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Source/Drain Structure
App 20220173239 - Liu; Su-Hao ; et al. | 2022-06-02 |
Electrode structure to improve RRAM performance
Grant 11,329,221 - Chu , et al. May 10, 2 | 2022-05-10 |
Melt Anneal Source and Drain Regions
App 20220140079 - Liu; Su-Hao ; et al. | 2022-05-05 |
Metal Loss Prevention Using Implantation
App 20220122884 - Wu; Li-Chieh ; et al. | 2022-04-21 |
Source/drain structure
Grant 11,257,952 - Liu , et al. February 22, 2 | 2022-02-22 |
Melt anneal source and drain regions
Grant 11,227,918 - Liu , et al. January 18, 2 | 2022-01-18 |
Metal loss prevention using implantation
Grant 11,211,289 - Wu , et al. December 28, 2 | 2021-12-28 |
Electrode structure to improve RRAM performance
Grant 11,183,631 - Chu , et al. November 23, 2 | 2021-11-23 |
Bonding Pad on a Back Side Illuminated Image Sensor
App 20210273009 - Chien; Volume ; et al. | 2021-09-02 |
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
Grant 11,018,176 - Chang , et al. May 25, 2 | 2021-05-25 |
Bonding pad on a back side illuminated image sensor
Grant 11,011,566 - Chien , et al. May 18, 2 | 2021-05-18 |
Thickness Sensor For Conductive Features
App 20210125881 - CHEN; CHIH HUNG ; et al. | 2021-04-29 |
Semiconductor Device
App 20210083048 - LIN; Jia-Ming ; et al. | 2021-03-18 |
Thickness sensor for conductive features
Grant 10,916,481 - Chen , et al. February 9, 2 | 2021-02-09 |
Semiconductor Device, Method, and Tool of Manufacture
App 20210036129 - Chen; Chih Hung ; et al. | 2021-02-04 |
Apparatus and method for timed dispensing various slurry components
Grant 10,875,149 - Chen , et al. December 29, 2 | 2020-12-29 |
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,868,178 - Liu , et al. December 15, 2 | 2020-12-15 |
Method for forming trench structure of semiconductor device
Grant 10,854,713 - Lin , et al. December 1, 2 | 2020-12-01 |
Block layer in the metal gate of MOS devices
Grant 10,840,330 - Tsao , et al. November 17, 2 | 2020-11-17 |
Semiconductor device, method, and tool of manufacture
Grant 10,804,370 - Chen , et al. October 13, 2 | 2020-10-13 |
Source/Drain Structure
App 20200279944 - Liu; Su-Hao ; et al. | 2020-09-03 |
Wafer Thinning Apparatus Having Feedback Control
App 20200258756 - A1 | 2020-08-13 |
Source/drain structure
Grant 10,658,510 - Liu , et al. | 2020-05-19 |
Wafer thinning apparatus having feedback control and method of using
Grant 10,643,853 - Chen , et al. | 2020-05-05 |
Metal loss prevention using implantation
Grant 10,643,892 - Wu , et al. | 2020-05-05 |
Field Effect Transistor Contact with Reduced Contact Resistance Using Implantation Process
App 20200119195 - Liu; Su-Hao ; et al. | 2020-04-16 |
Electrode Structure To Improve Rram Performance
App 20200091425 - Chu; Wen-Ting ; et al. | 2020-03-19 |
Fin-type field effect transistor structure and manufacturing method thereof
Grant 10,573,749 - Tsai , et al. Feb | 2020-02-25 |
Electrode Structure To Improve Rram Performance
App 20200058858 - Chu; Wen-Ting ; et al. | 2020-02-20 |
Melt Anneal Source and Drain Regions
App 20200044025 - Liu; Su-Hao ; et al. | 2020-02-06 |
Source/Drain Structure
App 20200006545 - Liu; Su-Hao ; et al. | 2020-01-02 |
Thickness Sensor For Conductive Features
App 20190393107 - CHEN; CHIH HUNG ; et al. | 2019-12-26 |
Fabrication of semiconductor device
Grant 10,516,048 - Chen , et al. Dec | 2019-12-24 |
Electrode structure to improve RRAM performance
Grant 10,516,106 - Chu , et al. Dec | 2019-12-24 |
Metal Loss Prevention Using Implantation
App 20190385909 - Wu; Li-Chieh ; et al. | 2019-12-19 |
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,510,891 - Liu , et al. Dec | 2019-12-17 |
Field Effect Transistor Contact with Reduced Contact Resistance Using Implantation Process
App 20190378928 - Liu; Su-Hao ; et al. | 2019-12-12 |
Metal Loss Prevention Using Implantation
App 20190371664 - Wu; Li-Chieh ; et al. | 2019-12-05 |
