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Embedded Component Structure And Manufacturing Method Thereof
App 20220287182 - Tseng; Tzyy-Jang ; et al. | 2022-09-08 |
Package structure with structure reinforcing element and manufacturing method thereof
Grant 11,410,940 - Lin , et al. August 9, 2 | 2022-08-09 |
Chip package structure
Grant 11,410,971 - Tseng , et al. August 9, 2 | 2022-08-09 |
Package structure and manufacturing method thereof
Grant 11,410,933 - Lau , et al. August 9, 2 | 2022-08-09 |
Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole
Grant 11,373,927 - Wang , et al. June 28, 2 | 2022-06-28 |
Chip package structure and manufacturing method thereof
Grant 11,362,057 - Lin , et al. June 14, 2 | 2022-06-14 |
Circuit board structure
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Package Structure
App 20220108934 - Tain; Ra-Min ; et al. | 2022-04-07 |
Package Structure And Manufacturing Method Thereof
App 20220108953 - Lau; John Hon-Shing ; et al. | 2022-04-07 |
Circuit Board And Manufacturing Method Thereof
App 20220095464 - Wang; Pei-Wei ; et al. | 2022-03-24 |
Circuit Board Structure And Manufacturing Method Thereof
App 20220071000 - Tseng; Tzyy-Jang ; et al. | 2022-03-03 |
Probe Card Testing Device
App 20220065897 - Tseng; Tzyy-Jang ; et al. | 2022-03-03 |
Circuit Board Structure And Manufacturing Method Thereof
App 20220071015 - Tseng; Tzyy-Jang ; et al. | 2022-03-03 |
Chip Package Structure
App 20220059498 - Tseng; Tzyy-Jang ; et al. | 2022-02-24 |
Circuit board and manufacturing method thereof
Grant 11,127,664 - Tain , et al. September 21, 2 | 2021-09-21 |
Vapor Chamber Structure And Manufacturing Method Thereof
App 20210251107 - Tain; Ra-Min ; et al. | 2021-08-12 |
Vapor Chamber Structure And Manufacturing Method Thereof
App 20210247147 - Tain; Ra-Min ; et al. | 2021-08-12 |
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof
App 20210159191 - LIN; Pu-Ju ; et al. | 2021-05-27 |
Method for forming circuit board stacked structure
Grant 11,013,103 - Tain , et al. May 18, 2 | 2021-05-18 |
Chip Package Structure And Manufacturing Method Thereof
App 20210118839 - Lin; Pu-Ju ; et al. | 2021-04-22 |
Package structure with structure reinforcing element and manufacturing method thereof
Grant 10,957,658 - Lin , et al. March 23, 2 | 2021-03-23 |
Package Structure And Manufacturing Method Thereof
App 20210074606 - Wang; Pei-Wei ; et al. | 2021-03-11 |
Manufacturing Method Of Circuit Carrier Board Structure
App 20210076508 - Lin; Wei-Ti ; et al. | 2021-03-11 |
Circuit Board Structure
App 20210014963 - Tain; Ra-Min ; et al. | 2021-01-14 |
Circuit carrier board structure and manufacturing method thereof
Grant 10,888,001 - Lin , et al. January 5, 2 | 2021-01-05 |
Package carrier and package structure
Grant 10,881,006 - Tain , et al. December 29, 2 | 2020-12-29 |
Package Carrier And Package Structure
App 20200329565 - Tain; Ra-Min ; et al. | 2020-10-15 |
Embedded chip package, manufacturing method thereof, and package-on-package structure
Grant 10,797,017 - Lin , et al. October 6, 2 | 2020-10-06 |
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof
App 20200266155 - LIN; Pu-Ju ; et al. | 2020-08-20 |
Chip module with porous bonding layer and stacked structure with porous bonding layer
