U.S. patent application number 16/776742 was filed with the patent office on 2020-05-28 for modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof.
The applicant listed for this patent is SAINT-GOBAIN CERAMICS & PLASTICS, INC.. Invention is credited to Nazila DADVAND, Nabil NAHAS.
Application Number | 20200165418 16/776742 |
Document ID | / |
Family ID | 59225473 |
Filed Date | 2020-05-28 |
![](/patent/app/20200165418/US20200165418A1-20200528-C00001.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00002.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00003.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00004.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00005.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00006.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00007.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00008.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00009.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00010.png)
![](/patent/app/20200165418/US20200165418A1-20200528-C00011.png)
View All Diagrams
United States Patent
Application |
20200165418 |
Kind Code |
A1 |
DADVAND; Nazila ; et
al. |
May 28, 2020 |
MODIFIED NITRIDE PARTICLES, OLIGOMER FUNCTIONALIZED NITRIDE
PARTICLES, POLYMER BASED COMPOSITES AND METHODS OF FORMING
THEREOF
Abstract
A surface modified nitride particle including a nitride particle
covalently bonded via a urethane moiety to an aromatic compound.
The surface modified nitride particle may further include at least
two auxiliary moieties for bonding to oligomers.
Inventors: |
DADVAND; Nazila; (Worcester,
MA) ; NAHAS; Nabil; (Mougins, FR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAINT-GOBAIN CERAMICS & PLASTICS, INC. |
Worcester |
MA |
US |
|
|
Family ID: |
59225473 |
Appl. No.: |
16/776742 |
Filed: |
January 30, 2020 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
15392699 |
Dec 28, 2016 |
10584231 |
|
|
16776742 |
|
|
|
|
62273078 |
Dec 30, 2015 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C08K 3/38 20130101; C08K
9/04 20130101; C09C 1/00 20130101; C09C 3/08 20130101; C08K 9/04
20130101; C08K 2003/385 20130101; C08L 9/00 20130101 |
International
Class: |
C08K 9/04 20060101
C08K009/04; C09C 3/08 20060101 C09C003/08; C08K 3/38 20060101
C08K003/38; C09C 1/00 20060101 C09C001/00 |
Claims
1. An oligomer functionalized nitride particle comprising: a
nitride particle; an aromatic compound covalently bonded via a
urethane moiety to the nitride particle; and at least two oligomers
covalently bonded to the aromatic compound via at least two
auxiliary moieties of the aromatic compound.
2. The oligomer functionalized nitride particle of claim 1, wherein
the nitride particle is a boron nitride particle or a silicon
nitride particle.
3. The oligomer functionalized nitride particle of claim 1, wherein
the nitride particle is a hexagonal boron nitride particle.
4. The oligomer functionalized nitride particle of claim 1, wherein
a majority of any moieties connecting the nitride particle and the
aromatic compound are urethane moieties.
5. The oligomer functionalized nitride particle of claim 1, wherein
the aromatic compound comprises at least one aromatic ring, at
least two aromatic rings, at least three aromatic rings.
6. The oligomer functionalized nitride particle of claim 1, wherein
the aromatic compound comprises a phenyl moiety, a biphenyl moiety,
a naphthyl moiety, a phenanthryl moiety, a methylene-diphenyl
moiety, a triphenyl-methane moiety.
7. The oligomer functionalized nitride particle of claim 1, wherein
the aromatic compound comprises a phenyl moiety.
8. The oligomer functionalized nitride particle of claim 1, wherein
the aromatic compound comprises a biphenyl moiety.
9. The oligomer functionalized nitride particle of claim 1, wherein
the at least two auxiliary moieties are amino groups (--NH2),
hydroxyl groups (--OH), fluoro groups (--F), chloro groups (--Cl),
bromo groups (--Br), iodo groups (--I), carboxyl groups (--COOH),
cyano groups (--CN), cyanate groups (--OCN), isocyanate groups
(--NCO), thiol groups (--SH), or thioisocyanate groups (--NCS).
10. The oligomer functionalized nitride particle of claim 1,
wherein the at least two auxiliary moieties are amino groups
(--NH2).
11. The oligomer functionalized nitride particle of claim 1,
wherein the at least two auxiliary moieties are hydroxyl groups
(--OH).
12. The oligomer functionalized nitride particle of claim 1,
wherein the aromatic compound comprises two isocyanate moieties,
three isocyanate moieties, four isocyanate moieties, five
isocyanate moieties.
13. The oligomer functionalized nitride particle of claim 1,
wherein the aromatic compound comprises three isocyanate
moieties.
14. The oligomer functionalized nitride particle of claim 1,
wherein the aromatic compound comprises four isocyanate
moieties.
15. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise silicone/siloxane,
phenolic resin, epoxy resin, poly-butadiene, polyimides, polyester
resin, polyurethane, poly(methyl methacrylate) (PMMA),
Acrylonitrile butadiene styrene (ABS), polylactic acid,
polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polyether sulfone (PES), polysulfone (PS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC),
poly(dimethylsiloxane) or a fluoropolymer.
16. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise silicone/siloxane.
17. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise phenolic resin.
18. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise silicone/siloxane,
phenolic resin, epoxy resin, poly-butadiene, polyimides, polyester
resin, polyurethane, poly(methyl methacrylate) (PMMA),
Acrylonitrile butadiene styrene (ABS), polylactic acid,
polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polyether sulfone (PES), polysulfone (PS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC),
poly(dimethylsiloxane) or a fluoropolymer.
19. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise PTFE, ETFE, FEP, ECTFE
or PFA.
20. The oligomer functionalized nitride particle of claim 1,
wherein the at least two oligomers comprise PTFE.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of and claims priority
under 35 U.S.C. .sctn. 120 to U.S. patent application Ser. No.
15/392,699, entitled "MODIFIED NITRIDE PARTICLES, OLIGOMER
FUNCTIONALIZED NITRIDE PARTICLES, POLYMER BASED COMPOSITES AND
METHODS OF FORMING THEREOF," by Nazila Dadvand et al., filed on
Dec. 28, 2016, which claims priority under 35 U.S.C. .sctn. 119(e)
to U.S. Provisional Application No. 62/273,078, entitled "MODIFIED
NITRIDE PARTICLES, OLIGOMER FUNCTIONALIZED NITRIDE PARTICLES,
POLYMER BASED COMPOSITES AND METHODS OF FORMING THEREOF," by Nazila
Dadvand et al., filed on Dec. 30, 2015, which are assigned to the
current assignee hereof and are incorporated herein by reference in
their entireties.
FIELD OF THE DISCLOSURE
[0002] The following is directed to a method of surface modifying
nitride particles and incorporation of the same in a polymer based
composite. More particularly, the following is directed to a method
of surface modifying boron nitride particles and incorporation of
the same in a polymer based composite.
DESCRIPTION OF THE RELATED ART
[0003] Nitride particles may be utilized as a filler material added
to polymer based composites as thermal fillers, to enhance
mechanical properties of the composites, such as material wear
resistance or peel strength, or as a solid lubricant. However,
nitride particles are very difficult to disperse uniformly within
an organic polymer matrix. Low dispersion of the nitride particles
minimizes any beneficial effect that the filler material may have
in the polymer based composite.
[0004] Accordingly, the industry continues to demand improved
nitride particle filler material that is more dispersible within a
polymer based composite while still maintaining its ability to
improve thermal conductivity, peel strength and other mechanical
properties of the polymer based composite.
SUMMARY
[0005] According to a first aspect, a surface modified nitride
particle may include a nitride particle covalently bonded via a
urethane moiety to an aromatic compound. The surface modified
nitride particle may further include at least two auxiliary
moieties.
[0006] According to another aspect, a method of forming a modified
nitride particle may include activating a nitride particle to form
at least one hydroxyl group and chemically reacting an aromatic
compound with the at least one hydroxyl group on the nitride
particle. The aromatic compound may include at least two auxiliary
moieties.
[0007] According to yet another aspect, an oligomer functionalized
nitride particle may include a nitride particle, an aromatic
compound covalently bonded via a urethane moiety to the nitride
particle and at least two oligomers covalently bonded to the
aromatic compound via at least two auxiliary moieties of the
aromatic compound.
[0008] According to still another aspect, a method of forming an
oligomer functionalized nitride particle may include activating a
nitride particle to form at least one hydroxyl group, chemically
reacting an aromatic compound with the at least one hydroxyl group
on the nitride particle. The aromatic compound may include at least
two auxiliary moieties. The method may further include chemically
reacting at least two oligomers covalently bonded to the aromatic
compound via the at least two auxiliary moieties.
