U.S. patent application number 16/029659 was filed with the patent office on 2019-12-05 for package carrier having a mesh gas-permeable structure disposed in the through hole.
This patent application is currently assigned to Unimicron Technology Corp.. The applicant listed for this patent is Unimicron Technology Corp.. Invention is credited to Pei-Chang Huang, Ra-Min Tain, Chin-Sheng Wang.
Application Number | 20190371704 16/029659 |
Document ID | / |
Family ID | 66590661 |
Filed Date | 2019-12-05 |
United States Patent
Application |
20190371704 |
Kind Code |
A1 |
Wang; Chin-Sheng ; et
al. |
December 5, 2019 |
PACKAGE CARRIER HAVING A MESH GAS-PERMEABLE STRUCTURE DISPOSED IN
THE THROUGH HOLE
Abstract
A package carrier includes a multilayer circuit structure, at
least one gas-permeable structure, a first outer circuit layer, a
second outer circuit layer, a first solder mask and a second solder
mask. The multilayer circuit structure has an upper surface and a
lower surface opposite to each other and a plurality of through
holes. The gas-permeable structure is in the form of a mesh and
disposed in at least one of the through holes. The first and the
second outer circuit layers respectively at least cover the upper
and the lower surfaces. At least one first opening of the first
solder mask exposes a portion of the first outer circuit layer and
is disposed corresponding to the gas-permeable structure. At least
one second opening of the second solder mask exposes a portion of
the second outer circuit layer and is disposed corresponding to the
gas-peiuieable structure.
Inventors: |
Wang; Chin-Sheng; (Taoyuan
City, TW) ; Huang; Pei-Chang; (Taoyuan City, TW)
; Tain; Ra-Min; (Hsinchu County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Unimicron Technology Corp. |
Taoyuan City |
|
TW |
|
|
Assignee: |
Unimicron Technology Corp.
Taoyuan City
TW
|
Family ID: |
66590661 |
Appl. No.: |
16/029659 |
Filed: |
July 9, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/467 20130101;
H01L 23/3677 20130101; H01L 23/49866 20130101; H01L 23/49838
20130101; H01L 23/3672 20130101; H01L 23/49822 20130101; H01L
23/49827 20130101 |
International
Class: |
H01L 23/467 20060101
H01L023/467; H01L 23/498 20060101 H01L023/498; H01L 23/367 20060101
H01L023/367 |
Foreign Application Data
Date |
Code |
Application Number |
May 30, 2018 |
TW |
107118580 |
Claims
1. A package carrier, comprising: a multilayer circuit structure,
having an upper surface and a lower surface opposite to each other
and a plurality of through holes, the plurality of through holes
connecting the upper surface and the lower surface; at least one
gas-permeable structure, in the form of a mesh and disposed in at
least one of the plurality of through holes; a first outer circuit
layer, disposed on the upper surface of the multilayer circuit
structure, and at least covering the upper surface; a second outer
circuit layer, disposed on the lower surface of the multilayer
circuit structure, and at least covering the lower surface; a first
solder mask, disposed on the first outer circuit layer, and having
at least one first opening, wherein the at least one first opening
exposes a portion of the first outer circuit layer and is disposed
corresponding to the at least one gas-permeable structure; and a
second solder mask, disposed on the second outer circuit layer, and
having at least one second opening, wherein the at least one second
opening exposes a portion of the second outer circuit layer and is
disposed corresponding to the at least one gas-permeable
structure.
2. The package carrier as recited in claim 1, wherein the
multilayer circuit structure comprises: a core layer, having a
first surface and a second surface opposite to each other; a first
dielectric layer, disposed on the first surface of the core layer;
a second dielectric layer, disposed on the second surface of the
core layer; a first inner circuit layer, disposed on the first
dielectric layer; and a second inner circuit layer, disposed on the
second dielectric layer.