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same
App 20190252427 - Chang; Shih-Chieh ; et al. | 2019-08-15 |
Polishing Pad For Chemical Mechanical Planarization
App 20190224810 - Chen; Chih Hung ; et al. | 2019-07-25 |
Field effect transistor contact with reduced contact resistance using implantation process
Grant 10,347,762 - Liu , et al. July 9, 2 | 2019-07-09 |
Methods for resistive random access memory (RRAM)
Grant 10,283,702 - Chang , et al. | 2019-05-07 |
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
Grant 10,276,621 - Chang , et al. | 2019-04-30 |
Electrode Structure To Improve Rram Performance
App 20180375024 - Chu; Wen-Ting ; et al. | 2018-12-27 |
Semiconductor Device with Multi Level Interconnects and Method of Forming the Same
App 20180337113 - Liang; Jeng Min ; et al. | 2018-11-22 |
Semiconductor device having barrier layer to prevent impurity diffusion
Grant 10,096,672 - Chen , et al. October 9, 2 | 2018-10-09 |
Apparatus And Method For Timed Dispensing Various Slurry Components
App 20180281152 - CHEN; Kei-Wei ; et al. | 2018-10-04 |
Semiconductor Device, Method, and Tool of Manufacture
App 20180269307 - Chen; Chih Hung ; et al. | 2018-09-20 |
Method for controlling chemical mechanical polishing process
Grant 10,058,974 - Chen , et al. August 28, 2 | 2018-08-28 |
Method For Forming Trench Structure Of Semiconductor Device
App 20180151667 - LIN; Jia-Ming ; et al. | 2018-05-31 |
Methods for Resistive Random Access Memory (RRAM)
App 20180108836 - Chang; Ting-Chang ; et al. | 2018-04-19 |
Wafer edge trimming tool using abrasive tape
Grant 9,931,726 - Chang , et al. April 3, 2 | 2018-04-03 |
Fabrication Of Semiconductor Device
App 20180061987 - CHEN; I-Chih ; et al. | 2018-03-01 |
Trench structure of semiconductor device having uneven nitrogen distribution liner
Grant 9,871,100 - Lin , et al. January 16, 2 | 2018-01-16 |
Semiconductor device and manufacturing method thereof
Grant 9,865,731 - Chen , et al. January 9, 2 | 2018-01-09 |
Methods and apparatus for resistive random access memory (RRAM)
Grant 9,847,478 - Chang , et al. December 19, 2 | 2017-12-19 |
Apparatus And Method For Treating Wafer
App 20170352574 - CHEN; Kei-Wei ; et al. | 2017-12-07 |
Lithography tool with backside polisher
Grant 9,829,806 - Chang , et al. November 28, 2 | 2017-11-28 |
Block Layer in the Metal Gate of MOS Devices
App 20170323940 - Tsao; Jung-Chih ; et al. | 2017-11-09 |
Metal shield structure and methods for BSI image sensors
Grant 9,812,492 - JangJian , et al. November 7, 2 | 2017-11-07 |
Semiconductor device and fabricating method thereof
Grant 9,812,569 - Chen , et al. November 7, 2 | 2017-11-07 |
Semiconductor Device Having Barrier Layer To Prevent Impurity Diffusion
App 20170317164 - CHEN; I-Chih ; et al. | 2017-11-02 |
Fin-type Field Effect Transistor Structure And Manufacturing Method Thereof
App 20170250281 - Tsai; Chun Hsiung ; et al. | 2017-08-31 |
Semiconductor device
Grant 9,735,271 - Hsiao , et al. August 15, 2 | 2017-08-15 |
Block layer in the metal gate of MOS devices
Grant 9,735,231 - Tsao , et al. August 15, 2 | 2017-08-15 |
Semiconductor wafer and semiconductor die
Grant 9,728,511 - Wu , et al. August 8, 2 | 2017-08-08 |
Semiconductor device having barrier layer to prevent impurity diffusion
Grant 9,728,598 - Chen , et al. August 8, 2 | 2017-08-08 |
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same
App 20170213861 - Chang; Shih-Chieh ; et al. | 2017-07-27 |
Wafer edge trim blade with slots
Grant 9,676,114 - Kuo , et al. June 13, 2 | 2017-06-13 |
Semiconductor devices utilizing partially doped stressor film portions
Grant 9,634,119 - Hsiao , et al. April 25, 2 | 2017-04-25 |
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
Grant 9,620,555 - Chang , et al. April 11, 2 | 2017-04-11 |
Method for wafer grinding
Grant 9,566,683 - Wei , et al. February 14, 2 | 2017-02-14 |
