| Patent | Date |
|---|
UV LED package structure for improving light extraction
Grant 11,349,048 - Ye , et al. May 31, 2 | 2022-05-31 |
Light-emitting diode (LED) assembly and method of manufacturing an LED cell of the same
Grant 11,322,542 - Pan , et al. May 3, 2 | 2022-05-03 |
Led Display Screen Module
App 20210328111 - CHANG; JEN-HUNG ; et al. | 2021-10-21 |
Light-emitting Diode (led) Assembly And Method Of Manufacturing An Led Cell Of The Same
App 20210305313 - PAN; SHYI-MING ; et al. | 2021-09-30 |
Light Source Assembly, Optical Sensor Assembly, And Method Of Manufacturing A Cell Of The Same
App 20210305449 - WANG; MAM-TSUNG ; et al. | 2021-09-30 |
Display device and light source module having high color conversion efficiency thereof
Grant 11,050,006 - Ye , et al. June 29, 2 | 2021-06-29 |
Uv Led Package Structure For Improving Light Extraction
App 20210135057 - YE; ZHI TING ; et al. | 2021-05-06 |
Movable display device
Grant 10,990,343 - Tang , et al. April 27, 2 | 2021-04-27 |
Enema device and method of using the same
Grant 10,980,935 - Wang April 20, 2 | 2021-04-20 |
Light emitting diode assembly structure
Grant 10,944,032 - Ye , et al. March 9, 2 | 2021-03-09 |
Display device
Grant 10,818,644 - Chang , et al. October 27, 2 | 2020-10-27 |
Movable Display Device
App 20200233627 - Tang; Yung-Pao ; et al. | 2020-07-23 |
Display Device
App 20200219856 - CHANG; Jen-Hung ; et al. | 2020-07-09 |
Light Emitting Diode Assembly Structure
App 20200052171 - YE; ZHI-TING ; et al. | 2020-02-13 |
Light emitting diode array package having a plurality of power source signals without limiting resistor
Grant 10,355,185 - Chang , et al. July 16, 2 | 2019-07-16 |
Display Device And Light Source Module Thereof
App 20190189864 - Ye; Zhi-Ting ; et al. | 2019-06-20 |
Enema Device And Method Of Using The Same
App 20190151530 - WANG; PING-LUNG | 2019-05-23 |
Display Device
App 20190096292 - Chang; Jen-Hung ; et al. | 2019-03-28 |
Light Emitting Diode Package
App 20190088841 - Chang; Jen-Hung ; et al. | 2019-03-21 |
Headlamp module
Grant 10,145,526 - Ye , et al. De | 2018-12-04 |
Semiconductor Light-emitting Module And Semiconductor Led Chip Thereof
App 20180287024 - YE; ZHI-TING ; et al. | 2018-10-04 |
Portable light-emitting device without pre-stored power sources and LED package structure thereof
Grant 10,084,123 - Lu , et al. September 25, 2 | 2018-09-25 |
Light emitting device
Grant 10,060,600 - Ye , et al. August 28, 2 | 2018-08-28 |
Light-emitting diode package structure having plane light source and method for manufacturing the same
Grant 9,978,917 - Ye , et al. May 22, 2 | 2018-05-22 |
Light source module
Grant 9,921,359 - Ye , et al. March 20, 2 | 2018-03-20 |
Light emitting diode device and light emitting device using the same
Grant 9,887,179 - Lu , et al. February 6, 2 | 2018-02-06 |
Light Source Module
App 20180031755 - YE; ZHI-TING ; et al. | 2018-02-01 |
Headlamp Module
App 20180031193 - YE; ZHI-TING ; et al. | 2018-02-01 |
Light Emitting Diode Assembly Structure
App 20180033928 - CHANG; CHIH-WEI ; et al. | 2018-02-01 |
Light emitting device
Grant 9,799,810 - Ye , et al. October 24, 2 | 2017-10-24 |
Display device and light-emitting array module thereof
Grant 9,685,428 - Chang June 20, 2 | 2017-06-20 |
System And Method For Recovering Metal From Metal-containing Waste Liquid
App 20170088964 - LIN; HUNG-CHIN | 2017-03-30 |
Display Device And Light-emitting Array Module Thereof
App 20170040299 - CHANG; JEN-HUNG | 2017-02-09 |
Display panel and composite display panel using the same
Grant 9,563,076 - Wang , et al. February 7, 2 | 2017-02-07 |
