U.S. patent application number 11/023692 was filed with the patent office on 2006-06-29 for light source with led and optical protrusions.
Invention is credited to Chin-Lung Chen, Hei-Tong Ching, Rong-Chang Fang, Ra-Min Tain.
Application Number | 20060138951 11/023692 |
Document ID | / |
Family ID | 36610659 |
Filed Date | 2006-06-29 |
United States Patent
Application |
20060138951 |
Kind Code |
A1 |
Tain; Ra-Min ; et
al. |
June 29, 2006 |
Light source with LED and optical protrusions
Abstract
A light source with LED and optical protrusions is provided. It
comprises an optical panel and at least one optical plate. The
light source can be used together with a heat sink or an optical
element to enhance its performance. The optical panel forms an
optical surface having plural optical protrusions to reflect and
mix lights emitted from the LEDs. The optical plate is inserted
into at least one slot on the optical panel, and it comprises a
heat dissipation core plate and at least one electric circuit
layer. The electric circuit layer comprises LEDs and at least one
control circuitry. The electric circuit layer can be attached to
either single side or both sides of the heat dissipation core
plate. The invention achieves good uniformity and high intensity of
the combined lights with desired chromaticity.
Inventors: |
Tain; Ra-Min; (Jhonghe City,
TW) ; Ching; Hei-Tong; (Taipei City, TW) ;
Chen; Chin-Lung; (Hsinchu City, TW) ; Fang;
Rong-Chang; (Hsinchu City, TW) |
Correspondence
Address: |
LIN & ASSOCIATES INTELLECTUAL PROPERTY
P.O. BOX 2339
SARATOGA
CA
95070-0339
US
|
Family ID: |
36610659 |
Appl. No.: |
11/023692 |
Filed: |
December 27, 2004 |
Current U.S.
Class: |
313/512 |
Current CPC
Class: |
G02F 1/133606 20130101;
G02F 1/133603 20130101; G02F 1/133628 20210101; F21K 9/00
20130101 |
Class at
Publication: |
313/512 |
International
Class: |
H05B 37/02 20060101
H05B037/02; H01L 33/00 20060101 H01L033/00 |
Claims
1. A light source with light emitting diode (LED) and optical
protrusions, comprising: an optical panel having at least one slot
thereon and plural optical protrusions to reflect and combine
lights; and at least one optical plate inserted into said at least
one slot on said optical panel, each optical plate having a heat
dissipation core plate and at least one electric circuit layer,
each said electric circuit layer having at least one LED and at
least one control circuitry to control the operation of said
LED.
2. The light source with LED and optical protrusions as claimed in
claim 1, wherein said LED is bare LED chip that is encapsulated
with a transparent material.
3. The light source with LED and optical protrusions as claimed in
claim 2, wherein said transparent material is chosen from the group
of epoxy and silicone.
4. The light source with LED and optical protrusions as claimed in
claim 1, wherein said LED is an LED package.
5. The light source with LED and optical protrusions as claimed in
claim 1, wherein said heat dissipation core plate is made of a
material chosen from the group of a dielectric material, an
electrical conductor, and a thermal conductor.
6. The light source with LED and optical protrusions as claimed in
claim 1, wherein the shapes of said optical protrusions include
pyramidal, conic, parabolic, and semispherical shapes.
7. The light source with LED and optical protrusions as claimed in
claim 1, wherein said electric circuit layer is an insulating
layer.
8. The light source with LED and optical protrusions as claimed in
claim 1, wherein said control circuitry is stacked on said electric
circuit layer.
9. The light source with LED and optical protrusions as claimed in
claim 1, wherein said control circuitry is printed on said electric
circuit layer.
10. The light source with LED and optical protrusions as claimed in
claim 2, wherein said bare LED chips are attached to said electric
circuit layer via a flip chip.
11. The light source with LED and optical protrusions as claimed in
claim 2, wherein said bare LED chips are attached to said electric
circuit layer via wire bonding.
12. The light source with LED and optical protrusions as claimed in
claim 2, wherein said bare LED chips are attached to said electric
circuit layer in a way such that their chips surfaces face said
optical protrusions.
13. The light source with LED and optical protrusions as claimed in
claim 1, wherein adjacent said LEDs emit lights of different
colors.
14. The light source with LED and optical protrusions as claimed in
claim 1, wherein adjacent said LEDs emit lights of same colors.
15. The light source with LED and optical protrusions as claimed in
claim 1, wherein each optical plate includes a heat dissipation
core plate and two electric circuit layers, and one electric
circuit layer is attached to each side of the heat dissipation core
plate.
