Wu; Wen-Kuei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Wen-Kuei.The latest application filed is for "pipe joint structure".

Company Profile

0.12.25

Wu; Wen-Kuei - Taichung City TW
Wu; Wen-Kuei - Hukou Township Hsinchu County TW
Wu; Wen-Kuei - Hsinchu County TW
Wu; Wen-Kuei - Hsinchu County 303 TW
Wu; Wen-Kuei - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pipe Joint Structure App 20170051853 - Wu; Wen-Kuei	2017-02-23
LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same Grant 8,198,800 - Wang , et al. June 12, 2	2012-06-12
Strip LED Grant D660,259 - Wang , et al. May 22, 2	2012-05-22
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same Grant 8,183,065 - Wang , et al. May 22, 2	2012-05-22
LED chip package structure with multifunctional integrated chips and a method for making the same Grant 8,162,510 - Wang , et al. April 24, 2	2012-04-24
LED chip package structure with different LED spacings and a method for making the same Grant 8,138,508 - Wang , et al. March 20, 2	2012-03-20
Led Chip Package Structure With A High-efficiency Heat-dissipating Substrate And Method For Making The Same App 20120049212 - WANG; BILY ; et al.	2012-03-01
Method Of Manufacturing A Led Chip Package Structure App 20120009700 - WANG; BILY ; et al.	2012-01-12
Led Chip Package Structure App 20120001203 - WANG; BILY ; et al.	2012-01-05
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same Grant 8,017,969 - Wang , et al. September 13, 2	2011-09-13
LED chip package structure using a substrate as a lampshade and method for making the same Grant 8,002,436 - Wang , et al. August 23, 2	2011-08-23
Led Chip Package Structure In Order To Prevent The Light-emitting Efficiency Of Fluorescent Powder From Decreasing Due To High Temperature And Method For Making The Same App 20110189803 - WANG; BILY ; et al.	2011-08-04
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof App 20110156061 - Wang; Bily ; et al.	2011-06-30
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof App 20110156083 - Wang; Bily ; et al.	2011-06-30
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof App 20110156060 - Wang; Bily ; et al.	2011-06-30
Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof App 20110157868 - Wang; Bily ; et al.	2011-06-30
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,951,621 - Wang , et al. May 31, 2	2011-05-31
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same Grant 7,923,745 - Wang , et al. April 12, 2	2011-04-12
Led Chip Package Structure With High-efficiency Light Emission By Rough Surfaces And Method Of Making The Same App 20110020967 - WANG; BILY ; et al.	2011-01-27
LED chip package structure with high-efficiency light-emitting effect and method of packing the same Grant 7,834,365 - Wang , et al. November 16, 2	2010-11-16
LED chip package structure with high-efficiency light-emitting effect and method for making the same Grant 7,829,901 - Wang , et al. November 9, 2	2010-11-09
Method for calculating out an optimum arrangement pitch between each two LED chip package units Grant 7,815,346 - Wang , et al. October 19, 2	2010-10-19
LED chip package structure with high-efficiency light-emitting effect and method of packaging the same App 20100099207 - Wang; Bily ; et al.	2010-04-22
Led Chip Package Structure Using A Substrate As A Lampshade And Method For Making The Same App 20090261368 - WANG; BILY ; et al.	2009-10-22
LED chip package structure and method for manufacturing the same App 20090246897 - Wang; Bily ; et al.	2009-10-01
LED chip package structure applied to a backlight module and method for making the same App 20090224266 - Wang; Bily ; et al.	2009-09-10
LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same App 20090224265 - Wang; Bily ; et al.	2009-09-10
LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same App 20090224653 - Wang; Bily ; et al.	2009-09-10
Led chip package structure with multifunctional integrated chips and a method for making the same App 20090212304 - Wang; Bily ; et al.	2009-08-27
Method for calculating out an optimum arrangement pitch between each two LED chip package units App 20090213378 - Wang; Bily ; et al.	2009-08-27
LED chip package structure with different LED spacings and a method for making the same App 20090206350 - Wang; Bily ; et al.	2009-08-20
LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same App 20090152570 - Wang; Bily ; et al.	2009-06-18
Led chip package structure with high-efficiency light-emitting effect and method for making the same App 20090146156 - Wang; Bily ; et al.	2009-06-11
LED chip package structure with high-efficiency light-emitting effect and method of packing the same App 20090065789 - Wang; Bily ; et al.	2009-03-12
Led Chip Package Structure With High-efficiency Light-emitting Effect And Method Of Packaging The Same App 20090020770 - Wang; Bily ; et al.	2009-01-22
LED chip package structure and method for manufacturing the same App 20080012035 - Wang; Bily ; et al.	2008-01-17

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