Ko; Chung-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Chung-Chi.The latest application filed is for "forming nitrogen-containing layers as oxidation blocking layers".

Company Profile

46.107.109

Ko; Chung-Chi - Nantou TW
KO; Chung-Chi - Nantou County TW
KO; Chung-Chi - Jushan Jen TW
Ko; Chung-Chi - Hsin-Chu TW
Ko; Chung-Chi - Jushan Township TW
Ko; Chung-Chi - Nautou TW
Ko; Chung-Chi - Nauton TW
Ko; Chung-Chi - Tainan TW
Ko; Chung-Chi - Nanton TW
Ko; Chung Chi - Lan-tou TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Forming Nitrogen-Containing Layers as Oxidation Blocking Layers App 20220301868 - Kao; Wan-Yi ; et al.	2022-09-22
Interconnect Structures Of Semiconductor Device And Methods Of Forming The Same App 20220262725 - Chou; Chia-Cheng ; et al.	2022-08-18
Forming Nitrogen-Containing Low-K Gate Spacer App 20220246478 - Kao; Wan-Yi ; et al.	2022-08-04
Low-k Feature Formation Processes and Structures Formed Thereby App 20220230871 - Kao; Wan-Yi ; et al.	2022-07-21
Silicon oxide layer for oxidation resistance and method forming same Grant 11,393,711 - Kao , et al. July 19, 2	2022-07-19
Methods of forming interconnect structures of semiconductor device Grant 11,373,947 - Chou , et al. June 28, 2	2022-06-28
Forming nitrogen-containing layers as oxidation blocking layers Grant 11,355,339 - Kao , et al. June 7, 2	2022-06-07
Varying Temperature Anneal for Film and Structures Formed Thereby App 20220157596 - Liao; Shu Ling ; et al.	2022-05-19
Spacer structure with high plasma resistance for semiconductor devices Grant 11,329,141 - Kao , et al. May 10, 2	2022-05-10
Interconnect structure and method Grant 11,328,952 - Chou , et al. May 10, 2	2022-05-10
Forming nitrogen-containing low-K gate spacer Grant 11,322,412 - Kao , et al. May 3, 2	2022-05-03
Method of Filling Gaps with Carbon and Nitrogen Doped Film App 20220122834 - Kao; Wan-Yi ; et al.	2022-04-21
Low-K feature formation processes and structures formed thereby Grant 11,295,948 - Kao , et al. April 5, 2	2022-04-05
Forming nitrogen-containing low-k gate spacer Grant 11,282,749 - Kao , et al. March 22, 2	2022-03-22
Method for preventing bottom layer wrinkling in a semiconductor device Grant 11,282,712 - Shiu , et al. March 22, 2	2022-03-22
Varying temperature anneal for film and structures formed thereby Grant 11,244,823 - Liao , et al. February 8, 2	2022-02-08
Method of filling gaps with carbon and nitrogen doped film Grant 11,211,243 - Kao , et al. December 28, 2	2021-12-28
Semiconductor Device And Method Of Fabricating The Same App 20210375779 - Chou; Chia-Cheng ; et al.	2021-12-02
Fin Field-effect Transistor Device And Method Of Forming The Same App 20210343867 - Kao; Wan-Yi ; et al.	2021-11-04
Semiconductor Device and Method App 20210287948 - Liao; Shu Ling ; et al.	2021-09-16
Methods Of Forming Interconnect Structures Of Semiconductor Device App 20210265264 - Chou; Chia-Cheng ; et al.	2021-08-26
Method for forming isolation structure having improved gap-fill capability Grant 11,075,123 - Kao , et al. July 27, 2	2021-07-27
Low-k Feature Formation Processes and Structures Formed Thereby App 20210226024 - Kao; Wan-Yi ; et al.	2021-07-22
Fin field-effect transistor device and method of forming the same Grant 11,069,812 - Kao , et al. July 20, 2	2021-07-20
Low-K Feature Formation Processes and Structures Formed Thereby App 20210202235 - Kao; Wan-Yi ; et al.	2021-07-01
Device Of Dielectric Layer App 20210202254 - PENG; Yu-Yun ; et al.	2021-07-01
Multi-patterning to form vias with straight profiles Grant 11,049,763 - Chen , et al. June 29, 2	2021-06-29
Semiconductor device and method Grant 11,024,550 - Liao , et al. June 1, 2	2021-06-01
Forming Nitrogen-Containing Low-K Gate Spacer App 20210125874 - Kao; Wan-Yi ; et al.	2021-04-29
