TSUKAHARA; NORIHITO

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSUKAHARA; NORIHITO.The latest application filed is for "fiber sheet, method for manufacturing fiber sheet, and cell culture chip".

Company Profile

0.37.44

TSUKAHARA; NORIHITO - Kyoto JP
Tsukahara; Norihito - Soraku-gun JP
Tsukahara; Norihito - Kyoto-fu JP
Tsukahara; Norihito - Souraku-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fiber Sheet, Method For Manufacturing Fiber Sheet, And Cell Culture Chip App 20220073864 - TSUKAHARA; NORIHITO ; et al.	2022-03-10
Ion-sensitive Substance, Ion-sensitive Membrane Using The Same, And Method For Producing The Ion-sensitive Substance App 20210362096 - TOYOTA; KEI ; et al.	2021-11-25
Cell Culture Chip App 20210348097 - NAKAMURA; TAICHI ; et al.	2021-11-11
Fiber Mesh Sheet, Method For Manufacturing Fiber Mesh Sheet, And Cell Culture Chip Formed Of Fiber Mesh Sheet App 20210285138 - NAKAMURA; TAICHI ; et al.	2021-09-16
Field asymmetric ion mobility spectrometer and method for separating mixture using the same Grant 9,927,400 - Tsukuda , et al. March 27, 2	2018-03-27
Field Asymmetric Ion Mobility Spectrometer And Method For Separating Mixture Using The Same App 20170343510 - TSUKUDA; MASAHIKO ; et al.	2017-11-30
Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same Grant 9,162,249 - Koyama , et al. October 20, 2	2015-10-20
Semiconductor device and method for manufacturing the same Grant 9,076,752 - Kojima , et al. July 7, 2	2015-07-07
Pressed-contact type semiconductor device and method for manufacturing the same Grant 9,018,035 - Tsukahara , et al. April 28, 2	2015-04-28
Semiconductor device having a porous nickel plating part Grant 8,816,481 - Ikuta , et al. August 26, 2	2014-08-26
Semiconductor Device And Method For Manufacturing The Same App 20140231981 - Kojima; Toshiyuki ; et al.	2014-08-21
Pressed-contact Type Semiconductor Device And Method For Manufacturing The Same App 20140110827 - Tsukahara; Norihito ; et al.	2014-04-24
Biosensor Device App 20140054170 - Tsukahara; Norihito ; et al.	2014-02-27
Semiconductor Device, And Method Of Manufacturing Semiconductor Device App 20140054757 - Ikuta; Keiko ; et al.	2014-02-27
Method of joining electronic component and the electronic component Grant 8,304,338 - Tsukahara , et al. November 6, 2	2012-11-06
Wiring board and wiring board manufacturing method Grant 8,237,057 - Hirose , et al. August 7, 2	2012-08-07
Circuit board and method for jointing circuit board Grant 8,115,109 - Koyama , et al. February 14, 2	2012-02-14
Method for forming artificial lipid membrane Grant 8,062,489 - Oki , et al. November 22, 2	2011-11-22
Antenna built-in module, card type information device, and methods for manufacturing them Grant 8,025,237 - Ochi , et al. September 27, 2	2011-09-27
Electronic circuit device and method for manufacturing same Grant 7,935,892 - Nishikawa , et al. May 3, 2	2011-05-03
Method For Forming Artificial Lipid Membrane App 20110083793 - OKI; Akio ; et al.	2011-04-14
Storage medium with built-in antenna Grant 7,924,228 - Ochi , et al. April 12, 2	2011-04-12
Method Of Joining Electronic Component And The Electronic Component App 20100244283 - Tsukahara; Norihito ; et al.	2010-09-30
Antenna Built-in Module, Card Type Information Device, And Methods For Manufacturing Them App 20100163630 - Ochi; Shozo ; et al.	2010-07-01
Paste Applicator And Paste Application Method App 20100080912 - Koyama; Masayoshi ; et al.	2010-04-01
Storage Medium With Built-in Antenna App 20100052996 - Ochi; Shozo ; et al.	2010-03-04
Wiring Board And Wiring Board Manufacturing Method App 20090314528 - Hirose; Takayuki ; et al.	2009-12-24
Circuit Board And Method For Jointing Circuit Board App 20090266592 - Koyama; Masayoshi ; et al.	2009-10-29
Electronic Circuit Device And Method For Manufacturing Same App 20090133900 - Nishikawa; Kazuhiro ; et al.	2009-05-28
Semiconductor memory module having built-in antenna Grant 7,471,260 - Ochi , et al. December 30, 2	2008-12-30
Wiring board and method of manufacturing the same Grant 7,381,902 - Tsukahara , et al. June 3, 2	2008-06-03
Circuit board and its manufacturing method Grant 7,376,318 - Tsukahara , et al. May 20, 2	2008-05-20
High density multilayer circuit module Grant 7,375,421 - Sakurai , et al. May 20, 2	2008-05-20
Semiconductor Memory Module Having Built-In Antenna App 20080111756 - Ochi; Shozo ; et al.	2008-05-15
Circuit board fabrication method and circuit board Grant 7,353,600 - Tsukahara , et al. April 8, 2	2008-04-08
Solder Paste and Electronic Device Using Same App 20070277909 - Tsukahara; Norihito ; et al.	2007-12-06
Circuit board and method of manufacturing the same Grant 7,297,876 - Sakurai , et al. November 20, 2	2007-11-20
Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component App 20070200217 - Tsukahara; Norihito ; et al.	2007-08-30
