U.S. patent application number 09/983811 was filed with the patent office on 2002-03-07 for method for mounting parts, and ic card and manufacturing method thereof.
This patent application is currently assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.. Invention is credited to Akiguchi, Takashi, Harada, Yutaka, Murakami, Shinji, Oku, Mitsumasa, Sato, Kenichi, Tsukahara, Norihito, Yokomakura, Mitsunori.
Application Number | 20020026703 09/983811 |
Document ID | / |
Family ID | 12844179 |
Filed Date | 2002-03-07 |
United States Patent
Application |
20020026703 |
Kind Code |
A1 |
Oku, Mitsumasa ; et
al. |
March 7, 2002 |
Method for mounting parts, and IC card and manufacturing method
thereof
Abstract
The present invention provides a method for mounting parts, and
an IC card and its manufacturing method, capable of reducing the
number of steps, increasing productivity, reducing in costs, and
miniaturizing the chip. For this purpose, in the present invention,
a first electrode (7a) of the IC chip (4) for processing signals
received from a coil (3) is connected to an internal end (3b) of a
coil pattern (2) formed on a first substrate (1a), and an external
end (3a) of the coil pattern (2) and a second electrode (7b) of the
IC chip (4) are connected via a jumper wiring means (8).
Inventors: |
Oku, Mitsumasa; (Toyono-gun,
JP) ; Akiguchi, Takashi; (Osaka, JP) ;
Murakami, Shinji; (Yahata-shi, JP) ; Harada,
Yutaka; (Kyoto-shi, JP) ; Tsukahara, Norihito;
(Soraku-gun, JP) ; Yokomakura, Mitsunori;
(Takatsuki-shi, JP) ; Sato, Kenichi; (Ikoma-shi,
JP) |
Correspondence
Address: |
PARKHURST & WENDEL, L.L.P.
Suite 210
1421 Prince Street
Alexandria
VA
22314-2805
US
|
Assignee: |
MATSUSHITA ELECTRIC INDUSTRIAL CO.,
LTD.
|
Family ID: |
12844179 |
Appl. No.: |
09/983811 |
Filed: |
October 26, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
09983811 |
Oct 26, 2001 |
|
|
|
09257268 |
Feb 25, 1999 |
|
|
|
Current U.S.
Class: |
29/602.1 ;
29/832; 29/846 |
Current CPC
Class: |
H01L 2924/01029
20130101; G06K 19/07779 20130101; H01F 5/003 20130101; H01L
2224/05573 20130101; H01L 2224/16225 20130101; H01L 2224/73204
20130101; H01L 2924/30107 20130101; H01L 2924/01015 20130101; G06K
19/0775 20130101; H01L 2224/16227 20130101; H01L 2924/01047
20130101; H01L 2924/19105 20130101; H01L 2924/01005 20130101; H05K
1/095 20130101; H01L 2924/01082 20130101; H01L 2224/73204 20130101;
H01F 41/041 20130101; H01L 2924/01006 20130101; H05K 2201/0367
20130101; Y10T 29/4913 20150115; H01L 2224/27013 20130101; H05K
2203/1453 20130101; Y10T 29/49155 20150115; H05K 2201/10674
20130101; H05K 3/222 20130101; H01L 2924/3011 20130101; H01F 27/40
20130101; H05K 3/4685 20130101; H01L 2924/00014 20130101; H01L
2224/32225 20130101; H01L 24/32 20130101; H01L 2224/81193 20130101;
H01L 2224/05567 20130101; H01L 2224/32057 20130101; H01L 2224/16225
20130101; H01L 2224/32225 20130101; H01L 2224/05599 20130101; H01L
2924/01033 20130101; G06K 19/07783 20130101; H01L 2924/01078
20130101; G06K 19/07749 20130101; H01L 21/4867 20130101; H01L
2924/01004 20130101; H01L 2924/01013 20130101; H01L 2924/01057
20130101; Y10T 29/49144 20150115; H05K 3/321 20130101; H01L
2924/00014 20130101; H01L 2224/83385 20130101; H01L 2924/14
20130101; H01L 2924/01079 20130101; H01L 2224/83051 20130101; H01L
2924/19041 20130101; Y10T 29/4902 20150115 |
Class at
Publication: |
29/602.1 ;
29/846; 29/832 |
International
Class: |
H01F 007/06; H05K
003/30 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 3, 1998 |
JP |
10-49910 |
Claims
What is claimed is:
1. A method for mounting parts, wherein a circuit is formed by the
steps of: printing a circuit pattern on a substrate with a
conductive paste; placing a part on said circuit pattern such that
an electrode is connected to the circuit pattern; and curing said
conductive paste to electrically connect the electrode with the
circuit pattern.
