Staktek Group, L.P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Staktek Group, L.P..The latest application filed is for "stacked module systems and methods".
Company Profile
0.42.96
Trademarks
- Staktek Group, L.P. -
- STAKTEK GROUP L.P. - Austin TX
- Staktek Group L.P. - 8900 Shoal Creek Blvd Suite 125 Austin TX
- Staktek Group L.P. - 8900 Shoal Creek Suite 125 Austin TX
- Staktek Group L.P. - 8900 Shoal Creek Austin TX
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Stacked Module Systems and Methods App 20090298230 - Partridge; Julian ; et al. | 2009-12-03 |
| Thin Circuit Module And Method App 20090073661 - Wolfe; Mark ; et al. | 2009-03-19 |
| High Capacity Thin Module System App 20090046431 - Wehrly, Jr.; James Douglas ; et al. | 2009-02-19 |
| Buffered Memory Device App 20080291747 - Goodwin; Paul ; et al. | 2008-11-27 |
| Memory module system and method App 20080278901 - Goodwin; Paul | 2008-11-13 |
| Package-Borne Selective Enablement Stacking App 20080246134 - Szewerenko; Leland ; et al. | 2008-10-09 |
| Managed Memory System App 20080222365 - Szewerenko; Leland ; et al. | 2008-09-11 |
| Stacked Modules and Method App 20080120831 - Wehrly; James Douglas | 2008-05-29 |
| Stacked module systems and methods Grant 7,371,609 - Partridge , et al. May 13, 2 | 2008-05-13 |
| High Capacity Thin Module System and Method App 20080094803 - Wehrly; James Douglas JR. ; et al. | 2008-04-24 |
| Stackable Micropackages and Stacked Modules App 20080093724 - Szewerenko; Leland ; et al. | 2008-04-24 |
| High Density IC Module App 20080093734 - Partridge; Julian ; et al. | 2008-04-24 |
| Stacked Modules and Method App 20080088032 - Wehrly; James Douglas JR. | 2008-04-17 |
| Stacked Modules and Method App 20080090329 - Wehrly; James Douglas JR. | 2008-04-17 |
| Stacked Modules and Method App 20080088003 - Wehrly; James Douglas JR. | 2008-04-17 |
| Inverted CSP Stacking System and Method App 20080079132 - Goodwin; Paul | 2008-04-03 |
| Modularized Die Stacking System and Method App 20080067662 - Roper; David L. ; et al. | 2008-03-20 |
| Integrated circuit stacking system and method Grant 7,335,975 - Cady , et al. February 26, 2 | 2008-02-26 |
| Stacked Module Systems and Methods App 20080036068 - Partridge; Julian ; et al. | 2008-02-14 |
| High Capacity Thin Module System and Method App 20080030966 - Goodwin; Paul | 2008-02-07 |
| High Capacity Thin Module System and Method App 20080030972 - Goodwin; Paul | 2008-02-07 |
| High capacity thin module system and method Grant 7,324,352 - Goodwin January 29, 2 | 2008-01-29 |
| Stacked module systems and method Grant 7,323,364 - Partridge , et al. January 29, 2 | 2008-01-29 |
| Interposer stacking system and method App 20070290313 - Partridge; Julian | 2007-12-20 |
| Carrier structure stacking system and method App 20070290312 - Partridge; Julian | 2007-12-20 |
| Stacked module systems and methods Grant 7,310,458 - Wehrly, Jr. December 18, 2 | 2007-12-18 |
| Inverted CSP stacking system and method Grant 7,309,914 - Goodwin December 18, 2 | 2007-12-18 |
| Managed memory component Grant 7,304,382 - Wehrly, Jr. , et al. December 4, 2 | 2007-12-04 |
| Perimeter stacking system and method App 20070262429 - Goodwin; Paul | 2007-11-15 |
| Leaded Package Integrated Circuit Stacking App 20070257349 - Wehrly; James Douglas JR. ; et al. | 2007-11-08 |
| Active cooling methods and apparatus for modules App 20070201208 - Goodwin; Paul ; et al. | 2007-08-30 |
| Leaded package integrated circuit stacking Grant 7,259,452 - Wehrly, Jr. , et al. August 21, 2 | 2007-08-21 |
| Memory expansion and chip scale stacking system and method Grant 7,256,484 - Rapport , et al. August 14, 2 | 2007-08-14 |
