Shimoyama; Masashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shimoyama; Masashi.The latest application filed is for "plating apparatus and plating method".

Company Profile

27.33.56

Shimoyama; Masashi - Tokyo JP
Shimoyama; Masashi - Kanagawa JP
Shimoyama; Masashi - Fujisawa JP
Shimoyama, Masashi - Fujisawa-shi JP
Shimoyama, Masashi - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plating method and plating apparatus Grant 11,447,885 - Fujikata , et al. September 20, 2	2022-09-20
Plating Apparatus And Plating Method App 20220178046 - Tomita; Masaki ; et al.	2022-06-09
Plating Method And Plating Apparatus App 20220170175 - Koizumi; Ryuya ; et al.	2022-06-02
Air Bubble Removing Method Of Plating Apparatus And Plating Apparatus App 20220106701 - Tsuji; Kazuhito ; et al.	2022-04-07
Plating Apparatus, Air Bubble Removing Method, And Storage Medium That Stores Program To Cause Computer In Plating Apparatus To Execute Air Bubble Removing Method App 20220106698 - Tsuji; Kazuhito ; et al.	2022-04-07
Plating method and plating apparatus Grant 11,286,577 - Koizumi , et al. March 29, 2	2022-03-29
Plate, Plating Apparatus, And Method Of Manufacturing Plate App 20210355596 - Shamoto; Mitsuhiro ; et al.	2021-11-18
Plating Device And Resistor App 20210277533 - SHAMOTO; MITSUHIRO ; et al.	2021-09-09
Paddle, Processing Apparatus Having The Paddle, And Method Of Producing The Paddle App 20210262111 - Masuda; Yasuyuki ; et al.	2021-08-26
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Grant 11,098,414 - Mitsuya , et al. August 24, 2	2021-08-24
Plating Support System, Plating Support Device, And Recording Medium App 20210222315 - SHAMOTO; MITSUHIRO ; et al.	2021-07-22
Plating apparatus and plating method Grant 11,047,063 - Fujikata , et al. June 29, 2	2021-06-29
Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus Grant 11,037,791 - Nagai , et al. June 15, 2	2021-06-15
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method App 20210154629 - Masuda; Yasuyuki ; et al.	2021-05-27
Plating apparatus Grant 10,982,348 - Shamoto , et al. April 20, 2	2021-04-20
Electroplating device Grant 10,968,530 - Shamoto , et al. April 6, 2	2021-04-06
Paddle, plating apparatus equipped with the paddle, and plating method Grant 10,946,351 - Masuda , et al. March 16, 2	2021-03-16
Plating Method And Plating Apparatus App 20210062354 - Fujikata; Jumpei ; et al.	2021-03-04
Plating Apparatus And Plating Method App 20210040641 - NAGAI; Mizuki ; et al.	2021-02-11
Plating apparatus and plating method Grant 10,914,019 - Chang , et al. February 9, 2	2021-02-09
Plating apparatus and plating method Grant 10,889,911 - Shimoyama , et al. January 12, 2	2021-01-12
Plating method and plating apparatus Grant 10,865,492 - Fujikata , et al. December 15, 2	2020-12-15
Plating Method, Pating Apparatus, And Method For Estimating Limiting Current Density App 20200332433 - MASUDA; Yasuyuki ; et al.	2020-10-22
Plating analysis method, plating analysis system, and computer readable storage medium for plating analysis Grant 10,768,140 - Shamoto , et al. Sep	2020-09-08
Plating method, plating apparatus, and method for estimating limiting current density Grant 10,760,177 - Masuda , et al. Sep	2020-09-01
Plating Method And Plating Apparatus App 20200232115 - Koizumi; Ryuya ; et al.	2020-07-23
Plating Apparatus And Plating Method App 20200208292 - Shimoyama; Masashi ; et al.	2020-07-02