2. A method for mounting parts, wherein a circuit is formed by the
steps of: printing a circuit pattern on a substrate with a
conductive paste; placing a part having a bump formed on an
electrode pad thereof on said circuit pattern such that an
electrode is connected to the circuit pattern; and curing said
conductive paste to electrically connect the electrode with the
circuit pattern.
3. The method for mounting parts according to claim 2, wherein the
bump is formed of metals or by plating.
4. An IC card which is a non-contact IC card having a coil and an
IC chip therewithin and transferring data to and from an outside
media via said coil, wherein a first electrode of the IC chip for
processing signals received from the coil is connected to an
internal end of a coil pattern formed on a substrate, and an
external end of the coil pattern and a second electrode of said IC
chip are connected via a jumper wiring means.
5. The IC card according to claim 4, wherein the jumper wiring
means is a wire having an insulated covered portion in the middle
thereof and exposed conductive portions at both ends thereof, or a
foil formed of an insulating sheet attached with a metal film.
6. A method for manufacturing an IC card, wherein in manufacturing
a non-contact IC card having a coil and an IC chip therewithin and
transferring data to and from an outside media via said coil, the
method comprises the steps of: printing a circuit pattern including
a coil pattern on a substrate with a conductive paste; placing the
IC chip on said circuit pattern such that an electrode is connected
to the circuit pattern; and placing a jumper wiring means for
connecting over the coil an electrode pad at an external end of
said coil to an electrode pad drawn out of the IC chip or a signal
line to said IC chip, before said conductive paste is cured; and
curing said conductive paste.
7. A method for manufacturing an IC card, wherein in manufacturing
a non-contact IC card having a coil and an IC chip therein and
transferring data to and from an outside media via said coil, the
method comprises the steps of: printing a circuit pattern including
the coil pattern on the substrate by means of the conductive paste;
placing the IC chip on said circuit pattern such that an electrode
is connected to the circuit pattern; and placing a jumper wiring
means for connecting over the coil an electrode pad at an external
end of said coil to an electrode pad drawn out of the IC chip,
after the conductive paste is cured.
8. The method for manufacturing the IC card according to claim 7,
wherein the IC card is configured by: printing a pattern with
insulating ink at a portion of the coil crossing over the jumper
wiring means, said pattern linking the electrode pad at the
external end of the coil and the electrode pad drawn out of the IC
chip; and printing conductive ink over said pattern.
9. A method for manufacturing the IC card, wherein in manufacturing
a non-contact IC card having a coil and an IC chip therewithin and
transferring data to and from an outside media via said coil, the
method comprises the steps of: printing a circuit pattern including
the coil pattern on a first substrate with the conductive paste;
placing the IC chip on said circuit pattern such that an electrode
is connected to the circuit pattern, and curing said conductive
paste; printing the conductive paste to form a jumper wiring means
on a second substrate at a position corresponding to a portion of
the first substrate for connecting the electrode pad at the
external end of said coil and the electrode pad drawn out of the IC
chip over the coil formed on said first substrate, said second
substrate being laminated over said first substrate; and applying
said second substrate to said first substrate by way of interposing
an insulating film having communicating openings formed at
positions corresponding to the electrode pad at the external end of
said coil and the electrode pad drawn out of the IC chip between
the first and second substrates, and curing the conductive paste in
order to connect the electrode of said first substrate and the
conductive paste of said second substrate.