| Composite core circuit module system and method App 20070176286 - Wehrly; James Douglas JR. | 2007-08-02 |
| Leaded package integrated circuit stacking App 20070170561 - Wehrly; James Douglas JR. | 2007-07-26 |
| High Density Memory Card System and Method (254-HD\C1) App 20070158795 - Wehrly; James Douglas JR. | 2007-07-12 |
| High density memory card system and method App 20070158802 - Wehrly; James Douglas JR. | 2007-07-12 |
| Memory Module System and Method App 20070126124 - Rapport; Russell ; et al. | 2007-06-07 |
| Memory Module System and Method App 20070126125 - Rapport; Russell ; et al. | 2007-06-07 |
| Thin Module System and Method App 20070115017 - Goodwin; Paul ; et al. | 2007-05-24 |
| Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area App 20070103877 - Thomas; John ; et al. | 2007-05-10 |
| Leaded package integrated circuit stacking App 20070080470 - Wehrly; James Douglas JR. ; et al. | 2007-04-12 |
| Pitch change and chip scale stacking system and method Grant 7,202,555 - Roper , et al. April 10, 2 | 2007-04-10 |
| Applied heat spreader with cooling fin App 20070070607 - Goodwin; Paul | 2007-03-29 |
| Low profile stacking system and method Grant 7,180,167 - Partridge , et al. February 20, 2 | 2007-02-20 |
| Enhanced routing grid system and method App 20070028201 - Mehrotra; Sharad ; et al. | 2007-02-01 |
| Memory module system and method App 20060261449 - Rapport; Russell ; et al. | 2006-11-23 |
| Stacked modules and method App 20060255446 - Wehrly; James Douglas JR. | 2006-11-16 |
| System component interposer App 20060250780 - Goodwin; Paul | 2006-11-09 |
| Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam App 20060244114 - Goodwin; Paul | 2006-11-02 |
| Memory module system and method App 20060203442 - Goodwin; Paul | 2006-09-14 |
| Modified core for circuit module system and method App 20060198238 - Partridge; Julian ; et al. | 2006-09-07 |
| Low profile chip scale stacking system and method Grant 7,094,632 - Cady , et al. August 22, 2 | 2006-08-22 |
| Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit App 20060175693 - Cady; James W. ; et al. | 2006-08-10 |
| CSP chip stack with flex circuit Grant 7,081,373 - Roeters , et al. July 25, 2 | 2006-07-25 |
| Inverted CSP stacking system and method App 20060157842 - Goodwin; Paul | 2006-07-20 |
| Microprocessor optimized for algorithmic processing App 20060149923 - Goodwin; Paul | 2006-07-06 |
| Flexible circuit connector for stacked chip module Grant 7,066,741 - Burns , et al. June 27, 2 | 2006-06-27 |
| Circuit module turbulence enhacement systems and methods App 20060129888 - Szewerenko; Leland ; et al. | 2006-06-15 |
| Flex circuit constructions for high capacity circuit module systems and methods App 20060125067 - Wehrly; James Douglas JR. ; et al. | 2006-06-15 |
| Circuit module component mounting system and method App 20060118936 - Rapport; Russell ; et al. | 2006-06-08 |
| Pitch change and chip scale stacking system Grant 7,053,478 - Roper , et al. May 30, 2 | 2006-05-30 |
| Stacked module systems and methods App 20060108572 - Wehrly; James Douglas JR. | 2006-05-25 |
| High capacity thin module system and method App 20060091529 - Wehrly; James Douglas JR. ; et al. | 2006-05-04 |
| Stacked module systems and methods App 20060092614 - Partridge; Julian ; et al. | 2006-05-04 |
| Stacked module systems and method Grant 7,033,861 - Partridge , et al. April 25, 2 | 2006-04-25 |
| Low profile chip scale stacking system and method Grant 7,026,708 - Cady , et al. April 11, 2 | 2006-04-11 |
| Circuit Module Access System and Method App 20060072297 - Goodwin; Paul | 2006-04-06 |
