van der Straten; Oscar
Patent Applications and Registrations
Patent applications and USPTO patent grants for van der Straten; Oscar.The latest application filed is for "same level mram stacks having different configurations".
Company Profile
72.116.119
- van der Straten; Oscar - Guilderland Center NY
- Van der Straten; Oscar - Albany NY
- van der Straten; Oscar - Mohegan Lake NY
- Van Der Straten; Oscar - Armonk NY
Patent Activity
| Patent | Date |
|---|---|
| Same Level Mram Stacks Having Different Configurations App 20220302207 - Mignot; Yann ; et al. | 2022-09-22 |
| Interconnects having air gap spacers Grant 11,430,690 - Cheng , et al. August 30, 2 | 2022-08-30 |
| Pillar bump with noble metal seed layer for advanced heterogeneous integration Grant 11,380,641 - Maniscalco , et al. July 5, 2 | 2022-07-05 |
| Magneto-resistive Random Access Memory With Laterally-recessed Free Layer App 20220190235 - van der Straten; Oscar ; et al. | 2022-06-16 |
| Pillar Bump With Noble Metal Seed Layer For Advanced Heterogeneous Integration App 20220139858 - Maniscalco; Joseph F. ; et al. | 2022-05-05 |
| Single process for liner and metal fill Grant 11,322,359 - Adusumilli , et al. May 3, 2 | 2022-05-03 |
| Interconnect structure with partial sidewall liner Grant 11,270,910 - Reznicek , et al. March 8, 2 | 2022-03-08 |
| Encapsulated Top Via Interconnects App 20220044967 - van der Straten; Oscar ; et al. | 2022-02-10 |
| Physical unclonable function for MRAM structures Grant 11,239,414 - Xie , et al. February 1, 2 | 2022-02-01 |
| Interconnect Structure with Partial Sidewall Liner App 20210375671 - Reznicek; Alexander ; et al. | 2021-12-02 |
| Dual Damascene Crossbar Array For Disabling A Defective Resistive Switching Device In The Array App 20210375389 - Maniscalco; Joseph F. ; et al. | 2021-12-02 |
| Interconnects with enlarged contact area Grant 11,183,455 - Motoyama , et al. November 23, 2 | 2021-11-23 |
| Encapsulated top via interconnects Grant 11,177,171 - van der Straten , et al. November 16, 2 | 2021-11-16 |
| Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap Grant 11,158,538 - Maniscalco , et al. October 26, 2 | 2021-10-26 |
| Interconnects With Enlarged Contact Area App 20210327803 - Motoyama; Koichi ; et al. | 2021-10-21 |
| Laser Anneal For Mram Encapsulation Enhancement App 20210313511 - Rizzolo; Michael ; et al. | 2021-10-07 |
| Physical Unclonable Function For Mram Structures App 20210305499 - Xie; Ruilong ; et al. | 2021-09-30 |
| Interconnect Structures With Cobalt-infused Ruthenium Liner And A Cobalt Cap App 20210242082 - Maniscalco; Joseph F. ; et al. | 2021-08-05 |
| Multi-spheroid BEOL capacitor Grant 11,081,543 - Reznicek , et al. August 3, 2 | 2021-08-03 |
| Buried MIM capacitor structure with landing pads Grant 11,081,542 - Reznicek , et al. August 3, 2 | 2021-08-03 |
| Hybrid sidewall barrier facilitating low resistance interconnection Grant 11,069,566 - van der Straten , et al. July 20, 2 | 2021-07-20 |
| Laser anneal for MRAM encapsulation enhancement Grant 11,069,854 - Rizzolo , et al. July 20, 2 | 2021-07-20 |
| Magnetic structures with tapered edges Grant 11,038,097 - Doris , et al. June 15, 2 | 2021-06-15 |
| Faceted sidewall magnetic tunnel junction structure Grant 11,011,697 - van der Straten , et al. May 18, 2 | 2021-05-18 |
| Conductive interconnect having a semi-liner and no top surface recess Grant 11,004,735 - Peethala , et al. May 11, 2 | 2021-05-11 |