10. A method for manufacturing the IC card, wherein in
manufacturing a non-contact IC card having a coil and an IC chip
therewithin and transferring data to and from an outside media via
said coil, the method comprises the steps of: printing a circuit
pattern on a substrate with the conductive paste; placing the IC
chip on said circuit pattern before the conductive paste is cured
such that an electrode is connected to the circuit pattern; curing
said conductive paste; and electrically connecting each end of the
coil constituted of a wound line to said circuit pattern.
11. A method for manufacturing the IC card, wherein in
manufacturing a non-contact IC card having a coil and an IC chip
therewithin and transferring data to and from an outside media via
said coil, the method comprises the steps of: printing a circuit
pattern on a substrate with the conductive paste; placing the IC
chip on said circuit pattern before the conductive paste is cured
such that an electrode is connected to the circuit pattern; placing
each end of the coil constituted of a wound line on said circuit
pattern before the conductive paste is cured; and curing said
conductive paste.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a method for mounting parts
by means of conductive paste, and an IC card and its manufacturing
method.
BACKGROUND OF THE INVENTION
[0002] In manufacturing a non-contact IC card comprising a coil and
an IC chip, and transferring data with external via the coil, coils
such as a copper wire-wound coil, coils of printed conductive
pastes, e.g. silver paste, and coils of etched metal foils, e.g.
copper foil, are used as a coil, and in particular, a method for
forming a circuit pattern by printing conductive pastes has become
popular.
[0003] FIGS. 10 to 13 show a conventional IC card and its
manufacturing method.
[0004] As shown in FIG. 10, the conventional IC card is constructed
such that a coil pattern 2 is formed on the first substrate 1a by
means of a conductive paste, and a connecting pad 6 provided at the
external end 3a of this coil pattern 2 and a connecting pad 6
provided at the internal end 3b are electrically connected with
electrodes of an IC chip 4.
[0005] The manufacturing process is shown in FIG. 11.
[0006] Firstly, in step 1, a circuit pattern including the coil
pattern 2 is printed on the surface of the first substrate 1a by
means of the conductive paste.
[0007] In step 2, the printed circuit pattern is heated for 10
minutes at the temperature of 120.degree. C. to cure the conductive
paste.
[0008] In step 3, as shown in FIG. 12(a), an anisotropic conductive
sheet 9 is stuck on the connecting pad 6 of the circuit
pattern.
[0009] In step 4, the anisotropic conductive sheet 9 is heated for
5 seconds at the temperature of 100.degree. C. and temporally
pressed.
[0010] In step 5, parts such as the IC chip 4 and capacitors are
mounted on the temporally pressed anisotropic conductive sheet
9.
[0011] A bump 10 is formed on an mounting surface of the parts 16
via an electrode pad 7, as shown in FIG. 12(b), and the bump 10 is
electrically connected with the connecting pad 6 via the
anisotropic conductive sheet 9, as shown in FIG. 12(c).
[0012] Particularly, the IC chip 4 is placed such that, as
described above, the connecting pads 6 provided at the external end
3a and the internal end 3b of the coil pattern 2 are electrically
connected with the electrode pad 7 of the IC chip 4.
[0013] And, the bump 10, formed by using wire bonding and plating,
in particular, plating using solder, gold, silver, and copper is
used.
[0014] In step 6, the anisotropic conductive sheet 9 is heated for
30 seconds at the temperature of 200.degree. C. to be cured for
pressing the parts 16 as shown in FIG. 12(d).