3. The package carrier as recited in claim 2, wherein the core
layer comprises: a core dielectric layer, having a first side
surface and a second side surface opposite to each other; a first
patterned copper foil layer, disposed on the first side surface of
the core dielectric layer, and exposing a portion of the first side
surface; and a second patterned copper foil layer, disposed on the
second side surface of the core dielectric layer, and exposing a
portion of the second side surface.
4. The package carrier as recited in claim 1, further comprising: a
seed layer, covering the upper surface and the lower surface of the
multilayer circuit structure and an inner wall of the plurality of
through holes.
5. The package carrier as recited in claim 1, wherein a material of
the gas-permeable structure comprises metal or ceramics.
6. The package carrier as recited in claim 1, wherein the at least
one gas-permeable structure has a first side and a second side
opposite to each other, and the first outer circuit layer and the
second outer circuit layer further completely cover the first side
and the second side of the at least one gas-permeable
structure.
7. The package carrier as recited in claim 1, wherein the at least
one gas-permeable structure has a first side and a second side
opposite to each other, and the first outer circuit layer and the
second outer circuit layer further partially cover the first side
and the second side of the at least one gas-permeable
structure.
8. The package carrier as recited in claim 1, further comprising: a
metal block, disposed in one of the plurality of through holes, and
having a top surface and a bottom surface opposite to each other,
wherein the first outer circuit layer and the second outer circuit
layer further completely cover the top surface and the bottom
surface of the metal block.
9. The package carrier as recited in claim 1, further comprising: a
first surface treatment layer, disposed on the first outer circuit
layer exposed by the first solder mask; and a second surface
treatment layer, disposed on the second outer circuit layer exposed
by the second solder mask.
10. The package carrier as recited in claim 1, wherein the first
solder mask and the second solder mask respectively cover an
exposed portion of the multilayer circuit structure.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 107118580, filed on May 30, 2018. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
Technical Field
[0002] The invention relates to a carrier structure, and
particularly relates to a package carrier.
Background
[0003] Generally, a package carrier mainly consists of a plurality
of circuit layers, wherein a heat-generating element, such as a
chip, is mostly disposed on an upper surface of the package
carrier. Since the heat-generating element generates heat easily in
operation, the operation performance of the heat-generating element
is easily affected. For heat-dissipating path of conventional
package carrier, the heat is dissipated mainly in a thickness
direction (perpendicular to plane). However, the heat-dissipating
method is still insufficient because it cannot quickly transmit the
heat energy generated by the heat-generating element, which causes
that the temperature of the package carrier continues to increase
and thus affecting the reliability of the heat-generating
element.
SUMMARY
[0004] The invention provides a package carrier having a better
heat-dissipating effect.
[0005] The package carrier of the invention includes a multilayer
circuit structure, at least one gas-permeable structure, a first
outer circuit layer, a second outer circuit layer, a first solder
mask and a second solder mask. The multilayer circuit structure has
an upper surface and a lower surface opposite to each other and a
plurality of through holes. The through holes connect the upper and
the lower surfaces. The gas-permeable structure is in the form of a
mesh and disposed in at least one through hole. The first outer
circuit layer is disposed on the upper surface of the multilayer
circuit structure and at least covers the upper surface. The second
outer circuit layer is disposed on the lower surface of the
multilayer circuit structure and at least covers the lower surface.
The first solder mask is disposed on the first outer circuit layer
and has at least one first opening. The first opening exposes a
portion of the first outer circuit layer and is disposed
corresponding to the gas-permeable structure. The second solder
mask is disposed on the second outer circuit layer and has at least
one second opening. The second opening exposes a portion of the
second outer circuit layer and is disposed corresponding to the
gas-permeable structure.