| Adapted leaded integrated circuit module App 20060055024 - Wehrly; James Douglass JR. | 2006-03-16 |
| Compact module system and method App 20060050592 - Cady; James W. ; et al. | 2006-03-09 |
| Thin module system and method App 20060053345 - Goodwin; Paul | 2006-03-09 |
| Optimized mounting area circuit module system and method App 20060050489 - Wehrly; James Douglas JR. ; et al. | 2006-03-09 |
| Buffered thin module system and method App 20060050497 - Goodwin; Paul | 2006-03-09 |
| Thin module system and method with skew reduction App 20060049512 - Goodwin; Paul | 2006-03-09 |
| Minimized profile circuit module systems and methods App 20060048385 - Cady; James W. ; et al. | 2006-03-09 |
| Thin module system and method App 20060049500 - Goodwin; Paul | 2006-03-09 |
| Thin module system and method with thermal management App 20060049513 - Goodwin; Paul | 2006-03-09 |
| Thin module system and method App 20060050492 - Goodwin; Paul ; et al. | 2006-03-09 |
| Module thermal management system and method App 20060049502 - Goodwin; Paul ; et al. | 2006-03-09 |
| Thin module system and method App 20060050496 - Goodwin; Paul | 2006-03-09 |
| Die module system and method App 20060050498 - Cady; James W. ; et al. | 2006-03-09 |
| Stacked integrated circuit cascade signaling system and method App 20060043558 - Cady; James W. ; et al. | 2006-03-02 |
| Rugged CSP module system and method App 20060033187 - Wilder; James ; et al. | 2006-02-16 |
| Reflection-control system and method Grant 6,992,501 - Rapport January 31, 2 | 2006-01-31 |
| Integrated circuit stacking system and method App 20060008945 - Cady; James W. ; et al. | 2006-01-12 |
| Stacking system and method App 20050280135 - Rapport, Russell ; et al. | 2005-12-22 |
| Stacked module systems and methods App 20050242423 - Partridge, Julian ; et al. | 2005-11-03 |
| Memory expansion and chip scale stacking system and method Grant 6,955,945 - Rapport , et al. October 18, 2 | 2005-10-18 |
| Integrated circuit stacking system and method Grant 6,956,284 - Cady , et al. October 18, 2 | 2005-10-18 |
| Reflection-control system and method App 20050200380 - Rapport, Russell | 2005-09-15 |
| Integrated circuit stacking system and method Grant 6,940,729 - Cady , et al. September 6, 2 | 2005-09-06 |
| High density integrated circuit module Grant 6,919,626 - Burns July 19, 2 | 2005-07-19 |
| Pitch change and chip scale stacking system and method App 20050146011 - Roper, David L. ; et al. | 2005-07-07 |
| Low profile stacking system and method App 20050146031 - Partridge, Julian ; et al. | 2005-07-07 |
| Memory expansion and chip scale stacking system and method Grant 6,914,324 - Rapport , et al. July 5, 2 | 2005-07-05 |
| Chip stack with differing chip package types Grant 6,908,792 - Bruce , et al. June 21, 2 | 2005-06-21 |
| Contact member stacking system and method Grant 6,893,899 - Wehrly, Jr. May 17, 2 | 2005-05-17 |
| Stacked module systems and methods App 20050098873 - Wehrly, James Douglas JR. | 2005-05-12 |
| Panel stacking of BGA devices to form three-dimensional modules Grant 6,878,571 - Isaak , et al. April 12, 2 | 2005-04-12 |
| Memory expansion and chip scale stacking system and method App 20050067683 - Rapport, Russell ; et al. | 2005-03-31 |
| Memory expansion and chip scale stacking system and method App 20050062144 - Rapport, Russell ; et al. | 2005-03-24 |
| Memory expansion and integrated circuit stacking system and method App 20050057911 - Rapport, Russell ; et al. | 2005-03-17 |
| Stacked module systems and methods App 20050056921 - Wehrly, James Douglas JR. ; et al. | 2005-03-17 |
| Integrated circuit stacking system and method App 20050041404 - Cady, James W. ; et al. | 2005-02-24 |