[0015] Then in step 7, by applying a second substrate to the first
substrate 1a for laminating processing, as shown in FIG. 13, the IC
card can be obtained in which the connecting pads 6 and the bump 10
provided on the parts 16 are electrically connected via the
anisotropic conductive sheet 9. 5 denotes a capacitor connected in
parallel to the coil pattern 2, and 1b denotes the second
substrate.
[0016] However, since it is typical to use inexpensive
thermoplastic resin such as polyethylene terephthalate and vinyl
chloride for the first substrate 1a and the second substrate 1b,
there is a problem that, in the conventional manufacturing process
described above, these substrates having less heat resistance are
susceptible to degradation due to the high temperature of
200.degree. C. or more when pressing the anisotropic conductive
sheet 9 in step 7.
[0017] Also, there is a problem that using a substrate having
superior heat resistance instead of the thermoplastic resin
increases the costs.
[0018] And there is a further problem that the connecting
resistance and the number of steps are increased, and the
productivity is lowered, and costs are increased because the
anisotropic conductive sheet is used for securing the parts. And it
is the same with the case of using an anisotropic conductive
particle instead of the anisotropic conductive sheet.
[0019] And, when the parts 16 are ed in step 5, there is a problem
that it is needed to draw a plurality of coil patterns 2 between
the terminals of the IC chip 4, as shown in FIG. 10, since the
external end 3a and internal end 3b of the coil pattern 2 are
constructed not so as to be linked to each other in a single brush
stroke.
DISCLOSURE OF THE INVENTION
[0020] The present invention provides a method for mounting parts,
and an IC card and its manufacturing method, that is capable of
solving the problems, reducing the number of steps, increasing the
productivity to lower costs, and miniaturizing the chip.
[0021] To solve the problems, the method for mounting parts
according to the invention is characterized in that parts to be ed
are placed on the circuit pattern before the conductive paste is
cured, and then ed by curing the conductive paste.
[0022] According to the invention, it is possible to lower costs
due to the reduction of steps, the good productivity, and the
possibility of the low temperature mounting of the parts, and
further to contribute to the miniaturization of the IC chip.
[0023] The method for mounting parts according to claim 1 of the
invention is characterized in that a circuit is formed by printing
a circuit pattern on a substrate by means of a conductive paste,
placing parts on the circuit pattern such that its electrode is
connected to the circuit pattern, and curing the conductive paste
to electrically connect the electrode with the circuit pattern.
[0024] According to this configuration, it is possible to parts at
low temperature and reduce steps to lower costs.
[0025] The method for mounting parts according to claim 2 of the
invention is characterized in that a circuit is formed by printing
a circuit pattern on a substrate by means of a conductive paste,
placing parts having a bump formed on its electrode pad on the
circuit pattern such that its electrode is connected to the circuit
pattern, and curing the conductive paste to electrically connect
the electrode to the circuit pattern.
[0026] The method for mounting parts according to claim 3 of the
invention is characterized in that, in claim 2, the bump is formed
of metals or plating.
[0027] The IC card according to claim 4 of the invention is a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, and is characterized
in that a first electrode of the IC chip for processing signals
received from the coil is connected to an internal end of a coil
pattern formed on the substrate, and an external end of the coil
pattern and a second electrode of the IC chip are connected via a
jumper wiring means.
[0028] According to this configuration, it is possible to reduce
manufacturing steps and lower costs, by directly mounting parts on
the conductive paste before it is cured, and then by curing the
conductive paste, and it is possible to stabilize the circuit
pattern, as well as ensure an electrical connection between the
circuit pattern and the parts.
[0029] And, an anisotropic conductive sheet is not required to
provide, and it becomes possible to various parts at low
temperature, and also lower resistance can be realized.
[0030] And further, it is not required to draw a plurality of coil
patterns between the terminals of the IC chip, so that it is
possible to use an IC chip having narrow space between the
terminals to miniaturize the IC card.