| Interconnects Having Air Gap Spacers App 20210118722 - Cheng; Kenneth Chun Kuen ; et al. | 2021-04-22 |
| Electrode with Alloy Interface App 20210104406 - Yang; Chih-Chao ; et al. | 2021-04-08 |
| Encapsulated Top Via Interconnects App 20210098293 - van der Straten; Oscar ; et al. | 2021-04-01 |
| Interconnects Having Air Gap Spacers App 20210090938 - Cheng; Kenneth Chun Kuen ; et al. | 2021-03-25 |
| Magnetic Structures With Tapered Edges App 20210091300 - Doris; Bruce B. ; et al. | 2021-03-25 |
| Interconnects having air gap spacers Grant 10,950,493 - Cheng , et al. March 16, 2 | 2021-03-16 |
| Bipolar junction transistor (BJT) for liquid flow biosensing applications without a reference electrode and large sensing area Grant 10,892,346 - Reznicek , et al. January 12, 2 | 2021-01-12 |
| Low resistance metal-insulator-metal capacitor electrode Grant 10,840,325 - Maniscalco , et al. November 17, 2 | 2020-11-17 |
| Copper Metallization Fill App 20200350201 - Motoyama; Koichi ; et al. | 2020-11-05 |
| Hardmask stress, grain, and structure engineering for advanced memory applications Grant 10,796,911 - Rizzolo , et al. October 6, 2 | 2020-10-06 |
| BEOL embedded high density vertical resistor structure Grant 10,784,194 - Reznicek , et al. Sept | 2020-09-22 |
| Single Process For Liner And Metal Fill App 20200273708 - Adusumilli; Praneet ; et al. | 2020-08-27 |
| Conformal capacitor structure formed by a single process Grant 10,756,163 - Adusumilli , et al. A | 2020-08-25 |
| FinFET fuses formed at tight pitch dimensions Grant 10,741,492 - Reznicek , et al. A | 2020-08-11 |
| Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures Grant 10,741,609 - Muthinti , et al. A | 2020-08-11 |
| ReRAM structure formed by a single process Grant 10,734,575 - Reznicek , et al. | 2020-08-04 |
| Liner-less contact metallization Grant 10,727,070 - Adusumilli , et al. | 2020-07-28 |
| Pre-patterned Etch Stop For Interconnect Trench Formation Overlying Embedded Mram Structures App 20200219932 - MUTHINTI; GANGADHARA RAJA ; et al. | 2020-07-09 |
| Hardmask Stress, Grain, And Structure Engineering For Advanced Memory Applications App 20200203164 - Rizzolo; Michael ; et al. | 2020-06-25 |
| Single process for linear and metal fill Grant 10,692,722 - Adusumilli , et al. | 2020-06-23 |
| Hardmask stress, grain, and structure engineering for advanced memory applications Grant 10,672,611 - Rizzolo , et al. | 2020-06-02 |
| Biconvex low resistance metal wire Grant 10,665,541 - Adusumilli , et al. | 2020-05-26 |
| Faceted Sidewall Magnetic Tunnel Junction Structure App 20200152860 - van der Straten; Oscar ; et al. | 2020-05-14 |
| Salicide bottom contacts Grant 10,651,042 - Adusumilli , et al. | 2020-05-12 |
| Hardmask Stress, Grain, And Structure Engineering For Advanced Memory Applications App 20200126791 - Rizzolo; Michael ; et al. | 2020-04-23 |
| Buried Mim Capacitor Structure With Landing Pads App 20200119136 - Reznicek; Alexander ; et al. | 2020-04-16 |
| Laser Anneal For Mram Encapsulation Enhancement App 20200119263 - Rizzolo; Michael ; et al. | 2020-04-16 |
| Hybrid Sidewall Barrier Facilitating Low Resistance Interconnection App 20200118870 - van der Straten; Oscar ; et al. | 2020-04-16 |
| Dual metal nitride landing pad for MRAM devices Grant 10,622,406 - Reznicek , et al. | 2020-04-14 |
| Precise/designable FinFET resistor structure Grant 10,600,860 - Adusumilli , et al. | 2020-03-24 |