Low-k feature formation processes and structures formed thereby Grant 10,971,589 - Kao , et al. April 6, 2	2021-04-06
Device and method of dielectric layer Grant 10,957,543 - Peng , et al. March 23, 2	2021-03-23
Method For Forming Isolation Structure Having Improved Gap-fill Capability App 20210082771 - KAO; Wan-Yi ; et al.	2021-03-18
Low-k feature formation processes and structures formed thereby Grant 10,950,431 - Kao , et al. March 16, 2	2021-03-16
Interconnect Structure and Method App 20210074581 - Chou; Chia-Cheng ; et al.	2021-03-11
Gap-fill method having improved gap-fill capability Grant 10,943,820 - Kao , et al. March 9, 2	2021-03-09
Methods for Reducing Dual Damascene Distortion App 20210057340 - Wang; Chao-Chun ; et al.	2021-02-25
Spacer Structure with High Plasma Resistance for Semiconductor Devices App 20210028293 - Kao; Wan-Yi ; et al.	2021-01-28
Methods of forming FinFET device Grant 10,867,860 - Kao , et al. December 15, 2	2020-12-15
Gap-fill Method Having Improved Gap-fill Capability App 20200365454 - KAO; Wan-Yi ; et al.	2020-11-19
Interconnect structure and method Grant 10,840,134 - Chou , et al. November 17, 2	2020-11-17
Methods for reducing dual damascene distortion Grant 10,818,598 - Wang , et al. October 27, 2	2020-10-27
Spacer structure with high plasma resistance for semiconductor devices Grant 10,804,374 - Kao , et al. October 13, 2	2020-10-13
Forming Nitrogen-Containing Low-K Gate Spacer App 20200321253 - Kao; Wan-Yi ; et al.	2020-10-08
Varying temperature anneal for film and structures formed thereby Grant 10,748,760 - Liao , et al. A	2020-08-18
Forming nitrogen-containing low-K gate spacer Grant 10,692,773 - Kao , et al.	2020-06-23
Gap Fill With Carbon and Nitrogen Doped Film App 20200161123 - Kao; Wan-Yi ; et al.	2020-05-21
Silicon Oxide Layer for Oxidation Resistance and Method Forming Same App 20200161170 - Kao; Wan-Yi ; et al.	2020-05-21
Method For Preventing Bottom Layer Wrinkling In A Semiconductor Device App 20200135488 - SHIU; Jung-Hau ; et al.	2020-04-30
Spacer Structure With High Plasma Resistance For Semiconductor Devices App 20200127112 - Kao; Wan-Yi ; et al.	2020-04-23
Low-k Feature Formation Processes and Structures Formed Thereby App 20200119151 - Kao; Wan-Yi ; et al.	2020-04-16
Fin Field-Effect Transistor Device and Method of Forming the Same App 20200105939 - Kao; Wan-Yi ; et al.	2020-04-02
Multi-Patterning to Form Vias with Straight Profiles App 20200090984 - Chen; Chun-Kai ; et al.	2020-03-19
Finfet Device And Methods Of Forming The Same App 20200075755 - Kao; Wan-Yi ; et al.	2020-03-05
Semiconductor Device and Method App 20200058561 - Liao; Shu Ling ; et al.	2020-02-20
Varying Temperature Anneal for Film and Structures Formed Thereby App 20200027719 - Liao; Shu Ling ; et al.	2020-01-23
Spacer Structure with High Plasma Resistance for Semiconductor Devices App 20200013872 - Kao; Wan-Yi ; et al.	2020-01-09
Forming Nitrogen-Containing Low-K Gate Spacer App 20200006151 - Kao; Wan-Yi ; et al.	2020-01-02
Forming Nitrogen-Containing Layers as Oxidation Blocking Layers App 20200006065 - Kao; Wan-Yi ; et al.	2020-01-02
Spacer structure with high plasma resistance for semiconductor devices Grant 10,516,036 - Kao , et al. Dec	2019-12-24
Semiconductor device structure with a low-k spacer layer and method for manufacturing the same Grant 10,516,035 - Lin , et al. Dec	2019-12-24
Method for preventing bottom layer wrinkling in a semiconductor device Grant 10,515,822 - Shiu , et al. Dec	2019-12-24
Low-k feature formation processes and structures formed thereby Grant 10,510,852 - Kao , et al. Dec	2019-12-17
Multi-patterning to form vias with straight profiles Grant 10,510,585 - Chen , et al. Dec	2019-12-17
Via patterning using multiple photo multiple etch Grant 10,510,584 - Shiu , et al. Dec	2019-12-17