[0031] The IC card according to claim 5 of the invention is
characterized in that, in claim 4, the jumper wiring means is a
wire having an insulatingly covered middle portion and ends with
exposed conductive portions, or a foil constituted of an insulating
sheet with a metal film.
[0032] The method for manufacturing the IC card according to claim
6 of the invention is characterized in that, in manufacturing a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, it comprises the
steps of printing the circuit pattern including the coil pattern on
the substrate by means of the conductive paste, placing the IC chip
on the circuit pattern such that its electrode is connected to the
circuit pattern, placing the jumper wiring means for connecting
over the coil the electrode pad at the external end of the coil to
the electrode pad drawn out of the IC chip or a signal line to the
IC chip before the conductive paste is cured, and curing the
conductive paste.
[0033] According to this configuration, it becomes possible to
miniaturize the IC card.
[0034] The method for manufacturing the IC card according to claim
7 of the invention is characterized in that, in manufacturing a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, it comprises the
steps of printing the circuit pattern including the coil pattern on
the substrate by means of the conductive paste, placing the IC chip
on the circuit pattern such that its electrode is connected to the
circuit pattern, and after the conductive paste is cured, placing
the jumper wiring means for connecting over the coil the electrode
pad at the external end of the coil to the electrode pad drawn out
of the IC chip.
[0035] The method for manufacturing the IC card according to claim
8 of the invention is characterized in that, in claim 7, the jumper
wiring means is configured by printing a pattern, which links the
electrode pad at the external end of the coil and the electrode pad
drawn out of the IC chip, by means of insulating ink at the portion
of the coil across the jumper wiring means, and printing conductive
ink over the pattern.
[0036] According to this configuration, it is possible to make the
IC card thinner, and improve the productivity due to its short
drying time.
[0037] The method for manufacturing the IC card according to claim
9 of the invention is characterized in that, in manufacturing a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, it comprises the
steps of printing the circuit pattern including the coil pattern on
the first substrate by means of the conductive paste, placing the
IC chip on the circuit pattern such that its electrode is connected
to the circuit pattern and curing the conductive paste, printing
the conductive paste at the position corresponding to the portion
in the second substrate laminated on the first substrate which
connects the electrode pad at the external end of the coil and the
electrode pad drawn out of the IC chip over the coil formed on the
first substrate to form the jumper wiring means, applying this
second substrate to the first substrate, with an insulating film
which has communicating openings formed at the positions
corresponding to the electrode pad at the external end of the coil
and the electrode pad drawn out of the IC chip being interposed,
curing the conductive paste, and connecting the electrode of the
first substrate and the conductive paste of the second
substrate.
[0038] The method for manufacturing the IC card according to claim
10 of the invention is characterized in that, in manufacturing a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, it comprises the
steps of printing the circuit pattern on the substrate by means of
the conductive paste, placing the IC chip on the circuit pattern
before the conductive paste is cured such that its electrode is
connected to the circuit pattern, curing the conductive paste, and
electrically connecting each end of the coil constituted of a wound
line to the circuit pattern.
[0039] The method for manufacturing the IC card according to claim
11 of the invention is characterized in that, in manufacturing a
non-contact IC card comprising a coil and an IC chip, and
transferring data with external via the coil, it comprises the
steps of printing the circuit pattern on the substrate by means of
the conductive paste, placing the IC chip on the circuit pattern
before the conductive paste is cured such that its electrode is
connected to the circuit pattern, placing each end of the coil
constituted of a wound line on the circuit pattern before the
conductive paste is cured, and curing the conductive paste.
