Dadvand; Nazila
Patent Applications and Registrations
Patent applications and USPTO patent grants for Dadvand; Nazila.The latest application filed is for "hexagonal boron nitride structures".
Company Profile
62.47.74
- Dadvand; Nazila - Richardson TX
- Dadvand; Nazila - Sunnyvale CA
- Dadvand; Nazila - SANTA CLARA CA
- Dadvand; Nazila - Worcester MA
- Dadvand; Nazila - The Woodlands TX
- Dadvand; Nazila - Gatineau N/A CA
- Dadvand; Nazila - Newtonville MA
- Dadvand; Nazila - Montreal CA
Patent Activity
| Patent | Date |
|---|---|
| Zinc layer for a semiconductor die pillar Grant 11,443,996 - Dadvand , et al. September 13, 2 | 2022-09-13 |
| Hexagonal Boron Nitride Structures App 20220250909 - COLOMBO; Luigi ; et al. | 2022-08-11 |
| Brass-coated metals in flip-chip redistribution layers Grant 11,410,947 - Sridharan , et al. August 9, 2 | 2022-08-09 |
| Multi-layered SP.sup.2-bonded carbon tubes Grant 11,390,527 - Cook , et al. July 19, 2 | 2022-07-19 |
| Semiconductor Package With Nickel-silver Pre-plated Leadframe App 20220208665 - Dadvand; Nazila ; et al. | 2022-06-30 |
| Thermally Conductive Wafer Layer App 20220208640 - Cook; Benjamin Stassen ; et al. | 2022-06-30 |
| Hexagonal boron nitride structures Grant 11,370,662 - Colombo , et al. June 28, 2 | 2022-06-28 |
| Nanoparticle matrix for backside heat spreading Grant 11,355,414 - Cook , et al. June 7, 2 | 2022-06-07 |
| Filler Particles For Polymers App 20220169773 - DADVAND; Nazila ; et al. | 2022-06-02 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20220173062 - DADVAND; Nazila ; et al. | 2022-06-02 |
| Multi-super lattice for switchable arrays Grant 11,309,388 - Cook , et al. April 19, 2 | 2022-04-19 |
| Leadless packaged device with metal die attach Grant 11,282,770 - Cook , et al. March 22, 2 | 2022-03-22 |
| Filler particles for polymers Grant 11,254,775 - Dadvand , et al. February 22, 2 | 2022-02-22 |
| Semiconductor Die With Conversion Coating App 20220005760 - Dadvand; Nazila ; et al. | 2022-01-06 |
| Multi-pitch Leads App 20210375729 - Koduri; Sreenivasan K. ; et al. | 2021-12-02 |
| Lattice bump interconnect Grant 11,145,598 - Cook , et al. October 12, 2 | 2021-10-12 |
| Nanostructure barrier for copper wire bonding Grant 11,127,515 - Dadvand , et al. September 21, 2 | 2021-09-21 |
| Semiconductor die with conversion coating Grant 11,121,076 - Dadvand , et al. September 14, 2 | 2021-09-14 |
| Zinc-cobalt Barrier For Interface In Solder Bond Applications App 20210280547 - Dadvand; Nazila ; et al. | 2021-09-09 |
| Nickel lanthanide alloys for MEMS packaging applications Grant 11,091,366 - Dadvand , et al. August 17, 2 | 2021-08-17 |
| Multi-pitch leads Grant 11,094,616 - Koduri , et al. August 17, 2 | 2021-08-17 |
| NIckel Alloy for Semiconductor Packaging App 20210242151 - Dadvand; Nazila ; et al. | 2021-08-05 |
| Metal-graphene structures forming a lattice of interconnected segments Grant 11,063,120 - Colombo , et al. July 13, 2 | 2021-07-13 |
| Quad Flat No-Lead Package with Wettable Flanges App 20210210419 - Dadvand; Nazila | 2021-07-08 |
| Brass-coated Metals In Flip-chip Redistribution Layers App 20210193600 - SRIDHARAN; Vivek Swaminathan ; et al. | 2021-06-24 |
| Nickel alloy for semiconductor packaging Grant 11,011,483 - Dadvand , et al. May 18, 2 | 2021-05-18 |