Modular grinding apparatuses and methods for wafer thinning
Grant 9,570,311 - Kuo , et al. February 14, 2 | 2017-02-14 |
Trench Structure Of Semiconductor Device And Manufacturing Method Thereof
App 20170033179 - LIN; Jia-Ming ; et al. | 2017-02-02 |
Semiconductor device and fabricating method thereof
Grant 9,520,477 - Hung , et al. December 13, 2 | 2016-12-13 |
Resistive random-access memory (RRAM) with a low-K porous layer
Grant 9,502,647 - Chang , et al. November 22, 2 | 2016-11-22 |
Oxidation-free copper metallization process using in-situ baking
Grant 9,502,290 - Wang , et al. November 22, 2 | 2016-11-22 |
Semiconductor device and manufacturing method thereof
Grant 9,490,345 - Chen , et al. November 8, 2 | 2016-11-08 |
Semiconductor Device Having Barrier Layer To Prevent Impurity Diffusion
App 20160300906 - CHEN; I-Chih ; et al. | 2016-10-13 |
Semiconductor Device And Fabricating Method Thereof
App 20160276456 - HUNG; CHI-CHENG ; et al. | 2016-09-22 |
Sensing product and method of making
Grant 9,419,155 - Chang , et al. August 16, 2 | 2016-08-16 |
Apparatus and method for reducing dark current in image sensors
Grant 9,379,275 - Liao , et al. June 28, 2 | 2016-06-28 |
Semiconductor Device
App 20160181427 - HSIAO; Wen Chu ; et al. | 2016-06-23 |
Dry etching gas and method of manufacturing semiconductor device
Grant 9,368,394 - Hung , et al. June 14, 2 | 2016-06-14 |
BSI image sensor chips and methods for forming the same
Grant 9,356,059 - JangJian , et al. May 31, 2 | 2016-05-31 |
Bonding Pad on a Back Side Illuminated Image Sensor
App 20160148967 - Chien; Volume ; et al. | 2016-05-26 |
Wafer polishing tool using abrasive tape
Grant 9,339,912 - Chang , et al. May 17, 2 | 2016-05-17 |
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same
App 20160118434 - Chang; Shih-Chieh ; et al. | 2016-04-28 |
Method Of Forming Diamond Conditioners For Cmp Process
App 20160114460 - CHAO; Yen-Chang ; et al. | 2016-04-28 |
Semiconductor device
Grant 9,324,863 - Hsiao , et al. April 26, 2 | 2016-04-26 |
Resistive random-access memory (RRAM) with multi-layer device structure
Grant 9,281,475 - Chang , et al. March 8, 2 | 2016-03-08 |
Method of forming diamond conditioners for CMP process
Grant 9,254,548 - Chao , et al. February 9, 2 | 2016-02-09 |
Bonding pad on a back side illuminated image sensor
Grant 9,252,180 - Chien , et al. February 2, 2 | 2016-02-02 |
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
Grant 9,224,773 - Chang , et al. December 29, 2 | 2015-12-29 |
Semiconductor device contact structures
Grant 9,224,691 - Chang , et al. December 29, 2 | 2015-12-29 |
Apparatus for Wafer Grinding
App 20150367475 - Wei; Kuo-Hsiu ; et al. | 2015-12-24 |
Resistive Random-access Memory (rram) With A Low-k Porous Layer
App 20150349251 - CHANG; TING-CHANG ; et al. | 2015-12-03 |
Resistive Random-access Memory (rram) With Multi-layer Device Structure
App 20150349250 - CHANG; TING-CHANG ; et al. | 2015-12-03 |
Semiconductor Devices Utilizing Partially Doped Stressor Film Portions
App 20150311314 - Hsiao; Wen Chu ; et al. | 2015-10-29 |
System and method for die to die stress improvement
Grant 9,171,759 - Cheng , et al. October 27, 2 | 2015-10-27 |
Backside Illuminated Image Sensor And Method Of Manufacturing The Same
App 20150279880 - JANGJIAN; SHIU-KO ; et al. | 2015-10-01 |
Block Layer In The Metal Gate Of Mos Devices
App 20150279838 - Tsao; Jung-Chih ; et al. | 2015-10-01 |
Lithography Tool With Backside Polisher
App 20150262831 - CHANG; TANG-KUEI ; et al. | 2015-09-17 |
Apparatus for wafer grinding
Grant 9,120,194 - Wei , et al. September 1, 2 | 2015-09-01 |
Semiconductor Device And Formation Thereof
App 20150235953 - Tsao; Jung-Chih ; et al. | 2015-08-20 |
Metal Shield Structure and Methods for BSI Image Sensors
App 20150214272 - JangJian; Shiu-Ko ; et al. | 2015-07-30 |
Semiconductor Device And Manufacturing Method Thereof
App 20150206946 - CHEN; I-CHIH ; et al. | 2015-07-23 |