BRIEF DESCRIPTION OF THE DRAWINGS
[0040] FIG. 1 is a plan view showing an IC card according to an
embodiment of the invention;
[0041] FIG. 2 is a diagram showing a process for manufacturing the
IC card according to the embodiment of the invention;
[0042] FIG. 3 is a plan view showing a coil pattern according to
the embodiment of the invention;
[0043] FIG. 4 is a schematic view showing the mounting of the IC
chip according to the embodiment of the invention;
[0044] FIG. 5 is a schematic view showing the mounting of a jumper
wire according to the embodiment of the invention;
[0045] FIG. 6 is a schematic view showing the finished
configuration of the IC card according to the embodiment of the
invention;
[0046] FIG. 7 is a schematic view showing the mounting of another
IC chip according to the embodiment of the invention;
[0047] FIG. 8 is a schematic view showing the mounting of another
jumper wire according to the embodiment of the invention;
[0048] FIG. 9 is an explanation view showing the electrical
connection of an input circuit of the IC chip and the coil
according to the embodiment of the invention;
[0049] FIG. 10 is a schematic view showing the finished
configuration of a conventional IC card;
[0050] FIG. 11 is a diagram showing a conventional process for
mounting a part;
[0051] FIG. 12 is a schematic view showing the process for mounting
the conventional IC chip; and
[0052] FIG. 13 is a schematic view showing the finished
configuration of the conventional IC card.
DESCRIPTION OF THE EMBODIMENTS
[0053] The embodiments of the present invention will be explained
below by means of FIGS. 1 to 8.
[0054] Here, the elements, which are similar to those in the above
conventional example, is are denoted by the same reference.
[0055] FIGS. 1 to 8 show the embodiments of the present
invention.
[0056] As shown in FIG. 1, an IC card of this embodiment is
composed of a coil and an IC chip 4 for performing a process
required to transfer signals via this coil, etc., and is different
from that in FIG. 10 showing a conventional example in the point
that it is configured such that a first electrode pad 7a of the IC
chip 4 is set for a connecting pad 6b at an internal end 3b of a
coil pattern 2 formed on a first substrate 1a, and an electrode pad
6a at an external end 3a of the coil pattern 2 and a second
electrode pad 7b of the IC chip 4 are connected via a jumper wiring
means 8.
[0057] Here, the coil pattern 2 is cured in the following procedure
so as to act as a coil for antenna. In the following description,
an already cured portion of the coil pattern 2 is described as a
coil 3. 5a denotes a resonant capacitor connected parallel to the
coil 3, 5b denotes a capacitor for power supply for charging power
received via the coil 3, and this IC card is operated by the power
of the capacitor for power supply 5b.
[0058] The process for manufacturing this IC card is shown in FIG.
2.
[0059] In step 1, a circuit pattern including the coil pattern 2 is
printed on the surface of the first substrate 1a by means of a
conductive paste.
[0060] FIG. 3 shows the printed circuit pattern, and a coil is
formed in the coil pattern 2 as denoted by an arrow A. And an IC
mounting portion denoted by an arrow B is formed inside the coil
pattern 2, and a capacitor mounting portion denoted by an arrow C
is formed at the portion leading to the external end 3a of the coil
pattern 2 and the IC mounting portion.
[0061] Substrates having a thickness on the order of 0.1 to 0.5 nm
made of polyethylene terephthalate, vinyl chloride, acrylonitrile
butadiene styrene, and polycarbonate, etc. are used for the first
substrate 1a and a second substrate 1b described later.
[0062] It is preferable to use a silver paste as the conductive
paste.
[0063] The conductive paste is printed using screen printing,
offset printing, and gravure printing, etc., and for example, is
formed in a way that a mask having 165 meshes per inch is used to
obtain an emulsion having a thickness of 10 .mu.m.
[0064] In step 2, parts 16 such as the IC chip 4, the capacitors to
be mounted on the surface 5a, 5b, and the jumper wiring means 8 are
mounted.
[0065] Concretely, the IC chip 4 is mounted on the IC mounting
portion denoted by an arrow B, and the capacitor for power supply
5a and the resonant capacitor 5b are mounted on the capacitor
mounting portion denoted by an arrow C. And the jumper wiring means
8 is provided to link the connecting pad 6a at the external end 3a
of the coil pattern 2 and the second electrode pad 7b of the IC
chip 4.
