U.S. patent application number 13/087504 was filed with the patent office on 2011-08-04 for led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same.
This patent application is currently assigned to HARVATEK CORPORATION. Invention is credited to BILY WANG, SHIH-YU WU, WEN-KUEI WU.
Application Number | 20110189803 13/087504 |
Document ID | / |
Family ID | 41052894 |
Filed Date | 2011-08-04 |
United States Patent
Application |
20110189803 |
Kind Code |
A1 |
WANG; BILY ; et al. |
August 4, 2011 |
LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING
EFFICIENCY OF FLUORESCENT POWDER FROM DECREASING DUE TO HIGH
TEMPERATURE AND METHOD FOR MAKING THE SAME
Abstract
An LED chip package structure in order to prevent the
light-emitting efficiency of fluorescent powder from decreasing due
to high temperature includes a substrate unit, a light-emitting
unit, a transparent colloid body unit, a fluorescent colloid body
unit and a frame unit. The light-emitting unit has a plurality of
LED chips electrically arranged on the substrate unit. The
transparent colloid body unit has a plurality of transparent
colloid bodies respectively covering the LED chips. The fluorescent
colloid body unit has a plurality of fluorescent colloid bodies
respectively covering the transparent colloid bodies. The frame
unit is covering the peripheries of each transparent colloid body
and each fluorescent colloid body in order to expose the top
surfaces of the fluorescent colloid body.
Inventors: |
WANG; BILY; (HSINCHU CITY,
TW) ; WU; SHIH-YU; (TAIPEI COUNTY, TW) ; WU;
WEN-KUEI; (HSINCHU COUNTY, TW) |
Assignee: |
HARVATEK CORPORATION
HSINCHU CITY
TW
|
Family ID: |
41052894 |
Appl. No.: |
13/087504 |
Filed: |
April 15, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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12232931 |
Sep 26, 2008 |
|
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13087504 |
|
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Current U.S.
Class: |
438/29 ;
257/E33.061 |
Current CPC
Class: |
H01L 2933/0041 20130101;
H01L 2224/48091 20130101; H01L 2224/48091 20130101; H01L 25/0753
20130101; H01L 33/507 20130101; H01L 2924/181 20130101; H01L
2924/181 20130101; H01L 2924/00012 20130101; H01L 2924/00014
20130101; H01L 33/60 20130101 |
Class at
Publication: |
438/29 ;
257/E33.061 |
International
Class: |
H01L 33/44 20100101
H01L033/44 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 7, 2008 |
TW |
97108013 |
Claims
1. A method for making an LED chip package structure in order to
prevent the light-emitting efficiency of fluorescent powder from
decreasing due to high temperature, comprising: providing a
substrate unit; electrically arranging a plurality of LED chips on
the substrate unit via a matrix method to form a plurality of
longitudinal LED chip rows; longitudinally and respectively
covering the longitudinal LED chip rows with a plurality of
elongated transparent colloid bodies; and longitudinally and
respectively covering the whole elongated transparent colloid
bodies with a plurality of elongated fluorescent colloid
bodies.
2. The method as claimed in claim 1, wherein the substrate unit is
a PCB (Printed Circuit Board), a flexible substrate, an aluminum
substrate, a ceramic substrate, or a copper substrate.
3. The method as claimed in claim 1, wherein the substrate unit has
a substrate body, and a positive trace and a negative trace
respectively formed on the substrate body, and the substrate body
has a metal layer and a Bakelite layer formed on the metal
layer.
4. The method as claimed in claim 3, wherein each LED chip has a
positive side and a negative side respectively and electrically
connected with the positive trace and the negative trace of the
substrate unit, and both the positive trace and the negative trace
are aluminum circuits or silver circuits.
5. The method as claimed in claim 1, wherein the elongated
transparent colloid bodies are formed by a first mold unit, the
first mold unit is composed of a first upper mold and a first lower
mold for supporting the substrate unit, the first upper mold has a
plurality of first channels corresponding to the longitudinal LED
chip rows, and the height and the width of each first channel are
equal to the height and the width of each elongated transparent
colloid body.
6. The method as claimed in claim 1, wherein the elongated
fluorescent colloid bodies are formed by a second mold unit, the
second mold unit is composed of a second upper mold and a second
lower mold for supporting the substrate unit, the second upper mold
has a plurality of second channels corresponding to the elongated
transparent colloid bodies, and the height and the width of each
second channel are equal to the height and the width of each
elongated fluorescent colloid body.