Semiconductor Device And Fabricating Method Thereof
App 20150200299 - CHEN; I-Chih ; et al. | 2015-07-16 |
Device with MOS device including a secondary metal and PVD tool with target for making same
Grant 9,070,664 - Chang , et al. June 30, 2 | 2015-06-30 |
Semiconductor devices utilizing partially doped stressor film portions and methods for forming the same
Grant 9,064,892 - Hsiao , et al. June 23, 2 | 2015-06-23 |
Methods for minimizing edge peeling in the manufacturing of BSI chips
Grant 9,064,770 - Kuo , et al. June 23, 2 | 2015-06-23 |
Semiconductor Wafer And Semiconductor Die
App 20150170985 - Wu; Hsi-Jung ; et al. | 2015-06-18 |
Semiconductor Device And Manufacturing Method Thereof
App 20150137247 - CHEN; I-CHIH ; et al. | 2015-05-21 |
Metal shield structure and methods for BSI image sensors
Grant 9,024,369 - JangJian , et al. May 5, 2 | 2015-05-05 |
MOSFET having memory characteristics
Grant 8,891,299 - Chang , et al. November 18, 2 | 2014-11-18 |
Methods and apparatus for an improved reflectivity optical grid for image sensors
Grant 8,890,273 - JangJian , et al. November 18, 2 | 2014-11-18 |
Image sensor and method of manufacturing
Grant 8,847,286 - Jangjian , et al. September 30, 2 | 2014-09-30 |
Semiconductor device
App 20140239416 - HSIAO; Wen Chu ; et al. | 2014-08-28 |
Bonding Pad On A Back Side Illuminated Image Sensor
App 20140225215 - CHIEN; VOLUME ; et al. | 2014-08-14 |
Wafer Polishing Tool Using Abrasive Tape
App 20140213153 - Chang; Tang-Kuei ; et al. | 2014-07-31 |
Wafer Edge Trimming Tool Using Abrasive Tape
App 20140213152 - Chang; Tang-Kuei ; et al. | 2014-07-31 |
Semiconductor Device With Multi Level Interconnects And Method Of Forming The Same
App 20140209984 - Liang; Jeng Min ; et al. | 2014-07-31 |
Method and apparatus for backside illumination sensor
Grant 8,772,899 - JangJian , et al. July 8, 2 | 2014-07-08 |
System And Method For Die To Die Stress Improvement
App 20140167199 - CHENG; Chia-Pin ; et al. | 2014-06-19 |
Metal Shield Structure and Methods for BSI Image Sensors
App 20140167197 - JangJian; Shiu-Ko ; et al. | 2014-06-19 |
Method of manufacturing semiconductor device
Grant 8,735,255 - Hsiao , et al. May 27, 2 | 2014-05-27 |
Mosfet Having Memory Characteristics
App 20140043899 - Chang; Ting-Chang ; et al. | 2014-02-13 |
Semiconductor device and method of formation
Grant 8,642,439 - Nian , et al. February 4, 2 | 2014-02-04 |
Methods for Minimizing Edge Peeling in the Manufacturing of BSI Chips
App 20140024170 - Kuo; Chun-Ting ; et al. | 2014-01-23 |
Device with MOS Device Including a Secondary Metal and PVD Tool with Target for Making Same
App 20130334581 - Chang; Shih-Chieh ; et al. | 2013-12-19 |
Semiconductor Device Contact Structures
App 20130320541 - CHANG; Shih-Chieh ; et al. | 2013-12-05 |
Method Of Manufacturing Semiconductor Device
App 20130295739 - HSIAO; Wen Chu ; et al. | 2013-11-07 |
Method Of Forming Diamond Conditioners For Cmp Process
App 20130288582 - CHAO; Yen-Chang ; et al. | 2013-10-31 |
Image Sensor Manufacturing Methods
App 20130273686 - Cheng; Mu-Han ; et al. | 2013-10-17 |
Oxidation-Free Copper Metallization Process Using In-situ Baking
App 20130273735 - Wang; Yu-Sheng ; et al. | 2013-10-17 |
Semiconductor Device and Method of Formation
App 20130264615 - Nian; Jun-Nan ; et al. | 2013-10-10 |
Nickel alloy target including a secondary metal
Grant 8,551,193 - Chang , et al. October 8, 2 | 2013-10-08 |
Semiconductor device
Grant 8,552,529 - Tsao , et al. October 8, 2 | 2013-10-08 |
Methods and Apparatus for Resistive Random Access Memory (RRAM)
App 20130234094 - Chang; Ting-Chang ; et al. | 2013-09-12 |
Via/contact and damascene structures
Grant 8,531,036 - Chang , et al. September 10, 2 | 2013-09-10 |
Method and Apparatus for Backside Illumination Sensor
App 20130228886 - JangJian; Shiu-Ko ; et al. | 2013-09-05 |
Wafer Edge Trim Blade With Slots
App 20130220090 - KUO; Chun-Ting ; et al. | 2013-08-29 |