Grant 10,714,448 - Wang , et al. | 2020-07-14 |
Package structure with structure reinforcing element and manufacturing method thereof
Grant 10,685,922 - Lin , et al. | 2020-06-16 |
Package Substrate And Manufacturing Method Thereof
App 20200083142 - Wang; Chin-Sheng ; et al. | 2020-03-12 |
Package carrier having a mesh gas-permeable structure disposed in the through hole
Grant 10,515,870 - Wang , et al. Dec | 2019-12-24 |
Circuit Carrier Board Structure And Manufacturing Method Thereof
App 20190380210 - Lin; Wei-Ti ; et al. | 2019-12-12 |
Embedded Component Structure And Manufacturing Method Thereof
App 20190380200 - Tseng; Tzyy-Jang ; et al. | 2019-12-12 |
Package Carrier Having A Mesh Gas-permeable Structure Disposed In The Through Hole
App 20190371704 - Wang; Chin-Sheng ; et al. | 2019-12-05 |
Embedded Chip Package, Manufacturing Method Thereof, And Package-on-package Structure
App 20190295984 - Lin; Po-Chen ; et al. | 2019-09-26 |
Embedded Component Structure And Manufacturing Method Thereof
App 20190296102 - Tain; Ra-Min ; et al. | 2019-09-26 |
Package Structure And Manufacturing Method Thereof
App 20190139907 - LIN; Pu-Ju ; et al. | 2019-05-09 |
Method For Forming Circuit Board Stacked Structure
App 20190098746 - TAIN; Ra-Min ; et al. | 2019-03-28 |
Chip Module And Stacked Structure
App 20190096845 - WANG; Chin-Sheng ; et al. | 2019-03-28 |
Chip package structure
Grant 10,211,139 - Tseng , et al. Feb | 2019-02-19 |
Circuit board stacked structure and method for forming the same
Grant 10,178,755 - Tain , et al. J | 2019-01-08 |
Manufacturing method of interconnection structure
Grant 10,141,224 - Hu , et al. Nov | 2018-11-27 |
Circuit Board Stacked Structure And Method For Forming The Same
App 20180332700 - TAIN; Ra-Min ; et al. | 2018-11-15 |
Manufacturing Method Of Interconnection Structure
App 20180096889 - Hu; Dyi-Chung ; et al. | 2018-04-05 |
Interconnection structure and manufacturing method thereof
Grant 9,859,159 - Hu , et al. January 2, 2 | 2018-01-02 |
Circuit Board And Manufacturing Method Thereof
App 20170110393 - Tain; Ra-Min ; et al. | 2017-04-20 |
Chip Package Structure
App 20170025342 - Tseng; Tzyy-Jang ; et al. | 2017-01-26 |
Interconnection Structure And Manufacturing Method Thereof
App 20160268206 - Hu; Dyi-Chung ; et al. | 2016-09-15 |
Method For Manufacturing An Interposer, Interposer And Chip Package Structure
App 20160190050 - Tain; Ra-Min ; et al. | 2016-06-30 |
Method for manufacturing an interposer, interposer and chip package structure
Grant 9,368,442 - Tain , et al. June 14, 2 | 2016-06-14 |
Wafer-to-wafer stack with supporting post
Grant 9,111,774 - Chang , et al. August 18, 2 | 2015-08-18 |
Wafer-to-wafer stack with supporting pedestal
Grant 8,810,031 - Chang , et al. August 19, 2 | 2014-08-19 |
Semiconductor device
Grant 8,674,491 - Liu , et al. March 18, 2 | 2014-03-18 |
Fabricating method of semiconductor device
Grant 8,673,658 - Hsieh , et al. March 18, 2 | 2014-03-18 |
Led Light Bulb Module
App 20140056001 - HSU; LU-CHEN ; et al. | 2014-02-27 |
Heat dissipation structure for electronic device and fabrication method thereof
Grant 8,552,554 - Tain , et al. October 8, 2 | 2013-10-08 |
Package structures for integrating thermoelectric components with stacking chips
Grant 8,546,924 - Yu , et al. October 1, 2 | 2013-10-01 |