7. The method as claimed in claim 1, wherein each elongated
fluorescent colloid body is formed by mixing silicon and
fluorescent powders or by mixing epoxy and fluorescent powders.
8. The method as claimed in claim 1, further comprising:
transversely cutting the elongated transparent colloid bodies, the
elongated fluorescent colloid bodies and the substrate unit along a
line between each two adjacent and longitudinal LED chips to form a
plurality of light bars, wherein each light bar has a plurality of
transparent colloid bodies that are separated from each other and
respectively covering the LED chips and a plurality of fluorescent
colloid bodies that are separated from each other and respectively
covering the transparent colloid bodies.
9. A method for making an LED chip package structure in order to
prevent the light-emitting efficiency of fluorescent powder from
decreasing due to high temperature, comprising: providing a
substrate unit; electrically arranging a plurality of LED chips on
the substrate unit via a matrix method to form a plurality of
longitudinal LED chip rows; longitudinally and respectively
covering the longitudinal LED chip rows with a plurality of
elongated transparent colloid bodies; longitudinally and
respectively covering the top surfaces of the elongated transparent
colloid bodies with a plurality of elongated fluorescent colloid
bodies; and transversely cutting the elongated transparent colloid
bodies and the elongated fluorescent colloid bodies along a line
between each two adjacent and longitudinal LED chips to form a
plurality of transparent colloid bodies that are separated from
each other and respectively covering the LED chips and a plurality
of fluorescent colloid bodies that are separated from each other
and respectively covering the transparent colloid bodies.
10. The method as claimed in claim 9, further comprising: covering
the substrate unit with a frame unit via a third mold unit, wherein
the frame unit is formed around the peripheries of each transparent
colloid body and each fluorescent colloid body; and transversely
cutting the frame unit and the substrate unit along a line between
each two adjacent and longitudinal LED chips to form a plurality of
light bars, wherein each light bar has a frame layer covering the
peripheries of each transparent colloid body and each fluorescent
colloid body.
11. The method as claimed in claim 10, wherein the third mold unit
is composed of a third upper mold and a third lower mold for
supporting the substrate unit, the third upper mold has a third
channel corresponding to the frame unit, the height of the third
channel is equal to the distance from the top side of the substrate
unit to the top side of the fluorescent colloid body, the width of
the third channel is equal to the width of the frame unit.
12. The method as claimed in claim 10, wherein the frame layer is
an opaque frame layer, and the opaque frame layer is a white frame
layer.
13. The method as claimed in claim 9, further comprising: covering
the substrate unit with a plurality of elongated frame layers via a
fourth mold unit, wherein each elongated frame layers are
longitudinally formed around the peripheries of each transparent
colloid body and each fluorescent colloid body; and transversely
cutting the elongated frame layer and the substrate unit along a
line between each two adjacent and longitudinal LED chips to form a
plurality of light bars, wherein each light bar has a plurality of
frame bodies each covering the peripheries of each transparent
colloid body and each fluorescent colloid body.
14. The method as claimed in claim 13, wherein the fourth mold unit
is composed of a fourth upper mold and a fourth lower mold for
supporting the substrate unit, the fourth upper mold has a
plurality of fourth channels corresponding to the longitudinal LED
chip rows, the height of the fourth channel is equal to the
distance from the top side of the substrate unit to the top side of
the fluorescent colloid body, the width of the fourth channels is
larger than the width of each transparent colloid body or each
fluorescent colloid body.
15. The method as claimed in claim 13, wherein each frame body is
an opaque frame body, and the opaque frame body is a white frame
body.
16. The method as claimed in claim 9, wherein the top surface of
each transparent colloid body is a cambered colloid surface and the
front surface of each transparent colloid body has a
light-outputting colloid surface formed in front of its cambered
colloid surface, and the fluorescent colloid bodies are
respectively covering the light-outputting colloid surfaces of the
transparent colloid bodies.
17. The method as claimed in claim 16, further comprising: forming
a plurality of frame bodies each formed on the cambered colloid
surface of each transparent colloid body.
Description
RELATED APPLICATIONS
[0001] This application is a Divisional patent application of
co-pending application Ser. No. 12/232,931, filed on 26 Sep. 2008,
now pending. The entire disclosure of the prior application Ser.
No. 12/323,931, from which an oath or declaration is supplied, is
considered a part of the disclosure of the accompanying Divisional
application and is hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an LED chip package
structure and a method of packaging the same, and particularly
relates to an LED chip package structure in order to prevent the
light-emitting efficiency of fluorescent powder from decreasing due
to high temperature and a method for making the same.