| Conductive Interconnect Having A Semi-liner And No Top Surface Recess App 20200090988 - Peethala; Cornelius B. ; et al. | 2020-03-19 |
| Deep high capacity capacitor for bulk substrates Grant 10,593,659 - Adusumilli , et al. | 2020-03-17 |
| Faceted Sidewall Magnetic Tunnel Junction Structure App 20200083425 - van der Straten; Oscar ; et al. | 2020-03-12 |
| Faceted sidewall magnetic tunnel junction structure Grant 10,580,966 - van der Straten , et al. | 2020-03-03 |
| FinFET fuses formed at tight pitch dimensions Grant 10,573,596 - Reznicek , et al. Feb | 2020-02-25 |
| Buried MIM capacitor structure with landing pads Grant 10,546,915 - Reznicek , et al. Ja | 2020-01-28 |
| Multilayer buried metal-insultor-metal capacitor structures Grant 10,546,918 - Reznicek , et al. Ja | 2020-01-28 |
| Low resistance interconnect structure with partial seed enhancement liner Grant 10,546,815 - van der Straten , et al. Ja | 2020-01-28 |
| Finfet Fuses Formed At Tight Pitch Dimensions App 20200027831 - Reznicek; Alexander ; et al. | 2020-01-23 |
| Programmable buried antifuse Grant 10,541,202 - Adusumilli , et al. Ja | 2020-01-21 |
| Biconvex low resistance metal wire Grant 10,541,207 - Adusumilli , et al. Ja | 2020-01-21 |
| Dual Metal Nitride Landing Pad For Mram Devices App 20200013826 - Reznicek; Alexander ; et al. | 2020-01-09 |
| ReRAM STRUCTURE FORMED BY A SINGLE PROCESS App 20200006648 - Reznicek; Alexander ; et al. | 2020-01-02 |
| ReRAM STRUCTURE FORMED BY A SINGLE PROCESS App 20200006647 - Reznicek; Alexander ; et al. | 2020-01-02 |
| Biconvex Low Resistance Metal Wire App 20190393152 - Adusumilli; Praneet ; et al. | 2019-12-26 |
| Secondary use of aspect ratio trapping trenches as resistor structures Grant 10,510,829 - Reznicek , et al. Dec | 2019-12-17 |
| Multilayer Buried Metal-insultor-metal Capacitor Structures App 20190371883 - REZNICEK; Alexander ; et al. | 2019-12-05 |
| Low Resistance Interconnect Structure With Partial Seed Enhancement Liner App 20190371735 - van der Straten; Oscar ; et al. | 2019-12-05 |
| Beol Embedded High Density Vertical Resistor Structure App 20190355661 - Reznicek; Alexander ; et al. | 2019-11-21 |
| Secondary Use Of Aspect Ratio Trapping Trenches As Resistor Structures App 20190348497 - REZNICEK; Alexander ; et al. | 2019-11-14 |
| ReRAM STRUCTURE FORMED BY A SINGLE PROCESS App 20190341546 - Reznicek; Alexander ; et al. | 2019-11-07 |
| Multilayer buried metal-insultor-metal capacitor structures Grant 10,461,148 - Reznicek , et al. Oc | 2019-10-29 |
| Conformal Capacitor Structure Formed By A Single Process App 20190319089 - Adusumilli; Praneet ; et al. | 2019-10-17 |
| Low Resistance Metal-insulator-metal Capacitor Electrode App 20190319088 - Maniscalco; Joseph F. ; et al. | 2019-10-17 |
| ReRAM structure formed by a single process Grant 10,446,746 - Reznicek , et al. Oc | 2019-10-15 |
| Bipolar Junction Transistor (bjt) For Liquid Flow Biosensing Applications Without A Reference Electrode And Large Sensing Area App 20190312125 - Reznicek; Alexander ; et al. | 2019-10-10 |
| Low resistance seed enhancement spacers for voidless interconnect structures Grant 10,431,542 - Adusumilli , et al. O | 2019-10-01 |
| Multi-spheroid Beol Capacitor App 20190296103 - REZNICEK; Alexander ; et al. | 2019-09-26 |
| Bipolar junction transistor (BJT) for liquid flow biosensing applications without a reference electrode and large sensing area Grant 10,411,109 - Reznicek , et al. Sept | 2019-09-10 |