[0006] According to an embodiment of the invention, the multilayer
circuit structure includes a core layer, a first dielectric layer,
a second dielectric layer, a first inner circuit layer and a second
inner circuit layer. The core layer has a first surface and a
second surface opposite to each other. The first dielectric layer
is disposed on the first surface of the core layer. The second
dielectric layer is disposed on the second surface of the core
layer. The first inner circuit layer is disposed on the first
dielectric layer. The second inner circuit layer is disposed on the
second dielectric layer.
[0007] According to an embodiment of the invention, the core layer
includes a core dielectric layer, a first patterned copper foil
layer and a second patterned copper foil layer. The core dielectric
layer has a first side surface and a second side surface opposite
to each other. The first patterned copper foil layer is disposed on
the first side surface of the core dielectric layer, and exposes a
portion of the first side surface. The second patterned copper foil
layer is disposed on the second side surface of the core dielectric
layer, and exposes a portion of the second side surface.
[0008] According to an embodiment of the invention, the package
carrier further includes a seed layer covering the upper surface
and lower surface of the multilayer circuit structure and an inner
wall of the through holes.
[0009] According to an embodiment of the invention, the material of
the gas-permeable structure includes metal or ceramics.
[0010] According to an embodiment of the invention, the
gas-permeable structure has a first side and a second side opposite
to each other. The first outer circuit layer and the second outer
circuit layer further completely cover the first side and the
second side of the gas-permeable structure.
[0011] According to an embodiment of the invention, the
gas-permeable structure has a first side and a second side opposite
to each other. The first outer circuit layer and the second outer
circuit layer further partially cover the first side and the second
side of the gas-permeable structure.
[0012] According to an embodiment of the invention, the package
carrier further includes a metal block disposed in one of the
through holes, and has a top surface and a bottom surface opposite
to each other. The first outer circuit layer and the second outer
circuit layer further completely cover the top surface and the
bottom surface of the metal block.
[0013] According to an embodiment of the invention, the package
carrier further includes a first surface treatment layer and a
second surface treatment player. The first surface treatment layer
is disposed on the first outer circuit layer exposed by the first
solder mask. The second surface treatment layer is disposed on the
second outer circuit layer exposed by the second solder mask.
[0014] According to an embodiment of the invention, the first
solder mask and the second solder mask respectively cover an
exposed portion of the multilayer circuit structure.
[0015] Based on the above, in the design of the package carrier of
the invention, the gas-permeable structure is in the form of a mesh
and disposed in the through holes of the multilayer circuit
structure, and the opening of the solder mask is disposed
corresponding to the gas-permeable structure. In this manner, the
gas-permeable structure not only can dissipate heat in a thickness
direction (i.e., Z direction) of the package carrier, but also can
dissipate heat in a plane direction (i.e., X-Y direction) of the
package carrier with the design of mesh. Briefly, the package
carrier of the invention increases the heat-dissipating area
through the configuration of the gas-permeable structure, thereby
improving the heat-dissipating effect.
[0016] To make the above features and advantages of the invention
more comprehensible, embodiments accompanied with drawings are
described in detail as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 A illustrates a schematic cross-sectional view of a
package carrier according to an embodiment of the invention.
[0018] FIG. 1B illustrates a schematic cross-sectional view of the
package carrier of FIG. 1A carrying a heat-generating element and a
heat-dissipating element.
[0019] FIG. 2A illustrates a schematic cross-sectional view of a
package carrier according to another embodiment of the
invention.
[0020] FIG. 2B illustrates a schematic cross-sectional view of the
package carrier in FIG. 2A carrying a heat-generating element and a
heat-dissipating element.
[0021] FIG. 3A illustrates a schematic cross-sectional view of a
package carrier according to yet another embodiment of the
invention.
[0022] FIG. 3B illustrates a schematic cross-sectional view of the
package carrier in FIG. 3A carrying a heat-generating element and a
heat-dissipating element.
DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS
[0023] FIG. 1A illustrates a schematic cross-sectional view of a
package carrier according to an embodiment of the invention.