| Integrated circuit stacking system and method App 20050041403 - Cady, James W. ; et al. | 2005-02-24 |
| Integrated circuit stacking system and method App 20050041402 - Cady, James W. ; et al. | 2005-02-24 |
| Thin scale outline package Grant 6,856,010 - Roeters , et al. February 15, 2 | 2005-02-15 |
| Pitch change and chip scale stacking system App 20050018412 - Roper, David L. ; et al. | 2005-01-27 |
| Stacked module systems and methods for CSP packages App 20050009234 - Partridge, Julian ; et al. | 2005-01-13 |
| Point to point memory expansion system and method App 20040245615 - Cady, James W. ; et al. | 2004-12-09 |
| Integrated circuit stacking system and method App 20040235222 - Cady, James W. ; et al. | 2004-11-25 |
| Low profile chip scale stacking system and method App 20040229402 - Cady, James W. ; et al. | 2004-11-18 |
| Contact member stacking system and method Grant 6,806,120 - Wehrly, Jr. October 19, 2 | 2004-10-19 |
| Stacked module systems and methods App 20040201091 - Partridge, Julian ; et al. | 2004-10-14 |
| Memory Expansion And Chip Scale Stacking System And Method App 20040197956 - Rapport, Russell ; et al. | 2004-10-07 |
| Integrated circuit stacking system and method App 20040183183 - Cady, James W. ; et al. | 2004-09-23 |
| Contact member stacking system and method App 20040183206 - Wehrly, James Douglas JR. | 2004-09-23 |
| Low profile chip scale stacking system and method App 20040052060 - Cady, James W. ; et al. | 2004-03-18 |
| Memory expansion and chip scale stacking system and method App 20040000708 - Rapport, Russell ; et al. | 2004-01-01 |
| Modularized die stacking system and method App 20040000707 - Roper, David L. ; et al. | 2004-01-01 |
| Low profile stacking system and method App 20030234443 - Partridge, Julian ; et al. | 2003-12-25 |
| Database utilities Grant 6,622,142 - Murray , et al. September 16, 2 | 2003-09-16 |
| Wide data path stacking system and method Grant 6,618,257 - Cady , et al. September 9, 2 | 2003-09-09 |
| Stacking system and method Grant 6,608,763 - Burns , et al. August 19, 2 | 2003-08-19 |
| Stacking system and method App 20030137048 - Cady, James W. ; et al. | 2003-07-24 |
| Chip scale stacking system and method Grant 6,576,992 - Cady , et al. June 10, 2 | 2003-06-10 |
| Flexible circuit connector for stacked chip module Grant 6,572,387 - Burns , et al. June 3, 2 | 2003-06-03 |
| Integrated circuit stacking system and method App 20030081392 - Cady, James W. ; et al. | 2003-05-01 |
| Contact member stacking system and method Grant 6,462,408 - Wehrly, Jr. October 8, 2 | 2002-10-08 |
| Contact member stacking system and method App 20020142515 - Wehrly, James Douglas JR. | 2002-10-03 |
| Rambus stakpak Grant 6,404,662 - Cady , et al. June 11, 2 | 2002-06-11 |
| Stacked micro ball grid array packages Grant 6,310,392 - Burns October 30, 2 | 2001-10-30 |
| High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Grant 6,288,907 - Burns September 11, 2 | 2001-09-11 |
| Clock driver with instantaneously selectable phase and method for use in data communication systems Grant 6,282,210 - Rapport , et al. August 28, 2 | 2001-08-28 |
| Method of manufacturing a surface mount package Grant 6,205,654 - Burns March 27, 2 | 2001-03-27 |
| Warp-resistent ultra-thin integrated circuit package fabrication method Grant 6,194,247 - Burns , et al. February 27, 2 | 2001-02-27 |
| Method of manufacturing a warp resistant thermally conductive circuit package Grant 6,190,939 - Burns February 20, 2 | 2001-02-20 |
| Ultra high density integrated circuit packages Grant 6,168,970 - Burns January 2, 2 | 2001-01-02 |
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