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Chip Package Structure App 20220059498 - Tseng; Tzyy-Jang ;   et al. | 2022-02-24 |
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Vapor Chamber Structure And Manufacturing Method Thereof App 20210251107 - Tain; Ra-Min ;   et al. | 2021-08-12 |
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Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof App 20210159191 - LIN; Pu-Ju ;   et al. | 2021-05-27 |
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Chip Package Structure And Manufacturing Method Thereof App 20210118839 - Lin; Pu-Ju ;   et al. | 2021-04-22 |
Package structure with structure reinforcing element and manufacturing method thereof Grant 10,957,658 - Lin , et al. March 23, 2 | 2021-03-23 |
Package Structure And Manufacturing Method Thereof App 20210074606 - Wang; Pei-Wei ;   et al. | 2021-03-11 |
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Package carrier having a mesh gas-permeable structure disposed in the through hole Grant 10,515,870 - Wang , et al. Dec | 2019-12-24 |
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Chip Module And Stacked Structure App 20190096845 - WANG; Chin-Sheng ;   et al. | 2019-03-28 |
Chip package structure Grant 10,211,139 - Tseng , et al. Feb | 2019-02-19 |
Circuit board stacked structure and method for forming the same Grant 10,178,755 - Tain , et al. J | 2019-01-08 |
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Manufacturing Method Of Interconnection Structure App 20180096889 - Hu; Dyi-Chung ;   et al. | 2018-04-05 |
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Circuit Board And Manufacturing Method Thereof App 20170110393 - Tain; Ra-Min ;   et al. | 2017-04-20 |
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Method For Manufacturing An Interposer, Interposer And Chip Package Structure App 20160190050 - Tain; Ra-Min ;   et al. | 2016-06-30 |
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Semiconductor device Grant 8,674,491 - Liu , et al. March 18, 2 | 2014-03-18 |
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Led Light Bulb Module App 20140056001 - HSU; LU-CHEN ;   et al. | 2014-02-27 |
Heat dissipation structure for electronic device and fabrication method thereof Grant 8,552,554 - Tain , et al. October 8, 2 | 2013-10-08 |
Package structures for integrating thermoelectric components with stacking chips Grant 8,546,924 - Yu , et al. October 1, 2 | 2013-10-01 |
Electronic device packaging structure Grant 8,536,701 - Tain , et al. September 17, 2 | 2013-09-17 |
Filled Through-silicon Via And The Fabrication Method Thereof App 20130234325 - Dai; Ming-Ji ;   et al. | 2013-09-12 |
Chip stacking structure and fabricating method of the chip stacking structure Grant 8,519,524 - Wu , et al. August 27, 2 | 2013-08-27 |
Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor Grant 8,507,909 - Tain , et al. August 13, 2 | 2013-08-13 |
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor Grant 8,502,224 - Tain , et al. August 6, 2 | 2013-08-06 |
Fabricating Method Of Semiconductor Device App 20130171747 - Hsieh; Ming-Che ;   et al. | 2013-07-04 |
Wafer-to-wafer Stack With Supporting Post App 20130161829 - CHANG; Chi-Shih ;   et al. | 2013-06-27 |
Filled through-silicon via with conductive composite material Grant 8,456,017 - Dai , et al. June 4, 2 | 2013-06-04 |
Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same Grant 8,438,847 - Chen , et al. May 14, 2 | 2013-05-14 |
Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same Grant 8,418,456 - Tain , et al. April 16, 2 | 2013-04-16 |
Light emitting devices having heat-dissipating surface Grant 8,408,747 - Wang , et al. April 2, 2 | 2013-04-02 |
Fabricating method and testing method of semiconductor device and mechanical integrity testing apparatus Grant 8,397,584 - Hsieh , et al. March 19, 2 | 2013-03-19 |
Electronic Device Packaging Structure App 20120280385 - Tain; Ra-Min ;   et al. | 2012-11-08 |
Filled Through-silicon Via And The Fabrication Method Thereof App 20120273939 - Dai; Ming-Ji ;   et al. | 2012-11-01 |
Circuit board structure and manufacturing method thereof Grant 8,288,655 - Tain , et al. October 16, 2 | 2012-10-16 |