[0009] According to yet another aspect, a polymer based composite
may include at least one polymer component and a modified nitride
filler material dispersed within the polymer component. The
modified nitride filler material may include a nitride particle, an
aromatic compound covalently bonded via a urethane linkage to the
nitride particle and at least two oligomer components covalently
bonded to the aromatic compound.
[0010] According to still another aspect, a method of forming a
polymer based composite may include combining at least one polymer
component with a nitride filler material of oligomer functionalized
nitride particles. The oligomer functionalized nitride particles
may include a nitride particle, an aromatic compound covalently
bonded via a urethane linkage to the nitride particle and at least
two oligomer components covalently bonded to the aromatic
compound.
BRIEF DESCRIPTION OF THE FIGURES
[0011] The present disclosure may be better understood, and its
numerous features and advantages made apparent to those skilled in
the art by referencing the accompanying drawings.
[0012] FIG. 1 includes an illustration of a flow diagram of a
process for forming a modified nitride particle according to
embodiments described herein;
[0013] FIG. 2 includes an illustration of a flow diagram of a
process for forming an oligomer functionalized nitride particle
according to embodiments described herein;
[0014] FIG. 3 includes an illustration of a flow diagram of a
process for forming polymer based composite that includes oligomer
functionalized nitride particles according to embodiments described
herein; and
[0015] FIG. 4 includes a plot comparing the peel strength of a
sample polymer based composite formed according to an embodiment
described herein with two comparison sample polymer based
composites.
[0016] Skilled artisans appreciate that elements in the figures are
illustrated for simplicity and clarity and have not necessarily
been drawn to scale. For example, the dimensions of some of the
elements in the figures may be exaggerated relative to other
elements to help to improve understanding of embodiments of the
invention.
DETAILED DESCRIPTION
[0017] The following is directed to methods of forming a modified
nitride particle, a modified nitride particle, methods of forming
an oligomer functionalized nitride particle, an oligomer
functionalized nitride particle, methods of forming a polymer based
composite including oligomer functionalized nitride particles, and
a polymer based composite including oligomer functionalized nitride
particles.
[0018] Referring first to methods of forming a surface modified
nitride particle, FIG. 1 illustrates a nitride particle surface
modification process 100. Surface nitride particle modification
process 100 may include a first step 110 of providing a nitride
particle, a second step 120 of activating the surface of the
nitride particle by creating at least one hydroxyl group, a third
step 130 of chemically reacting an aromatic compound with the at
least one hydroxyl group on the nitride particle.
[0019] According to certain embodiments, surface nitride particle
modification process 100 may include modifying any nitride particle
suitable for surface modification according to embodiments
described herein. According to certain embodiments, the nitride
particle may be a crystalline nitride particle or a partially
crystalline nitride particle. According to still other embodiments,
the nitride particle may be a boron nitride particle or a silicon
nitride particle. According to still other embodiments, the boron
nitride particle may be a cubic boron nitride particle. According
to yet other embodiments, the boron nitride particle may be a
hexagonal boron nitride particle.
[0020] Referring to second step 120, activating the surface of the
nitride particle by creating at least one hydroxyl group may
include applying an ultrasonic treatment to the nitride particle.
According to still other embodiments, applying the ultrasonic
treatment may include applying an ultrasonic treatment with
hydrogen peroxide to the nitride particle. According to yet another
embodiment, applying the ultrasonic treatment may include applying
an ultrasonic treatment in a water based system. According to still
other embodiments, applying the ultrasonic treatment may include
applying an ultrasonic treatment in suspension. According to yet
another embodiment, activating the surface of the nitride particle
by creating at least one hydroxyl group may include applying a
thermal treatment to the nitride particle.
[0021] According to still other embodiments, activating the surface
of the nitride particle may include preferentially creating
hydroxyl groups on the surface of the nitride particles. It will be
appreciated that preferentially creating hydroxyl groups on the
surface of the nitride particle may be understood to mean that a
majority of the polar groups created on the surface of the nitride
particle are hydroxyl groups. For example, preferentially creating
hydroxyl groups on the surface of the nitride particle may include
creating more hydroxyl groups than polar amine groups.
[0022] Referring to third step 130, chemically reacting an aromatic
compound with the at least one hydroxyl group on the nitride
particle may include creating a covalent bond between the aromatic
compound and the nitride particle. According to still other
embodiments, creating a covalent bond between the aromatic compound
and the nitride particle may include creating a covalent bond via a
urethane linkage to the nitride particle, as illustrated here:
##STR00001##
where NP represents the nitride particle and AR represents the
aromatic compound.
[0023] According to still other embodiment, the aromatic compound
may include a particular number of aromatic rings. For example, the
aromatic compound may include at least one aromatic ring, such as,
at least two aromatic rings or even at least three aromatic
rings.
[0024] According to still other embodiments, the aromatic compound
may include multiple isocyanate moieties. For example, the aromatic
compound may include at least two isocyanate moieties, such as, at
least three isocyanate moieties, at least four isocyanate moieties,
five isocyanate moieties.
[0025] According to yet another embodiment, the aromatic compound
may include di-isocyanate. According to still another embodiment,
the aromatic compound may include tri-isocyanate. According to
another embodiment, the aromatic compound may include 4-isocyanate.
According to yet another embodiment, the aromatic compound may
include 5-isocyanate. According to yet another embodiment, the
aromatic compound may include 6-isocyanate.
[0026] According to yet other embodiments, the aromatic compound
may include multiple auxiliary moieties. It will be appreciated
that an auxiliary moiety may be defined as a moiety bonded to the
aromatic compound but not to the nitride particle. According to
particular embodiments, the aromatic compound may include at least
two auxiliary moieties, such as, at east three auxiliary moieties,
at least four auxiliary moieties or even at least five auxiliary
moieties.
[0027] According to still other embodiments, the aromatic compound
may include particular auxiliary moieties. For example, the
aromatic compound may include a phenyl moiety, a biphenyl moiety, a
naphthyl moiety, a phenanthryl moiety, a methylene-diphenyl moiety,
a triphenyl-methane moiety or any combination thereof.
[0028] According to certain embodiments, nitride particle surface
modification process 100 may be described according to the
following reaction scheme:
##STR00002##
where NP represents the nitride particle, AR represents the
aromatic compound, AM1 represents the first auxiliary moiety and
AM2 represents the second auxiliary moiety.
[0029] According to particular embodiments, NP may be any nitride
particle suitable for surface modification according to embodiments
described herein. According to certain embodiments, the NP may be a
crystalline nitride particle or a partially crystalline nitride
particle. According to still other embodiments, the NP may be a
boron nitride particle or a silicon nitride particle. According to
still other embodiments, the NP may be a cubic boron nitride
particle. According to yet other embodiments, the NP may be a
hexagonal boron nitride particle.
[0030] According to other embodiments, the AR may include a
particular number of aromatic rings. For example, AR may include at
least one aromatic ring, such as, at least two aromatic rings or
even at least three aromatic rings.
[0031] According to still other embodiments, the AR may include
multiple isocyanate moieties. For example, the aromatic compound
may include at least two isocyanate moieties, such as, at least
three isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0032] According to yet another embodiment, the AR may include
di-isocyanate. According to still another embodiment, the AR may
include tri-isocyanate. According to another embodiment, the AR may
include 4-isocyanate. According to yet another embodiment, the AR
may include 5-isocyanate. According to yet another embodiment, the
AR may include 6-isocyanate.
[0033] According to yet another embodiment, the AR may include any
aromatic compound as illustrated here:
##STR00003## ##STR00004##
[0034] According to still other embodiments, the AM1 and AM2 may be
the same auxiliary moieties. According to still other embodiments,
the AM1 and AM2 may be different auxiliary moieties. According to
yet other embodiments, AM1 and AM2 may be selected from OH, SH,
NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any combination
thereof.
[0035] It will be appreciated that, though not shown in the formula
above, the surface modified nitride particle may include more
auxiliary moieties, such as, for example, AM3, AM4, AM5, AM6 and
any such additional auxiliary moieties may further be selected from
OH, SH, NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any
combination thereof.
[0036] Referring now to the surface modified nitride particle
formed according to embodiments described herein, the surface
modified nitride particle may include a nitride particle covalently
bonded via a urethane linkage to an aromatic compound. The surface
modified nitride particle may further include at least two
auxiliary moieties.
[0037] According to certain embodiments, the nitride particle of
the surface modified nitride particle may be any nitride particle
suitable for surface modification according to embodiments
described herein. According to certain embodiments, the nitride
particle may be a crystalline nitride particle or a partially
crystalline nitride particle. According to still other embodiments,
the nitride particle may be a boron nitride particle or a silicon
nitride particle. According to still other embodiments, the boron
nitride particle may be a cubic boron nitride particle. According
to yet other embodiments, the boron nitride particle may be a
hexagonal boron nitride particle.