Spacer structure with high plasma resistance for semiconductor devices Grant 10,483,372 - Kao , et al. Nov	2019-11-19
Via Patterning Using Multiple Photo Multiple Etch App 20190326164 - Shiu; Jung-Hau ; et al.	2019-10-24
Low-k Feature Formation Processes and Structures Formed Thereby App 20190279863 - Kao; Wan-Yi ; et al.	2019-09-12
Interconnect Structure and Method App 20190252246 - Chou; Chia-Cheng ; et al.	2019-08-15
Methods for Reducing Dual Damascene Distortion App 20190244898 - Wang; Chao-Chun ; et al.	2019-08-08
Via patterning using multiple photo multiple etch Grant 10,340,178 - Shiu , et al.	2019-07-02
Methods for reducing dual damascene distortion Grant 10,332,836 - Wang , et al.	2019-06-25
Forming interconnect structure using plasma treated metal hard mask Grant 10,312,107 - Ko , et al.	2019-06-04
Varying Temperature Anneal for Film and Structures Formed Thereby App 20190164743 - Liao; Shu Ling ; et al.	2019-05-30
Low-k Feature Formation Processes and Structures Formed Thereby App 20190165112 - Kao; Wan-Yi ; et al.	2019-05-30
Low-k feature formation processes and structures formed thereby Grant 10,304,677 - Kao , et al.	2019-05-28
Semiconductor Device Structure And Method For Manufacturing The Same App 20190148511 - LIN; Hsiang-Wei ; et al.	2019-05-16
Interconnect structure and method Grant 10,269,627 - Chou , et al.	2019-04-23
Spacer Structure With High Plasma Resistance For Semiconductor Devices App 20190103475 - Kao; Wan-Yi ; et al.	2019-04-04
Device And Method Of Dielectric Layer App 20190103276 - PENG; Yu-Yun ; et al.	2019-04-04
Low-k Feature Formation Processes And Structures Formed Thereby App 20190103265 - KAO; Wan-Yi ; et al.	2019-04-04
Via Patterning Using Multiple Photo Multiple Etch App 20190096752 - Shiu; Jung-Hau ; et al.	2019-03-28
Low-K dielectric interconnect systems Grant 10,163,691 - Shih , et al. Dec	2018-12-25
Interconnect structure with kinked profile Grant 10,163,688 - Chen , et al. Dec	2018-12-25
Via patterning using multiple photo multiple etch Grant 10,141,220 - Shiu , et al. Nov	2018-11-27
Interconnect structure for semiconductor devices Grant 10,062,645 - Kuo , et al. August 28, 2	2018-08-28
Methods for Reducing Dual Damascene Distortion App 20180102319 - Wang; Chao-Chun ; et al.	2018-04-12
Multi-Patterning to Form Vias with Straight Profiles App 20180033685 - Chen; Chun-Kai ; et al.	2018-02-01
Low-k Dielectric Interconnect Systems App 20180005882 - SHIH; Po-Cheng ; et al.	2018-01-04
Interconnect Structure and Method App 20170372948 - Chou; Chia-Cheng ; et al.	2017-12-28
Via Patterning Using Multiple Photo Multiple Etch App 20170365508 - Shiu; Jung-Hau ; et al.	2017-12-21
Method For Preventing Bottom Layer Wrinkling In A Semiconductor Device App 20170365561 - SHIU; Jung-Hau ; et al.	2017-12-21
Methods for reducing dual damascene distortion Grant 9,842,804 - Wang , et al. December 12, 2	2017-12-12
Manufacturing method of semiconductor device Grant 9,818,638 - Peng , et al. November 14, 2	2017-11-14
Interconnect Structure for Semiconductor Devices App 20170278785 - Kuo; Han-Hsin ; et al.	2017-09-28
Low-k dielectric interconnect systems Grant 9,768,061 - Shih , et al. September 19, 2	2017-09-19
Interconnect Structure And Method App 20170256445 - Chou; Chia-Cheng ; et al.	2017-09-07
Via patterning using multiple photo multiple etch Grant 9,754,818 - Shiu , et al. September 5, 2	2017-09-05
Interconnect structure and method Grant 9,754,822 - Chou , et al. September 5, 2	2017-09-05
Via Patterning Using Multiple Photo Multiple Etch App 20170200636 - Shiu; Jung-Hau ; et al.	2017-07-13
Methods for Reducing Dual Damascene Distortion App 20170194253 - Wang; Chao-Chun ; et al.	2017-07-06
Interconnect structure for semiconductor devices Grant 9,679,848 - Kuo , et al. June 13, 2	2017-06-13