[0004] 2. Description of the Related Art
[0005] Referring to FIG. 1, a known first method for packaging LED
chips is shown. The known first method includes: providing a
plurality of LEDs that have been packaged (S800); providing an
elongated substrate body that has a positive trace and a negative
trace (S802); and then, arranging each LED on the elongated
substrate body in sequence and electrically connecting a positive
electrode side and a negative electrode side of each LED with the
positive trace and the negative trace of the substrate body
(S804).
[0006] Referring to FIG. 2, a known second method for packaging LED
chips is shown. The known second method includes: providing an
elongated substrate body that has a positive trace and a negative
trace (S900); arranging a plurality of LED chips on the elongated
substrate body in sequence and electrically connecting a positive
electrode side and a negative electrode side of each LED chip with
the positive trace and the negative trace of the substrate body
(S902); and then, covering the substrate body and the LED chips
with an elongated fluorescent colloid body to form a light bar with
an elongated light-emitting area (S904).
[0007] However, With regards to the known first method, each LED
needs to be firstly cut from an entire LED package structure, and
then each LED is arranged on the elongated substrate body via SMT
process. Hence, the known first packaging process is
time-consuming. Moreover, because the fluorescent colloid bodies
are separated from each other, a dark band is easily produced
between the two fluorescent colloid bodies and the two LEDs. Hence,
the known LED package structure does not offer a good display for
users. Moreover, because the fluorescent colloid bodies of the LEDs
are separated from each other, a dark band is easily produced
between each two fluorescent colloid bodies and each two LEDs.
Hence, the known first LED package structure does not offer a good
display for users.
[0008] With regards to the known second method, because the light
bar produces the elongated light-emitting area, no dark band is
produced. However, the triggered area of the elongated fluorescent
body is not uniform, so the light-emitting efficiency of the light
bar is not good. In other words, one partial package area of the
elongated fluorescent body close to the LED chips generates a
stronger triggered light, and the other partial package area of the
elongated fluorescent body separated from the LED chips generates a
weaker triggered light.
[0009] Moreover, when fluorescent colloid bodies are directly
formed on the LED chips, the heat generated by the LED chips
reduces the quality of the fluorescent colloid bodies. Hence, the
light-emitting efficiency of the fluorescent colloid bodies is
decreased due to high temperature of the LED chips.
SUMMARY OF THE INVENTION
[0010] The present invention provides an LED chip package structure
in order to prevent the light-emitting efficiency of fluorescent
powder from decreasing due to high temperature and a method for
making the same. When the LED chip package structure of the present
invention lights up, the LED chip package structure generates a
series of light-generating areas on a colloid body unit. Because
the series of light-generating areas is continuous, no dark bands
are produced between each two LED chips. Furthermore, because the
LED chips are arranged on a substrate body via a COB (Chip On
Board) method and a hot pressing method, the process for the LED
chip package structure is simple and less time is needed for the
manufacturing process.
[0011] Moreover, because fluorescent colloid bodies cannot directly
touch the LED chips, the present invention can prevent the
light-emitting efficiency of fluorescent powder from decreasing due
to high temperature.
[0012] Furthermore, the LED chip package structure can be applied
to any type of light source such as a back light module, a
decorative lamp, a lighting lamp, or a scanner.
[0013] A first aspect of the present invention is a method for
making an LED chip package structure in order to prevent the
light-emitting efficiency of fluorescent powder from decreasing due
to high temperature, comprising: providing a substrate unit;
electrically arranging a plurality of LED chips on the substrate
unit via a matrix method to form a plurality of longitudinal LED
chip rows; longitudinally and respectively covering the
longitudinal LED chip rows with a plurality of elongated
transparent colloid bodies; longitudinally and respectively
covering the whole elongated transparent colloid bodies with a
plurality of elongated fluorescent colloid bodies; and transversely
cutting the elongated transparent colloid bodies, the elongated
fluorescent colloid bodies and the substrate unit along a line
between each two adjacent and longitudinal LED chips to form a
plurality of light bars, and each light bar having a plurality of
transparent colloid bodies that are separated from each other and
respectively covering the LED chips and a plurality of fluorescent
colloid bodies that are separated from each other and respectively
covering the transparent colloid bodies.
[0014] A second aspect of the present invention is an LED chip
package structure in order to prevent the light-emitting efficiency
of fluorescent powder from decreasing due to high temperature,
comprising: a substrate unit, a light-emitting unit, a transparent
colloid body unit, a fluorescent colloid body unit and a frame
unit.