16. The light source with LED and optical protrusions as claimed in
claim 1, wherein each optical plate includes a heat dissipation
core plate and one electric circuit layer. The electric circuit
layer is attached to single side of the heat dissipation core
plate.
17. The light source with LED and optical protrusions as claimed in
claim 1, wherein said light source further comprises a heat sink
that is attached to said optical panel to enhance heat
dissipation.
18. The light source with LED and optical protrusions as claimed in
claim 1, wherein said light source further comprises an optical
element that is used to guide said combined light towards a display
screen.
19. The light source with LED and optical protrusions as claimed in
claim 7, wherein said electric circuit layer is chosen from the
group of printed circuit board, oxide, and ceramic material.
20. The light source with LED and optical protrusions as claimed in
claim 18, wherein said optical element is a light diffuser.
21. The light source with LED and optical protrusions as claimed in
claim 18, wherein said optical element is a wave guide.
22. The light source with LED and optical protrusions as claimed in
claim 18, wherein each optical plate includes a heat dissipation
core plate and two electric circuit layers, and one electric
circuit layer is attached to each side of the heat dissipation core
plate.
23. The light source with LED and optical protrusions as claimed in
claim 18, wherein each optical plate includes a heat dissipation
core plate and one electric circuit layer, and the electric circuit
layer is attached to single side of the heat dissipation core
plate.
Description
FIELD OF THE INVENTION
[0001] The present invention generally relates to a light emitting
diode (LED) lighting system, and more specifically to a light
source with LED and optical protrusions.
BACKGROUND OF THE INVENTION
[0002] A light source for illuminating an information source is
often required in many applications. In particular, liquid crystal
displays (LCDs) have become more and more popular in many
electronic media. LCDs are commonly adopted in various
applications, such as laptop computers, display monitors, video
cameras, automatic teller machine displays, displays in avionics,
televisions etc. In general, a backlight module is required for the
LCDs to illuminate the information to be displayed. There are
various kinds of light sources used in a backlight module of an
LCD, e.g., fluorescent lamps and LEDs. While the fluorescent lamps
are inexpensive and do not need a complex control circuitry, they
are sometimes inadequate for certain applications that require good
color quality and long lamp life. LEDs have been proposed for use
as light sources, such as LCD backlight modules, for many reasons.
These advantages of LED light sources include long life, ease of
replacement, robust mechanical property, and better color quality
than fluorescent lamps. Certain applications (e.g., avionics)
require a specific chromaticity of light emitted from the LCD
backlight module. However, most commercially available LEDs are
made with a limited number of chromaticity choices and their
chromaticity may change over time.
[0003] An LED light source with a raised LED 100, as shown in FIG.
1, to improve the chromaticity of a combined light was disclosed in
U.S. Pat. No. 6,666,567. The raised LED 100 includes an LED diode
101 encased in a package 102 which is raised above the floor 103 of
optical cavities. The raised structure permits light to be emitted
from the base of the LED. Additionally, reflective protrusions may
be placed beneath the raised LED to aid in redirecting the light
trajectory. A combination of fluorescent lamps and LEDs were also
proposed to form a hybrid light source. However, all these schemes
increase the complexity and cost of the light source.
[0004] As shown in FIG. 2 and FIG. 3, an LCD backlight 200, which
includes a first LED array 201 that provides light with a first
chromaticity and a second LED array 202 that provides light with a
second chromaticity, was disclosed in another U.S. Pat. No.
6,608,614. The lights emitted from these two LED arrays 201 and 202
are combined through a combining element 301 (e.g., a wave guide)
and then projected towards an LCD stack 302. The LED chip normally
emits light in a direction which is approximately perpendicular to
the chip surface. The directions of light emitted from the first
and the second LED arrays are approximately perpendicular and
parallel to the panel surface, respectively. A separate combining
element 301 is required in this light source. The chromaticity of
the combined light can only be adjusted by changing the
chromaticity of the second LED array 202 through a control system
(not shown). Therefore, there is a limited flexibility for
chromaticity adjustment.
[0005] According to another prior art, a Luxeon side-emitter having
packaged LED chips was disclosed, as shown in FIG. 4. The
side-emitter may provide good uniformity of combined light but the
light intensity is poor. In addition, packaged LED chips normally
occupy a much larger area than the bare chips scheme of the present
invention.