Multi-patterning to form vias with straight profiles Grant 9,679,804 - Chen , et al. June 13, 2	2017-06-13
Manufacturing method of semiconductor device Grant 9,659,811 - Peng , et al. May 23, 2	2017-05-23
Self-aligned repairing process for barrier layer Grant 9,640,428 - Chi , et al. May 2, 2	2017-05-02
Automatically adjusting baking process for low-k dielectric material Grant 9,589,856 - Chou , et al. March 7, 2	2017-03-07
Interconnect Structure for Semiconductor Devices App 20170018496 - Kuo; Han-Hsin ; et al.	2017-01-19
Selective repairing process for barrier layer Grant 9,514,928 - Chi , et al. December 6, 2	2016-12-06
Interconnect structure for semiconductor devices Grant 9,460,997 - Kuo , et al. October 4, 2	2016-10-04
Via patterning using multiple photo multiple etch Grant 9,412,648 - Shiu , et al. August 9, 2	2016-08-09
Self-aligned Repairing Process For Barrier Layer App 20160204060 - CHI; Chih-Chien ; et al.	2016-07-14
Self-aligned repairing process for barrier layer Grant 9,324,606 - Chi , et al. April 26, 2	2016-04-26
Automatically Adjusting Baking Process for Low-k Dielectric Material App 20160086865 - Chou; Chia-Cheng ; et al.	2016-03-24
Method for forming semiconductor device structure Grant 9,236,294 - Chou , et al. January 12, 2	2016-01-12
Automatically adjusting baking process for low-k dielectric material Grant 9,196,551 - Chou , et al. November 24, 2	2015-11-24
Semiconductor devices and methods of manufacture thereof Grant 9,153,538 - Ko , et al. October 6, 2	2015-10-06
Impurity doped UV protection layer Grant 9,136,226 - Wu , et al. September 15, 2	2015-09-15
Methods for forming interconnect structures of integrated circuits Grant 9,130,017 - Shih , et al. September 8, 2	2015-09-08
High UV curing efficiency for low-k dielectrics Grant 9,093,265 - Shih , et al. July 28, 2	2015-07-28
Low-k interconnect structures with reduced RC delay Grant 9,087,877 - Ko , et al. July 21, 2	2015-07-21
Method For Forming Semiconductor Device Structure App 20150200133 - CHOU; Chia-Cheng ; et al.	2015-07-16
Selective Repairing Process For Barrier Layer App 20150201501 - Chi; Chih-Chien ; et al.	2015-07-16
Self-aligned Repairing Process For Barrier Layer App 20150194343 - CHI; Chih-Chien ; et al.	2015-07-09
Interconnect Structure for Semiconductor Devices App 20150187697 - Kuo; Han-Hsin ; et al.	2015-07-02
High Uv Curing Efficiency For Low-k Dielectrics App 20150104953 - Shih; Po-Cheng ; et al.	2015-04-16
Method of and apparatus for active energy assist baking Grant 9,004,914 - Ko , et al. April 14, 2	2015-04-14
Pore Sealing Techniques For Porous Low-k Dielectric Interconnect App 20150091172 - Ko; Chung-Chi ; et al.	2015-04-02
Low-k Cu barriers in damascene interconnect structures Grant 8,993,435 - Wang , et al. March 31, 2	2015-03-31
Semiconductor Devices and Methods of Manufacture Thereof App 20150054170 - Ko; Chung-Chi ; et al.	2015-02-26
Double patterning strategy for contact hole and trench in photolithography Grant 8,940,643 - Ko , et al. January 27, 2	2015-01-27
Method of modifying a low k dielectric layer having etched features and the resulting product Grant 8,846,528 - Liou , et al. September 30, 2	2014-09-30
Interconnect Structure With Kinked Profile App 20140264923 - Chen; Chih-Hao ; et al.	2014-09-18
Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections Grant 8,629,056 - Ko , et al. January 14, 2	2014-01-14
Double Patterning Strategy for Contact Hole and Trench in Photolithography App 20130337651 - Ko; Chung-Chi ; et al.	2013-12-19
Method Of And Apparatus For Active Energy Assist Baking App 20130273732 - KO; Chung-Chi ; et al.	2013-10-17
Double patterning strategy for contact hole and trench in photolithography Grant 8,536,064 - Ko , et al. September 17, 2	2013-09-17
Method of and apparatus for active energy assist baking Grant 8,481,412 - Ko , et al. July 9, 2	2013-07-09
