitlin E. ; et al. | 2020-04-02 |
| Low Peel Adhesive App 20130084459 - Larson; Eric G. ; et al. | 2013-04-04 |
| Article And Method For Bonding Substrates With Large Topographies App 20120034426 - Webb; Richard J. ; et al. | 2012-02-09 |
| Modular in-wall medical services unit Grant 7,950,189 - Walker , et al. May 31, 2 | 2011-05-31 |
| Modular in-wall medical services unit Grant 7,775,000 - Walker , et al. August 17, 2 | 2010-08-17 |
| Method for manufacturing thin substrate using a laminate body Grant 7,759,050 - Kessel , et al. July 20, 2 | 2010-07-20 |
| Method For Manufacturing Thin Substrate Using A Laminate Body App 20090115075 - KESSEL; Carl R. ; et al. | 2009-05-07 |
| Layered Body And Method For Manufacturing Thin Substrate Using The Layered Body App 20090017248 - Larson; Eric G. ; et al. | 2009-01-15 |
| Layered Body And Method For Manufacturing Thin Substrate Using The Layered Body App 20090017323 - WEBB; Richard J. ; et al. | 2009-01-15 |
| Method of polishing a wafer Grant 7,449,124 - Webb , et al. November 11, 2 | 2008-11-11 |
| Print-receptive Electrostatic Dissipating Label App 20080026215 - Wan; Luan Yie ; et al. | 2008-01-31 |
| Laminate Body, And Method For Manufacturing Thin Substrate Using The Laminate Body App 20080014532 - KESSEL; Carl R. ; et al. | 2008-01-17 |
| Wafer planarization composition and method of use Grant 7,198,560 - Rueb , et al. April 3, 2 | 2007-04-03 |
| Method of polishing a wafer App 20060191872 - Webb; Richard J. ; et al. | 2006-08-31 |
| Wafer planarization composition and method of use App 20060141913 - Rueb; Christopher J. ; et al. | 2006-06-29 |
| Wafer planarization composition and method of use Grant 6,997,785 - Rueb , et al. February 14, 2 | 2006-02-14 |
| Abrasive article having a window system for polishing wafers, and methods Grant 6,786,810 - Muilenburg , et al. September 7, 2 | 2004-09-07 |
| Modular in-wall medical services unit App 20030177713 - Walker, James A. ; et al. | 2003-09-25 |
| Abrasive article having a window system for polishing wafers, and methods Grant 6,604,985 - Muilenburg , et al. August 12, 2 | 2003-08-12 |
| Abrasive article having a window system for polishing wafers, and methods App 20030064663 - Muilenburg, Michael J. ; et al. | 2003-04-03 |
| Abrasive article having a window system for polishing wafers, and methods App 20030022598 - Muilenburg, Michael J. ; et al. | 2003-01-30 |
| Abrasive article having a window system for polishing wafers, and methods App 20020072296 - Muilenburg, Michael J. ; et al. | 2002-06-13 |
| Abrasive construction for semiconductor wafer modification Grant 6,007,407 - Rutherford , et al. December 28, 1 | 1999-12-28 |
| Method of modifying an exposed surface of a semiconductor wafer Grant 5,958,794 - Bruxvoort , et al. September 28, 1 | 1999-09-28 |
| Abrasive construction for semiconductor wafer modification Grant 5,692,950 - Rutherford , et al. December 2, 1 | 1997-12-02 |
| Abrasive article having abrasive composite members positioned in recesses Grant 5,219,462 - Bruxvoort , et al. June 15, 1 | 1993-06-15 |
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