[0038] According to other embodiments, the aromatic compound of the
surface modified nitride particle may include a particular number
of aromatic rings. For example, the aromatic compound may include
at least one aromatic ring, such as, at least two aromatic rings or
even at least three aromatic rings.
[0039] According to still other embodiments, the aromatic compound
of the surface modified nitride particle may include multiple
isocyanate moieties. For example, the aromatic compound may include
at least two isocyanate moieties, such as, at least three
isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0040] According to yet another embodiment, the aromatic compound
of the surface modified nitride particle may include di-isocyanate.
According to still another embodiment, the aromatic compound of the
surface modified nitride particle may include tri-isocyanate.
According to another embodiment, the aromatic compound of the
surface modified nitride particle may include 4-isocyanate.
According to yet another embodiment, the aromatic compound of the
surface modified nitride particle may include 5-isocyanate.
According to yet another embodiment, the aromatic compound of the
surface modified nitride particle may include 6-isocyanate.
[0041] According to yet other embodiments, the aromatic compound of
the surface modified nitride particle may include multiple
auxiliary moieties. It will be appreciated that an auxiliary moiety
may be defined as a moiety bonded to the aromatic compound but not
to the nitride particle. According to particular embodiments, the
aromatic compound may include at least two auxiliary moieties, such
as, at east three auxiliary moieties, at least four auxiliary
moieties or even at least five auxiliary moieties.
[0042] According to still other embodiments, the aromatic compound
of the surface modified nitride particle may include particular
auxiliary moieties. For example, the aromatic compound of the
surface modified nitride particle may include a phenyl moiety, a
biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, a
methylene-diphenyl moiety, a triphenyl-methane moiety or any
combination thereof.
[0043] According to certain embodiments, the surface modified
nitride particle formed according to embodiments described herein
may be described as a compound having the following formula:
##STR00005##
where NP represents the nitride particle, AR represents the
aromatic compound, L represents the urethane linkage between the
nitride particle and the aromatic compound, AM1 represents the
first auxiliary moiety and AM2 represents the second auxiliary
moiety.
[0044] According to particular embodiments, NP may be any nitride
particle suitable for surface modification according to embodiments
described herein. According to certain embodiments, the NP may be a
crystalline nitride particle or a partially crystalline nitride
particle. According to still other embodiments, the NP may be a
boron nitride particle or a silicon nitride particle. According to
still other embodiments, the NP may be a cubic boron nitride
particle. According to yet other embodiments, the NP may be a
hexagonal boron nitride particle.
[0045] According to other embodiments, the AR may include a
particular number of aromatic rings. For example, AR may include at
least one aromatic ring, such as, at least two aromatic rings or
even at least three aromatic rings.
[0046] According to still other embodiments, the AR may include
multiple isocyanate moieties. For example, the aromatic compound
may include at least two isocyanate moieties, such as, at least
three isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0047] According to yet another embodiment, the AR may include
di-isocyanate. According to still another embodiment, the AR may
include tri-isocyanate. According to another embodiment, the AR may
include 4-isocyanate. According to yet another embodiment, the AR
may include 5-isocyanate. According to yet another embodiment, the
AR may include 6-isocyanate.
[0048] According to yet another embodiment, the AR may include any
aromatic compound as illustrated here:
##STR00006## ##STR00007##
[0049] According to still other embodiments, the AM1 and AM2 may be
the same auxiliary moieties. According to still other embodiments,
the AM1 and AM2 may be different auxiliary moieties. According to
yet other embodiments, AM1 and AM2 may be selected from OH, SH,
NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any combination
thereof.
[0050] It will be appreciated that, though not shown in the formula
above, the surface modified nitride particle may include more
auxiliary moieties, such as AM3, AM4, AM5, AM6 and any such
additional auxiliary moieties may further be selected from OH, SH,
NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any combination
thereof.
[0051] Referring now to methods of forming an oligomer
functionalized nitride particle, FIG. 2 illustrates a nitride
particle oligomer functionalization process 200. Nitride particle
oligomer functionalization process 200 may include a first step 210
of providing a surface modified nitride particle formed according
to embodiments described herein and a second step 220 of chemically
reacting at least two oligomers with the auxiliary moieties of the
aromatic compound in the surface modified nitride particle. It will
be appreciated that the modified nitride particle may be formed
according to any embodiment described herein and may further
include any components described herein.
[0052] Referring to second step 220, according to certain
embodiments, the two oligomers that are chemically reacted with the
auxiliary moieties of the aromatic compound may include particular
monomer units. For example, the two oligomers may include monomer
units of silicone/siloxane, phenolic resin, epoxy resin,
poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),
polyether sulfone (PES), poly ether ether ketone (PEEK),
polyetherimide (PEI), polyethylene (PE), polyphenylene oxide (PPO),
polyphenylene sulfide (PPS), polypropylene (PP), polystyrene (PS),
polyvinyl chloride (PVC) or poly(dimethylsiloxane). According to
still other embodiments, the two oligomers may include monomer
units of a fluoropolymer. For example, the two oligomers may
include monomer units of PTFE, ETFE or PFA.
[0053] According to still other embodiments, the two oligomers that
are chemically reacted with the auxiliary moieties of the aromatic
compound may be particular oligomers. For example, the two
oligomers may be silicone/siloxane, phenolic resin, epoxy resin,
poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),
polyether sulfone (PES), poly ether ether ketone (PEEK),
polyetherimide (PEI), polyethylene (PE), polyphenylene oxide (PPO),
polyphenylene sulfide (PPS), polypropylene (PP), polystyrene (PS),
polyvinyl chloride (PVC) or poly(dimethylsiloxane). According to
still other embodiments, the two oligomers may be fluoropolymers.
For example, the two oligomers may be PTFE, ETFE or PFA.
[0054] According to certain embodiments, nitride particle oligomer
functionalization process 200 may be described according to the
following reaction scheme:
##STR00008##
where NP represents the nitride particle, AR represents the
aromatic compound, L represents the urethane linkage between the
nitride particle and the aromatic compound, OG1 represents a first
oligomer, AL1 represents the first auxiliary linkage between the AR
and OG1, OG2 represents a second oligomer and AL2 represents a
second auxiliary linkage between AR and OG2.
[0055] According to particular embodiments, NP may be any nitride
particle suitable for surface modification according to embodiments
described herein. According to certain embodiments, the NP may be a
crystalline nitride particle or a partially crystalline nitride
particle. According to still other embodiments, the NP may be a
boron nitride particle or a silicon nitride particle. According to
still other embodiments, the NP may be a cubic boron nitride
particle. According to yet other embodiments, the NP may be a
hexagonal boron nitride particle.
[0056] According to other embodiments, the AR may include a
particular number of aromatic rings. For example, AR may include at
least one aromatic ring, such as, at least two aromatic rings or
even at least three aromatic rings.
[0057] According to still other embodiments, the AR may include
multiple isocyanate moieties. For example, the aromatic compound
may include at least two isocyanate moieties, such as, at least
three isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0058] According to yet another embodiment, the AR may include
di-isocyanate. According to still another embodiment, the AR may
include tri-isocyanate. According to another embodiment, the AR may
include 4-isocyanate. According to yet another embodiment, the AR
may include 5-isocyanate. According to yet another embodiment, the
AR may include 6-isocyanate.
[0059] According to yet another embodiment, the AR may include any
aromatic compound as illustrated here:
##STR00009## ##STR00010##
[0060] According to still other embodiments, the AM1 and AM2 may be
the same auxiliary moieties. According to still other embodiments,
the AM1 and AM2 may be different auxiliary moieties. According to
yet other embodiments, AM1 and AM2 may be selected from OH, SH,
NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any combination
thereof.
[0061] According to still other embodiments, OG1 and OG2 may
include particular monomer units. For example, the OG1 and OG2 may
include monomer units of silicone/siloxane, phenolic resin, epoxy
resin, poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),
polyether sulfone (PES), poly ether ether ketone (PEEK),
polyetherimide (PEI), polyethylene (PE), polyphenylene oxide (PPO),
polyphenylene sulfide (PPS), polypropylene (PP), polystyrene (PS),
polyvinyl chloride (PVC) or poly(dimethylsiloxane). According to
still other embodiments, OG1 and OG2 may include monomer units of a
fluoropolymer. For example, OG1 and OG2 may include monomer units
of PTFE, ETFE or PFA.
[0062] According to still other embodiments, OG1 and OG2 may be
particular oligomers. For example, OG1 and OG2 may be
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, OG1 and OG2 may be fluoropolymers. For example, OG1
and OG2 may be PTFE, ETFE or PFA.