Electronic device packaging structure
Grant 8,536,701 - Tain , et al. September 17, 2 | 2013-09-17 |
Filled Through-silicon Via And The Fabrication Method Thereof
App 20130234325 - Dai; Ming-Ji ; et al. | 2013-09-12 |
Chip stacking structure and fabricating method of the chip stacking structure
Grant 8,519,524 - Wu , et al. August 27, 2 | 2013-08-27 |
Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor
Grant 8,507,909 - Tain , et al. August 13, 2 | 2013-08-13 |
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
Grant 8,502,224 - Tain , et al. August 6, 2 | 2013-08-06 |
Fabricating Method Of Semiconductor Device
App 20130171747 - Hsieh; Ming-Che ; et al. | 2013-07-04 |
Wafer-to-wafer Stack With Supporting Post
App 20130161829 - CHANG; Chi-Shih ; et al. | 2013-06-27 |
Filled through-silicon via with conductive composite material
Grant 8,456,017 - Dai , et al. June 4, 2 | 2013-06-04 |
Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same
Grant 8,438,847 - Chen , et al. May 14, 2 | 2013-05-14 |
Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same
Grant 8,418,456 - Tain , et al. April 16, 2 | 2013-04-16 |
Light emitting devices having heat-dissipating surface
Grant 8,408,747 - Wang , et al. April 2, 2 | 2013-04-02 |
Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus
Grant 8,397,584 - Hsieh , et al. March 19, 2 | 2013-03-19 |
Electronic Device Packaging Structure
App 20120280385 - Tain; Ra-Min ; et al. | 2012-11-08 |
Filled Through-silicon Via And The Fabrication Method Thereof
App 20120273939 - Dai; Ming-Ji ; et al. | 2012-11-01 |
Circuit board structure and manufacturing method thereof
Grant 8,288,655 - Tain , et al. October 16, 2 | 2012-10-16 |
Heat-pipe electric-power generating device
Grant 8,283,613 - Tain , et al. October 9, 2 | 2012-10-09 |
Test Structure And Measurement Method Thereof
App 20120249176 - Chien; Heng-Chieh ; et al. | 2012-10-04 |
Heat dissipation structure for electronic device and fabrication method thereof
Grant 8,278,755 - Tain , et al. October 2, 2 | 2012-10-02 |
Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same
App 20120227684 - Tain; Ra-Min ; et al. | 2012-09-13 |
LED lamp
Grant RE43,626 - Tain , et al. September 4, 2 | 2012-09-04 |
Wafer-to-wafer Stack With Supporting Pedestal
App 20120178212 - Chang; Chi-Shih ; et al. | 2012-07-12 |
Semiconductor Device
App 20120153454 - Liu; Chun-Kai ; et al. | 2012-06-21 |
Fabricating Method And Testing Method Of Semiconductor Device And Mechanical Integrity Testing Apparatus
App 20120135547 - Hsieh; Ming-Che ; et al. | 2012-05-31 |
Wafer-to-wafer stack with supporting pedestal
Grant 8,164,165 - Chang , et al. April 24, 2 | 2012-04-24 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof
App 20120092834 - Tain; Ra-Min ; et al. | 2012-04-19 |
Measuring Apparatus
App 20120068177 - Tain; Ra-Min ; et al. | 2012-03-22 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
Grant 8,123,965 - Hsu , et al. February 28, 2 | 2012-02-28 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof
App 20120038041 - Tain; Ra-Min ; et al. | 2012-02-16 |
Chip package structure and method for fabricating the same
Grant 8,102,058 - Hsieh , et al. January 24, 2 | 2012-01-24 |
Measuring Apparatus
App 20110309357 - Tain; Ra-Min ; et al. | 2011-12-22 |