[0015] Moreover, the light-emitting unit has a plurality of LED
chips electrically arranged on the substrate unit. The transparent
colloid body unit has a plurality of transparent colloid bodies
respectively covering the LED chips. The fluorescent colloid body
unit has a plurality of fluorescent colloid bodies respectively
covering the transparent colloid bodies. The frame unit is covering
the peripheries of each transparent colloid body and each
fluorescent colloid body in order to expose the top surfaces of the
fluorescent colloid body.
[0016] Therefore, because the series of light-generating areas are
continuous, no dark bands are produced between each two LED chips.
Furthermore, because the LED chips are arranged on the substrate
body via a COB (Chip On Board) method and a hot pressing method,
the process of the present invention is simple and so reduces the
required manufacturing time.
[0017] It is to be understood that both the foregoing general
description and the following detailed description are exemplary,
and are intended to provide further explanation of the invention as
claimed. Other advantages and features of the invention will be
apparent from the following description, drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The various objects and advantages of the present invention
will be more readily understood from the following detailed
description when read in conjunction with the appended drawings, in
which:
[0019] FIG. 1 is a flowchart of a first method for making LED chips
of the prior art;
[0020] FIG. 2 is a flowchart of a second method for making LED
chips of the prior art;
[0021] FIG. 3 is a flowchart of a method for making an LED chip
package structure according to the first embodiment of the present
invention;
[0022] FIGS. 3a to 3e are perspective, schematic diagrams of a
packaging process according to the first embodiment of the present
invention, respectively;
[0023] FIGS. 3A to 3E are cross-sectional diagrams of a packaging
process according to the first embodiment of the present invention,
respectively;
[0024] FIG. 4 is a schematic view of LED chips electrically
connected on a substrate body via a flip-chip method;
[0025] FIG. 5 is a flowchart of a method for making an LED chip
package structure according to the second embodiment of the present
invention;
[0026] FIGS. 5a to 5d are partial perspective, schematic diagrams
of a packaging process according to the second embodiment of the
present invention, respectively;
[0027] FIGS. 5A to 5D are partial cross-sectional diagrams of a
packaging process according to the second embodiment of the present
invention, respectively;
[0028] FIG. 6 is a flowchart of a method for making an LED chip
package structure according to the third embodiment of the present
invention;
[0029] FIGS. 6a to 6b are partial perspective, schematic diagrams
of a packaging process according to the third embodiment of the
present invention, respectively;
[0030] FIGS. 6A to 6B are partial cross-sectional diagrams of a
packaging process according to the third embodiment of the present
invention, respectively;
[0031] FIG. 7a is perspective, schematic diagram of an LED chip
package structure in order to prevent the light-emitting efficiency
of fluorescent powder from decreasing due to high temperature
according to the fourth embodiment of the present invention;
and
[0032] FIG. 7A is a cross-sectional diagram of an LED chip package
structure in order to prevent the light-emitting efficiency of
fluorescent powder from decreasing due to high temperature
according to the fourth embodiment of the present invention.
DETAILED DESCRIPTION OF PREFERRED BEST MOLDS
[0033] Referring to FIGS. 3, 3a to 3e, and 3A to 3E, the first
embodiment of the present invention provides a method for making an
LED chip package structure in order to prevent the light-emitting
efficiency of fluorescent powder from decreasing due to high
temperature.
[0034] The method includes: referring to FIGS. 3a and 3A, providing
a substrate unit 1 that has a substrate body 10, and a positive
trace 11 and a negative trace 12 respectively formed on the
substrate body 10 (S100).
[0035] The substrate body 10 has a metal layer 10A and a Bakelite
layer 10B formed on the metal layer 10A. The substrate unit 1 can
be a PCB (Printed Circuit Board), a flexible substrate, an aluminum
substrate, a ceramic substrate, or a copper substrate according to
different design needs. In addition, both the positive trace 11 and
the negative trace 12 can be aluminum circuits or silver circuits.
The layouts of the positive trace 11 and the negative trace 12 are
determined by different needs.
[0036] Referring to FIGS. 3b and 3B, the method of the first
embodiment further includes: arranging a plurality of LED chips 20
on the substrate body 10 via a matrix method to form a plurality of
longitudinal LED chip rows 2, each LED chip 20 having a positive
side 201 and a negative side 202 respectively and electrically
connected with the positive trace 11 and the negative trace 12 of
the substrate unit 1 (S102).