Method Of Constructing Prediction Model That Predicts Number Of Plateable Substrates, Method Of Constructing Selection Model For App 20200193294 - Oishi; Kunio ; et al.	2020-06-18
Plating device, plating method, substrate holder, resistance measuring module, and substrate holder testing method Grant 10,676,838 - Nagai , et al.	2020-06-09
Copper Oxide Powder For Use In Plating Of A Substrate App 20200165737 - SHIMOYAMA; MASASHI ; et al.	2020-05-28
Plating method and plating apparatus Grant 10,648,099 - Koizumi , et al.	2020-05-12
Plating apparatus, plating method, and recording medium Grant 10,633,757 - Shimoyama , et al.	2020-04-28
Plating apparatus and plating method Grant 10,619,265 - Shimoyama , et al.	2020-04-14
Plating System, A Plating System Control Method, And A Storage Medium Containing A Program For Causing A Computer To Execute The App 20200056301 - Mitsuya; Takashi ; et al.	2020-02-20
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Grant 10,501,862 - Mitsuya , et al. Dec	2019-12-10
Plating Method, Plating Apparatus, And Method For Estimating Limiting Current Density App 20190368069 - MASUDA; Yasuyuki ; et al.	2019-12-05
Method of adjusting plating apparatus, and measuring apparatus Grant 10,487,415 - Fujikata , et al. Nov	2019-11-26
Plating Apparatus App 20190338438 - SHAMOTO; Mitsuhiro ; et al.	2019-11-07
Plating Apparatus, Plating Method, And Recording Medium App 20190309436 - SHIMOYAMA; Masashi ; et al.	2019-10-10
Electroplating Device App 20190256997 - SHAMOTO; MITSUHIRO ; et al.	2019-08-22
Plating Apparatus And Plating Method App 20190226114 - FUJIKATA; Jumpei ; et al.	2019-07-25
Plating apparatus and plating method Grant 10,294,578 - Fujikata , et al.	2019-05-21
Plating Analysis Method, Plating Analysis System, And Computer Readable Storage Medium For Plating Analysis App 20190137445 - SHAMOTO; Mitsuhiro ; et al.	2019-05-09
Plating Apparatus And Plating Method App 20190127875 - CHANG; Shao Hua ; et al.	2019-05-02
Substrate Holder, A Method For Holding A Substrate With A Substrate Holder, And A Plating Apparatus App 20190027366 - NAGAI; Mizuki ; et al.	2019-01-24
Method Of Adjusting Plating Apparatus, And Measuring Apparatus App 20180371636 - FUJIKATA; Jumpei ; et al.	2018-12-27
Method of cleaning substrate holder Grant 10,119,198 - Fujikata , et al. November 6, 2	2018-11-06
Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus Grant 10,115,598 - Nagai , et al. October 30, 2	2018-10-30
Method of adjusting plating apparatus, and measuring apparatus Grant 10,100,424 - Fujikata , et al. October 16, 2	2018-10-16
Plating Method App 20180282895 - WAKUDA; Yohei ; et al.	2018-10-04
Plating Method And Plating Apparatus App 20180282892 - FUJIKATA; Jumpei ; et al.	2018-10-04
Plating Apparatus And Method For Determining Plating Bath Configuration App 20180274116 - SHAMOTO; Mitsuhiro ; et al.	2018-09-27
Plating Method And Plating Apparatus App 20180266009 - KOIZUMI; Ryuya ; et al.	2018-09-20
Plating apparatus and plating method Grant 10,047,454 - Araki , et al. August 14, 2	2018-08-14
Paddle, Plating Apparatus Equipped With The Paddle, And Plating Method App 20180221835 - MASUDA; Yasuyuki ; et al.	2018-08-09
Plating Device, Plating Method, Substrate Holder, Resistance Measuring Module, And Substrate Holder Testing Method App 20180209062 - NAGAI; Mizuki ; et al.	2018-07-26
Plating Apparatus, Plating Method And Computer Readable Recording Medium App 20180171501 - Masuda; Yasuyuki ; et al.	2018-06-21