| Zinc-cobalt barrier for interface in solder bond applications Grant 11,011,488 - Dadvand , et al. May 18, 2 | 2021-05-18 |
| Semiconductor Device With Metal Die Attach To Substrate With Multi-size Cavity App 20210125902 - Cook; Benjamin Stassen ; et al. | 2021-04-29 |
| Nanoparticle Matrix For Backside Heat Spreading App 20210098331 - Cook; Benjamin Stassen ; et al. | 2021-04-01 |
| Multi-chip package with high thermal conductivity die attach Grant 10,957,635 - Dadvand , et al. March 23, 2 | 2021-03-23 |
| Quad flat no-lead package with wettable flanges Grant 10,957,637 - Dadvand March 23, 2 | 2021-03-23 |
| Multi-pitch Leads App 20210050287 - KODURI; Sreenivasan K. ; et al. | 2021-02-18 |
| Contact Fabrication To Mitigate Undercut App 20210028060 - Dadvand; Nazila ; et al. | 2021-01-28 |
| Leadless Packaged Device With Metal Die Attach App 20210013133 - Cook; Benjamin Stassen ; et al. | 2021-01-14 |
| Microelectronic Device With Solder-free Plated Leads App 20210013167 - Dadvand; Nazila | 2021-01-14 |
| Semiconductor device with metal die attach to substrate with multi-size cavity Grant 10,892,209 - Cook , et al. January 12, 2 | 2021-01-12 |
| Semiconductor Die With Conversion Coating App 20200411429 - Dadvand; Nazila ; et al. | 2020-12-31 |
| Multi-super Lattice For Switchable Arrays App 20200381517 - Cook; Benjamin Stassen ; et al. | 2020-12-03 |
| Plating For Thermal Management App 20200365483 - Dadvand; Nazila ; et al. | 2020-11-19 |
| Semiconductor device with vias having a zinc-second metal-copper composite layer Grant 10,840,185 - Dadvand November 17, 2 | 2020-11-17 |
| Leadless Packaged Device With Metal Die Attach App 20200357725 - Cook; Benjamin Stassen ; et al. | 2020-11-12 |
| Packaged Multichip Device With Stacked Die Having A Metal Die Attach App 20200357726 - Dadvand; Nazila ; et al. | 2020-11-12 |
| Packaged multichip device with stacked die having a metal die attach Grant 10,832,993 - Dadvand , et al. November 10, 2 | 2020-11-10 |
| Leadless packaged device with metal die attach Grant 10,832,991 - Cook , et al. November 10, 2 | 2020-11-10 |
| Dissimilar material interface having lattices Grant 10,804,201 - Venugopal , et al. October 13, 2 | 2020-10-13 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20200321299 - DADVAND; Nazila ; et al. | 2020-10-08 |
| Contact fabrication to mitigate undercut Grant 10,796,956 - Dadvand , et al. October 6, 2 | 2020-10-06 |
| Semiconductor Device With Metal Die Attach To Substrate With Multi-size Cavity App 20200312747 - Cook; Benjamin Stassen ; et al. | 2020-10-01 |
| Multi-chip Package With High Thermal Conductivity Die Attach App 20200303285 - Dadvand; Nazila ; et al. | 2020-09-24 |
| Semiconductor Device With Vias Having A Zinc-second Metal-copper Composite Layer App 20200286837 - Dadvand; Nazila | 2020-09-10 |
| Semiconductor Device With Electroplated Copper Structures App 20200286844 - Johnson; Keith Edward ; et al. | 2020-09-10 |
| Multi-super lattice for switchable arrays Grant 10,748,999 - Cook , et al. A | 2020-08-18 |
| Nanostructure Barrier For Copper Wire Bonding App 20200251257 - Kind Code | 2020-08-06 |
| NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION App 20200248329 - Kind Code | 2020-08-06 |
| Plating for thermal management Grant 10,734,304 - Dadvand , et al. | 2020-08-04 |
| Semiconductor device with electroplated die attach Grant 10,714,417 - Dadvand , et al. | 2020-07-14 |