[0066] In mounting these parts at the predetermined position, in
this embodiment, the parts 16 are mounted on the connecting pad 6
before it is cured, while in the above conventional example, the
parts 16 are mounted on the connecting pad 6 after it is cured via
the anisotropic conductive sheet 9.
[0067] Here, the first electrode pad 7a and the second electrode
pad 7b are formed on the IC chip 4 in the same way as the above
conventional example, and bumps 10 are formed on the first
electrode pad 7a and the second electrode pad 7b, and as shown in
FIG. 4, the first electrode pad 7a and the second electrode pad 7b
are mounted on the connecting pads 6 via bumps 10a and 10b
respectively.
[0068] And as shown in FIG. 5, the jumper wiring means 8 is
configured to have a covered portion 11, which is an insulator
covering the middle portion of a conductive portion made of a
conductor, and exposed conductive portions 12 at the opposite ends,
and a thin type having a thickness about 0.1 mm is used, The
conductive portions 12 on the opposite ends of this jumper wiring
means 8 are mounted on the connecting pads 6a, 6c.
[0069] In step 3, the conductive paste is cured to secure the parts
16 mounted in step 2.
[0070] In this way, only curing the conductive paste makes it
possible to stabilize the circuit pattern, as well as to ensure an
electrical connection to the parts.
[0071] In step 4, the second substrate 1b is opposed to the first
substrate 1a configured as described above, laminated with a film,
and made into a card by thermal pressing.
[0072] Polyethylene terephthalate, vinyl chloride, ABS, and
polycarbonate, etc. are used for the laminate.
[0073] A finished configuration of the obtained IC card is shown in
the schematic view of FIG. 6.
[0074] As shown in FIG. 6, differing from FIG. 13 showing the above
conventional example, in this embodiment, the manufacturing process
is shortened and the productivity is improved, because the parts 16
are directly mounted on the connecting pads 6 made of the
conductive paste before it is cured, rather than mounted by
providing the anisotropic conductive sheet 9 between the connecting
pads 6 and the parts 16.
[0075] Also, differing from FIG. 10 showing the above conventional
example, since the jumper wiring means 8 is provided to connect the
external end 3a and the internal end 3b of the coil pattern 2, it
is not required to draw a plurality of coil patterns 2 between the
terminals of the IC chip 4, and therefore it is possible to
miniaturize the IC card.
[0076] Here, while the IC chip 4 provided with the bumps 10a, 10b
is mounted in the above described embodiment, the present invention
is not limited to this embodiment, and it may be configured such
that the first electrode pad 7a and the second electrode pad 7b
directly contact with the connecting pads 6, as shown in FIG.
7.
[0077] In such a configuration, because of the absence of the bumps
10, it is possible to mount the parts at a low temperature and to
reduce the number of steps to lower costs. Also, it is possible to
lower the connecting resistance.
[0078] And, while in the above embodiment the jumper wiring means 8
is mounted before the conductive paste is cured, the jumper wiring
means 8 may be provided after the conductive paste is cured.
[0079] Also, while in the above embodiment that is configured as
shown in FIG. 5 is used for the jumper wiring means 8, however
instead of this, a thin laminate sheet, which has a thickness
between 20 and 30 .mu.m constituted of an insulating sheet and a
conductive foil made by the vapor deposition of the metals such as
copper, gold, and aluminium on an insulating sheet having a
thickness on the order of 20 .mu.m such as polyethylene
terephthalate, can be used for the jumper wiring means 8 to obtain
the same effect.
[0080] The jumper wiring means 8 constituted of the laminate sheet
is placed such that the connecting pad 6a and the connecting pad 6c
are linked to each other, with its insulating sheet facing the
first substrate 1a and its conductive foil being to be the upper
surface, and heat-welded. Then, another insulating sheet is placed
over the portion of the conductive foil which is exposed
upward.