[0006] It is known that the majority of lights emitted from LED
chips travel in a direction approximately perpendicular to the chip
surface. Therefore, the LED chips need to be arranged in a way such
that the lights emitted from different LED chips have a chance to
be combined and mixed in order to achieve desired chromaticity
before they reach a display screen. It is the main objective of the
present invention to use a low complexity and low cost system to
achieve high intensity and good color quality.
SUMMARY OF THE INVENTION
[0007] The present invention has been made to achieve the
advantages of a practical LED light source. The primary object is
to provide a light source with LED and optical protrusions. It
eliminates the need of a package for encasing an LED chip, and thus
reduces cost and space. The high intensity is also achieved due to
a high LED packaging density.
[0008] In the first embodiment of the invention, the LED light
source comprises an optical panel and at least one optical plate.
This LED light source can be used together with a heat sink to
enhance its performance. The optical panel forms an optical surface
having plural optical protrusions to reflect and combine lights
that are emitted from the LED. The optical plate is inserted into
at least one slot on the optical panel. The optical plate comprises
a heat dissipation core plate and at least one electric circuit
layer. One electric circuit layer comprises at least one LED and at
least one control circuitry which is designed to control the
operation of the bare LED chips.
[0009] In the second embodiment, the LED light source further
includes an optical element that is used to guide said combined
light towards a display screen. The optical element may be a light
diffuser or a wave guide.
[0010] The optical plate includes a heat dissipation core plate and
two electric circuit layers. One electric circuit layer is attached
to each side of the heat dissipation core plate. Alternatively, the
optical plate includes a heat dissipation core plate and one
electric circuit layer. The electric circuit layer is attached to
single side of the heat dissipation core plate.
[0011] According to the invention, the LEDs are attached to an
electric circuit layer via a flip chip or wire bonding. The LEDs
are attached in a way such that their chip surfaces face the
optical protrusions. Therefore, the emitted lights from different
LEDs have a chance to be reflected and combined on the optical
surface in order to achieve desired chromaticity before they reach
a display screen. These LEDs can be encapsulated with a transparent
material to prevent the LEDs from reacting with air. The control
circuitry is used to power up the LEDs, to control the brightness
of the LEDs, to provide electrostatic discharge protection for the
LEDs, and to adjust the chromaticity of the combined light to meet
desired applications. The control circuitry may be stacked or
printed on the electric circuit layer.
[0012] Simulation results indicate that good uniformity and high
intensity of combined lights with desired chromaticity are
achieved. The combined lights can be further directed towards a
light diffuser or a wave guide. Moreover, the heat dissipation core
plates are normally connected to a heat sink to enhance dissipation
of heat, and thus enhance the performance and increase the life
time of the light source. The LED light source of this invention
can be used as a backlight module for a liquid-crystal display.
[0013] The foregoing and other objects, features, aspects and
advantages of the present invention will become better understood
from a careful reading of a detailed description provided herein
below with appropriate reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 shows a conventional raised LED structure.
[0015] FIG. 2 shows a conventional LED-based LCD backlight.
[0016] FIG. 3 shows a side elevational view of the LCD backlight
shown in FIG. 2.
[0017] FIG. 4 shows a Luxeon side-emitter.
[0018] FIG. 5A shows a top view of a light source with LED and
optical protrusions according to a first embodiment of the present
invention.
[0019] FIG. 5B is an enlarged view of the optical plate in FIG.
5A.
[0020] FIG. 6 shows a second embodiment of a light source with LED
and optical protrusions according to the present invention.
[0021] FIG. 7A shows a flip chip bonding.
[0022] FIG. 7B shows an edge wire bonding.
[0023] FIG. 7C shows a center wire bonding.
[0024] FIG. 8 shows the intensity of the combined light from
left/bottom to right/top of a screen surface.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0025] FIG. 5A and FIG. 5B depict a preferred embodiment of a light
source 500 with LED and optical protrusions according to the
present invention. Referring to FIG. 5A, the light source 500
comprises an optical panel 501 and at least one optical plate 505.
The optical panel 501 forms an optical surface having plural
optical protrusions 503 to reflect and combine lights that are
emitted from LEDs 504 and travel approximately in parallel to the
surface of the optical panel 501. The optical plate 505 is inserted
into at least one slot 509 on the optical panel 501. The slot may
span from one panel edge to another. This light source 500 can be
used together with a heat sink to enhance its performance. For
example, a heat sink (shown in dotted line) 502 is attached to the
optical panel 501 to enhance heat dissipation.
[0026] As shown in FIG. 5B, the optical plate 505 further comprises
a heat dissipation core plate 508 and at least one electric circuit
layer which is attached to the heat dissipation core plate 508. One
electric circuit layer 506 further comprises at least one LED 504
and at least one control circuitry 507 which is designed to control
the operation of the bare LED chips 504.