[0063] Referring now to the oligomer functionalized nitride
particle formed according to embodiments described herein, the
oligomer functionalized nitride particle may include a nitride
particle, an aromatic compound covalently bonded via a urethane
moiety to the nitride particle, and at least two oligomers
covalently bonded to the aromatic compound through at least two
auxiliary moieties of the aromatic compound.
[0064] According to certain embodiments, the nitride particle of
the oligomer functionalized nitride particle may be any nitride
particle suitable for nitride particle oligomer functionalization
according to embodiments described herein. According to certain
embodiments, the nitride particle may be a crystalline nitride
particle or a partially crystalline nitride particle. According to
still other embodiments, the nitride particle may be a boron
nitride particle or a silicon nitride particle. According to still
other embodiments, the boron nitride particle may be a cubic boron
nitride particle. According to yet other embodiments, the boron
nitride particle may be a hexagonal boron nitride particle.
[0065] According to other embodiments, the aromatic compound of the
oligomer functionalized nitride particle may include a particular
number of aromatic rings. For example, the aromatic compound may
include at least one aromatic ring, such as, at least two aromatic
rings or even at least three aromatic rings.
[0066] According to still other embodiments, the aromatic compound
of the oligomer functionalized nitride particle may include
multiple isocyanate moieties. For example, the aromatic compound
may include at least two isocyanate moieties, such as, at least
three isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0067] According to yet another embodiment, the aromatic compound
of the oligomer functionalized nitride particle may include
di-isocyanate. According to still another embodiment, the aromatic
compound of the oligomer functionalized nitride particle may
include tri-isocyanate. According to another embodiment, the
aromatic compound of the oligomer functionalized nitride particle
may include 4-isocyanate. According to yet another embodiment, the
aromatic compound of the oligomer functionalized nitride particle
may include 5-isocyanate. According to yet another embodiment, the
aromatic compound of the oligomer functionalized nitride particle
may include 6-isocyanate.
[0068] According to yet other embodiments, the aromatic compound of
the oligomer functionalized nitride particle may include multiple
auxiliary moieties. It will be appreciated that an auxiliary moiety
may be defined as a moiety bonded to the aromatic compound but not
to the nitride particle. According to particular embodiments, the
aromatic compound may include at least two auxiliary moieties, such
as, at east three auxiliary moieties, at least four auxiliary
moieties or even at least five auxiliary moieties.
[0069] According to still other embodiments, the aromatic compound
of the oligomer functionalized nitride particle may include
particular auxiliary moieties. For example, the aromatic compound
of the oligomer functionalized nitride particle may include a
phenyl moiety, a biphenyl moiety, a naphthyl moiety, a phenanthryl
moiety, a methylene-diphenyl moiety, a triphenyl-methane moiety or
any combination thereof.
[0070] According to still other embodiments, the at least two
oligomers of the oligomer functionalized nitride particle may
include particular monomer units. For example, the at least two
oligomers may include monomer units of silicone/siloxane, phenolic
resin, epoxy resin, poly-butadiene, polyimides, polyester resin,
polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile
butadiene styrene (ABS), polylactic acid, polybenzimaidazole,
polycarbonate (PC), polyether sulfone (PES), poly ether ether
ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC) or
poly(dimethylsiloxane). According to still other embodiments, the
at least two oligomers may include monomer units of a
fluoropolymer. For example, the at least two oligomers may include
monomer units of PTFE, ETFE or PFA.
[0071] According to still other embodiments, the at least two
oligomers of the oligomer functionalized nitride particle may be
particular oligomers. For example, the at least two oligomers may
be silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, the at least two oligomers may be fluoropolymers. For
example, the at least two oligomers may be PTFE, ETFE or PFA.
[0072] According to certain embodiments, the oligomer
functionalized nitride particle formed according to embodiments
described herein may be described as a compound having the
following formula:
##STR00011##
where NP represents the nitride particle, AR represents the
aromatic compound, L represents the urethane linkage between the
nitride particle and the aromatic compound, OG1 represents a first
oligomer, AL1 represents the first auxiliary linkage between the AR
and OG1, OG2 represents a second oligomer and AL2 represents a
second auxiliary linkage between AR and OG2.
[0073] According to particular embodiments, NP may be any nitride
particle suitable for surface modification according to embodiments
described herein. According to certain embodiments, the NP may be a
crystalline nitride particle or a partially crystalline nitride
particle. According to still other embodiments, the NP may be a
boron nitride particle or a silicon nitride particle. According to
still other embodiments, the NP may be a cubic boron nitride
particle. According to yet other embodiments, the NP may be a
hexagonal boron nitride particle.
[0074] According to other embodiments, the AR may include a
particular number of aromatic rings. For example, AR may include at
least one aromatic ring, such as, at least two aromatic rings or
even at least three aromatic rings.
[0075] According to still other embodiments, the AR may include
multiple isocyanate moieties. For example, the aromatic compound
may include at least two isocyanate moieties, such as, at least
three isocyanate moieties, at least four isocyanate moieties, five
isocyanate moieties.
[0076] According to yet another embodiment, the AR may include
di-isocyanate. According to still another embodiment, the AR may
include tri-isocyanate. According to another embodiment, the AR may
include 4-isocyanate. According to yet another embodiment, the AR
may include 5-isocyanate. According to yet another embodiment, the
AR may include 6-isocyanate.
[0077] According to yet another embodiment, the AR may include any
aromatic compound as illustrated here:
##STR00012## ##STR00013##
[0078] According to still other embodiments, the AL1 and AL2 may be
the same auxiliary moieties. According to still other embodiments,
the AL1 and AL2 may be different auxiliary moieties. According to
yet other embodiments, AL1 and AL2 may be selected from OH, SH,
NH.sub.2, F, Cl, Br, I, COOH, CN, OCN, CNO, NCS or any combination
thereof.
[0079] According to still other embodiments, OG1 and OG2 may
include particular monomer units. For example, the OG1 and OG2 may
include monomer units of silicone/siloxane, phenolic resin, epoxy
resin, poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole, polycarbonate (PC),
polyether sulfone (PES), poly ether ether ketone (PEEK),
polyetherimide (PEI), polyethylene (PE), polyphenylene oxide (PPO),
polyphenylene sulfide (PPS), polypropylene (PP), polystyrene (PS),
polyvinyl chloride (PVC) or poly(dimethylsiloxane). According to
still other embodiments, OG1 and OG2 may include monomer units of a
fluoropolymer. For example, OG1 and OG2 may include monomer units
of PTFE, ETFE or PFA.
[0080] According to still other embodiments, OG1 and OG2 may be
particular oligomers. For example, OG1 and OG2 may be
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, OG1 and OG2 may be fluoropolymers. For example, OG1
and OG2 may be PTFE, ETFE or PFA.
[0081] Referring now to methods of forming a polymer based
composite including oligomer functionalized nitride particles, FIG.
3 illustrates a polymer based composite forming process 300.
Polymer based composite forming process 300 may include a first
step 310 of providing at least one polymer component and a second
step 320 of combining the polymer component with a modified nitride
filler material that includes oligomer functionalized nitride
particles. It will be appreciated that the oligomer functionalized
nitride particles may be formed according to any embodiment
described herein and may further include any components described
herein.
[0082] Referring to first step 310, according to certain
embodiments, the polymer component may include particular monomer
units. For example, the polymer component may include monomer units
of silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, the polymer component may include monomer units of a
fluoropolymer. For example, the polymer component may include
monomer units of PTFE, ETFE or PFA.
[0083] According to still other embodiments, the polymer component
may be particular oligomers. For example, the polymer component may
be silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, the polymer component may be fluoropolymers. For
example, the polymer component may be PTFE, ETFE or PFA.
[0084] According to yet other embodiments, a monomer unit of the
polymer component may be from the same organic component family as
a monomer unit of the oligomer components. According to still other
embodiments, a monomer unit of the polymer component may be the
same as a monomer unit of the oligomer components.
[0085] Referring now to the polymer based composite formed
according to embodiments described herein, the polymer based
composite may include at least one polymer component and a modified
nitride filler material dispersed within the polymer component. The
modified nitride filler material may include oligomer
functionalized nitride particles. The oligomer functionalized
nitride particles may include a nitride particle, an aromatic
compound covalently bonded via a urethane moiety to the nitride
particle, and at least two oligomers covalently bonded to the
aromatic compound through at least two auxiliary moieties of the
aromatic compound.