Referring to FIG. 1A, in the embodiment, a package carrier 100a
includes a plurality of multilayer circuit structure 110, at least
one gas-permeable structure 120 (only two gas-permeable structures
are shown in FIG. 1A), a first outer circuit layer 130a, a second
outer circuit layer 140a, a first solder mask 150 and a second
solder mask 160. The multilayer circuit structure 110 has an upper
surface S1 and a lower surface S2 opposite to each other and a
plurality of through holes T (only two through holes are shown in
FIG. 1A). The through holes T connect the upper surface S1 and the
lower surface S2. The gas-permeable structure 120 is in the form of
a mesh and respectively disposed in the through holes T. The first
outer circuit layer 130a is disposed on the upper surface S1 of the
multilayer circuit structure 110 and at least covers the upper
surface S1. The second outer circuit layer 140a is disposed on the
lower surface S2 of the multilayer circuit structure 110 and at
least covers the lower surface S2. The first solder mask 150 is
disposed on the first outer circuit layer 130a and has at least one
first opening 152 (only two openings are shown in FIG. 1A). The
first opening 152 exposes a portion of the first outer circuit
layer 130a and is disposed corresponding to the gas-permeable
structure 120. The second solder mask 160 is disposed on the second
outer circuit layer 140a and has at least one second opening 162
(only two openings are shown in
[0024] FIG. 1A). The second opening 162 exposes a portion of the
second outer circuit layer 140a and is disposed corresponding to
the gas-permeable structure 120.
[0025] Specifically, the multilayer circuit structure 110 of the
embodiment includes a core layer 112, a first dielectric layer 113,
a second dielectric layer 115, a first inner circuit layer 114 and
a second inner circuit layer 116. The core layer 112 has a first
surface 112a and a second surface 112b opposite to each other,
wherein the core layer 112 includes a core dielectric layer CD, a
first patterned copper foil layer CL1 and a second patterned copper
coil layer CL2. The core dielectric layer CD has a first side
surface C1 and a second side surface C2 opposite to each other. The
first patterned copper foil layer CL1 is disposed on the first side
surface C1 of the core dielectric layer CD, and exposes a portion
of the first side surface C1. The second patterned copper foil
layer CL2 is disposed on the second side surface C2 of the core
dielectric layer CD, and exposes a portion of the second side
surface C2. The first dielectric layer 113 is disposed on the first
surface 112a of the core layer 112, and the second dielectric layer
115 is disposed on the second surface 112b of the core layer 112.
The first inner circuit layer 114 is disposed on the first
dielectric layer 113, and the second inner circuit layer 116 is
disposed on the second dielectric layer 115.
[0026] Furthermore, in order to electrically connect the first
patterned copper foil layer CL1, the second patterned copper foil
layer CL2, the first inner circuit layer 114 and the second inner
circuit layer 116, the package carrier 100a of the embodiment
further includes a seed layer 170, wherein the seed layer 170
covers the upper surface S1 and the lower surface S2 of the
multilayer circuit structure 110 and the inner wall of the through
holes T. Herein, as shown in FIG. 1A, the seed layer 170 is
disposed between the first outer circuit layer 130a and the first
inner circuit layer 114, the second outer circuit layer 140a and
the second inner circuit layer 116, and the multilayer circuit
structure 110 and the gas-permeable structure 120. The
gas-permeable structure 120 is disposed in the through holes T and
has a first side 122 and a second side 124 opposite to each other.
Herein, the material of the gas-permeable structure 120 is, for
example, metal or ceramics, wherein the metal is, for example,
gold, silver, copper, aluminum or other metals having higher
thermal conductivity. As shown in FIG. 1A, the first outer circuit
layer 130a and the second outer circuit layer 140a of the
embodiment are not patterned and completely cover the first side
122 and the second side 124 of the gas-permeable structure 120.
