| Patent | Date |
|---|
Stacked Plate Heat Exchanger
App 20220155020 - BUNGO; Takuya ; et al. | 2022-05-19 |
Waveguide Member And Waveguide Layered Product
App 20220066098 - Iwai; Toshiki ; et al. | 2022-03-03 |
Multilayer substrate
Grant 11,152,291 - Iwai , et al. October 19, 2 | 2021-10-19 |
Electronic device, method of manufacturing electronic device, and electronic apparatus
Grant 11,114,418 - Uemura , et al. September 7, 2 | 2021-09-07 |
Drawn cup-type heat exchanger
Grant 11,105,559 - Okubo , et al. August 31, 2 | 2021-08-31 |
Circuit board, method of manufacturing circuit board, and electronic device
Grant 11,057,996 - Iwai , et al. July 6, 2 | 2021-07-06 |
Plate laminate type heat exchanger
Grant 10,976,110 - Bungo , et al. April 13, 2 | 2021-04-13 |
Laminated core type heat sink
Grant 10,837,718 - Bungo , et al. November 17, 2 | 2020-11-17 |
Laminated heat sink core
Grant 10,739,085 - Bungo , et al. A | 2020-08-11 |
Heat exchanger and method for assembling same
Grant 10,724,807 - Okubo , et al. | 2020-07-28 |
Substrate, Method Of Manufacturing Substrate, And Electronic Device
App 20200203266 - Iwai; Toshiki ; et al. | 2020-06-25 |
Laminated heat sink
Grant 10,655,922 - Bungo , et al. | 2020-05-19 |
Multilayer Substrate
App 20200152562 - Iwai; Toshiki ; et al. | 2020-05-14 |
Wiring Substrate And Electronic Device
App 20200154566 - IWAI; Toshiki ; et al. | 2020-05-14 |
Drawn Cup-type Heat Exchanger
App 20200033065 - OKUBO; Atsushi ; et al. | 2020-01-30 |
Circuit Board, Method Of Manufacturing Circuit Board, And Electronic Device
App 20190289715 - Iwai; Toshiki ; et al. | 2019-09-19 |
Circuit Board, Method Of Manufacturing Circuit Board, And Electronic Device
App 20190254164 - Iwai; Toshiki ; et al. | 2019-08-15 |
Electronic Device, Method Of Manufacturing Electronic Device, And Electronic Apparatus
App 20190252357 - Uemura; Taiki ; et al. | 2019-08-15 |
Laminated Heat Sink Core
App 20190249934 - BUNGO; Takuya ; et al. | 2019-08-15 |
Electronic apparatus, fabrication method therefor and electronic part
Grant 10,383,229 - Uemura , et al. A | 2019-08-13 |
Electronic Device And Method Of Manufacturing Electronic Device
App 20190192036 - Sakai; Taiji ; et al. | 2019-06-27 |
Heat exchanger core
Grant 10,309,729 - Bungo , et al. | 2019-06-04 |
Electronic device, method for manufacturing the electronic device, and electronic apparatus
Grant 10,283,434 - Sakai , et al. | 2019-05-07 |
Heat exchanger
Grant 10,274,262 - Okubo , et al. | 2019-04-30 |
Plate Laminate Type Heat Exchanger
App 20190063847 - BUNGO; Takuya ; et al. | 2019-02-28 |
Stacked Plate Heat Exchanger
App 20190024986 - BUNGO; Takuya ; et al. | 2019-01-24 |
Heat Exchanger And Method For Assembling Same
App 20180306527 - OKUBO; Atsushi ; et al. | 2018-10-25 |
Laminated Core Type Heat Sink
App 20180283802 - BUNGO; Takuya ; et al. | 2018-10-04 |
Electronic Apparatus, Fabrication Method Therefor And Electronic Part
App 20180279476 - UEMURA; Taiki ; et al. | 2018-09-27 |
Laminated Type Heat Sink
App 20180245862 - BUNGO; Takuya ; et al. | 2018-08-30 |
Seal structure for tank
Grant 10,006,723 - Okubo , et al. June 26, 2 | 2018-06-26 |
Corrugated fins for heat exchanger
Grant 9,995,539 - Bungo , et al. June 12, 2 | 2018-06-12 |
Method of manufacturing an electronic device, and electronic device manufacturing apparatus
Grant 9,911,642 - Sakai , et al. March 6, 2 | 2018-03-06 |
Corrugated Fins For Heat Exchanger
App 20170284748 - BUNGO; Takuya ; et al. | 2017-10-05 |
Heat Exchanger Core
App 20170153068 - BUNGO; Takuya ; et al. | 2017-06-01 |
Electronic Device, Method For Manufacturing The Electronic Device, And Electronic Apparatus
App 20170125359 - Sakai; Taiji ; et al. | 2017-05-04 |
Seal Structure For Tank
App 20170016684 - OKUBO; Atsushi ; et al. | 2017-01-19 |
Heat Exchanger