| Electronic device having cobalt coated aluminum contact pads Grant 10,714,439 - Dadvand , et al. | 2020-07-14 |
| Quad Flat No-Lead Package with Wettable Flanges App 20200219801 - Dadvand; Nazila | 2020-07-09 |
| Multi-super Lattice For Switchable Arrays App 20200203483 - COOK; Benjamin Stassen ; et al. | 2020-06-25 |
| Multilayers of nickel alloys as diffusion barrier layers Grant 10,692,830 - Dadvand , et al. | 2020-06-23 |
| Semiconductor Device With Electroplated Die Attach App 20200185318 - Dadvand; Nazila ; et al. | 2020-06-11 |
| Die Attach Surface Copper Layer With Protective Layer For Microelectronic Devices App 20200185309 - Manack; Christopher Daniel ; et al. | 2020-06-11 |
| Conversion coating and method of making Grant 10,676,828 - Dadvand , et al. | 2020-06-09 |
| Nickel Lanthanide Alloys For Mems Packaging Applications App 20200165124 - Dadvand; Nazila ; et al. | 2020-05-28 |
| Modified Nitride Particles, Oligomer Functionalized Nitride Particles, Polymer Based Composites And Methods Of Forming Thereof App 20200165418 - DADVAND; Nazila ; et al. | 2020-05-28 |
| Plating For Thermal Management App 20200161210 - Dadvand; Nazila ; et al. | 2020-05-21 |
| Nanostructure barrier for copper wire bonding Grant 10,629,334 - Dadvand , et al. | 2020-04-21 |
| Coated Articles, Electrodeposition Baths, And Related Systems App 20200115815 - Dadvand; Nazila ; et al. | 2020-04-16 |
| Semiconductor device with electroplated die attach Grant 10,607,931 - Dadvand , et al. | 2020-03-31 |
| Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof Grant 10,584,231 - Dadvand , et al. | 2020-03-10 |
| Die attach surface copper layer with protective layer for microelectronic devices Grant 10,566,267 - Manack , et al. Feb | 2020-02-18 |
| Zinc-cobalt Barrier For Interface In Solder Bond Applications App 20200051939 - Dadvand; Nazila ; et al. | 2020-02-13 |
| Nickel lanthanide alloys for mems packaging applications Grant 10,544,034 - Dadvand , et al. Ja | 2020-01-28 |
| Nickel Lanthanide Alloys For Mems Packaging Applications App 20200024130 - DADVAND; Nazila ; et al. | 2020-01-23 |
| Alloy Diffusion Barrier Layer App 20200020656 - Dadvand; Nazila ; et al. | 2020-01-16 |
| Semiconductor Device With Electroplated Die Attach App 20200013709 - DADVAND; NAZILA ; et al. | 2020-01-09 |
| Contact Fabrication To Mitigate Undercut App 20200006134 - Dadvand; Nazila ; et al. | 2020-01-02 |
| Zinc-cobalt barrier for interface in solder bond applications Grant 10,453,817 - Dadvand , et al. Oc | 2019-10-22 |
| Alloy diffusion barrier layer Grant 10,424,552 - Dadvand , et al. Sept | 2019-09-24 |
| Nickel Alloy for Semiconductor Packaging App 20190259717 - Dadvand; Nazila ; et al. | 2019-08-22 |
| Dissimilar Material Interface Having Lattices App 20190206793 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
| Metal-graphene Structures App 20190207002 - COLOMBO; Luigi ; et al. | 2019-07-04 |
| Lattice Bump Interconnect App 20190206788 - COOK; Benjamin Stassen ; et al. | 2019-07-04 |
| Hall Sensor Array App 20190204395 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
| Hexagonal Boron Nitride Structures App 20190202696 - COLOMBO; Luigi ; et al. | 2019-07-04 |
| Multi-layered Sp2-bonded Carbon Tubes App 20190202700 - COOK; Benjamin Stassen ; et al. | 2019-07-04 |