Hermetic light-emitting device
Grant 8,075,152 - Chen , et al. December 13, 2 | 2011-12-13 |
Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels
Grant 8,049,330 - Tain , et al. November 1, 2 | 2011-11-01 |
Interconnect structure of an integrated circuit and manufacturing method thereof
Grant 8,026,603 - Hsu , et al. September 27, 2 | 2011-09-27 |
Chip package structure and manufacturing method thereof
Grant 8,004,079 - Tain , et al. August 23, 2 | 2011-08-23 |
Wafer-to-wafer Stack With Supporting Pedestal
App 20110156249 - Chang; Chi-Shih ; et al. | 2011-06-30 |
Apparatus and method for measuring diode chip
Grant 7,952,368 - Dai , et al. May 31, 2 | 2011-05-31 |
Wafer-to-wafer stacking
Grant 7,948,072 - Tain , et al. May 24, 2 | 2011-05-24 |
Chip Package Structure And Method For Fabricating The Same
App 20110108973 - Hsieh; Ming-Che ; et al. | 2011-05-12 |
Hermetic Light-emitting Device
App 20110103059 - CHEN; Yao Shun ; et al. | 2011-05-05 |
Package Structures For Integrating Thermoelectric Components With Stacking Chips
App 20110042805 - Yu; Chih-Kuang ; et al. | 2011-02-24 |
Light source module, illuminating apparatus and liquid crystal display
Grant 7,812,898 - Tain October 12, 2 | 2010-10-12 |
Structure for reducing stress for vias and fabricating method thereof
Grant 7,754,599 - Hsu , et al. July 13, 2 | 2010-07-13 |
Heat -pipe Electric Power Generating Device And Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same
App 20100162970 - Chen; Yao-Shun ; et al. | 2010-07-01 |
Heat-pipe Electric Power Generating Device And Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same
App 20100162969 - Tain; Ra-Min ; et al. | 2010-07-01 |
Light Emitting Devices Having Heat-dissipating Surface
App 20100085754 - Wang; Kung-Hsia ; et al. | 2010-04-08 |
Composite mode transducer and cooling device having the composite mode transducer
Grant 7,683,522 - Cheng , et al. March 23, 2 | 2010-03-23 |
Circuit Board Structure And Manufacturing Method Thereof
App 20100051328 - Tain; Ra-Min ; et al. | 2010-03-04 |
Wafer-To-Wafer Stacking
App 20100020502 - Tain; Ra-Min ; et al. | 2010-01-28 |
Chip Package Structure And Manufacturing Method Thereof
App 20090294947 - Tain; Ra-Min ; et al. | 2009-12-03 |
Ultrasonic atomizing cooling apparatus
Grant 7,610,769 - Tain , et al. November 3, 2 | 2009-11-03 |
High efficiency liquid crystal display projection system
Grant 7,589,797 - Tain , et al. September 15, 2 | 2009-09-15 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
Grant 7,586,187 - Hsu , et al. September 8, 2 | 2009-09-08 |
Composite mode transducer and cooling device having the composite mode transducer
Grant 7,567,015 - Cheng , et al. July 28, 2 | 2009-07-28 |
Structure for reducing stress for vias and fabricating method thereof
App 20090156001 - Hsu; Yung-Yu ; et al. | 2009-06-18 |
Structure for reducing stress for vias and fabricating method thereof
Grant 7,545,039 - Hsu , et al. June 9, 2 | 2009-06-09 |
Lighting devices
Grant 7,517,114 - Tain , et al. April 14, 2 | 2009-04-14 |
Interconnect Structure With Stress Buffering Ability And The Manufacturing Method Thereof
App 20080264899 - HSU; Yung-Yu ; et al. | 2008-10-30 |
Flexible circuit board with heat sink
Grant 7,443,678 - Han , et al. October 28, 2 | 2008-10-28 |
LED lamp