[0081] In such a configuration, heat welding causes the connecting
pads 6a and 6c to be electrically connected with each other via the
conductive foil. Also, the welded portion of the insulating sheet
provided below the conductive foil secures them.
[0082] And the jumper wiring means 8 may be formed by mounting the
IC chip 4, and by curing the conductive paste, and by printing the
pattern which links the connecting pads 6a and 6c over the coil
pattern 2 by means of insulating ink as shown in FIG. 1, and by
printing conductive ink over the pattern. Using such a jumper
wiring means 8 makes it possible to make the IC card thinner, and
the productivity can be improved due to its short drying time.
[0083] As further shown in FIG. 8, it may be configured by forming
the coil pattern 2 on the first substrate la as described above,
and by painting the conductive paste on the second substrate 1b to
provide the jumper wiring means 8.
[0084] Concretely, the circuit pattern including the coil pattern 2
is formed on the first substrate 1a in the same way as the above
described embodiment.
[0085] The jumper wiring means 8 is provided on the second
substrate 1b by applying the conductive paste at the position
corresponding to the position which links the connecting pads 6a
and 6c over the coil pattern 2 as shown in FIG. 1. Then, the second
substrate 1b is applied to the first substrate 1a, with an
insulating film 13, which has communicating openings 14 formed at
the positions corresponding to the connecting pads 6a, 6c, being
interposed between the first substrate 1a and the second substrate
1b, and the conductive paste is cured.
[0086] Thus obtained IC card is configured such that the connecting
pads 6a, 6c of the first substrate 1b are electrically connected
with the jumper wiring means 8 of the second substrate 1b, and
provides the same effect as the IC card in the above described
embodiment.
[0087] Here, a plurality of insulating films 13 which are
interposed between the first substrate 1a and the second substrate
1b may be provided, and the multilayer configuration can increase
the number of turns of the coil pattern 2, and thus increased
number of turns of the coil pattern 2 can increase the inductance
of the coil.
[0088] While the connecting point P in the coil 3 in the above
embodiment can be considered to have a circuit configuration so as
to be directly connected to the electrode pad drawn out of the IC
chip 4 as shown in FIG. 9(a), if the connecting point P in the coil
3 is not directly connected to the electrode pad drawn out of the
IC chip 4 as shown in FIG. 9(b), the present invention provides the
same effect.
[0089] In another embodiment shown in FIG. 9(b), a trap 15 is
interposed between the IC chip 4 and the coil 3, and the connecting
point P in the coil 3 can be considered to be a signal line for the
IC chip 4. The trap 15 mentioned here is a filter circuit which
exhibits high impedance for useless frequency component which acts
on the coil 3 from external, and low impedance for target frequency
component which acts on the coil 3 from external.
[0090] Further, while above each embodiment has been described as
for the coil 3 formed on the substrate by means of the coil pattern
2 by way of examples, in the case of mounting with only the heat
treatment steps in the manufacturing process being reduced, the
need to form the coil 3 as a pattern on the substrate is eliminated
by printing the circuit pattern on the substrate by means of the
conductive paste, placing the IC chip on the circuit pattern such
that its electrodes are connected to the circuit pattern before the
conductive paste is cured, and then curing the conductive paste to
mount parts, and then the IC card may be configured by using the
coil constituted of a wound line, and electrically connecting both
ends of this coil constituted of the wound line with the electric
circuit on the substrate using a technique such as soldering after
the conductive paste is cured and the mounting of the parts is
completed,
[0091] Further, while, in the above description, both ends of the
coil constituted of the wound line are electrically connected to
the cured circuit pattern, however the IC card may be configured by
placing the IC chip, and any other chip parts, and both ends of the
coil on the circuit pattern before cured, and then by curing the
circuit pattern to establish the electrical connections.
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