| Filler Particles For Polymers App 20190202958 - DADVAND; Nazila ; et al. | 2019-07-04 |
| Gas Sensor With Superlattice Structure App 20190204252 - VENUGOPAL; Archana ; et al. | 2019-07-04 |
| SP2-Bonded Carbon Structures App 20190202174 - COLOMBO; Luigi ; et al. | 2019-07-04 |
| Die Attach Surface Copper Layer With Protective Layer For Microelectronic Devices App 20190109074 - Manack; Christopher Daniel ; et al. | 2019-04-11 |
| Zinc Layer For A Semiconductor Die Pillar App 20190109062 - Dadvand; Nazila ; et al. | 2019-04-11 |
| Multilayers Of Nickel Alloys As Diffusion Barrier Layers App 20190109109 - DADVAND; Nazila ; et al. | 2019-04-11 |
| Alloy Diffusion Barrier Layer App 20190088608 - Dadvand; Nazila ; et al. | 2019-03-21 |
| Nanostructure Barrier For Copper Wire Bonding App 20190088389 - Dadvand; Nazila ; et al. | 2019-03-21 |
| Coated Articles, Electrodeposition Baths, And Related Systems App 20180163315 - Dadvand; Nazila ; et al. | 2018-06-14 |
| Conversion Coating And Method Of Making App 20180057946 - DADVAND; Nazila ; et al. | 2018-03-01 |
| Coated Articles And Methods App 20180056630 - Dadvand; Nazila ; et al. | 2018-03-01 |
| Modified Nitride Particles, Oligomer Functionalized Nitride Particles, Polymer Based Composites And Methods Of Forming Thereof App 20170190885 - DADVAND; Nazila ; et al. | 2017-07-06 |
| Coated articles and methods Grant 9,694,562 - Dadvand , et al. July 4, 2 | 2017-07-04 |
| Electrodeposition baths, systems and methods Grant 9,631,293 - Lund , et al. April 25, 2 | 2017-04-25 |
| Coated articles and methods Grant 8,936,857 - Dadvand , et al. January 20, 2 | 2015-01-20 |
| Coated Articles And Methods App 20130260176 - Dadvand; Nazila ; et al. | 2013-10-03 |
| Electrodeposition Baths, Systems And Methods App 20130153430 - Lund; Alan C. ; et al. | 2013-06-20 |
| Coated articles and methods Grant 8,445,116 - Dadvand , et al. May 21, 2 | 2013-05-21 |
| Coated Articles, Electrodeposition Baths, And Related Systems App 20120118755 - Dadvand; Nazila ; et al. | 2012-05-17 |
| Coated Articles And Methods App 20120070688 - Dadvand; Nazila ; et al. | 2012-03-22 |
| Electrodeposition Baths, Systems And Methods App 20120043213 - Lund; Alan C. ; et al. | 2012-02-23 |
| Electrodeposition baths, systems and methods Grant 8,071,387 - Lund , et al. December 6, 2 | 2011-12-06 |
| Electrodeposition Baths, Systems And Methods App 20110290651 - Lund; Alan C. ; et al. | 2011-12-01 |
| Electrodeposition Baths And Systems App 20110220511 - Dadvand; Nazila ; et al. | 2011-09-15 |
| Coated Articles And Methods App 20110223442 - Dadvand; Nazila ; et al. | 2011-09-15 |
| Electrodeposition baths, systems and methods Grant 7,951,600 - Lund , et al. May 31, 2 | 2011-05-31 |
| Citrate Analysis For Electrodeposition Methods App 20100255596 - DADVAND; NAZILA ; et al. | 2010-10-07 |
| Metallic structures incorporating bioactive materials and methods for creating the same Grant 7,776,379 - Gertner , et al. August 17, 2 | 2010-08-17 |
| Electrodeposition Baths, Systems And Methods App 20100116675 - Sklar; Glenn ; et al. | 2010-05-13 |
| ELECTRODEPOSITION BATHS, SYSTEMS and METHODS App 20100120159 - Lund; Alan C. ; et al. | 2010-05-13 |
| Metallic structures incorporating bioactive materials and methods for creating the same App 20060062820 - Gertner; Michael E. ; et al. | 2006-03-23 |
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