[0037] In the first embodiment, the positive side 201 and the
negative side 202 of each LED chip 20 are respectively and
electrically connected with the positive trace 11 and the negative
trace 12 of the substrate unit 1 via two corresponding leading
wires W by a wire-bounding method. Moreover, each longitudinal LED
chip row 2 is straightly arranged on the substrate body 10 of the
substrate unit 1. Each LED chip 20 can be a blue LED chip.
[0038] However, the above-mentioned method of electrically
connecting the LED chips 20 should not be used to limit the present
invention. For example, referring to FIG. 4, the positive side 201'
and the negative side 202' of each LED chip 20' respectively and
electrically connected with the positive trace 11' and the negative
trace 12' of the substrate unit 1' via a plurality of corresponding
solder balls B by a flip-chip method. Moreover, according to
different needs, positive sides and negative sides of LED chips
(not shown) can be electrically connected to a positive trace and a
negative trace of a substrate unit (not shown) via parallel,
serial, or parallel and serial method.
[0039] Referring to FIGS. 3c and 3C, the method of the first
embodiment further includes: longitudinally and respectively
covering the longitudinal LED chip rows 2 with a plurality of
elongated transparent colloid bodies 3 via a first mold unit M1
(S104).
[0040] The first mold unit M1 is composed of a first upper mold M11
and a first lower mold M12 for supporting the substrate body 10.
The first upper mold M11 has a plurality of first channels M110
corresponding to the longitudinal LED chip rows 2. In addition, the
height and the width of each first channel M110 are equal to the
height and the width of each elongated transparent colloid body
3.
[0041] Moreover, referring to FIGS. 3d and 3D, the method of the
first embodiment further includes: longitudinally and respectively
covering the whole elongated transparent colloid bodies 3 with a
plurality of elongated fluorescent colloid bodies 4 via a second
mold unit M2 (S106).
[0042] The second mold unit M2 is composed of a second upper mold
M21 and a second lower mold M22 for supporting the substrate body
10. The second upper mold M21 has a plurality of second channels
M210 corresponding to the elongated transparent colloid bodies 3.
The height and the width of each second channel M210 are equal to
the height and the width of each elongated fluorescent colloid body
4. Moreover, according to different needs, each elongated
fluorescent colloid body 3 can be formed by mixing silicon and
fluorescent powders or by mixing epoxy and fluorescent powders.
[0043] Finally, Referring to FIGS. 3d, 3e and 3E, the method of the
first embodiment further includes: transversely cutting the
elongated transparent colloid bodies 3, the elongated fluorescent
colloid bodies 4 and the substrate body 10 along a line between
each two adjacent and longitudinal LED chips 20 to form a plurality
of light bars L1, and each light bar L1 having a plurality of
transparent colloid bodies 30 that are separated from each other
and respectively covering the LED chips 20 and a plurality of
fluorescent colloid bodies 40 that are separated from each other
and respectively covering the transparent colloid bodies 30
(S108).
[0044] Referring to FIGS. 5, 5a to 5d, and 5A to 5D, the steps S200
to S204 of the second embodiment are same as the steps S100 to S104
of the first embodiment. In other words, the illustration of S200
is the same as FIGS. 3a and 3A of the first embodiment, the
illustration of S202 is the same as FIGS. 3b and 3B of the first
embodiment, and the illustration of S204 is the same as FIGS. 3c
and 3C of the first embodiment.
[0045] After the step of S204, referring to FIGS. 5a and 5A, the
method of the second embodiment further includes: longitudinally
and respectively covering the top surfaces of the elongated
transparent colloid bodies 3' with a plurality of elongated
fluorescent colloid bodies 4' (S206).
[0046] Referring to FIGS. 5b and 5B, the method of the second
embodiment further includes: transversely cutting the elongated
transparent colloid bodies 3' and the elongated fluorescent colloid
bodies 4' along a line between each two adjacent and longitudinal
LED chips 20 to form a plurality of transparent colloid bodies 30'
that are separated from each other and respectively covering the
LED chips 20 and a plurality of fluorescent colloid bodies 40' that
are separated from each other and respectively covering the
transparent colloid bodies 30' (S208).