Semiconductor device contact structures and methods for making the same
Grant 8,518,819 - Chang , et al. August 27, 2 | 2013-08-27 |
Wafer Thinning Apparatus Having Feedback Control And Method Of Using
App 20130210172 - Chen; Yuan-Hsuan ; et al. | 2013-08-15 |
Modular Grinding Apparatuses And Methods For Wafer Thinning
App 20130210321 - KUO; Chun-Ting ; et al. | 2013-08-15 |
Methods and Apparatus for an Improved Reflectivity Optical Grid for Image Sensors
App 20130193538 - JangJian; Shiu-Ko ; et al. | 2013-08-01 |
Apparatus and Method for Reducing Dark Current in Image Sensors
App 20130193540 - Liao; Miao-Cheng ; et al. | 2013-08-01 |
Image Sensor And Method Of Manufacturing
App 20130181258 - JangJian; Shiu-Ko ; et al. | 2013-07-18 |
Sensing Product And Method Of Making
App 20130175653 - CHANG; Shih-Chieh ; et al. | 2013-07-11 |
Oxidation-free copper metallization process using in-situ baking
Grant 8,470,390 - Wang , et al. June 25, 2 | 2013-06-25 |
BSI Image Sensor Chips and Methods for Forming the Same
App 20130153901 - JangJian; Shiu-Ko ; et al. | 2013-06-20 |
Stressed semiconductor device and method of manufacturing
Grant 8,455,883 - Liao , et al. June 4, 2 | 2013-06-04 |
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same
App 20130134541 - Chang; Shih-Chieh ; et al. | 2013-05-30 |
Semiconductor Device and Method of Formation
App 20130126950 - Nian; Jun-Nan ; et al. | 2013-05-23 |
Semiconductor device and method of formation
Grant 8,435,893 - Nian , et al. May 7, 2 | 2013-05-07 |
Semiconductor Manufacturing Apparatus And Method Of Manufacturing Semiconductor Device
App 20130102152 - CHAO; Yen-Chang ; et al. | 2013-04-25 |
Metal Gate Stack Having Tialn Blocking/wetting Layer
App 20130075831 - JangJian; Shiu-Ko ; et al. | 2013-03-28 |
Semiconductor Devices Utilizing Partially Doped Stressor Film Portions And Methods For Forming The Same
App 20130049101 - HSIAO; Wen Chu ; et al. | 2013-02-28 |
Apparatus for Wafer Grinding
App 20130023188 - Wei; Kuo-Hsiu ; et al. | 2013-01-24 |
Nickel Alloy Target Including a Secondary Metal
App 20130020617 - Chang; Shih-Chieh ; et al. | 2013-01-24 |
Stressed Semiconductor Device And Method Of Manufacturing
App 20120292639 - Liao; Miao-Cheng ; et al. | 2012-11-22 |
Via/contact And Damascene Structures
App 20120292768 - Chang; Shih-Chieh ; et al. | 2012-11-22 |
Chemical Mechanical Polishing Slurry, System And Method
App 20120264303 - CHEN; Kei-Wei ; et al. | 2012-10-18 |
Semiconductor Device
App 20120241908 - TSAO; Jung-Chih ; et al. | 2012-09-27 |
Semiconductor Device Contact Structures And Methods For Making The Same
App 20120235299 - CHANG; Shih Chieh ; et al. | 2012-09-20 |
Via/contact and damascene structures and manufacturing methods thereof
Grant 8,247,322 - Chang , et al. August 21, 2 | 2012-08-21 |
Current-leveling electroplating/electropolishing electrode
Grant 8,099,861 - Chang , et al. January 24, 2 | 2012-01-24 |
Method and system for providing a selection of golden tools for better defect density and product yield
Grant 8,041,440 - Cheng , et al. October 18, 2 | 2011-10-18 |
Oxygen plasma reduction to eliminate precursor overflow in BPTEOS film deposition
Grant 7,955,993 - Lan , et al. June 7, 2 | 2011-06-07 |
Current-leveling Electroplating/electropolishing Electrode
App 20100314256 - Chang; Shih-Chieh ; et al. | 2010-12-16 |
Oxygen Plasma Reduction To Eliminate Precursor Overflow In Bpteos Film Deposition
App 20100311252 - Lan; Chin Kun ; et al. | 2010-12-09 |
Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
Grant 7,837,841 - Chen , et al. November 23, 2 | 2010-11-23 |
Current-leveling electroplating/electropolishing electrode
Grant 7,803,257 - Chang , et al. September 28, 2 | 2010-09-28 |
Methods of spin-on wafer cleaning
Grant 7,611,589 - Wu , et al. November 3, 2 | 2009-11-03 |
Oxidation-Free Copper Metallization Process Using In-situ Baking