| BEOL embedded high density vertical resistor structure Grant 10,410,966 - Reznicek , et al. Sept | 2019-09-10 |
| Thin low defect relaxed silicon germanium layers on bulk silicon substrates Grant 10,396,165 - Adusumilli , et al. A | 2019-08-27 |
| Conformal capacitor structure formed by a single process Grant 10,388,721 - Adusumilli , et al. A | 2019-08-20 |
| Binary metallization structure for nanoscale dual damascene interconnects Grant 10,388,600 - Reznicek , et al. A | 2019-08-20 |
| Low resistivity wrap-around contacts Grant 10,361,277 - Adusumilli , et al. | 2019-07-23 |
| Low resistance contact structures for trench structures Grant 10,355,094 - Adusumilli , et al. July 16, 2 | 2019-07-16 |
| Salicide Bottom Contacts App 20190206692 - Adusumilli; Praneet ; et al. | 2019-07-04 |
| Bipolar Junction Transistor (bjt) For Liquid Flow Biosensing Applications Without A Reference Electrode And Large Sensing Area App 20190207011 - Reznicek; Alexander ; et al. | 2019-07-04 |
| Method of forming a dual metal interconnect structure Grant 10,340,355 - Adusumilli , et al. | 2019-07-02 |
| Stacked FinFET anti-fuse Grant 10,340,221 - Reznicek , et al. | 2019-07-02 |
| Buried Mim Capacitor Structure With Landing Pads App 20190198605 - Reznicek; Alexander ; et al. | 2019-06-27 |
| Binary Metallization Structure For Nanoscale Dual Damascene Interconnects App 20190189555 - Reznicek; Alexander ; et al. | 2019-06-20 |
| Beol Embedded High Density Vertical Resistor Structure App 20190189558 - Reznicek; Alexander ; et al. | 2019-06-20 |
| Finfet Fuses Formed At Tight Pitch Dimensions App 20190181090 - Reznicek; Alexander ; et al. | 2019-06-13 |
| Salicide bottom contacts Grant 10,312,097 - Adusumilli , et al. | 2019-06-04 |
| Low resistance contact structures including a copper fill for trench structures Grant 10,304,773 - Adusumilli , et al. | 2019-05-28 |
| Metal FinFET anti-fuse Grant 10,304,841 - Adusumilli , et al. | 2019-05-28 |
| Single Process For Liner And Metal Fill App 20190157088 - Adusumilli; Praneet ; et al. | 2019-05-23 |
| Biconvex Low Resistance Metal Wire App 20190139894 - Adusumilli; Praneet ; et al. | 2019-05-09 |
| Binary metallization structure for nanoscale dual damascene interconnects Grant 10,269,698 - Reznicek , et al. | 2019-04-23 |
| Multi-level metallization interconnect structure Grant 10,269,710 - Adusumilli , et al. | 2019-04-23 |
| Low resistance contact structures for trench structures Grant 10,249,724 - Adusumilli , et al. | 2019-04-02 |
| Single process for liner and metal fill Grant 10,249,501 - Adusumilli , et al. | 2019-04-02 |
| Metallic blocking layer for reliable interconnects and contacts Grant 10,224,281 - Adusumilli , et al. | 2019-03-05 |
| High performance middle of line interconnects Grant 10,211,095 - Adusumilli , et al. Feb | 2019-02-19 |
| Liner-less Contact Metallization App 20190035634 - Adusumilli; Praneet ; et al. | 2019-01-31 |
| Biconvex low resistance metal wire Grant 10,170,419 - Adusumilli , et al. J | 2019-01-01 |
| Reflow enhancement layer for metallization structures Grant 10,170,360 - Adusumilli , et al. J | 2019-01-01 |
| Metal cap integration by local alloying Grant 10,170,423 - Adusumilli , et al. J | 2019-01-01 |
| Programmable Buried Antifuse App 20180342457 - Adusumilli; Praneet ; et al. | 2018-11-29 |
| High aspect ratio contact metallization without seams Grant 10,128,188 - Adusumilli , et al. November 13, 2 | 2018-11-13 |