[0047] Furthermore, referring to FIGS. 5c and 5C, the method of the
second embodiment further includes: covering substrate body 10 with
a frame unit 5 via a third mold unit M3, and the frame unit 5
formed around the peripheries of each transparent colloid body 30'
and each fluorescent colloid body 40' (S210). The third mold unit
M3 is composed of a third upper mold M31 and a third lower mold M32
for supporting the substrate body 10. The third upper mold M31 has
a third channel M310 corresponding to the frame unit 5. The height
of the third channel M310 is equal to the distance from the top
side of the substrate body 10 to the top side of the fluorescent
colloid body 40', and the width of the third channel M310 is equal
to the width of the frame unit 5.
[0048] Finally, referring to FIGS. 5c, 5d and 5D, the method of the
second embodiment further includes: transversely cutting the frame
unit 5 and the substrate body 10 along a line between each two
adjacent and longitudinal LED chips 20 to form a plurality of light
bars L2, and each light bar L2 having a frame layer 50 covering the
peripheries of each transparent colloid body 30' and each
fluorescent colloid body 40' (S212). In addition, the frame layer
50 can be an opaque frame layer, and the opaque frame layer is a
white frame layer.
[0049] Referring to FIGS. 6, 6a to 6b, and 6A to 6B, the steps S300
to S304 of the third embodiment are same as the steps S100 to S104
of the first embodiment, and the step of S306 of the third
embodiment is same as the step of S206 of the second embodiment. In
other words, the illustration of S300 is the same as FIGS. 3a and
3A of the first embodiment, the illustration of S302 is the same as
FIGS. 3b and 3B of the first embodiment, the illustration of S304
is the same as FIGS. 3c and 3C of the first embodiment, and the
illustration of S306 is the same as FIGS. 5a and 5A of the second
embodiment.
[0050] After the step of S306, referring to FIGS. 6a and 6A, the
method of the third embodiment further includes: covering substrate
body 10 with a plurality of elongated frame layers 5' via a fourth
mold unit M4, and each elongated frame layers 5' longitudinally
formed around the peripheries of each transparent colloid body 30'
and each fluorescent colloid body 40' (S308). Moreover, the fourth
mold unit M4 is composed of a fourth upper mold M41 and a fourth
lower mold M42 for supporting the substrate body 10. The fourth
upper mold M41 has a plurality of fourth channels M410
corresponding to the longitudinal LED chip rows 2. The height of
the fourth channel M410 is equal to the distance from the top side
of the substrate body 10 to the top side of the fluorescent colloid
body 40', and the width of the fourth channels M410 is larger than
the width of each transparent colloid body 30' or each fluorescent
colloid body 40'.
[0051] Finally, referring to FIGS. 6a, 6b, and 6B, the method of
the third embodiment further includes: transversely cutting the
elongated frame layer 5' and the substrate body 10 along a line
between each two adjacent and longitudinal LED chips 20 to form a
plurality of light bars L3, and each light bar L3 having a
plurality of frame bodies 50' each covering the peripheries of each
transparent colloid body 30' and each fluorescent colloid body 40'
(S310). Moreover, each frame body 50' can be an opaque frame body,
and the opaque frame body is a white frame body.
[0052] Referring to FIGS. 7a and 7A, each light bar L4 has a
plurality of LED chips 20 electrically disposed on a substrate body
10. Each transparent colloid body 30'' is formed on each LED chip
20. In addition, the top surface of each transparent colloid body
30'' is a cambered colloid surface 300'' and the front surface of
each transparent colloid body 30'' has a light-outputting colloid
surface 301'' formed in front of its cambered colloid surface
300''. Each fluorescent colloid body 40'' is covering the
light-outputting colloid surfaces 301'' of the transparent colloid
bodies 30''. Each frame body 50'' is formed on the cambered colloid
surface 300'' of each transparent colloid body 30''.
[0053] In conclusion, when the LED chip package structure of the
present invention lights up, the LED chip package structure
generates a series of light-generating areas on a colloid body
unit. Because the series of light-generating areas is continuous,
no dark bands are produced between each two LED chips. Furthermore,
because the LED chips are arranged on a substrate body via a COB
(Chip On Board) method and a hot pressing method, the process of
the LED chip package structure is simple and therefore reduces the
required manufacturing time. Furthermore, the LED chip package
structure can be applied to any type of light source such as a back
light module, a decorative lamp, a lighting lamp, or a scanner.
[0054] Although the present invention has been described with
reference to the preferred best molds thereof, it will be
understood that the invention is not limited to the details
thereof. Various substitutions and modifications have been
suggested in the foregoing description, and others will occur to
those of ordinary skill in the art. Therefore, all such
substitutions and modifications are intended to be embraced within
the scope of the invention as defined in the appended claims.
* * * * *