Interconnection substrate and fabrication method thereof Grant 7,233,069 - Tsukahara , et al. June 19, 2	2007-06-19
Connecting structure of circuit board and method for manufacturing the same Grant 7,229,293 - Sakurai , et al. June 12, 2	2007-06-12
Electronic circuit device and method of manufacturing the same App 20070127224 - Tsukahara; Norihito ; et al.	2007-06-07
Circuit board and its manufacturing method App 20070114058 - Tsukahara; Norihito ; et al.	2007-05-24
Electronic circuit device and method of manufacturing the same Grant 7,186,925 - Tsukahara , et al. March 6, 2	2007-03-06
Electronic circuit device and its manufacturing method Grant 7,180,007 - Nishikawa , et al. February 20, 2	2007-02-20
Circuit board and its manufacturing method Grant 7,180,749 - Tsukahara , et al. February 20, 2	2007-02-20
Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component Grant 7,176,055 - Tsukahara , et al. February 13, 2	2007-02-13
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method Grant 7,090,482 - Tsukahara , et al. August 15, 2	2006-08-15
Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product Grant 7,084,008 - Sakurai , et al. August 1, 2	2006-08-01
Semiconductor element having protruded bump electrodes Grant 7,071,090 - Higashi , et al. July 4, 2	2006-07-04
Connecting structure of circuit board and method for manufacturing the same App 20060014403 - Sakurai; Daisuke ; et al.	2006-01-19
Circuit module and method for manufacturing the same App 20050275088 - Sakurai, Daisuke ; et al.	2005-12-15
Multilayered circuit board forming method and multilayered circuit board Grant 6,971,167 - Nishikawa , et al. December 6, 2	2005-12-06
Semiconductor element having protruded bump electrodes App 20050146029 - Higashi, Kazushi ; et al.	2005-07-07
Semiconductor element having protruded bump electrodes Grant 6,894,387 - Higashi , et al. May 17, 2	2005-05-17
Electronic circuit device, and method and apparatus for manufacturing the same App 20050093172 - Tsukahara, Norihito ; et al.	2005-05-05
Wiring board and method of manufacturing the same App 20050087363 - Tsukahara, Norihito ; et al.	2005-04-28
Interconnection substrate and fabrication method thereof App 20050079707 - Tsukahara, Norihito ; et al.	2005-04-14
Circuit board fabrication method and circuit board App 20050060886 - Tsukahara, Norihito ; et al.	2005-03-24
Circuit board and method of manufacturing the same App 20050045379 - Sakurai, Daisuke ; et al.	2005-03-03
Electronic circuit device and its manufacturing method App 20050017373 - Nishikawa, Kazuhiro ; et al.	2005-01-27
Method for assembling integral type electronic device, and integral type electronic device App 20050001315 - Higashi, Kazushi ; et al.	2005-01-06
Method for assembling integral type electronic component and integral type electronic component Grant 6,825,055 - Higashi , et al. November 30, 2	2004-11-30
Electronic circuit device and method of manufacturing the same App 20040200065 - Tsukahara, Norihito ; et al.	2004-10-14
Package of semiconductor device and method of manufacture thereof Grant 6,780,668 - Tsukahara , et al. August 24, 2	2004-08-24
Circuit board and its manufacturing method App 20040134681 - Tsukahara, Norihito ; et al.	2004-07-15
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method App 20040130024 - Tsukahara, Norihito ; et al.	2004-07-08
Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product App 20040115864 - Sakurai, Daisuke ; et al.	2004-06-17
Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component App 20040082100 - Tsukahara, Norihito ; et al.	2004-04-29
Multilayered circuit board forming method and multilayered circuit board App 20040020047 - Nishikawa, Kazuhiro ; et al.	2004-02-05
Mounting method of semiconductor element Grant 6,531,022 - Tsukahara March 11, 2	2003-03-11
Method for assembling integral type electronic component and integral type electronic component App 20020028595 - Higashi, Kazushi ; et al.	2002-03-07
Method for mounting parts, and IC card and manufacturing method thereof App 20020026703 - Oku, Mitsumasa ; et al.	2002-03-07
Electronic Component With Ball Bonded Pads Connected To A Plated Lead Frame App 20020014685 - TSUKAHARA, NORIHITO	2002-02-07
Method of forming a ball bond using a bonding capillary App 20010005054 - Higashi, Kazushi ; et al.	2001-06-28
Method of forming a ball bond using a bonding capillary Grant 6,207,549 - Higashi , et al. March 27, 2	2001-03-27
Mounting method of semiconductor element Grant 6,051,093 - Tsukahara April 18, 2	2000-04-18
Circuit board having electrodes and pre-deposit solder receiver Grant 5,917,156 - Nobori , et al. June 29, 1	1999-06-29
Semiconductor device and manufacturing method thereof Grant 5,686,353 - Yagi , et al. November 11, 1	1997-11-11

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