| Devices and methods of cobalt fill metallization Grant 10,128,151 - Kamineni , et al. November 13, 2 | 2018-11-13 |
| Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric Grant 10,115,665 - Adusumilli , et al. October 30, 2 | 2018-10-30 |
| Programmable bulk FinFET antifuses Grant 10,109,740 - Adusumilli , et al. October 23, 2 | 2018-10-23 |
| Low Resistance Contact Structures For Trench Structures App 20180294339 - Adusumilli; Praneet ; et al. | 2018-10-11 |
| Low Resistance Contact Structures For Trench Structures App 20180286958 - Adusumilli; Praneet ; et al. | 2018-10-04 |
| Deep High Capacity Capacitor For Bulk Substrates App 20180286849 - Adusumilli; Praneet ; et al. | 2018-10-04 |
| Deep High Capacity Capacitor For Bulk Substrates App 20180286848 - Adusumilli; Praneet ; et al. | 2018-10-04 |
| Structure and method to reduce copper loss during metal cap formation Grant 10,090,151 - Adusumilli , et al. October 2, 2 | 2018-10-02 |
| Deep high capacity capacitor for bulk substrates Grant 10,090,287 - Adusumilli , et al. October 2, 2 | 2018-10-02 |
| Low resistivity wrap-around contacts Grant 10,074,727 - Adusumilli , et al. September 11, 2 | 2018-09-11 |
| High Performance Middle Of Line Interconnects App 20180247865 - Adusumilli; Praneet ; et al. | 2018-08-30 |
| Metal Finfet Anti-fuse App 20180247945 - Adusumilli; Praneet ; et al. | 2018-08-30 |
| Vertically stacked FinFET fuse Grant 10,056,391 - Adusumilli , et al. August 21, 2 | 2018-08-21 |
| Programmable buried antifuse Grant 10,056,329 - Adusumilli , et al. August 21, 2 | 2018-08-21 |
| Low Resistance Seed Enhancement Spacers For Voidless Interconnect Structures App 20180233445 - Adusumilli; Praneet ; et al. | 2018-08-16 |
| Low Resistance Seed Enhancement Spacers For Voidless Interconnect Structures App 20180233444 - Adusumilli; Praneet ; et al. | 2018-08-16 |
| Low resistance seed enhancement spacers for voidless interconnect structures Grant 10,049,980 - Adusumilli , et al. August 14, 2 | 2018-08-14 |
| Salicide Bottom Contacts App 20180218913 - Adusumilli; Praneet ; et al. | 2018-08-02 |
| Low resistance contact structures for trench structures Grant 10,037,942 - Adusumilli , et al. July 31, 2 | 2018-07-31 |
| FinFET resistor and method to fabricate same Grant 10,038,050 - Adusumilli , et al. July 31, 2 | 2018-07-31 |
| Conformal Capacitor Structure Formed By A Single Process App 20180212019 - Adusumilli; Praneet ; et al. | 2018-07-26 |
| Low resistance contact structures for trench structures Grant 10,032,721 - Adusumilli , et al. July 24, 2 | 2018-07-24 |
| Multi-level Metallization Interconnect Structure App 20180204800 - Adusumilli; Praneet ; et al. | 2018-07-19 |
| Low Resistivity Wrap-around Contacts App 20180197965 - Adusumilli; Praneet ; et al. | 2018-07-12 |
| Structure And Method To Reduce Copper Loss During Metal Cap Formation App 20180190592 - Adusumilli; Praneet ; et al. | 2018-07-05 |
| Precise/designable Finfet Resistor Structure App 20180190755 - Adusumilli; Praneet ; et al. | 2018-07-05 |
| Thin Low Defect Relaxed Silicon Germanium Layers On Bulk Silicon Substrates App 20180182720 - Adusumilli; Praneet ; et al. | 2018-06-28 |
| Metal FinFET anti-fuse Grant 10,008,507 - Adusumilli , et al. June 26, 2 | 2018-06-26 |
| Dielectric with air gaps for use in semiconductor devices Grant 10,008,563 - Adusumilli , et al. June 26, 2 | 2018-06-26 |