[0086] According to certain embodiments, the nitride particle of
the oligomer functionalized nitride particle in the polymer based
composite may be any nitride particle suitable for nitride particle
oligomer functionalization according to embodiments described
herein. According to certain embodiments, the nitride particle may
be a crystalline nitride particle or a partially crystalline
nitride particle. According to still other embodiments, the nitride
particle may be a boron nitride particle or a silicon nitride
particle. According to still other embodiments, the boron nitride
particle may be a cubic boron nitride particle. According to yet
other embodiments, the boron nitride particle may be a hexagonal
boron nitride particle.
[0087] According to other embodiments, the aromatic compound of the
oligomer functionalized nitride particle in the polymer based
composite may include a particular number of aromatic rings. For
example, the aromatic compound may include at least one aromatic
ring, such as, at least two aromatic rings or even at least three
aromatic rings.
[0088] According to still other embodiments, the aromatic compound
of the oligomer functionalized nitride particle in the polymer
based composite may include multiple isocyanate moieties. For
example, the aromatic compound may include at least two isocyanate
moieties, such as, at least three isocyanate moieties, at least
four isocyanate moieties, five isocyanate moieties.
[0089] According to yet another embodiment, the aromatic compound
of the oligomer functionalized nitride particle in the polymer
based composite may include di-isocyanate. According to still
another embodiment, the aromatic compound of the oligomer
functionalized nitride particle may include tri-isocyanate.
According to another embodiment, the aromatic compound of the
oligomer functionalized nitride particle may include 4-isocyanate.
According to yet another embodiment, the aromatic compound of the
oligomer functionalized nitride particle may include 5-isocyanate.
According to yet another embodiment, the aromatic compound of the
oligomer functionalized nitride particle may include
6-isocyanate.
[0090] According to yet other embodiments, the aromatic compound of
the oligomer functionalized nitride particle in the polymer based
composite may include multiple auxiliary moieties. It will be
appreciated that an auxiliary moiety may be defined as a moiety
bonded to the aromatic compound but not to the nitride particle.
According to particular embodiments, the aromatic compound may
include at least two auxiliary moieties, such as, at east three
auxiliary moieties, at least four auxiliary moieties or even at
least five auxiliary moieties.
[0091] According to still other embodiments, the aromatic compound
of the oligomer functionalized nitride particle in the polymer
based composite may include particular auxiliary moieties. For
example, the aromatic compound of the oligomer functionalized
nitride particle may include a phenyl moiety, a biphenyl moiety, a
naphthyl moiety, a phenanthryl moiety, a methylene-diphenyl moiety,
a triphenyl-methane moiety or any combination thereof.
[0092] According to still other embodiments, the at least two
oligomers of the oligomer functionalized nitride particle in the
polymer based composite may include particular monomer units. For
example, the at least two oligomers may include monomer units of
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, the at least two oligomers may include monomer units
of a fluoropolymer. For example, the at least two oligomers may
include monomer units of PTFE, ETFE or PFA.
[0093] According to still other embodiments, the at least two
oligomers of the oligomer functionalized nitride particle in the
polymer based composite may be particular oligomers. For example,
the at least two oligomers may be silicone/siloxane, phenolic
resin, epoxy resin, poly-butadiene, polyimides, polyester resin,
polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile
butadiene styrene (ABS), polylactic acid, polybenzimaidazole,
polycarbonate (PC), polyether sulfone (PES), poly ether ether
ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC) or
poly(dimethylsiloxane). According to still other embodiments, the
at least two oligomers may be fluoropolymers. For example, the at
least two oligomers may be PTFE, ETFE or PFA.
[0094] According to yet other embodiments, the polymer component in
the polymer based composite may include particular monomer units.
For example, the polymer component may include monomer units of
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC) or poly(dimethylsiloxane). According to still other
embodiments, the polymer component may include monomer units of a
fluoropolymer. For example, the polymer component may include
monomer units of PTFE, ETFE or PFA.
[0095] According to still other embodiments, the polymer component
in the polymer based composite may be particular oligomers. For
example, the polymer component may be silicone/siloxane, phenolic
resin, epoxy resin, poly-butadiene, polyimides, polyester resin,
polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile
butadiene styrene (ABS), polylactic acid, polybenzimaidazole,
polycarbonate (PC), polyether sulfone (PES), poly ether ether
ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC) or
poly(dimethylsiloxane). According to still other embodiments, the
polymer component may be fluoropolymers. For example, the polymer
component may be PTFE, ETFE or PFA.
[0096] According to yet other embodiments, a monomer unit of the
polymer component in the polymer based composite may be from the
same organic component family as a monomer unit of the oligomer
components in the polymer based composite. According to still other
embodiments, a monomer unit of the polymer component in the polymer
based composite may be the same as a monomer unit of the oligomer
components in the polymer based composite.
[0097] According to still other embodiments, a polymer based
composite formed according to embodiments described herein may have
a particular peel strength as measured according to IPC standard
2.4.9. For example, a polymer based composite formed according to
embodiments described herein may have a peel strength of at least
about 5 N/in, such as, at least about 18 N/in or even at least
about 20 N/in. According to still other embodiments, a polymer
based composite formed according to embodiments described herein
may have a peel strength of not greater than about 100 N/in, such
as, not greater than about 75 N/in or even not greater than about
50 N/in. It will be appreciated that the peel strength of a polymer
based composite formed according to embodiments described herein
may be any value between any of minimum and maximum values noted
above. It will be further appreciated that the peel strength of a
polymer based composite formed according to embodiments described
may be within a range between any of the minimum and maximum values
noted above.
[0098] According to yet other embodiments, a polymer based
composite formed according to embodiments described herein may have
a particular original peel strength percentage equal to
CPL/PPL*100, where CPL is equal to the peel strength of the polymer
based composite and PPL is equal to the peel strength of the
polymer component alone that is used to form the polymer based
composite. It will be appreciated that peel strength is measured
according to IPC standard 2.4.9. According to particular
embodiments, a polymer based composite formed according to
embodiments described herein may have an original peel strength
percentage of at least about 60%, such as, at least about 70%, at
least about 75%, at least about 80%, at least about 90%, at least
about 95%, at least about 100%, at least about 105%, at least about
110%, at least about 120%, at least about 125%, at least about
130%, at least about 135%, at least about 140%, at least about
150%, at least about 175% or even at least about 200%. According to
still other embodiments, a polymer based composite formed according
to embodiments described herein may have an original peel strength
percentage of not greater than about 250%. It will be appreciated
that the original peel strength percentage of a polymer based
composite formed according to embodiments described herein may be
any value between any of minimum and maximum values noted above. It
will be further appreciated that the original peel strength
percentage of a polymer based composite formed according to
embodiments described may be within a range between any of the
minimum and maximum values noted above. According to still other
embodiments, a polymer based composite formed according to
embodiments described herein may have a particular thermal
conductivity. Thermal conductivity is calculated as the product of
thermal diffusivity, density and heat capacity. More particularly,
through plane thermal conductivity is calculated as the product of
the through plane thermal diffusivity, the density and the heat
capacity. The thermal diffusivity of the composite polymer is
measured according to the standard ASTM C-518 by the thermal flows
method. The diffusivity is measured perpendicularly to the
composite polymer layer. The heat capacity of the composite polymer
is measured by DSC (differential scanning calorimetry) on a Netzsch
thermobalance. The composite polymer density is measured by Helium
pycnometry.
[0099] According to certain embodiments, a polymer based composite
formed according to embodiments described herein may have a thermal
conductivity of at least about 0.2 W/mK, such as, at least about
0.5 W/mK, at least about 1 W/mK, at least about 2 W/mK, at least
about 3 W/mK, at least about 5 W/mK, at least about 7 W/mK, or even
at least about 10 W/mK. According to still other embodiments, a
polymer based composite formed according to embodiments described
herein may have a thermal conductivity of not greater than about 20
W/mK, such as, not greater than about 15 W/mK. It will be
appreciated that the thermal conductivity of a polymer based
composite formed according to embodiments described herein may be
any value between any of minimum and maximum values noted above. It
will be further appreciated that the thermal conductivity of a
polymer based composite formed according to embodiments described
may be within a range between any of the minimum and maximum values
noted above.
[0100] According to yet other embodiments, a polymer based
composite formed according to embodiments described herein may have
a particular original thermal conductivity percentage equal to
CTC/PTC*100, where CTC is equal to the thermal conductivity of the
polymer based composite and PTC is equal to the thermal
conductivity of the polymer component alone that is used to form
the polymer based composite. It will be appreciated that thermal
conductivity of both the composite are measured according to the
standard outlined above. According to particular embodiments, a
polymer based composite formed according to embodiments described
herein may have an original thermal conductivity percentage of at
least about 200%, such as, at least about 300%, at least about
400%, at least about 500%, at least about 1000%, at least about
2000%, at least about 5000%, or even at least about 10000%.
