LED package base
Wang May 15, 2
U.S. patent number D659,654 [Application Number D/396,121] was granted by the patent office on 2012-05-15 for led package base. This patent grant is currently assigned to Harvatek Corporation. Invention is credited to Bily Wang.
| United States Patent | D659,654 |
| Wang | May 15, 2012 |
LED package base
Claims
CLAIM The ornamental design for a "LED package base," as shown and described.
| Inventors: | Wang; Bily (Hsinchu, TW) |
|---|---|
| Assignee: | Harvatek Corporation (Hsinchu,
TW) |
| Appl. No.: | D/396,121 |
| Filed: | June 26, 2011 |
Foreign Application Priority Data
| Jan 5, 2011 [TW] | 100300048 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/1,2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800 |
References Cited [Referenced By]
U.S. Patent Documents
| D534132 | December 2006 | Yoon |
| 7242035 | July 2007 | Kim et al. |
| D558693 | January 2008 | Shin et al. |
| D599305 | September 2009 | Kim et al. |
| D633053 | February 2011 | Lin |
| 7910948 | March 2011 | Kim et al. |
| D637981 | May 2011 | Ko et al. |
| 7935982 | May 2011 | Kim et al. |
| 7968900 | June 2011 | Hussell et al. |
Attorney, Agent or Firm: Li & Cai Intellectual Property (USA) Office
Description
FIG. 1 is a perspective view of a "LED package base" showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view showing the practical usage.
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