U.S. patent number D659,654 [Application Number D/396,121] was granted by the patent office on 2012-05-15 for led package base.
This patent grant is currently assigned to Harvatek Corporation. Invention is credited to Bily Wang.
United States Patent |
D659,654 |
Wang |
May 15, 2012 |
LED package base
Claims
CLAIM The ornamental design for a "LED package base," as shown and
described.
Inventors: |
Wang; Bily (Hsinchu,
TW) |
Assignee: |
Harvatek Corporation (Hsinchu,
TW)
|
Appl.
No.: |
D/396,121 |
Filed: |
June 26, 2011 |
Foreign Application Priority Data
|
|
|
|
|
Jan 5, 2011 [TW] |
|
|
100300048 |
|
Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/1,2
;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500
;362/555,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Li & Cai Intellectual Property
(USA) Office
Description
FIG. 1 is a perspective view of a "LED package base" showing my new
design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a perspective view showing the practical usage.
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