According to still other embodiments, a polymer based composite
formed according to embodiments described herein may have an
original thermal conductivity percentage of not greater than about
20000%. It will be appreciated that the original thermal
conductivity percentage of a polymer based composite formed
according to embodiments described herein may be any value between
any of minimum and maximum values noted above. It will be further
appreciated that the original thermal conductivity percentage of a
polymer based composite formed according to embodiments described
may be within a range between any of the minimum and maximum values
noted above.
[0101] Many different aspects and embodiments are possible. Some of
those aspects and embodiments are described herein. After reading
this specification, skilled artisans will appreciate that those
aspects and embodiments are only illustrative and do not limit the
scope of the present invention. Embodiments may be in accordance
with any one or more of the embodiments as listed below.
Embodiment 1
[0102] A surface modified nitride particle comprising: a nitride
particle covalently bonded via a urethane moiety to an aromatic
compound; and at least two auxiliary moieties.
Embodiment 2
[0103] A method of forming a modified nitride particle, wherein the
method comprises: activating a nitride particle to form at least
one hydroxyl group; chemically reacting an aromatic compound with
the at least one hydroxyl group on the nitride particle, wherein
the aromatic compound comprises at least two auxiliary
moieties.
Embodiment 3
[0104] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the nitride particle is a boron
nitride particle or a silicon nitride particle.
Embodiment 4
[0105] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the nitride particle is a hexagonal
boron nitride particle.
Embodiment 5
[0106] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein a majority of any moieties
connecting the nitride particle and the aromatic compound are
urethane moieties.
Embodiment 6
[0107] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the aromatic compound comprises at
least one aromatic ring, at least two aromatic rings, at least
three aromatic rings.
Embodiment 7
[0108] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the aromatic compound comprises a
phenyl moiety, a biphenyl moiety, a naphthyl moiety, a phenanthryl
moiety, a methylene-diphenyl moiety, a triphenyl-methane
moiety.
Embodiment 8
[0109] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the at least two auxiliary moieties
are amino groups (--NH2), hydroxyl groups (--OH), fluoro groups
(--F), chloro groups (--Cl), bromo groups (--Br), iodo groups
(--I), carboxyl groups (--COOH), cyano groups (--CN), cyanate
groups (--OCN), isocyanate groups (--NCO), thiol groups (--SH), or
thioisocyanate groups (--NCS).
Embodiment 9
[0110] The surface modified nitride particle or method of any one
of embodiments 1 and 2, wherein the aromatic compound comprises two
isocyanate moieties, three isocyanate moieties, four isocyanate
moieties, five isocyanate moieties.
Embodiment 10
[0111] An oligomer functionalized nitride particle comprising: a
nitride particle; an aromatic compound covalently bonded via a
urethane moiety to the nitride particle; and at least two oligomers
covalently bonded to the aromatic compound via at least two
auxiliary moieties of the aromatic compound.
Embodiment 11
[0112] A method of forming an oligomer functionalized nitride
particle, wherein the method comprises: activating a nitride
particle to form at least one hydroxyl group; chemically reacting
an aromatic compound with the at least one hydroxyl group on the
nitride particle, wherein the aromatic compound comprises at least
two auxiliary moieties; and chemically reacting at least two
oligomers covalently bonded to the aromatic compound via the at
least two auxiliary moieties.
Embodiment 12
[0113] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the nitride particle is a
boron nitride particle or a silicon nitride particle.
Embodiment 13
[0114] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the nitride particle is a
hexagonal boron nitride particle.
Embodiment 14
[0115] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein a majority of any
moieties connecting the nitride particle and the aromatic compound
are urethane moieties.
Embodiment 15
[0116] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the aromatic compound
comprises at least one aromatic ring, at least two aromatic rings,
at least three aromatic rings.
Embodiment 16
[0117] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the aromatic compound
comprises a phenyl moiety, a biphenyl moiety, a naphthyl moiety, a
phenanthryl moiety, a methylene-diphenyl moiety, a
triphenyl-methane moiety.
Embodiment 17
[0118] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the at least two
auxiliary moieties are amino groups (--NH2), hydroxyl groups
(--OH), fluoro groups (--F), chloro groups (--Cl), bromo groups
(--Br), iodo groups (--I), carboxyl groups (--COOH), cyano groups
(--CN), cyanate groups (--OCN), isocyanate groups (--NCO), thiol
groups (--SH), or thioisocyanate groups (--NCS).
Embodiment 18
[0119] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the aromatic compound
comprises two isocyanate moieties, three isocyanate moieties, four
isocyanate moieties, five isocyanate moieties.
Embodiment 19
[0120] The oligomer functionalized nitride particle or method of
any one of embodiments 10 and 11, wherein the oligomer components
comprises silicone/siloxane, phenolic resin, epoxy resin,
poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole (PBO and PBI),
polycarbonate (PC), polyether sulfone (PES), poly ether ether
ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyether
sulfone (PES), polysulfone (PS), polypropylene (PP), polystyrene
(PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or a
fluoropolymer.
Embodiment 20
[0121] The oligomer functionalized nitride particle or method of
embodiment 19, wherein the fluoro-based oligomers comprises of
PTFE, ETFE, FEP, ECTFE or PFA.
Embodiment 21
[0122] A polymer based composite comprising: at least one polymer
component and a modified nitride filler material dispersed within
the polymer component, wherein the modified nitride filler material
comprises: a nitride particle; an aromatic compound covalently
bonded via a urethane linkage to the nitride particle; and at least
two oligomer components covalently bonded to the aromatic
compound.
Embodiment 22
[0123] A method of forming a polymer based composite, wherein the
method comprises: combining at least one polymer component with a
nitride filler material of oligomer functionalized nitride
particles, wherein each of the oligomer functionalized nitride
particles comprise: a nitride particle; an aromatic compound
covalently bonded via a urethane linkage to the nitride particle;
and at least two oligomer components covalently bonded to the
aromatic compound.
Embodiment 23
[0124] The polymer composite or method of any one of embodiments 21
and 22, wherein the nitride particle is a boron nitride particle or
a silicon nitride particle.
Embodiment 24
[0125] The polymer composite or method of any one of embodiments 21
and 22, wherein the nitride particle is a hexagonal boron nitride
particle.
Embodiment 25
[0126] The oligomer functionalized nitride particle or method of
any one of embodiments 21 and 22, wherein a majority of any
moieties connecting the nitride particle and the aromatic compound
are urethane moieties.
Embodiment 26
[0127] The polymer composite or method of any one of embodiments 21
and 22, wherein the aromatic compound comprises at least one
aromatic ring, at least two aromatic rings, at least three aromatic
rings.
Embodiment 27
[0128] The polymer composite or method of any one of embodiments 21
and 22, wherein the aromatic compound comprises a phenyl moiety, a
biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, a
methylene-diphenyl moiety, a triphenyl-methane moiety.
Embodiment 28
[0129] The oligomer functionalized nitride particle or method of
any one of embodiments 21 and 22, wherein the at least two
auxiliary moieties are amino groups (--NH2), hydroxyl groups
(--OH), fluoro groups (--F), chloro groups (--Cl), bromo groups
(--Br), iodo groups (--I), carboxyl groups (--COOH), cyano groups
(--CN), cyanate groups (--OCN), isocyanate groups (--NCO), thiol
groups (--SH), or thioisocyanate groups (--NCS).
Embodiment 29
[0130] The polymer composite or method of any one of embodiments 21
and 22, wherein the aromatic compound comprises two isocyanate
moieties, three isocyanate moieties, four isocyanate moieties, five
isocyanate moieties.
Embodiment 30
[0131] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer component comprises silicone/siloxane,
phenolic resin, epoxy resin, poly-butadiene, polyimides, polyester
resin, polyurethane, poly(methyl methacrylate) (PMMA),
Acrylonitrile butadiene styrene (ABS), polylactic acid,
polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polysulfone, polypropylene (PP), polystyrene (PS),
polyvinyl chloride (PVC), poly(dimethylsiloxane) or a
fluoropolymer.
Embodiment 31
[0132] The polymer composite or method of embodiment 30, wherein
the fluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE or
PFA.
Embodiment 32
[0133] The polymer based composite or method of any one of
embodiments 21 and 22, wherein a monomer unit of the polymer
component is from the same family as a monomer unit of the oligomer
components.
Embodiment 33
[0134] The polymer based composite or method of embodiment 32,
wherein a monomer unit of the polymer component is the same as a
monomer unit of the oligomer components.
Embodiment 34
[0135] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer component comprises a thermoset polymer
or a thermoplastic polymer.