| Devices And Methods Of Cobalt Fill Metallization App 20180174965 - KAMINENI; Vimal ; et al. | 2018-06-21 |
| High performance middle of line interconnects Grant 10,002,789 - Adusumilli , et al. June 19, 2 | 2018-06-19 |
| FinFET resistor and method to fabricate same Grant 9,997,590 - Adusumilli , et al. June 12, 2 | 2018-06-12 |
| Antifuse having comb-like top electrode Grant 9,997,453 - Adusumilli , et al. June 12, 2 | 2018-06-12 |
| Metallic Blocking Layer For Reliable Interconnects And Contacts App 20180151489 - Adusumilli; Praneet ; et al. | 2018-05-31 |
| Ion flow barrier structure for interconnect metallization Grant 9,966,305 - Demarest , et al. May 8, 2 | 2018-05-08 |
| Low resistance contact structures for trench structures Grant 9,960,240 - Adusumilli , et al. May 1, 2 | 2018-05-01 |
| Precise/designable Finfet Resistor Structure App 20180114827 - Adusumilli; Praneet ; et al. | 2018-04-26 |
| FinFET Resistor And Method To Fabricate Same App 20180114828 - Adusumilli; Praneet ; et al. | 2018-04-26 |
| Finfet Resistor And Method To Fabricate Same App 20180114826 - Adusumilli; Praneet ; et al. | 2018-04-26 |
| Precise/designable FinFET resistor structure Grant 9,954,050 - Adusumilli , et al. April 24, 2 | 2018-04-24 |
| Structure and method to reduce copper loss during metal cap formation Grant 9,947,621 - Adusumilli , et al. April 17, 2 | 2018-04-17 |
| III-V compatible anti-fuses Grant 9,941,204 - Adusumilli , et al. April 10, 2 | 2018-04-10 |
| Salicide bottom contacts Grant 9,934,977 - Adusumilli , et al. April 3, 2 | 2018-04-03 |
| Multi-level metallization interconnect structure Grant 9,935,051 - Adusumilli , et al. April 3, 2 | 2018-04-03 |
| Low Resistivity Wrap-around Contacts App 20180090582 - Adusumilli; Praneet ; et al. | 2018-03-29 |
| Thin Low Defect Relaxed Silicon Germanium Layers On Bulk Silicon Substrates App 20180082958 - Adusumilli; Praneet ; et al. | 2018-03-22 |
| Metal Cap Integration By Local Alloying App 20180082845 - Adusumilli; Praneet ; et al. | 2018-03-22 |
| Thin low defect relaxed silicon germanium layers on bulk silicon substrates Grant 9,922,941 - Adusumilli , et al. March 20, 2 | 2018-03-20 |
| Multi-level Metallization Interconnect Structure App 20180053721 - Adusumilli; Praneet ; et al. | 2018-02-22 |
| Semiconductor Resistor Structures Embedded In A Middle-of-the-line (mol) Dielectric App 20180047668 - Adusumilli; Praneet ; et al. | 2018-02-15 |
| Iii-v Compatible Anti-fuses App 20180047669 - Adusumilli; Praneet ; et al. | 2018-02-15 |
| Reflow Enhancement Layer For Metallization Structures App 20180047625 - Adusumilli; Praneet ; et al. | 2018-02-15 |
| Structure And Method To Reduce Copper Loss During Metal Cap Formation App 20180040507 - Adusumilli; Praneet ; et al. | 2018-02-08 |
| Metal cap integration by local alloying Grant 9,881,798 - Adusumilli , et al. January 30, 2 | 2018-01-30 |
| Vertically Stacked Finfet Fuse App 20180026043 - Adusumilli; Praneet ; et al. | 2018-01-25 |
| Metal Cap Integration By Local Alloying App 20180025969 - Adusumilli; Praneet ; et al. | 2018-01-25 |
| Method of forming dielectric with air gaps for use in semiconductor devices Grant 9,876,075 - Adusumilli , et al. January 23, 2 | 2018-01-23 |
| Programmable Bulk Finfet Antifuses App 20180019340 - Adusumilli; Praneet ; et al. | 2018-01-18 |
| Metallic blocking layer for reliable interconnects and contacts Grant 9,865,538 - Adusumilli , et al. January 9, 2 | 2018-01-09 |