[0027] The combined lights can be further directed towards a light
diffuser or a wave guide (not shown). Moreover, the heat
dissipation core plates 508 are usually connected to the heat sink
502 to enhance the dissipation of heat, and thus enhance the
performance and increase the life time of the light source 500. The
light source 500 of this invention can be used as a backlight
module for a liquid-crystal display. The light source 500
eliminates the need of a package for encasing an LED chip, and thus
reduces cost and space. However, this light source do not prohibit
using packaged LED lamps and should not be limited to the use of
bare LED chips only.
[0028] One electric circuit layer 506 is attached to each side of
the heat dissipation core plate 508, and the LEDs 504 on the
electric circuit layer 506 are exposed on the optical surface to
emit lights. The LEDs 504 are attached to the electric circuit
layer 506 in a way such that their chips surfaces face the optical
protrusions 503. Therefore, the majority of lights are emitted
towards the optical protrusions 503, which are then reflected and
combined by the optical protrusions 503 on the optical surface.
Alternatively, only single side of the heat dissipation core plate
508 is attached with an electric circuit layer 506. Adjacent LEDs
are allowed to emit lights of different or same colors depending on
desired applications.
[0029] The control circuitry 507 is used to power up the LEDs 504,
to control the brightness of the LEDs 504, to provide electrostatic
discharge protection for the bare LED chips 504, and to adjust the
chromaticity of the combined light to meet desired applications.
The control circuitry 507 may be stacked or printed on the electric
circuit layer 506.
[0030] FIG. 6 shows a second embodiment of a light source 600 with
LED and optical protrusions according to the present invention,
wherein an optical element 601 is placed in between a display
screen 602 and the light source 500 shown in FIG. 5A. The optical
element 601 is used to guide the combined light towards the display
screen 602 such as an LCD stack. The optical element 601 may be a
light diffuser or a wave guide.
[0031] According to desired applications, the optical protrusions
can be formed in any suitable manner and shape and made of any
suitable material. The shape of the optical protrusions can be, but
not limited to, pyramidal or conic or parabolic or semispherical.
The electric circuit layer is made of an insulating layer, such as
printed circuit board (PCB), oxide and ceramic material. These LEDs
can be encapsulated with a transparent material to prevent the LEDs
from reacting with air. Furthermore, total reflection can be
avoided if the refractive index of the transparent material is
properly selected. The transparent material can be chosen from the
group of, but not limited to, epoxy and silicone. The heat
dissipation core plate can be made of a material chosen from the
group of a dielectric material, an electrical conductor, and a
thermal conductor.
[0032] According to the invention, the LEDs are attached to the
electric circuit layer via a flip chip or wire bonding. FIG. 7A
shows a flip chip bonding, wherein an LED chip 701 is bonded onto a
substrate (i.e., electric circuit layer 506) with paste or solder.
The flip chip bonding eliminates the need of a conventional wire
bonding which is used to electrically connect the chip to an
external circuitry. The bonding pads of a flip chip are also served
as electrical connections to the control circuitry. The flip chip
bonding is often adopted for applications that require a small form
factor or have a high density of bonding pads. The wire bonding
further includes edge wire bonding and center wire bonding. FIGS.
7B and 7C show an edge wire bonding and a center wire bonding,
respectively. Wherein an LED chip 702 or 703 is first bonded onto a
substrate (i.e., electric circuit layer 506) with paste or solder,
and then metal wire bonding is followed to complete the electrical
connections to the control circuitry.
[0033] In a simulated RGB color map of a combined light at a screen
surface, it shows that the chromaticity of the combined light using
the light source with LED and optical protrusions according to the
invention well matches a targeted white color. The light intensity
is also higher than that can be achieved with the conventional
schemes. FIG. 8 further shows the intensity of the combined light
from left/bottom to right/top of the screen surface. The horizontal
axis represents the location on the screen. The solid line
represents the horizontal component of the light intensity and the
dashed line represents the vertical component of the light
intensity. The results indicate that good uniformity and high
intensity of the combined lights with desired chromaticity are
achieved in both horizontal and vertical directions.
[0034] Although the present invention has been described with
reference to the preferred embodiments, it will be understood that
the invention is not limited to the details described thereof.
Various substitutions and modifications have been suggested in the
foregoing description, and others will occur to those of ordinary
skill in the art. Therefore, all such substitutions and
modifications are intended to be embraced within the scope of the
invention as defined in the appended claims.
* * * * *