Embodiment 35
[0136] The polymer based composite or method of embodiment 34,
wherein the polymer component comprises silicone/siloxane, phenolic
resin, epoxy resin, poly-butadiene, polyimides, polyester resin,
polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile
butadiene styrene (ABS), polylactic acid, polybenzimaidazole (PBO
and PBI), polycarbonate (PC), polyether sulfone (PES), poly ether
ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS),
polysulfone, polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC), poly(dimethylsiloxane) or a fluoropolymer.
Embodiment 36
[0137] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer component comprises phenol formaldehyde
resins, Bakelite, Novotext (cotton fibre-reinforced phenolic),
Oasis (an open-celled phenolic foam), Maritex Aquarius,
poly-butadiene, styrene-butadiene copolymer,
Kapton(poly-oxydiphenylene-pyromellitimide), aliphatic polyimides,
aromatic polyimides, semiaromatic polyimides, Acrylated
saturated/unsaturated aliphatic polyurethane, Polybutadiene rubber
blended with nitrile rubber, styrene-butadiene copolymer or
UTEM.
Embodiment 37
[0138] The polymer composite or method of any one of embodiments 21
and 22, wherein the fluoro-based polymer comprises PTFE, ETFE, FEP,
ECTFE or PFA.
Embodiment 38
[0139] The polymer composite or method of any one of embodiments 21
and 22, wherein the oligomer components comprises
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole (PBO and PBI), polycarbonate
(PC), polyether sulfone (PES), poly ether ether ketone (PEEK),
polyetherimide (PEI), polyethylene (PE), polyphenylene oxide (PPO),
polyphenylene sulfide (PPS), polysulfone, polypropylene (PP),
polystyrene (PS), polyvinyl chloride (PVC), poly(dimethylsiloxane)
or a fluoropolymer.
Embodiment 39
[0140] The polymer based composite of embodiment 38, wherein the
fluoro-based oligomers comprises of PTFE, ETFE or PFA.
Embodiment 40
[0141] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer based composite comprises a peel
strength of at least about 10 N/in and a thermal conductivity of at
least about 0.2 W/mK.
Embodiment 41
[0142] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer based composite comprises a peel
strength of at least about 5 N/in.
Embodiment 42
[0143] The polymer composite or method of any one of embodiments 21
and 22, wherein the polymer based composite comprises a thermal
conductivity of at least about 1 W/mK.
Embodiment 43
[0144] A surface modified boron nitride particle comprising: a
boron nitride particle covalently bonded via a urethane moiety to
an aromatic compound; and at least two auxiliary moieties.
Embodiment 44
[0145] A method of forming a surface modified boron nitride
particle, wherein the method comprises: activating a boron nitride
particle to form at least one hydroxyl group; chemically reacting
an aromatic compound with the at least one hydroxyl group on the
boron nitride particle, wherein the aromatic compound comprises at
least two auxiliary moieties.
Embodiment 45
[0146] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein the boron nitride particle is
a hexagonal boron nitride particle.
Embodiment 46
[0147] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein a majority of any moieties
connecting the boron nitride particle and the aromatic compound are
urethane moieties.
Embodiment 47
[0148] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein the aromatic compound
comprises at least one aromatic ring, at least two aromatic rings,
at least three aromatic rings.
Embodiment 48
[0149] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein the aromatic compound
comprises a phenyl moiety, a biphenyl moiety, a naphthyl moiety, a
phenanthryl moiety, a methylene-diphenyl moiety, a
triphenyl-methane moiety.
Embodiment 49
[0150] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein the at least two auxiliary
moieties are amino groups (--NH2), hydroxyl groups (--OH), fluoro
groups (--F), chloro groups (--Cl), bromo groups (--Br), iodo
groups (--I), carboxyl groups (--COOH), cyano groups (--CN),
cyanate groups (--OCN), isocyanate groups (--NCO), thiol groups
(--SH), or thioisocyanate groups (--NCS).
Embodiment 50
[0151] The surface modified boron nitride particle or method of any
one of embodiments 43 and 44, wherein the aromatic compound
comprises two isocyanate moieties, three isocyanate moieties, four
isocyanate moieties, five isocyanate moieties.
Embodiment 51
[0152] An oligomer functionalized boron nitride particle
comprising: a boron nitride particle; an aromatic compound
covalently bonded via a urethane moiety to the boron nitride
particle; and at least two oligomers covalently bonded to the
aromatic compound via at least two auxiliary moieties of the
aromatic compound.
Embodiment 52
[0153] A method of forming an oligomer functionalized boron nitride
particle, wherein the method comprises: activating a boron nitride
particle to form at least one hydroxyl group; chemically reacting
an aromatic compound with the at least one hydroxyl group on the
boron nitride particle, wherein the aromatic compound comprises at
least two auxiliary moieties; and chemically reacting at least two
oligomers covalently bonded to the aromatic compound via the at
least two auxiliary moieties.
Embodiment 53
[0154] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the boron nitride
particle is a hexagonal boron nitride particle.
Embodiment 54
[0155] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein a majority of any
moieties connecting the boron nitride particle and the aromatic
compound are urethane moieties.
Embodiment 55
[0156] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the aromatic compound
comprises at least one aromatic ring, at least two aromatic rings,
at least three aromatic rings.
Embodiment 56
[0157] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the aromatic compound
comprises a phenyl moiety, a biphenyl moiety, a naphthyl moiety, a
phenanthryl moiety, a methylene-diphenyl moiety, a
triphenyl-methane moiety.
Embodiment 57
[0158] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the at least two
auxiliary moieties are amino groups (--NH2), hydroxyl groups
(--OH), fluoro groups (--F), chloro groups (--Cl), bromo groups
(--Br), iodo groups (--I), carboxyl groups (--COOH), cyano groups
(--CN), cyanate groups (--OCN), isocyanate groups (--NCO), thiol
groups (--SH), or thioisocyanate groups (--NCS).
Embodiment 58
[0159] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the aromatic compound
comprises two isocyanate moieties, three isocyanate moieties, four
isocyanate moieties, five isocyanate moieties.
Embodiment 59
[0160] The oligomer functionalized boron nitride particle or method
of any one of embodiments 51 and 52, wherein the oligomer
components comprises silicone/siloxane, phenolic resin, epoxy
resin, poly-butadiene, polyimides, polyester resin, polyurethane,
poly(methyl methacrylate) (PMMA), Acrylonitrile butadiene styrene
(ABS), polylactic acid, polybenzimaidazole (PBO and PBI),
polycarbonate (PC), polyether sulfone (PES), poly ether ether
ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS),
polysulfone, polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC), poly(dimethylsiloxane) or a fluoropolymer.
Embodiment 60
[0161] The oligomer functionalized boron nitride particle or method
of embodiment 59, wherein the fluoro-based oligomers comprises of
PTFE, ETFE, FEP, ECTFE or PFA.
Embodiment 61
[0162] A polymer based composite comprising: at least one polymer
component and a modified boron nitride filler material dispersed
within the polymer component, wherein the modified boron nitride
filler material comprises: a boron nitride particle; an aromatic
compound covalently bonded via a urethane linkage to the boron
nitride particle; and at least two oligomer components covalently
bonded to the aromatic compound.
Embodiment 62
[0163] A method of forming a polymer based composite, wherein the
method comprises: combining at least one polymer component with a
boron nitride filler material of oligomer functionalized boron
nitride particles, wherein each of the oligomer functionalized
boron nitride particles comprise: a boron nitride particle; an
aromatic compound covalently bonded via a urethane linkage to the
boron nitride particle; and at least two oligomer components
covalently bonded to the aromatic compound.
Embodiment 63
[0164] The polymer composite or method of any one of embodiments 61
and 62, wherein the boron nitride particle is a hexagonal boron
nitride particle.
Embodiment 64
[0165] The polymer composite or method of any one of embodiments 61
and 62, wherein a majority of any moieties connecting the boron
nitride particle and the aromatic compound are urethane
moieties.
Embodiment 65
[0166] The polymer composite or method of any one of embodiments 61
and 62, wherein the aromatic compound comprises at least one
aromatic ring, at least two aromatic rings, at least three aromatic
rings.
Embodiment 66
[0167] The polymer composite or method of any one of embodiments 61
and 62, wherein the aromatic compound comprises a phenyl moiety, a
biphenyl moiety, a naphthyl moiety, a phenanthryl moiety, a
methylene-diphenyl moiety, a triphenyl-methane moiety.
Embodiment 67
[0168] The polymer composite or method of any one of embodiments 61
and 62, wherein the at least two auxiliary moieties are amino
groups (--NH2), hydroxyl groups (--OH), fluoro groups (--F), chloro
groups (--Cl), bromo groups (--Br), iodo groups (--I), carboxyl
groups (--COOH), cyano groups (--CN), cyanate groups (--OCN),
isocyanate groups (--NCO), thiol groups (--SH), or thioisocyanate
groups (--NCS).