[0027] Additionally, the first solder mask 150 and the second
solder mask 160 of the embodiment are respectively disposed on the
first outer circuit layer 130a and the second outer circuit layer
140a, and respectively penetrate through the first outer circuit
layer 130a and the second outer circuit layer 140a to be connected
to the first dielectric layer 113 and the second dielectric layer
115 of the multilayer circuit structure 110. In other words, the
first solder mask 150 and the second solder mask 160 respectively
cover the exposed portion of the multilayer circuit structure 110.
The first opening 152 of the first solder mask 150 and the second
opening 162 of the second solder mask 160 respectively expose a
portion of the first outer circuit layer 130a and a portion of the
second outer circuit layer 140a. In order to prevent the first
outer circuit layer 130a and the second outer circuit layer 140a
respectively exposed by the first opening 152 and the second
opening 162 from being oxidized, the package carrier 100a of the
embodiment further includes a first surface treatment layer 190 and
a second surface treatment layer 195. The first surface treatment
layer 190 is disposed on the first outer circuit layer 130a exposed
by the first solder mask 150. The second surface treatment layer
195 is disposed on the second outer circuit layer 140a exposed by
the second solder mask 160.
[0028] Since the gas-permeable structure 120 of the embodiment is
in the form of a mesh and disposed in the through holes T of the
multilayer circuit structure 110, and the first opening 152 of the
first solder mask 150 and the second opening 162 of the second
solder mask 160 are disposed corresponding to the first side 122
and the second side 124 of the gas-permeable structure 120, in this
manner, the gas-permeable structure 120 not only can dissipate heat
in the thickness direction (i.e., Z direction) of the package
carrier 100a, but also can dissipate heat in the plane direction
(i.e., X-Y direction) of the package carrier 100a through the
design of mesh. In brief, the package carrier 100a of the
embodiment increases the heat-dissipating area through the
configuration of the gas-permeable structure 120, thereby
increasing the heat-dissipating effect.
[0029] In application of the package carrier 100a, referring to
FIG. 1B, a heat-dissipating fin 20 may be disposed on the first
surface treatment layer 190, and the heat-generating element 10 may
be disposed on the second surface treatment layer 195. The heat
generated by the heat-generating element 10 may be transmitted to
the heat-dissipating fin 20 through the second surface treatment
layer 195, the second outer circuit layer 140a, the gas-permeable
structure 120, the first outer circuit layer 130a and the first
surface treatment layer 190 in sequence. Herein, the mesh-shaped
gas-permeable structure 120 not only can dissipate heat in the
thickness direction (i.e., Z direction) of the package carrier 100a
but also can dissipate heat in the plane direction (i.e., X-Y
direction) of the package carrier 100a. Accordingly, the package
carrier 100a of the embodiment can increase the heat-dissipating
area through the configuration of the gas-permeable structure 120,
thereby improving the heat-dissipating effect.
[0030] It is to be explained that, the following embodiment has
adopted component notations and part of the contents from the
previous embodiment, wherein the same notations are used for
representing the same or similar components, and descriptions of
the same technical contents are omitted. The descriptions regarding
the omitted part may be referred to the previous embodiments, and
thus are not repeated herein.
[0031] FIG. 2A illustrates a schematic cross-sectional view of a
package carrier according to another embodiment of the invention.
FIG. 2B illustrates a schematic cross-sectional view of the package
carrier in FIG. 2A carrying a heat-generating element and a
heat-dissipating element. Referring to FIG. 1A and FIG. 2A, a
package carrier 100b of the embodiment is similar to the package
carrier 100a in FIG. 1A, and the difference between the two is that
a first outer circuit layer 130b and a second outer circuit layer
140b of the embodiment partially cover the first side 122 and the
second side 124 of the gas-permeable structure 120. In other words,
the first outer circuit layer 130b and the second outer circuit
layer 140b of the embodiment are patterned structures respectively,
and the first outer circuit layer 130b and the second outer circuit
layer 140b respectively expose a portion of the first side 122 and
a portion of the second side 124 of the gas-permeable structure
120.