| Copper wiring structures with copper titanium encapsulation Grant 9,859,219 - Adusumilli , et al. January 2, 2 | 2018-01-02 |
| Reflow Enhancement Layer For Metallization Structures App 20170372954 - Adusumilli; Praneet ; et al. | 2017-12-28 |
| Biconvex Low Resistance Metal Wire App 20170373006 - Adusumilli; Praneet ; et al. | 2017-12-28 |
| III-V compatible anti-fuses Grant 9,852,981 - Adusumilli , et al. December 26, 2 | 2017-12-26 |
| Reflow enhancement layer for metallization structures Grant 9,842,770 - Adusumilli , et al. December 12, 2 | 2017-12-12 |
| Antifuse Having Comb-like Top Electrode App 20170345757 - Adusumilli; Praneet ; et al. | 2017-11-30 |
| Multiple breakdown point low resistance anti-fuse structure Grant 9,831,254 - Adusumilli , et al. November 28, 2 | 2017-11-28 |
| Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric Grant 9,824,967 - Adusumilli , et al. November 21, 2 | 2017-11-21 |
| Metal-insulator-metal capacitor fabrication with unitary sputtering process Grant 9,812,522 - Adusumilli , et al. November 7, 2 | 2017-11-07 |
| Metal Finfet Anti-fuse App 20170301680 - Adusumilli; Praneet ; et al. | 2017-10-19 |
| Iii-v Compatible Anti-fuses App 20170301622 - Adusumilli; Praneet ; et al. | 2017-10-19 |
| Ion flow barrier structure for interconnect metallization Grant 9,793,213 - Demarest , et al. October 17, 2 | 2017-10-17 |
| Antifuse having comb-like top electrode Grant 9,786,595 - Adusumilli , et al. October 10, 2 | 2017-10-10 |
| Fuse formed from III-V aspect ratio structure Grant 9,786,596 - Adusumilli , et al. October 10, 2 | 2017-10-10 |
| Dual Metal Interconnect Structure App 20170278939 - Adusumilli; Praneet ; et al. | 2017-09-28 |
| High Aspect Ratio Contact Metallization Without Seams App 20170278800 - Adusumilli; Praneet ; et al. | 2017-09-28 |
| Single Process For Liner And Metal Fill App 20170278969 - Adusumilli; Praneet ; et al. | 2017-09-28 |
| High Performance Middle Of Line Interconnects App 20170278747 - Adusumilli; Praneet ; et al. | 2017-09-28 |
| Liner-less Contact Metallization App 20170271512 - Adusumilli; Praneet ; et al. | 2017-09-21 |
| Metallic Blocking Layer For Reliable Interconnects And Contacts App 20170263547 - Adusumilli; Praneet ; et al. | 2017-09-14 |
| Fuse Formed From Iii-v Aspect Ratio Structure App 20170263554 - Adusumilli; Praneet ; et al. | 2017-09-14 |
| Low Resistance Contact Structures For Trench Structures App 20170243825 - Adusumilli; Praneet ; et al. | 2017-08-24 |
| Low Resistance Contact Structures For Trench Structures App 20170243824 - Adusumilli; Praneet ; et al. | 2017-08-24 |
| Dual Metal Interconnect Structure App 20170243947 - Adusumilli; Praneet ; et al. | 2017-08-24 |
| Dual metal interconnect structure Grant 9,741,812 - Adusumilli , et al. August 22, 2 | 2017-08-22 |
| Ion Flow Barrier Structure For Interconnect Metallization App 20170236748 - Demarest; James J. ; et al. | 2017-08-17 |
| Ion Flow Barrier Structure For Interconnect Metallization App 20170236784 - Demarest; James J. ; et al. | 2017-08-17 |
| Vertically stacked FinFET fuse Grant 9,735,165 - Adusumilli , et al. August 15, 2 | 2017-08-15 |
| Metal cap protection layer for gate and contact metallization Grant 9,722,038 - Adusumilli , et al. August 1, 2 | 2017-08-01 |
| Metal-insulator-metal Capacitor Fabrication With Unitary Sputtering Process App 20170141182 - Adusumilli; Praneet ; et al. | 2017-05-18 |