Portable Light-emitting Device Without Pre-stored Power Sources And Led Package Structure Thereof
App 20170033270 - Lu; Hsin I ; et al. | 2017-02-02 |
Display Panel And Composite Display Panel Using The Same
App 20160370623 - WANG; Ping-Lung ; et al. | 2016-12-22 |
Light Emitting Diode Device And Light Emitting Device Using The Same
App 20160155727 - LU; Hsin-I ; et al. | 2016-06-02 |
White light emitting diodes package containing plural blue light-emitting diodes
Grant 9,224,718 - Cheng , et al. December 29, 2 | 2015-12-29 |
Display Structure
App 20150282265 - Wei; Meng-Hsiu | 2015-10-01 |
Compound for carrier transport, element and electronic device using the same
Grant 9,074,043 - Chang , et al. July 7, 2 | 2015-07-07 |
Package Of Light Emitting Diode Chips
App 20150060902 - CHENG; Tsung-Kan ; et al. | 2015-03-05 |
White Light Emitting Diodes Package Containing Plural Blue Light-emitting Diodes
App 20140209934 - CHENG; Tsung-Kan ; et al. | 2014-07-31 |
Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
Grant 8,748,209 - Wang , et al. June 10, 2 | 2014-06-10 |
Novel Compound For Carrier Transport, Element And Electronic Device Using The Same
App 20140051826 - Chang; Feng-Chih ; et al. | 2014-02-20 |
LED chip package structure using sedimentation and method for making the same
Grant 8,623,680 - Wang , et al. January 7, 2 | 2014-01-07 |
Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
Grant 8,555,492 - Wang , et al. October 15, 2 | 2013-10-15 |
Simple detachable illumination structure and lamp tube
Grant 8,556,463 - Wang , et al. October 15, 2 | 2013-10-15 |
Lamp head assembly and lighting lamp tube
Grant 8,398,275 - Wang , et al. March 19, 2 | 2013-03-19 |
Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
Grant 8,263,876 - Wang , et al. September 11, 2 | 2012-09-11 |
LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same
Grant 8,198,800 - Wang , et al. June 12, 2 | 2012-06-12 |
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
Grant 8,183,065 - Wang , et al. May 22, 2 | 2012-05-22 |
Strip LED
Grant D660,259 - Wang , et al. May 22, 2 | 2012-05-22 |
White Light-emitting Diode Package Structure For Simplifying Package Process And Method For Making The Same
App 20120122254 - WANG; BILY ; et al. | 2012-05-17 |
Led Package Structure With A Deposited-type Phosphor Layer And Method For Making The Same
App 20120119231 - WANG; BILY ; et al. | 2012-05-17 |
LED package base
Grant D659,655 - Wang May 15, 2 | 2012-05-15 |
LED package base
Grant D659,654 - Wang May 15, 2 | 2012-05-15 |
Led Package Structure
App 20120106171 - WANG; BILY ; et al. | 2012-05-03 |
Conductive Substrate Structure With Conductive Channels Formed By Using A Two-sided Cut Approach And A Method For Manufacturing The Same
App 20120096710 - WANG; BILY ; et al. | 2012-04-26 |
Illumination device with a fire-fighting function
Grant 8,162,514 - Wang April 24, 2 | 2012-04-24 |
LED chip package structure with multifunctional integrated chips and a method for making the same
Grant 8,162,510 - Wang , et al. April 24, 2 | 2012-04-24 |
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same
App 20120094407 - WANG; BILY ; et al. | 2012-04-19 |
Lamp Head Assembly And Lighting Lamp Tube
App 20120069583 - WANG; BILY ; et al. | 2012-03-22 |
Package for a light emitting diode and method for fabricating the same
Grant 8,137,999 - Wang , et al. March 20, 2 | 2012-03-20 |
LED chip package structure with different LED spacings and a method for making the same
Grant 8,138,508 - Wang , et al. March 20, 2 | 2012-03-20 |
Led Chip Package Structure With A High-efficiency Heat-dissipating Substrate And Method For Making The Same