Embodiment 68
[0169] The polymer composite or method of any one of embodiments 61
and 62, wherein the aromatic compound comprises two isocyanate
moieties, three isocyanate moieties, four isocyanate moieties, five
isocyanate moieties.
Embodiment 69
[0170] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer component comprises silicone/siloxane,
phenolic resin, epoxy resin, poly-butadiene, polyimides, polyester
resin, polyurethane, poly(methyl methacrylate) (PMMA),
Acrylonitrile butadiene styrene (ABS), polylactic acid,
polybenzimaidazole (PBO and PBI), polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polyether sulfone (PES), polysulfone (PS),
polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC),
poly(dimethylsiloxane) or a fluoropolymer.
Embodiment 70
[0171] The polymer composite or method of embodiment 69, wherein
the fluoro-based polymer comprises PTFE, ETFE, FEP, ECTFE or
PFA.
Embodiment 71
[0172] The polymer composite or method of any one of embodiments 61
and 62, wherein a monomer unit of the polymer component is from the
same family as a monomer unit of the oligomer components.
Embodiment 72
[0173] The polymer based composite or method of embodiment 71,
wherein a monomer unit of the polymer component is the same as a
monomer unit of the oligomer components.
Embodiment 73
[0174] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer component comprises a thermoset polymer
or a thermoplastic polymer.
Embodiment 74
[0175] The polymer based composite or method of embodiment 73,
wherein the polymer component comprises silicone/siloxane, phenolic
resin, epoxy resin, poly-butadiene, polyimides, polyester resin,
polyurethane, poly(methyl methacrylate) (PMMA), Acrylonitrile
butadiene styrene (ABS), polylactic acid, polybenzimaidazole (PBO
and PBI), polycarbonate (PC), polyether sulfone (PES), poly ether
ether ketone (PEEK), polyetherimide (PEI), polyethylene (PE),
polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyether
sulfone (PES), polysulfone (PS), polypropylene (PP), polystyrene
(PS), polyvinyl chloride (PVC), poly(dimethylsiloxane) or a
fluoropolymer.
Embodiment 75
[0176] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer component comprises phenol formaldehyde
resins, Bakelite, Novotext (cotton fibre-reinforced phenolic),
Oasis (an open-celled phenolic foam), Maritex Aquarius,
poly-butadiene, styrene-butadiene copolymer,
Kapton(poly-oxydiphenylene-pyromellitimide), aliphatic polyimides,
aromatic polyimides, semiaromatic polyimides, Acrylated
saturated/unsaturated aliphatic polyurethane, Polybutadiene rubber
blended with nitrile rubber, styrene-butadiene copolymer or
UTEM.
Embodiment 76
[0177] The polymer composite or method of any one of embodiments 61
and 62, wherein the fluoro-based polymer comprises PTFE, ETFE, FEP,
ECTFE or PFA.
Embodiment 77
[0178] The polymer composite or method of any one of embodiments 61
and 62, wherein the oligomer components comprises
silicone/siloxane, phenolic resin, epoxy resin, poly-butadiene,
polyimides, polyester resin, polyurethane, poly(methyl
methacrylate) (PMMA), Acrylonitrile butadiene styrene (ABS),
polylactic acid, polybenzimaidazole, polycarbonate (PC), polyether
sulfone (PES), poly ether ether ketone (PEEK), polyetherimide
(PEI), polyethylene (PE), polyphenylene oxide (PPO), polyphenylene
sulfide (PPS), polypropylene (PP), polystyrene (PS), polyvinyl
chloride (PVC), poly(dimethylsiloxane) or a fluoropolymer.
Embodiment 78
[0179] The polymer based composite of embodiment 77, wherein the
fluoro-based oligomers comprises of PTFE, ETFE or PFA.
Embodiment 79
[0180] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer based composite comprises a peel
strength of at least about 10 N/in and a thermal conductivity of at
least about 0.2 W/mK.
Embodiment 80
[0181] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer based composite comprises a peel
strength of at least about 15 N/in, at least about 20N/in.
Embodiment 81
[0182] The polymer composite or method of any one of embodiments 61
and 62, wherein the polymer based composite comprises a thermal
conductivity of at least about 1 W/mK.
EXAMPLES
Example 1
[0183] A sample polymer based composite 51 was formed according to
embodiments described herein. Specifically, 51 included oligomer
functionalized hexagonal boron nitride powder formed according to
embodiments described herein and combined in a polybutadiene
polymer matrix with a 10% mass ratio of nitride powder to polymer
matrix.
[0184] For purposes of comparison, two comparison sample composites
CS1 and CS2 were formed. Comparison sample composite CS1 included a
polybutadiene polymer matrix with no fillers (i.e., no hexagonal
boron nitride powder). Comparison sample composite CS2 included
non-modified hexagonal boron nitride powder combined in a
polybutadiene polymer matrix with a 10% mass ratio of nitride
powder to poly matrix.
[0185] Peel strength of sample polymer based composite S1,
comparison sample composite CS1 and comparison sample composite CS2
was measured and recorded. Peel strength was measured according to
IPC standard 2.4.9.
[0186] Peel strength measurements are summarized in Table 1
below:
TABLE-US-00001 TABLE 1 Peel Strength PEEL STRENGTH SAMPLE (N/in) S1
20.1 CS1 19.0 CS2 14.8
[0187] FIG. 4 illustrates a plot of the peel strength for each
sample polymer based composite S1, CS1 and CS2.
Example 2
[0188] Sample polymer based composites S2-S4 were formed according
to embodiments described herein. Specifically, S2 included oligomer
functionalized hexagonal boron nitride powder formed according to
embodiments described herein and combined in a polybutadiene
polymer matrix with a 20% mass ratio of nitride powder to polymer
matrix. S3 included oligomer functionalized hexagonal boron nitride
powder formed according to embodiments described herein and
combined in a polybutadiene polymer matrix with a 30% mass ratio of
nitride powder to polymer matrix. S4 included oligomer
functionalized hexagonal boron nitride powder formed according to
embodiments described herein and combined in a polybutadiene
polymer matrix with a 40% mass ratio of nitride powder to polymer
matrix.
[0189] For purposes of comparison, two comparison sample composites
CS3 and CS4 were formed. Comparison sample composite CS3 included a
polybutadiene polymer matrix with no fillers (i.e., no hexagonal
boron nitride powder). Comparison sample composite CS4 included
non-modified hexagonal boron nitride powder combined in a
polybutadiene polymer matrix with a 20% mass ratio of nitride
powder to poly matrix.
[0190] Thermal conductivity of sample polymer based composites
S2-S4, comparison sample composite CS3 and comparison sample
composite CS4 was measured and recorded. Thermal conductivity was
calculated as the product of thermal diffusivity, density and heat
capacity. More particularly, through plane thermal conductivity was
calculated as the product of the through plane thermal diffusivity,
the density and the heat capacity. The thermal diffusivity of each
sample was measured according to the standard ASTM C-518 by the
thermal flows method. The diffusivity of each sample was measured
perpendicularly to the composite polymer layer. The heat capacity
of each sample was measured by DSC (differential scanning
calorimetry) on a Netzsch thermobalance. The density of each sample
was measured by Helium pycnometry.
[0191] Thermal conductivity measurements are summarized in Table 2
below:
TABLE-US-00002 TABLE 2 Thermal Conductivity THERMAL CONDUCTIVITY
SAMPLE (W/mK) CS2 0.1 S2 0.239 S3 0.287 S4 0.372 CS4 0.129
[0192] The above-disclosed subject matter is to be considered
illustrative, and not restrictive, and the appended claims are
intended to cover all such modifications, enhancements, and other
embodiments, which fall within the true scope of the present
invention. Thus, to the maximum extent allowed by law, the scope of
the present invention is to be determined by the broadest
permissible interpretation of the following claims and their
equivalents, and shall not be restricted or limited by the
foregoing detailed description.
[0193] The Abstract of the Disclosure is provided to comply with
Patent Law and is submitted with the understanding that it will not
be used to interpret or limit the scope or meaning of the claims.
In addition, in the foregoing Detailed Description, various
features may be grouped together or described in a single
embodiment for the purpose of streamlining the disclosure. This
disclosure is not to be interpreted as reflecting an intention that
the claimed embodiments require more features than are expressly
recited in each claim. Rather, as the following claims reflect,
inventive subject matter may be directed to less than all features
of any of the disclosed embodiments. Thus, the following claims are
incorporated into the Detailed Description, with each claim
standing on its own as defining separately claimed subject
matter.
* * * * *