Double patterning strategy for contact hole and trench in photolithography Grant 8,470,708 - Shih , et al. June 25, 2	2013-06-25
Method Of Modifying A Low K Dielectric Layer Having Etched Features And The Resulting Product App 20130137261 - LIOU; Joung-Wei ; et al.	2013-05-30
Semiconductor Device and Method for Forming the Same App 20130062774 - Ko; Chung-Chi ; et al.	2013-03-14
Methods for Forming Interconnect Structures of Integrated Circuits App 20130052818 - Shih; Po-Cheng ; et al.	2013-02-28
Automatically adjusting baking process for low-k dielectric material App 20130052755 - Chou; Chia-Cheng ; et al.	2013-02-28
Barrier layer for copper interconnect Grant 8,361,900 - Pan , et al. January 29, 2	2013-01-29
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties Grant 8,158,521 - Chang , et al. April 17, 2	2012-04-17
Method Of And Apparatus For Active Energy Assist Baking App 20120077339 - KO; Chung-Chi ; et al.	2012-03-29
Post etch dielectric film re-capping layer Grant 8,105,947 - Jeng , et al. January 31, 2	2012-01-31
Barrier Layer For Copper Interconnect App 20110256715 - PAN; Shing-Chyang ; et al.	2011-10-20
Low-k Cu Barriers in Damascene Interconnect Structures App 20110223759 - Wang; Kuan-Chen ; et al.	2011-09-15
Method for Forming Self-Assembled Mono-Layer Liner for Cu/Porous Low-k Interconnections App 20110217840 - Ko; Chung-Chi ; et al.	2011-09-08
Double Patterning Strategy For Contact Hole And Trench In Photolithography App 20110207329 - SHIH; Po-Cheng ; et al.	2011-08-25
Double Patterning Strategy For Contact Hole And Trench In Photolithography App 20110195576 - KO; Chung-Chi ; et al.	2011-08-11
Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections Grant 7,968,451 - Ko , et al. June 28, 2	2011-06-28
Method for enhancing adhesion between layers in BEOL fabrication Grant 7,897,505 - Ko , et al. March 1, 2	2011-03-01
Impurity Doped UV Protection Layer App 20100213518 - Wu; Zhen-Cheng ; et al.	2010-08-26
Impurity doped UV protection layer Grant 7,732,923 - Wu , et al. June 8, 2	2010-06-08
Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio Grant 7,723,226 - Yu , et al. May 25, 2	2010-05-25
Post Etch Dielectric Film Re-Capping Layer App 20100120253 - Jeng; Shwang-Ming ; et al.	2010-05-13
Method for Forming Self-Assembled Mono-Layer Liner for Cu/Porous Low-k Interconnections App 20090286394 - Ko; Chung-Chi ; et al.	2009-11-19
Method for Improving the Reliability of Low-k Dielectric Materials App 20090258487 - Lin; Keng-Chu ; et al.	2009-10-15
Method for photoresist stripping and treatment of low-k dielectric material Grant 7,598,176 - Tsai , et al. October 6, 2	2009-10-06
Semiconductor device Grant 7,485,949 - Ko , et al. February 3, 2	2009-02-03
Interconnect structures with surfaces roughness improving liner and methods for fabricating the same Grant 7,466,027 - Ko , et al. December 16, 2	2008-12-16
Semiconductor device App 20080272493 - Ko; Chung-Chi ; et al.	2008-11-06
UV treatment for low-k dielectric layer in damascene structure Grant 7,429,542 - Ko , et al. September 30, 2	2008-09-30
Method for enhancing adhesion between layers App 20080233765 - Ko; Chung-Chi ; et al.	2008-09-25
Methods for forming interconnect structures Grant 7,410,895 - Lin , et al. August 12, 2	2008-08-12
Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio App 20080171431 - Yu; Chen-Hua ; et al.	2008-07-17
Low-k interconnect structures with reduced RC delay App 20080096380 - Ko; Chung-Chi ; et al.	2008-04-24
Interconnect Structures And Methods For Fabricating The Same App 20080061442 - Ko; Chung-Chi ; et al.	2008-03-13
Two Step Post-Deposition Treatment of ILD Layer for a Lower Dielectric Constant and Improved Mechanical Properties App 20080014369 - Chang; Hui-Lin ; et al.	2008-01-17