App 20120049212 - WANG; BILY ; et al. | 2012-03-01 |
Led Package Structure And Method Of Making The Same
App 20120037937 - WANG; BILY ; et al. | 2012-02-16 |
Simple Detachable Illumination Structure And Lamp Tube
App 20120014087 - WANG; BILY ; et al. | 2012-01-19 |
Wafer Level Led Package Structure For Increase Light-emitting Efficiency And Method For Making The Same
App 20120009699 - WANG; BILY ; et al. | 2012-01-12 |
Method Of Manufacturing A Led Chip Package Structure
App 20120009700 - WANG; BILY ; et al. | 2012-01-12 |
Led Chip Package Structure
App 20120001203 - WANG; BILY ; et al. | 2012-01-05 |
Led Chip Package Structure Using Sedimentation And Method For Making The Same
App 20120003765 - WANG; BILY ; et al. | 2012-01-05 |
Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency
Grant 8,079,737 - Wang , et al. December 20, 2 | 2011-12-20 |
Wafer Level Diode Package Structure
App 20110304020 - WANG; BILY ; et al. | 2011-12-15 |
Package For A Light Emitting Diode And Method For Fabricating The Same
App 20110300649 - WANG; BILY ; et al. | 2011-12-08 |
Color-mixture display unit and image display apparatus using the same
Grant 8,053,961 - Wang , et al. November 8, 2 | 2011-11-08 |
Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
Grant 8,053,904 - Wang , et al. November 8, 2 | 2011-11-08 |
Wafer level vertical diode package structure and method for making the same
Grant 8,053,885 - Wang , et al. November 8, 2 | 2011-11-08 |
Semiconductor Chip Package Structure For Achieving Flip-chip Type Electrical Connection Without Using Wire-bonding Process And Method For Making The Same
App 20110229991 - WANG; BILY ; et al. | 2011-09-22 |
LED base
Grant D645,421 - Wang , et al. September 20, 2 | 2011-09-20 |
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
Grant 8,017,969 - Wang , et al. September 13, 2 | 2011-09-13 |
Led Package Structure And Method Of Manufacturing The Same
App 20110215357 - WANG; BILY ; et al. | 2011-09-08 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
Grant 8,003,413 - Wang , et al. August 23, 2 | 2011-08-23 |
Led Chip Package Structure In Order To Prevent The Light-emitting Efficiency Of Fluorescent Powder From Decreasing Due To High Temperature And Method For Making The Same
App 20110189803 - WANG; BILY ; et al. | 2011-08-04 |
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
App 20110156061 - Wang; Bily ; et al. | 2011-06-30 |
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
App 20110156083 - Wang; Bily ; et al. | 2011-06-30 |
Conductive Substrate Structure With Conductive Channels Formed By Using A Two-sided Cut Approach And A Method For Manufacturing The Same
App 20110155436 - WANG; BILY ; et al. | 2011-06-30 |
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
App 20110156060 - Wang; Bily ; et al. | 2011-06-30 |
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
App 20110157868 - Wang; Bily ; et al. | 2011-06-30 |
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same
App 20110147774 - WANG; BILY ; et al. | 2011-06-23 |
LED chip package structure with an embedded ESD function and method for manufacturing the same
Grant 7,964,420 - Wang , et al. June 21, 2 | 2011-06-21 |
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
Grant 7,951,621 - Wang , et al. May 31, 2 | 2011-05-31 |
Wafer level LED package structure and method for making the same
Grant 7,923,747 - Wang , et al. April 12, 2 | 2011-04-12 |
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same
Grant 7,923,745 - Wang , et al. April 12, 2 | 2011-04-12 |