Heat-pipe electric-power generating device Grant 8,283,613 - Tain , et al. October 9, 2 | 2012-10-09 |
Test Structure And Measurement Method Thereof App 20120249176 - Chien; Heng-Chieh ;   et al. | 2012-10-04 |
Heat dissipation structure for electronic device and fabrication method thereof Grant 8,278,755 - Tain , et al. October 2, 2 | 2012-10-02 |
Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same App 20120227684 - Tain; Ra-Min ;   et al. | 2012-09-13 |
LED lamp Grant RE43,626 - Tain , et al. September 4, 2 | 2012-09-04 |
Wafer-to-wafer Stack With Supporting Pedestal App 20120178212 - Chang; Chi-Shih ;   et al. | 2012-07-12 |
Semiconductor Device App 20120153454 - Liu; Chun-Kai ;   et al. | 2012-06-21 |
Fabricating Method And Testing Method Of Semiconductor Device And Mechanical Integrity Testing Apparatus App 20120135547 - Hsieh; Ming-Che ;   et al. | 2012-05-31 |
Wafer-to-wafer stack with supporting pedestal Grant 8,164,165 - Chang , et al. April 24, 2 | 2012-04-24 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof App 20120092834 - Tain; Ra-Min ;   et al. | 2012-04-19 |
Measuring Apparatus App 20120068177 - Tain; Ra-Min ;   et al. | 2012-03-22 |
Interconnect structure with stress buffering ability and the manufacturing method thereof Grant 8,123,965 - Hsu , et al. February 28, 2 | 2012-02-28 |
Heat Dissipation Structure For Electronic Device And Fabrication Method Thereof App 20120038041 - Tain; Ra-Min ;   et al. | 2012-02-16 |
Chip package structure and method for fabricating the same Grant 8,102,058 - Hsieh , et al. January 24, 2 | 2012-01-24 |
Measuring Apparatus App 20110309357 - Tain; Ra-Min ;   et al. | 2011-12-22 |
Hermetic light-emitting device Grant 8,075,152 - Chen , et al. December 13, 2 | 2011-12-13 |
Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels Grant 8,049,330 - Tain , et al. November 1, 2 | 2011-11-01 |
Interconnect structure of an integrated circuit and manufacturing method thereof Grant 8,026,603 - Hsu , et al. September 27, 2 | 2011-09-27 |
Chip package structure and manufacturing method thereof Grant 8,004,079 - Tain , et al. August 23, 2 | 2011-08-23 |
Wafer-to-wafer Stack With Supporting Pedestal App 20110156249 - Chang; Chi-Shih ;   et al. | 2011-06-30 |
Apparatus and method for measuring diode chip Grant 7,952,368 - Dai , et al. May 31, 2 | 2011-05-31 |
Wafer-to-wafer stacking Grant 7,948,072 - Tain , et al. May 24, 2 | 2011-05-24 |
Chip Package Structure And Method For Fabricating The Same App 20110108973 - Hsieh; Ming-Che ;   et al. | 2011-05-12 |
Hermetic Light-emitting Device App 20110103059 - CHEN; Yao Shun ;   et al. | 2011-05-05 |
Package Structures For Integrating Thermoelectric Components With Stacking Chips App 20110042805 - Yu; Chih-Kuang ;   et al. | 2011-02-24 |
Light source module, illuminating apparatus and liquid crystal display Grant 7,812,898 - Tain October 12, 2 | 2010-10-12 |
Structure for reducing stress for vias and fabricating method thereof Grant 7,754,599 - Hsu , et al. July 13, 2 | 2010-07-13 |
Heat -pipe Electric Power Generating Device And Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same App 20100162970 - Chen; Yao-Shun ;   et al. | 2010-07-01 |
Heat-pipe Electric Power Generating Device And Hydrogen/oxygen Gas Generating Apparatus And Internal Combustion Engine System Having The Same App 20100162969 - Tain; Ra-Min ;   et al. | 2010-07-01 |
Light Emitting Devices Having Heat-dissipating Surface App 20100085754 - Wang; Kung-Hsia ;   et al. | 2010-04-08 |
Composite mode transducer and cooling device having the composite mode transducer Grant 7,683,522 - Cheng , et al. March 23, 2 | 2010-03-23 |
Circuit Board Structure And Manufacturing Method Thereof App 20100051328 - Tain; Ra-Min ;   et al. | 2010-03-04 |
Wafer-To-Wafer Stacking App 20100020502 - Tain; Ra-Min ;   et al. | 2010-01-28 |
Chip Package Structure And Manufacturing Method Thereof App 20090294947 - Tain; Ra-Min ;   et al. | 2009-12-03 |
Ultrasonic atomizing cooling apparatus Grant 7,610,769 - Tain , et al. November 3, 2 | 2009-11-03 |
High efficiency liquid crystal display projection system Grant 7,589,797 - Tain , et al. September 15, 2 | 2009-09-15 |