App 20090181164 - Wang; Yu-Sheng ; et al. | 2009-07-16 |
Forming Seed Layer in Nano-Trench Structure Using Net Deposition and Net Etch
App 20090127097 - Chen; Kei-Wei ; et al. | 2009-05-21 |
Semiconductor devices having post passivation interconnections and a buffer layer
Grant 7,528,478 - Cheng , et al. May 5, 2 | 2009-05-05 |
TEOS deposition method
Grant 7,470,584 - Cheng , et al. December 30, 2 | 2008-12-30 |
Semiconductor Device
App 20080251889 - Tsao; Jung-Chih ; et al. | 2008-10-16 |
Apparatuses For Electrochemical Deposition, Conductive Layer, And Fabrication Methods Thereof
App 20080223724 - Chen; Kei-Wei ; et al. | 2008-09-18 |
Via/contact And Damascene Structures And Manufacturing Methods Thereof
App 20080211106 - Chang; Shih-Chieh ; et al. | 2008-09-04 |
Method and system for virtual metrology in semiconductor manufacturing
Grant 7,359,759 - Cheng , et al. April 15, 2 | 2008-04-15 |
Metal-oxide-metal structure with improved capacitive coupling area
App 20080061343 - Lan; Chin Kun ; et al. | 2008-03-13 |
Method and System for Providing a Selection of Golden Tools for Better Defect Density and Product Yield
App 20080021585 - Cheng; Chang Yung ; et al. | 2008-01-24 |
Copper plating of semiconductor devices using single intermediate low power immersion step
Grant 7,312,149 - Chen , et al. December 25, 2 | 2007-12-25 |
Test device and method for laser alignment calibration
Grant 7,304,728 - Chang , et al. December 4, 2 | 2007-12-04 |
Barrier layer for semiconductor interconnect structure
App 20070257366 - Wang; Yu-Sheng ; et al. | 2007-11-08 |
Semiconductor Devices And Fabrication Method Thereof
App 20070252277 - Tsao; Jung-Chih ; et al. | 2007-11-01 |
Low-k dielectric layer, semiconductor device, and method for fabricating the same
App 20070205516 - Chen; Kei-Wei ; et al. | 2007-09-06 |
Dual contact ring and method for metal ECP process
Grant 7,252,750 - Liu , et al. August 7, 2 | 2007-08-07 |
Method for forming IMD films
Grant 7,253,121 - Cheng , et al. August 7, 2 | 2007-08-07 |
Method and system for virtual metrology in semiconductor manufacturing
App 20070100487 - Cheng; Chang Yung ; et al. | 2007-05-03 |
Method for cleaning a plasma enhanced CVD chamber
Grant 7,207,339 - Chen , et al. April 24, 2 | 2007-04-24 |
Plating apparatuses and processes
App 20070084730 - Chen; Kei-Wei ; et al. | 2007-04-19 |
MIM structure and fabrication process with improved capacitance reliability
Grant 7,205,634 - Liao , et al. April 17, 2 | 2007-04-17 |
Metal-filled openings for submicron devices and methods of manufacture thereof
Grant 7,199,045 - Liu , et al. April 3, 2 | 2007-04-03 |
Damascene process using dielectic layer containing fluorine and nitrogen
App 20060292859 - Jian; Shiu-Ko Jang ; et al. | 2006-12-28 |
Method of forming a protective layer over Cu filled semiconductor features
Grant 7,144,811 - Liu , et al. December 5, 2 | 2006-12-05 |
Electropolishing method for removing particles from wafer surface
Grant 7,128,821 - Lin , et al. October 31, 2 | 2006-10-31 |
CMP process leaving no residual oxide layer or slurry particles
Grant 7,125,802 - Wang , et al. October 24, 2 | 2006-10-24 |
Methods of spin-on wafer cleaning
App 20060196526 - Wu; Jun ; et al. | 2006-09-07 |
TEOS deposition method
App 20060166514 - Cheng; Yi-Lung ; et al. | 2006-07-27 |
Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current
Grant 7,078,336 - Cheng , et al. July 18, 2 | 2006-07-18 |
Semiconductor devices having post passivation interconnections with a second connection pattern
App 20060145332 - Cheng; Hsi-Kuei ; et al. | 2006-07-06 |
Damascene MIM capacitor structure with self-aligned oxidation fabrication process
App 20060148192 - Chou; You-Hua ; et al. | 2006-07-06 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
Grant 7,071,100 - Chen , et al. July 4, 2 | 2006-07-04 |
Current-leveling electroplating/electropolishing electrode
App 20060086609 - Chang; Shih-Chieh ; et al. | 2006-04-27 |