Semiconductor Chip Package Structure For Achieving Flip-chip Type Electrical Connection Without Using Wire-bonding Process And Method For Making The Same
App 20110018019 - WANG; BILY ; et al. | 2011-01-27 |
Semiconductor Chip Package Structure For Achieving Electrical Connection Without Using Wire-bonding Process And Method For Making The Same
App 20110018018 - WANG; BILY ; et al. | 2011-01-27 |
Led Chip Package Structure With High-efficiency Light Emission By Rough Surfaces And Method Of Making The Same
App 20110020967 - WANG; BILY ; et al. | 2011-01-27 |
LED chip package structure with an embedded ESD function and method for manufacturing the same
Grant 7,876,593 - Wang , et al. January 25, 2 | 2011-01-25 |
Wafer Level Led Package Structure For Increasing Light-emitting Efficiency And Heat-dissipating Effect And Method For Manufacturing The Same
App 20100301349 - WANG; BILY ; et al. | 2010-12-02 |
Front and rear covering type LED package structure and method for packaging the same
Grant 7,842,964 - Wang , et al. November 30, 2 | 2010-11-30 |
LED chip package structure with high-efficiency light-emitting effect and method of packing the same
Grant 7,834,365 - Wang , et al. November 16, 2 | 2010-11-16 |
LED chip package structure with high-efficiency light-emitting effect and method for making the same
Grant 7,829,901 - Wang , et al. November 9, 2 | 2010-11-09 |
LED lamp structure and system with high-efficiency heat-dissipating function
Grant 7,828,464 - Wang , et al. November 9, 2 | 2010-11-09 |
Method for manufacturing an LED chip package structure
Grant 7,824,938 - Wang , et al. November 2, 2 | 2010-11-02 |
Light-guiding Structure With Phosphor Material Layers
App 20100271844 - Wang; Bily ; et al. | 2010-10-28 |
Method for calculating out an optimum arrangement pitch between each two LED chip package units
Grant 7,815,346 - Wang , et al. October 19, 2 | 2010-10-19 |
Mold structure for packaging LED chips and method thereof
Grant 7,803,641 - Wang , et al. September 28, 2 | 2010-09-28 |
Multi-wavelength white light-emitting structure
Grant 7,804,162 - Wang , et al. September 28, 2 | 2010-09-28 |
Method for manufacturing a light-emitting diode having high heat-dissipating efficiency
Grant 7,749,781 - Wang , et al. July 6, 2 | 2010-07-06 |
Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the same
Grant 7,741,648 - Wang , et al. June 22, 2 | 2010-06-22 |
High efficiency white light emitting diode and method for manufacturing the same
Grant 7,737,635 - Wang , et al. June 15, 2 | 2010-06-15 |
White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blend
Grant 7,701,124 - Wang , et al. April 20, 2 | 2010-04-20 |
LED driving circuit and a serial LED illumination system using the same
Grant 7,696,990 - Wang , et al. April 13, 2 | 2010-04-13 |
Illumination Device With A Fire-fighting Function
App 20100079975 - WANG; Bily | 2010-04-01 |
LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
Grant 7,671,374 - Wang , et al. March 2, 2 | 2010-03-02 |
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
Grant 7,671,373 - Wang , et al. March 2, 2 | 2010-03-02 |
Method of manufacturing a substrate structure for increasing cutting precision and strength thereof
Grant 7,662,661 - Wang , et al. February 16, 2 | 2010-02-16 |
Wafer Level Led Package Structure For Increasing Conductive Area And Heat-dissipating Area And Method For Making The Same
App 20100032706 - Wang; Bily ; et al. | 2010-02-11 |
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same
Grant 7,655,997 - Wang , et al. February 2, 2 | 2010-02-02 |
Led Chip Package Structure With An Embedded Esd Function And Method For Manufacturing The Same