Semiconductor device and fabrication method thereof Grant 7,312,531 - Chang , et al. December 25, 2	2007-12-25
Self-assembled mono-layer liner for cu/porous low-k interconnections App 20070278682 - Ko; Chung-Chi ; et al.	2007-12-06
UV treatment for low-k dielectric layer in damascene structure App 20070243720 - Ko; Chung-Chi ; et al.	2007-10-18
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties Grant 7,250,370 - Chang , et al. July 31, 2	2007-07-31
Semiconductor device and fabrication method thereof App 20070096326 - Chang; Hui-Lin ; et al.	2007-05-03
Method of preventing photoresist poisoning of a low-dielectric-constant insulator Grant 7,172,964 - Ko , et al. February 6, 2	2007-02-06
Methods for forming interconnect structures App 20070015355 - Lin; Keng-Chu ; et al.	2007-01-18
Impurity doped UV protection layer App 20060145303 - Wu; Zhen-Cheng ; et al.	2006-07-06
Method for decreasing a dielectric constant of a low-k film App 20060115980 - Ko; Chung-Chi ; et al.	2006-06-01
Method for photoresist stripping and treatment of low-k dielectric material App 20060063386 - Tsai; Jang-Shiang ; et al.	2006-03-23
Method of preventing photoresist poisoning of a low-dielectric-constant insulator App 20050282382 - Ko, Chung Chi ; et al.	2005-12-22
SiOCH low k surface protection layer formation by CxHy gas plasma treatment Grant 6,962,869 - Bao , et al. November 8, 2	2005-11-08
SiOC properties and its uniformity in bulk for damascene applications Grant 6,924,242 - Jang , et al. August 2, 2	2005-08-02
SiOC properties and its uniformity in bulk for damascene applications App 20050133931 - Jang, Syun-Ming ; et al.	2005-06-23
ATR-FTIR metal surface cleanliness monitoring Grant 6,908,773 - Li , et al. June 21, 2	2005-06-21
Sioc Properties And Its Uniformity In Bulk For Damascene Applications App 20050090122 - Jang, Syun-Ming ; et al.	2005-04-28
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties App 20050064698 - Chang, Hui-Lin ; et al.	2005-03-24
Method to increase cracking threshold for low-k materials Grant 6,867,126 - Li , et al. March 15, 2	2005-03-15
Method for ultra low-K dielectric deposition App 20050048795 - Ko, Chung-Chi ; et al.	2005-03-03
Method for forming a carbon doped oxide low-k insulating layer Grant 6,812,043 - Bao , et al. November 2, 2	2004-11-02
Method for forming low dielectric constant damascene structure while employing a carbon doped silicon oxide capping layer Grant 6,806,185 - Li , et al. October 19, 2	2004-10-19
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant Grant 6,756,321 - Ko , et al. June 29, 2	2004-06-29
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant App 20040067658 - Ko, Chung-Chi ; et al.	2004-04-08
Method for forming low dielectric constant damascene structure while employing a carbon doped silicon oxide capping layer App 20040058523 - Li, Lain-Jong ; et al.	2004-03-25
System for detecting surface defects in semiconductor wafers Grant 6,654,109 - Li , et al. November 25, 2	2003-11-25
Method for forming a carbon doped oxide low-k insulating layer App 20030203652 - Bao, Tien-I ; et al.	2003-10-30
ATR-FTIR metal surface cleanliness monitoring App 20030179368 - Li, Lain-Jong ; et al.	2003-09-25
System for detecting surface defects in semiconductor wafers App 20030147069 - Li, Lain-Jong ; et al.	2003-08-07
Method for protecting sidewalls of etched openings to prevent via poisoning Grant 6,602,780 - Shih , et al. August 5, 2	2003-08-05
Method for forming low dielectric constant damascene structure while employing carbon doped silicon oxide planarizing stop layer Grant 6,602,779 - Li , et al. August 5, 2	2003-08-05
Method for protecting sidewalls of etched openings to prevent via poisoning App 20030045124 - Shih, Tsu ; et al.	2003-03-06

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