Method for reducing defects in post passivation interconnect process
Grant 7,026,233 - Cheng , et al. April 11, 2 | 2006-04-11 |
Test device and method for laser alignment calibration
App 20060055928 - Chang; Shih-Tzung ; et al. | 2006-03-16 |
Method for forming IMD films
App 20060051973 - Cheng; Yi-Lung ; et al. | 2006-03-09 |
Chamber leakage detection by measurement of reflectivity of oxidized thin film
Grant 6,985,222 - Cheng , et al. January 10, 2 | 2006-01-10 |
Metal-filled openings for submicron devices and methods of manufacture thereof
App 20050275941 - Liu, Chi-Wen ; et al. | 2005-12-15 |
Method and structure for improving adhesion between intermetal dielectric layer and cap layer
App 20050253268 - Hsu, Shao-Ta ; et al. | 2005-11-17 |
Copper plating of semiconductor devices using intermediate immersion step
App 20050250327 - Chen, Chao-Lung ; et al. | 2005-11-10 |
Novel ECP method for preventing the formation of voids and contamination in vias
App 20050236181 - Chen, Kei-Wei ; et al. | 2005-10-27 |
MIM structure and fabrication process with improved capacitance reliability
App 20050202616 - Liao, Miao-Cheng ; et al. | 2005-09-15 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
App 20050191855 - Chen, Kei-Wei ; et al. | 2005-09-01 |
Electropolishing method for removing particles from wafer surface
App 20050155869 - Lin, Shih-Ho ; et al. | 2005-07-21 |
Chamber cleaning method
App 20050155625 - Jangjian, Shiu-Ko ; et al. | 2005-07-21 |
Method for cleaning a plasma enhanced CVD chamber
App 20050133059 - Chen, Sheng-Wen ; et al. | 2005-06-23 |
Novel method to deposit carbon doped SiO2 films with improved film quality
App 20050124151 - Cheng, Yi-Lung ; et al. | 2005-06-09 |
CMP process leaving no residual oxide layer or slurry particles
Grant 6,903,019 - Wang , et al. June 7, 2 | 2005-06-07 |
Displacement method to grow cu overburden
Grant 6,903,011 - Liu , et al. June 7, 2 | 2005-06-07 |
Method and system for fabricating a copper barrier layer with low dielectric constant and leakage current
App 20050106858 - Cheng, Yi-Lung ; et al. | 2005-05-19 |
Method of forming inter-metal dielectric layer structure
App 20050074554 - Jangjian, Shiu-Ko ; et al. | 2005-04-07 |
Dual contact ring and method for metal ECP process
App 20050056544 - Liu, Chi-Wen ; et al. | 2005-03-17 |
Catch-pin water support for process chamber
Grant 6,863,491 - Cheng , et al. March 8, 2 | 2005-03-08 |
Method for reducing defects in post passivation interconnect process
App 20050032353 - Cheng, Hsi-Kuei ; et al. | 2005-02-10 |
Novel method to increase fluorine stability to improve gap fill ability and reduce k value of fluorine silicate glass (FSG) film
App 20050009367 - Cheng, Yi-Lung ; et al. | 2005-01-13 |
Displacement method to grow cu overburden
App 20040248407 - Liu, Chi-Wen ; et al. | 2004-12-09 |
Removal of SiON residue after CMP
Grant 6,828,226 - Chen , et al. December 7, 2 | 2004-12-07 |
Metal surface and film protection method to prolong Q-time after metal deposition
Grant 6,825,120 - Liu , et al. November 30, 2 | 2004-11-30 |
Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film
Grant 6,815,007 - Yoo , et al. November 9, 2 | 2004-11-09 |
Method to solve particle performance of FSG layer by using UFU season film for FSG process
Grant 6,815,072 - Yoo , et al. November 9, 2 | 2004-11-09 |
Chamber leakage detection by measurement of reflectivity of oxidized thin film
App 20040212798 - Cheng, Hsi-Kuei ; et al. | 2004-10-28 |
Semiconductor chamber process apparatus and method
Grant 6,802,935 - Cheng , et al. October 12, 2 | 2004-10-12 |
Method for capping over a copper layer
Grant 6,790,778 - Cheng , et al. September 14, 2 | 2004-09-14 |
Shallow trench isolation process
Grant 6,784,077 - Lin , et al. August 31, 2 | 2004-08-31 |
Preventative maintenance aided tool for CVD chamber
Grant 6,776,850 - Liao , et al. August 17, 2 | 2004-08-17 |