| Low Resistance Contact Structures Including A Copper Fill For Trench Structures App 20170117181 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Dielectric With Air Gaps For Use In Semiconductor Devices App 20170117357 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Low Resistance Contact Structures For Trench Structures App 20170117371 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Low Resistance Contact Structures Including A Copper Fill For Trench Structures App 20170117225 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Low Resistance Contact Structures For Trench Structures App 20170117226 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Low Resistance Contact Structures For Trench Structures App 20170117224 - Adusumilli; Praneet ; et al. | 2017-04-27 |
| Dielectric With Air Gaps For Use In Semiconductor Devices App 20170110361 - Adusumilli; Praneet ; et al. | 2017-04-20 |
| Epitaxial semiconductor fuse for FinFET structure Grant 9,613,899 - Adusumilli , et al. April 4, 2 | 2017-04-04 |
| Metal Cap Protection Layer For Gate And Contact Metallization App 20170077256 - ADUSUMILLI; PRANEET ; et al. | 2017-03-16 |
| Metal-insulator-metal capacitor fabrication with unitary sputtering process Grant 9,564,310 - Adusumilli , et al. February 7, 2 | 2017-02-07 |
| Selective gate contact fill metallization Grant 9,437,714 - Adusumilli , et al. September 6, 2 | 2016-09-06 |
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| Hardmask Faceting For Enhancing Metal Fill In Trenches App 20150221547 - Arnold; John C. ; et al. | 2015-08-06 |
| Titanium-Nitride Removal App 20140312265 - Chen; Shyng-Tsong ; et al. | 2014-10-23 |
| Titanium-nitride removal Grant 8,835,326 - Fitzsimmons , et al. September 16, 2 | 2014-09-16 |
| Semiconductor Device Including An Insulating Layer, And Method Of Forming The Semiconductor Device App 20140117550 - Motoyama; Koichi ; et al. | 2014-05-01 |
| Interconnect structure containing non-damaged dielectric and a via gouging feature Grant 8,664,766 - Yang , et al. March 4, 2 | 2014-03-04 |
| Titanium Nitride Removal App 20130200040 - Fitzsimmons; John A. ; et al. | 2013-08-08 |
| Titanium-Nitride Removal App 20130171829 - Fitzsimmons; John A. ; et al. | 2013-07-04 |
| METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES App 20120301706 - Kellock; Andrew J. ; et al. | 2012-11-29 |
| Structure and method for creating reliable via contacts for interconnect applications Grant 7,960,274 - Yang , et al. June 14, 2 | 2011-06-14 |
| Reliable via contact interconnect structure Grant 7,800,228 - Yang , et al. September 21, 2 | 2010-09-21 |
| METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES App 20100055442 - Kellock; Andrew J. ; et al. | 2010-03-04 |
| Structure And Method For Creating Reliable Via Contacts For Interconnect Applications App 20090298280 - Yang; Chih-Chao ; et al. | 2009-12-03 |
| Novel Structure And Method For Metal Integration App 20090206485 - Yang; Chih-Chao ; et al. | 2009-08-20 |
| Structure and method for metal integration Grant 7,528,066 - Yang , et al. May 5, 2 | 2009-05-05 |
| Method for direct electroplating of copper onto a non-copper plateable layer Grant 7,405,153 - Malhotra , et al. July 29, 2 | 2008-07-29 |
| Method For Direct Electroplating Of Copper Onto A Non-copper Plateable Layer App 20070166995 - Malhotra; Sandra G. ; et al. | 2007-07-19 |
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