Interconnect structure with stress buffering ability and the manufacturing method thereof Grant 7,586,187 - Hsu , et al. September 8, 2 | 2009-09-08 |
Composite mode transducer and cooling device having the composite mode transducer Grant 7,567,015 - Cheng , et al. July 28, 2 | 2009-07-28 |
Structure for reducing stress for vias and fabricating method thereof App 20090156001 - Hsu; Yung-Yu ;   et al. | 2009-06-18 |
Structure for reducing stress for vias and fabricating method thereof Grant 7,545,039 - Hsu , et al. June 9, 2 | 2009-06-09 |
Lighting devices Grant 7,517,114 - Tain , et al. April 14, 2 | 2009-04-14 |
Interconnect Structure With Stress Buffering Ability And The Manufacturing Method Thereof App 20080264899 - HSU; Yung-Yu ;   et al. | 2008-10-30 |
Flexible circuit board with heat sink Grant 7,443,678 - Han , et al. October 28, 2 | 2008-10-28 |
LED lamp Grant 7,413,326 - Tain , et al. August 19, 2 | 2008-08-19 |
Composite mode transducer and cooling device having the composite mode transducer App 20080135213 - Cheng; Syh-Yuh ;   et al. | 2008-06-12 |
Lighting device with flipped side-structure of LEDs Grant 7,381,995 - Tain , et al. June 3, 2 | 2008-06-03 |
Side structure of a bare LED and backlight module thereof Grant 7,375,384 - Tain , et al. May 20, 2 | 2008-05-20 |
Structure of illuminating unit and structure of illuminating light source Grant 7,354,178 - Han , et al. April 8, 2 | 2008-04-08 |
Light Emitting Diode Lighting Module with Improved Heat Dissipation Structure App 20080023720 - Yang; Shu Jung ;   et al. | 2008-01-31 |
Lighting Devices App 20080013320 - Tain; Ra-Min ;   et al. | 2008-01-17 |
LED lamp Grant 7,314,291 - Tain , et al. January 1, 2 | 2008-01-01 |
Led Lamp App 20070297178 - Tain; Ra-Min ;   et al. | 2007-12-27 |
Side structure of a bare LED and backlight module thereof Grant 7,312,478 - Tain , et al. December 25, 2 | 2007-12-25 |
High Efficiency Liquid Crystal Display Projection System App 20070258018 - Tain; Ra-Min ;   et al. | 2007-11-08 |
Interconnect structure with stress buffering ability and the manufacturing method thereof App 20070228549 - Hsu; Yung-Yu ;   et al. | 2007-10-04 |
Side structure of a bare LED and backlight module thereof App 20070205427 - Tain; Ra-Min ;   et al. | 2007-09-06 |
Composite mode transducer and cooling device having the composite mode transducer App 20070205690 - Cheng; Syh-Yuh ;   et al. | 2007-09-06 |
Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof App 20070163756 - Wang; Chih-Yao ;   et al. | 2007-07-19 |
Heat-pipe Electric-power Generating Device App 20070151969 - Tain; Ra-Min ;   et al. | 2007-07-05 |
Interconnect structure of an integrated circuit and manufacturing method thereof App 20070128845 - Hsu; Yung-Yu ;   et al. | 2007-06-07 |
Structure for reducing stress for vias and fabricating method thereof App 20070108572 - Hsu; Yung-Yu ;   et al. | 2007-05-17 |
Wafer-to-wafer stack with supporting pedestal App 20070090490 - Chang; Chi-Shih ;   et al. | 2007-04-26 |
Light source with LED and optical protrusions Grant 7,205,719 - Tain , et al. April 17, 2 | 2007-04-17 |
Flexible Circuit Board With Heat Sink App 20070076381 - Han; Wei-Kuo ;   et al. | 2007-04-05 |
Light Source Module, Illuminating Apparatus And Liquid Crystal Display App 20070047231 - Tain; Ra-Min | 2007-03-01 |
Structur of illuminating unit and structure of illuminating light source App 20070019412 - Han; Wei-Kuo ;   et al. | 2007-01-25 |
Light-emitting-diode packaging structure having thermal-electric element App 20070012938 - Yu; Chih-Kuang ;   et al. | 2007-01-18 |
LED wafer-level chip scale packaging App 20060278885 - Tain; Ra-Min ;   et al. | 2006-12-14 |
Lighting device with flipped side-structure of LEDs App 20060220030 - Tain; Ra-Min ;   et al. | 2006-10-05 |
Light source with LED and optical protrusions App 20060138951 - Tain; Ra-Min ;   et al. | 2006-06-29 |
Ultrasonic atomizing cooling apparatus App 20060130506 - Tain; Ra-Min ;   et al. | 2006-06-22 |
Side structure of a bare LED and backlight module thereof App 20060027827 - Tain; Ra-Min ;   et al. | 2006-02-09 |
LED lamp App 20060001384 - Tain; Ra-Min ;   et al. | 2006-01-05 |