[0032] In application of the package carrier 100b, referring to
FIG. 2B, the heat-dissipating fin 20 may be disposed on the first
surface treatment layer 190, and the heat-generating element 10 may
be disposed on the second surface treatment layer 195.
[0033] The heat generated by the heat-generating element 10 may be
dissipated in the thickness direction (i.e., Z direction) of the
package carrier 100b by the gas-permeable structure 120, and the
heat energy in the package carrier 100b may be dissipated in the
plane direction (i.e., X-Y direction) of the package carrier 100b
through the mesh-shaped gas-permeable structure 120, and outer air
A can directly pass through the gas-permeable structure 120 to
dissipate the heat in the package carrier 100b. In brief, the
embodiment increases the heat-dissipating area through the
configuration of the gas-permeable structure 120, thereby improving
the heat-dissipating effect of the package carrier 100b.
[0034] FIG. 3A illustrates a schematic cross-sectional view of a
package carrier according to yet another embodiment of the
invention. FIG. 3B illustrates a schematic cross-sectional view of
the package carrier in FIG. 3A carrying a heat-generating element
and a heat-dissipating element. Referring to FIG. 1A and FIG. 3A, a
package carrier 100c in the embodiment is similar to the package
carrier 100a in FIG. 1A, and the difference between the two is that
the package carrier 100c in the embodiment further includes a metal
block 180, wherein the metal block 180 is disposed in one of the
through holes T, and the metal block 180 has a top surface 182 and
a bottom surface 184 opposite to each other. Herein, the first
outer circuit layer 130c and the second outer circuit layer 140c
further completely cover the top surface 182 and the bottom surface
184 of the metal block 180. In other words, the first outer circuit
layer 130c and the second outer circuit layer 140c respectively
expose the first side 122 and the second side 124 of the
gas-permeable structure 120.
[0035] In application of the package carrier 100c, referring to
FIG. 3B, the heat-dissipating fin 20 may be disposed on the first
surface treatment layer 190, and the heat-generating element 10 may
be disposed on the second surface treatment layer 195. The heat
generated by the heat-generating element 10 may be transmitted to
the heat-dissipating fin 20 through the second surface treatment
layer 195, the second outer circuit layer 140c, the metal block
180, the first outer circuit layer 130c and the first surface
treatment layer 190 in sequence. That is, the heat may be
dissipated in the thickness direction (i.e., Z direction) of the
package carrier 100c through the metal block 180. The heat energy
in the package carrier 100c may be dissipated in the plane
direction (i.e., X-Y direction) of the package carrier 100c through
the mesh-shaped gas-permeable structure 120, and outer air A can
directly pass through the gas-permeable structure 120 to dissipate
the heat in the package carrier 100c. In brief, the package carrier
100c in the embodiment may have a better heat-dissipating
effect.
[0036] Certainly, in other embodiments that are not shown, a fan
can be selectively disposed on the second side of the gas-permeable
structure, thereby increasing air circulation and further improving
the heat-dissipating effect of the package carrier.
[0037] In summary, in the design of the package carrier of the
invention, the gas-permeable structure is in the form of a mesh and
disposed in the through holes of the multilayer circuit structure,
and the opening of the solder mask is disposed corresponding to the
gas-permeable structure. In this manner, the gas-permeable
structure not only can dissipate heat in a thickness direction
(i.e., Z direction) of the package carrier, but also can dissipate
heat in a plane direction (i.e., X-Y direction) of the package
carrier with the design of mesh. Briefly, the package carrier of
the invention increases the heat-dissipating area through the
configuration of the gas-permeable structure, thereby improving the
heat-dissipating effect.
[0038] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
disclosed embodiments without departing from the scope or spirit of
the invention. In view of the foregoing, it is intended that the
invention cover modifications and variations of this invention
provided they fall within the scope of the following claims and
their equivalents.
* * * * *