Method and system for slurry usage reduction in chemical mechanical polishing
Grant 6,769,959 - Chen , et al. August 3, 2 | 2004-08-03 |
Novel method to reduce stress for copper CMP
App 20040147116 - Chen, Kei-Wei ; et al. | 2004-07-29 |
Catch-pin water support for process chamber
App 20040131460 - Cheng, Hsi-Kuei ; et al. | 2004-07-08 |
Completely enclosed copper structure to avoid copper damage for damascene processes
App 20040110373 - Liu, Chi-Wen ; et al. | 2004-06-10 |
CMP process leaving no residual oxide layer or slurry particles
App 20040097083 - Wang, Ying-Lang ; et al. | 2004-05-20 |
CMP process leaving no residual oxide layer or slurry particles
App 20040084415 - Wang, Ying-Lang ; et al. | 2004-05-06 |
Method of forming a protective layer over Cu filled semiconductor features
App 20040067643 - Liu, Chi-Wen ; et al. | 2004-04-08 |
Self-aligned method for forming dual gate thin film transistor (TFT) device
Grant 6,673,661 - Liu , et al. January 6, 2 | 2004-01-06 |
Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure
Grant 6,670,274 - Liu , et al. December 30, 2 | 2003-12-30 |
Preventative Maintenance Aided Tool For Cvd Chamber
App 20030228751 - Liao, Miao-Cheng ; et al. | 2003-12-11 |
CMP process leaving no residual oxide layer or slurry particles
Grant 6,660,638 - Wang , et al. December 9, 2 | 2003-12-09 |
Planarization of shallow trench isolation (STI)
Grant 6,645,825 - Lan , et al. November 11, 2 | 2003-11-11 |
Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using
App 20030203708 - Liu, Chi-Wen ; et al. | 2003-10-30 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
Grant 6,626,741 - Wang , et al. September 30, 2 | 2003-09-30 |
Semiconductor chamber process apparatus and method
App 20030178141 - Cheng, Yi-Lung ; et al. | 2003-09-25 |
Method and system for slurry usage reduction in chemical mechanical polishing
App 20030143924 - Chen, Kei-Wei ; et al. | 2003-07-31 |
Method for achieving a uniform material removal rate in a CMP process
App 20030129846 - Liu, Chi-Wen ; et al. | 2003-07-10 |
Semiconductor Wafer Cleaning Method To Remove Residual Contamination Including Metal Nitride Particles
App 20030084919 - Tai, Yali ; et al. | 2003-05-08 |
Method of unloading substrates in chemical-mechanical polishing apparatus
Grant 6,558,228 - Cheng , et al. May 6, 2 | 2003-05-06 |
Method for reducing contaminants in a CVD chamber
App 20030068448 - Cheng, Yi-Lung ; et al. | 2003-04-10 |
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures
Grant 6,531,382 - Cheng , et al. March 11, 2 | 2003-03-11 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing
App 20030017784 - Wang, Ting-Chun ; et al. | 2003-01-23 |
Rule to determine CMP polish time
App 20020090745 - Lin, Hway-Chi ; et al. | 2002-07-11 |
Method to solve the delamination of a silicon nitride layer from an underlying spin on glass layer
Grant 6,407,007 - Tsan , et al. June 18, 2 | 2002-06-18 |
Methods to reduce metal bridges and line shorts in integrated circuits
Grant 6,372,645 - Liu , et al. April 16, 2 | 2002-04-16 |
Low temperature process for forming intermetal gap-filling insulating layers in silicon wafer integrated circuitry
App 20010030351 - Wang, Ying-Lang ; et al. | 2001-10-18 |
Three-dimensional type inductor for mixed mode radio frequency device
Grant 6,291,872 - Wang , et al. September 18, 2 | 2001-09-18 |
Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issue
Grant 6,291,331 - Wang , et al. September 18, 2 | 2001-09-18 |
Low temperature process for forming inter-metal gap-filling insulating layers in silicon wafer integrated circuitry
Grant 6,268,274 - Wang , et al. July 31, 2 | 2001-07-31 |
Methods to improve copper-fluorinated silica glass interconnects
Grant 6,136,680 - Lai , et al. October 24, 2 | 2000-10-24 |
Chemical mechanical polishing slurry
Grant 6,046,112 - Wang April 4, 2 | 2000-04-04 |
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