Copper Oxide Powder For Use In Plating Of A Substrate, Method Of Plating A Substrate Using The Copper Oxide Powder, And Method Of Managing Plating Solution Using The Copper Oxide Powder App 20180105946 - SHIMOYAMA; Masashi ; et al.	2018-04-19
Plating System, A Plating System Control Method, And A Storage Medium Containing A Program For Causing A Computer To Execute The Plating System Control Method App 20180038008 - MITSUYA; Takashi ; et al.	2018-02-08
Sn alloy plating apparatus and Sn alloy plating method Grant 9,816,197 - Shimoyama , et al. November 14, 2	2017-11-14
Plating Method App 20170278813 - WAKUDA; Yohei ; et al.	2017-09-28
Plating Apparatus And Plating Method App 20170253987 - SHIMOYAMA; Masashi ; et al.	2017-09-07
Apparatus And Method For Supplying Plating Solution To Plating Tank, Plating System, Powder Container, And Plating Method App 20170226656 - DOU; Chunhui ; et al.	2017-08-10
Sn alloy plating apparatus and Sn alloy plating method Grant 9,551,084 - Shimoyama , et al. January 24, 2	2017-01-24
Method Of Adjusting Plating Apparatus, And Measuring Apparatus App 20160369422 - FUJIKATA; Jumpei ; et al.	2016-12-22
Method Of Cleaning Substrate Holder App 20160265135 - FUJIKATA; Jumpei ; et al.	2016-09-15
Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus App 20160194780 - Nagai; Mizuki ; et al.	2016-07-07
Plating apparatus and method of cleaning substrate holder Grant 9,376,760 - Fujikata , et al. June 28, 2	2016-06-28
Electroplating method Grant 9,376,758 - Yasuda , et al. June 28, 2	2016-06-28
Plating Apparatus And Plating Method App 20160145760 - FUJIKATA; Jumpei ; et al.	2016-05-26
Electroplating method and electroplating apparatus for through-hole Grant 9,297,088 - Shimoyama , et al. March 29, 2	2016-03-29
Plating Apparatus And Plating Method App 20150354084 - ARAKI; Yuji ; et al.	2015-12-10
Electroless Plating Method App 20150267302 - Kubota; Makoto ; et al.	2015-09-24
Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD App 20150136609 - SHIMOYAMA; Masashi ; et al.	2015-05-21
Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD App 20140332393 - SHIMOYAMA; Masashi ; et al.	2014-11-13
Sn ALLOY PLATING APPARATUS AND METHOD App 20140166492 - SHIMOYAMA; Masashi ; et al.	2014-06-19
Electroplating Method And Electroplating Apparatus For Through-hole App 20140042032 - SHIMOYAMA; Masashi ; et al.	2014-02-13
Plating Apparatus And Method Of Cleaning Substrate Holder App 20140020720 - FUJIKATA; Jumpei ; et al.	2014-01-23
Plating Apparatus And Plating Solution Management Method App 20130306483 - ARAKI; Yuji ; et al.	2013-11-21
Electroplating Method App 20120152749 - YASUDA; Shingo ; et al.	2012-06-21
Plating Method And Plating Apparatus App 20110180412 - SHIMOYAMA; Masashi ; et al.	2011-07-28
Mixed conductive carbon and electrode App 20060219986 - Yokota; Hiroshi ; et al.	2006-10-05
Lead free bump and method of forming the same Grant 7,012,333 - Shimoyama , et al. March 14, 2	2006-03-14
Method of forming a lead-free bump and a plating apparatus therefor App 20050279640 - Shimoyama, Masashi ; et al.	2005-12-22
Method and apparatus for forming capping film App 20050009340 - Saijo, Yasuhiko ; et al.	2005-01-13
Lead free bump and method of forming the same App 20040219775 - Shimoyama, Masashi ; et al.	2004-11-04
Photo-electric chemical apparatus using carbon cluster electrode Grant 5,723,029 - Shimoyama March 3, 1	1998-03-03
Method of forming a thin electroconductive film Grant 5,266,244 - Yabe , et al. November 30, 1	1993-11-30