Grant 7,413,326 - Tain , et al. August 19, 2 | 2008-08-19 |
Composite mode transducer and cooling device having the composite mode transducer
App 20080135213 - Cheng; Syh-Yuh ; et al. | 2008-06-12 |
Lighting device with flipped side-structure of LEDs
Grant 7,381,995 - Tain , et al. June 3, 2 | 2008-06-03 |
Side structure of a bare LED and backlight module thereof
Grant 7,375,384 - Tain , et al. May 20, 2 | 2008-05-20 |
Structure of illuminating unit and structure of illuminating light source
Grant 7,354,178 - Han , et al. April 8, 2 | 2008-04-08 |
Light Emitting Diode Lighting Module with Improved Heat Dissipation Structure
App 20080023720 - Yang; Shu Jung ; et al. | 2008-01-31 |
Lighting Devices
App 20080013320 - Tain; Ra-Min ; et al. | 2008-01-17 |
LED lamp
Grant 7,314,291 - Tain , et al. January 1, 2 | 2008-01-01 |
Led Lamp
App 20070297178 - Tain; Ra-Min ; et al. | 2007-12-27 |
Side structure of a bare LED and backlight module thereof
Grant 7,312,478 - Tain , et al. December 25, 2 | 2007-12-25 |
High Efficiency Liquid Crystal Display Projection System
App 20070258018 - Tain; Ra-Min ; et al. | 2007-11-08 |
Interconnect structure with stress buffering ability and the manufacturing method thereof
App 20070228549 - Hsu; Yung-Yu ; et al. | 2007-10-04 |
Side structure of a bare LED and backlight module thereof
App 20070205427 - Tain; Ra-Min ; et al. | 2007-09-06 |
Composite mode transducer and cooling device having the composite mode transducer
App 20070205690 - Cheng; Syh-Yuh ; et al. | 2007-09-06 |
Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof
App 20070163756 - Wang; Chih-Yao ; et al. | 2007-07-19 |
Heat-pipe Electric-power Generating Device
App 20070151969 - Tain; Ra-Min ; et al. | 2007-07-05 |
Interconnect structure of an integrated circuit and manufacturing method thereof
App 20070128845 - Hsu; Yung-Yu ; et al. | 2007-06-07 |
Structure for reducing stress for vias and fabricating method thereof
App 20070108572 - Hsu; Yung-Yu ; et al. | 2007-05-17 |
Wafer-to-wafer stack with supporting pedestal
App 20070090490 - Chang; Chi-Shih ; et al. | 2007-04-26 |
Light source with LED and optical protrusions
Grant 7,205,719 - Tain , et al. April 17, 2 | 2007-04-17 |
Flexible Circuit Board With Heat Sink
App 20070076381 - Han; Wei-Kuo ; et al. | 2007-04-05 |
Light Source Module, Illuminating Apparatus And Liquid Crystal Display
App 20070047231 - Tain; Ra-Min | 2007-03-01 |
Structur of illuminating unit and structure of illuminating light source
App 20070019412 - Han; Wei-Kuo ; et al. | 2007-01-25 |
Light-emitting-diode packaging structure having thermal-electric element
App 20070012938 - Yu; Chih-Kuang ; et al. | 2007-01-18 |
LED wafer-level chip scale packaging
App 20060278885 - Tain; Ra-Min ; et al. | 2006-12-14 |
Lighting device with flipped side-structure of LEDs
App 20060220030 - Tain; Ra-Min ; et al. | 2006-10-05 |
Light source with LED and optical protrusions
App 20060138951 - Tain; Ra-Min ; et al. | 2006-06-29 |
Ultrasonic atomizing cooling apparatus
App 20060130506 - Tain; Ra-Min ; et al. | 2006-06-22 |
Side structure of a bare LED and backlight module thereof
App 20060027827 - Tain; Ra-Min ; et al. | 2006-02-09 |
LED lamp
App 20060001384 - Tain; Ra-Min ; et al. | 2006-01-05 |
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