Akiguchi; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akiguchi; Takashi.The latest application filed is for "semiconductor device package manufacturing method and semiconductor device package manufactured by the method".

Company Profile

0.7.4

Akiguchi; Takashi - Osaka JP
Akiguchi, Takashi - Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method Grant 7,090,482 - Tsukahara , et al. August 15, 2	2006-08-15
Package of semiconductor device and method of manufacture thereof Grant 6,780,668 - Tsukahara , et al. August 24, 2	2004-08-24
Semiconductor device package manufacturing method and semiconductor device package manufactured by the method App 20040130024 - Tsukahara, Norihito ; et al.	2004-07-08
Article with electronic circuit formed and method of manufacturing the same App 20040078965 - Miyakawa, Hidenori ; et al.	2004-04-29
Method of manufacturing article having electronic circuit Grant 6,708,401 - Miyakawa , et al. March 23, 2	2004-03-23
Article with electronic circuit formed and method of manufacturing the same App 20020036898 - Miyakawa, Hidenori ; et al.	2002-03-28
Method for mounting parts, and IC card and manufacturing method thereof App 20020026703 - Oku, Mitsumasa ; et al.	2002-03-07
Method for connecting electrodes of plasma display panel Grant 6,086,441 - Akiguchi , et al. July 11, 2	2000-07-11
Method of packaging electronic chip component and method of bonding of electrode thereof Grant 5,744,382 - Kitayama , et al. April 28, 1	1998-04-28
Method for mounting electronic parts on a printed circuit board by use of an adhesive composition Grant 5,427,642 - Akiguchi , et al. June 27, 1	1995-06-27
Method for packaging electronic parts and adhesive for use in said method Grant 5,137,936 - Akiguchi , et al. August 11, 1	1992-08-11

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