Bruxvoort; Wesley J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bruxvoort; Wesley J..The latest application filed is for "dual cured abrasive articles".

Company Profile

0.12.7

Bruxvoort; Wesley J. - Woodbury MN
Bruxvoort, Wesley J. - St. Paul MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dual cured abrasive articles Grant 6,848,986 - Kendall , et al. February 1, 2	2005-02-01
Abrasive article having a window system for polishing wafers, and methods Grant 6,786,810 - Muilenburg , et al. September 7, 2	2004-09-07
Dual cured abrasive articles App 20030194961 - Kendall, Philip E. ; et al.	2003-10-16
Abrasive article suitable for modifying a semiconductor wafer Grant 6,612,917 - Bruxvoort September 2, 2	2003-09-02
Abrasive article having a window system for polishing wafers, and methods Grant 6,604,985 - Muilenburg , et al. August 12, 2	2003-08-12
Abrasive article having a window system for polishing wafers, and methods App 20030064663 - Muilenburg, Michael J. ; et al.	2003-04-03
Abrasive articles with water soluble particles App 20030024169 - Kendall, Philip E. ; et al.	2003-02-06
Abrasive article having a window system for polishing wafers, and methods App 20030022598 - Muilenburg, Michael J. ; et al.	2003-01-30
Dual cured abrasive articles App 20030017797 - Kendall, Philip E. ; et al.	2003-01-23
Abrasive article suitable for modifying a semiconductor wafer App 20020106980 - Bruxvoort, Wesley J.	2002-08-08
Abrasive article having a window system for polishing wafers, and methods App 20020072296 - Muilenburg, Michael J. ; et al.	2002-06-13
Organometallic monomers and polymers with improved adhesion Grant 6,217,984 - Bruxvoort , et al. April 17, 2	2001-04-17
Abrasive construction for semiconductor wafer modification Grant 6,007,407 - Rutherford , et al. December 28, 1	1999-12-28
Method of modifying an exposed surface of a semiconductor wafer Grant 5,958,794 - Bruxvoort , et al. September 28, 1	1999-09-28
Abrasive construction for semiconductor wafer modification Grant 5,692,950 - Rutherford , et al. December 2, 1	1997-12-02
Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface Grant 5,549,961 - Haas , et al. August 27, 1	1996-08-27
Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface Grant 5,453,312 - Haas , et al. September 26, 1	1995-09-26
Abrasive article having abrasive composite members positioned in recesses Grant 5,219,462 - Bruxvoort , et al. June 15, 1	1993-06-15
Abrasive sheeting having individually positioned abrasive granules Grant 4,930,266 - Calhoun , et al. June 5, 1	1990-06-05

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