App 20090316315 - WANG; BILY ; et al. | 2009-12-24 |
Semiconductor Chip Package Structure For Achieving Face-down Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same
App 20090283881 - WANG; BILY ; et al. | 2009-11-19 |
Semiconductor Chip Package Structure Without Substrates For Achieving Face-up Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same
App 20090278159 - WANG; Bily ; et al. | 2009-11-12 |
Modular illumination device with adjustable lighting angles
Grant 7,614,766 - Wang , et al. November 10, 2 | 2009-11-10 |
Led Chip Package Structure Using A Substrate As A Lampshade And Method For Making The Same
App 20090261368 - WANG; BILY ; et al. | 2009-10-22 |
Semiconductor Chip Package Structure For Achieving Face-up Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same
App 20090230538 - WANG; BILY ; et al. | 2009-09-17 |
Semiconductor Chip Package Structure For Achieving Electrical Connection Without Using A Wire-bonding Process And Method For Making The Same
App 20090206465 - WANG; BILY ; et al. | 2009-08-20 |
Laminated light-emitting diode display device and manufacturing method thereof
Grant 7,563,641 - Wang , et al. July 21, 2 | 2009-07-21 |
Light emitting diode
Grant D595,675 - Wang , et al. July 7, 2 | 2009-07-07 |
Light emitting diode
Grant D595,674 - Wang , et al. July 7, 2 | 2009-07-07 |
LED package structure for increasing light-emitting efficiency and method of packaging the same
Grant 7,515,061 - Wang , et al. April 7, 2 | 2009-04-07 |
Method of manufacturing high power light-emitting device package and structure thereof
Grant 7,485,480 - Wang , et al. February 3, 2 | 2009-02-03 |
Led Chip Package Structure With High-efficiency Light-emitting Effect And Method Of Packaging The Same
App 20090020770 - Wang; Bily ; et al. | 2009-01-22 |
Led Chip Package Structure With A Plurality Of Thick Guiding Pins And A Method For Manufacturing The Same
App 20080179604 - Wang; Bily ; et al. | 2008-07-31 |
Mold Structure For Packaging Led Chips And Method Thereof
App 20080160658 - WANG; BILY ; et al. | 2008-07-03 |
Semiconductor substrate structure and processing method thereof
Grant 7,303,984 - Wang , et al. December 4, 2 | 2007-12-04 |
Package structure for semiconductor
Grant 7,276,782 - Wang , et al. October 2, 2 | 2007-10-02 |
Lighting module
Grant 7,255,463 - Wang , et al. August 14, 2 | 2007-08-14 |
White light-emitting device
App 20070152562 - Wang; Bily ; et al. | 2007-07-05 |
Backlight module
Grant 7,237,938 - Wang , et al. July 3, 2 | 2007-07-03 |
Electrical lamp apparatus
App 20070133209 - Wang; Bily ; et al. | 2007-06-14 |
LED package structure and method for making the same
Grant 7,211,882 - Wang , et al. May 1, 2 | 2007-05-01 |
Laminated light-emitting diode display device and manufacturing method thereof
App 20070072506 - Wang; Bily ; et al. | 2007-03-29 |
Wing-shaped surface mount package for light emitting diodes
Grant 7,154,155 - Wang , et al. December 26, 2 | 2006-12-26 |
Water-cooling heat dissipation device adopted for modulized LEDs
Grant 7,140,753 - Wang , et al. November 28, 2 | 2006-11-28 |
Circuit board for large screen LED matrix array display
Grant 7,142,181 - Wang , et al. November 28, 2 | 2006-11-28 |
Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same
App 20060261488 - Wang; Bily ; et al. | 2006-11-23 |
Circuit for driving LED display
Grant 7,138,995 - Wang , et al. November 21, 2 | 2006-11-21 |
Backlight module
App 20060215387 - Wang; Bily ; et al. | 2006-09-28 |
Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same
App 20060166477 - Wang; Bily ; et al. | 2006-07-27 |