App 20160370127 - OKUBO; Atsushi ; et al. | 2016-12-22 |
Conductive material, conductive paste, circuit board, and semiconductor device
Grant 9,402,313 - Sakuyama , et al. July 26, 2 | 2016-07-26 |
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus
App 20150132865 - Mizukoshi; Masataka ; et al. | 2015-05-14 |
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
Grant 8,962,470 - Mizukoshi , et al. February 24, 2 | 2015-02-24 |
Electronic device having electrodes bonded with each other
Grant 8,922,027 - Sakai , et al. December 30, 2 | 2014-12-30 |
Electronic device having electrodes bonded with each other
Grant 08922027 - | 2014-12-30 |
Electronic Device, Method Of Manufacturing, And Electronic Device Manufacturing Apparatus
App 20140342504 - SAKAI; Taiji ; et al. | 2014-11-20 |
Printed Wiring Board Having Metal Layers Producing Eutectic Reaction
App 20140202739 - Sakai; Taiji ; et al. | 2014-07-24 |
Conductive Material, Conductive Paste, Circuit Board, And Semiconductor Device
App 20140140030 - Sakuyama; Seiki ; et al. | 2014-05-22 |
Method of manufacturing a printed wiring board
Grant 8,713,792 - Sakai , et al. May 6, 2 | 2014-05-06 |
Conductive material, conductive paste, circuit board, and semiconductor device
Grant 8,673,050 - Sakuyama , et al. March 18, 2 | 2014-03-18 |
Electronic Device, Method Of Manufacturing, And Electronic Device Manufacturing Apparatus
App 20130187293 - SAKAI; Taiji ; et al. | 2013-07-25 |
Method for manufacturing interposer
Grant 8,479,386 - Shioga , et al. July 9, 2 | 2013-07-09 |
Method of manufacturing semiconductor device
Grant 8,409,931 - Sakai , et al. April 2, 2 | 2013-04-02 |
Method Of Manufacturing Semiconductor Device
App 20120244665 - SAKAI; Taiji ; et al. | 2012-09-27 |
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20120217626 - SAKAI; Taiji ; et al. | 2012-08-30 |
Interposer and method for manufacturing the same
App 20110056068 - Shioga; Takeshi ; et al. | 2011-03-10 |
Printed Wiring Board Having Metal Layers Producing Eutectic Reaction
App 20110031002 - Sakai; Taiji ; et al. | 2011-02-10 |
Interposer and method for manufacturing the same
Grant 7,863,524 - Shioga , et al. January 4, 2 | 2011-01-04 |
Conductive Material, Conductive Paste, Circuit Board, And Semiconductor Device
App 20100315796 - Sakuyama; Seiki ; et al. | 2010-12-16 |
Multi-layer display element and manufacturing method for the same
Grant 7,852,439 - Yamaguchi , et al. December 14, 2 | 2010-12-14 |
Multi-layer Display Element And Manufacturing Method For The Same
App 20100097550 - Yamaguchi; Hisashi ; et al. | 2010-04-22 |
Method for fabricating an interposer
Grant 7,614,142 - Shioga , et al. November 10, 2 | 2009-11-10 |
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus
App 20090186425 - MIZUKOSHI; Masataka ; et al. | 2009-07-23 |
Method of connecting base materials
Grant 7,402,461 - Mizukoshi , et al. July 22, 2 | 2008-07-22 |
Interposer and method for fabricating the same
App 20080134499 - Shioga; Takeshi ; et al. | 2008-06-12 |
Interposer and method for fabricating the same
Grant 7,355,290 - Shioga , et al. April 8, 2 | 2008-04-08 |
Interposer and method for manufacturing the same
App 20080073110 - Shioga; Takeshi ; et al. | 2008-03-27 |
Interposer and method for fabricating the same
App 20070090546 - Shioga; Takeshi ; et al. | 2007-04-26 |
Pressure-type flow rate control apparatus
Grant 6,964,279 - Ohmi , et al. November 15, 2 | 2005-11-15 |
Method of connecting base materials
App 20050227474 - Mizukoshi, Masataka ; et al. | 2005-10-13 |
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
App 20050161814 - Mizukoshi, Masataka ; et al. | 2005-07-28 |
Advance pressure type flow control device
App 20040204794 - Ohmi, Tadahiro ; et al. | 2004-10-14 |
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