LED light source with reflecting side wall
Grant 7,080,924 - Tseng , et al. July 25, 2 | 2006-07-25 |
LED packaging structure
Grant 7,049,639 - Wang , et al. May 23, 2 | 2006-05-23 |
Charge coupled device package
Grant 7,041,527 - Wu May 9, 2 | 2006-05-09 |
Package structure for optical-electrical semiconductor
App 20060086945 - Wang; Bily ; et al. | 2006-04-27 |
LED lamp
App 20060082994 - Wang; Bily ; et al. | 2006-04-20 |
Semiconductor substrate structure
App 20060071328 - Wang; Bily ; et al. | 2006-04-06 |
Mixing light board
App 20060044796 - Wang; Bily ; et al. | 2006-03-02 |
Laminated light-emitting diode display device and manufacturing method thereof
App 20060038485 - Wang; Bily ; et al. | 2006-02-23 |
Light-emitting diode lamp
App 20060034071 - Wang; Bily ; et al. | 2006-02-16 |
Method Of Forming A Composite Polymer Material Inside Trenches Of A Semiconductor Substrate To Form A Composite Polymer Structure
App 20060035406 - Wang; Bily ; et al. | 2006-02-16 |
Water-cooling heat dissipation device adopted for modulized LEDs
App 20060034085 - Wang; Bily ; et al. | 2006-02-16 |
LED packaging structure
App 20050274957 - Wang, Bily ; et al. | 2005-12-15 |
Fan structure
App 20050265834 - Wang, Jia-Yeh ; et al. | 2005-12-01 |
White light emitting diode light source and method for manufacturing the same
App 20050264173 - Wang, Bily ; et al. | 2005-12-01 |
Light-emitting diode
Grant D511,328 - Wang , et al. November 8, 2 | 2005-11-08 |
White light-emitting device
App 20050236958 - Wang, Bily ; et al. | 2005-10-27 |
Flexible light array and fabrication procedure thereof
App 20050207156 - Wang, Bily ; et al. | 2005-09-22 |
Metal base design for surface mount device LED
Grant D509,809 - Wang , et al. September 20, 2 | 2005-09-20 |
Light emitting diode package
Grant D509,195 - Wang , et al. September 6, 2 | 2005-09-06 |
Led chip lamp apparatus
App 20050169006 - Wang, Bily ; et al. | 2005-08-04 |
White light source
Grant 6,919,584 - Wang , et al. July 19, 2 | 2005-07-19 |
Light emitting diode package
Grant D507,544 - Wang , et al. July 19, 2 | 2005-07-19 |
Light emitting diode package
Grant D507,246 - Wang , et al. July 12, 2 | 2005-07-12 |
Package structure for semiconductor
App 20050139855 - Wang, Bily ; et al. | 2005-06-30 |
Light-emitting diode
Grant D506,732 - Wang , et al. June 28, 2 | 2005-06-28 |
Optical projection device of a colored lighting module
App 20050135113 - Wang, Bily ; et al. | 2005-06-23 |
Semiconductor packaging substrate
App 20050133888 - Wang, Bily ; et al. | 2005-06-23 |
Package structure of optical sensitive device and method for packaging optical sensitive device
App 20050135071 - Wang, Billy ; et al. | 2005-06-23 |
Metal base design for surface mount device LED (light emitting diode)
Grant D506,187 - Wang , et al. June 14, 2 | 2005-06-14 |
IC package with stacked sheet metal substrate
Grant 6,885,037 - Wang , et al. April 26, 2 | 2005-04-26 |
Virtual stereoscopic light emitting diode display panel
Grant 6,864,864 - Lin March 8, 2 | 2005-03-08 |
White light source from light emitting diode
Grant 6,841,934 - Wang , et al. January 11, 2 | 2005-01-11 |
White light source
Grant 6,794,686 - Chang , et al. September 21, 2 | 2004-09-21 |
Random partitionable dot matrix LED display
Grant 6,784,458 - Wang , et al. August 31, 2 | 2004-08-31 |
Mass production technique for surface mount optical device with a focusing cup
Grant 6,627,482 - Wang , et al. September 30, 2 | 2003-09-30 |
Single-side mounted light emitting diode module
Grant 6,297,598 - Wang , et al. October 2, 2 | 2001-10-02 |
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