| Patent | Date |
|---|
RF devices with enhanced performance and methods of forming the same
Grant 11,456,282 - Costa , et al. September 27, 2 | 2022-09-27 |
RF devices with enhanced performance and methods of forming the same
Grant 11,444,050 - Costa , et al. September 13, 2 | 2022-09-13 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,443,999 - Costa , et al. September 13, 2 | 2022-09-13 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,430,871 - Costa , et al. August 30, 2 | 2022-08-30 |
RF devices with enhanced performance and methods of forming the same
Grant 11,430,715 - Costa , et al. August 30, 2 | 2022-08-30 |
RF devices with enhanced performance and methods of forming the same
Grant 11,430,757 - Costa , et al. August 30, 2 | 2022-08-30 |
RF devices with enhanced performance and methods of forming the same
Grant 11,417,632 - Costa , et al. August 16, 2 | 2022-08-16 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,410,904 - Costa , et al. August 9, 2 | 2022-08-09 |
RF devices with enhanced performance and methods of forming the same
Grant 11,387,206 - Costa , et al. July 12, 2 | 2022-07-12 |
RF devices with enhanced performance and methods of forming the same
Grant 11,387,215 - Costa , et al. July 12, 2 | 2022-07-12 |
RF devices with enhanced performance and methods of forming the same
Grant 11,387,157 - Costa , et al. July 12, 2 | 2022-07-12 |
RF devices with enhanced performance and methods of forming the same
Grant 11,387,170 - Costa , et al. July 12, 2 | 2022-07-12 |
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
Grant 11,355,385 - Costa , et al. June 7, 2 | 2022-06-07 |
RF devices with enhanced performance and methods of forming the same
Grant 11,355,405 - Costa , et al. June 7, 2 | 2022-06-07 |
RF devices with enhanced performance and methods of forming the same
Grant 11,355,422 - Costa , et al. June 7, 2 | 2022-06-07 |
RF devices with enhanced performance and methods of forming the same
Grant 11,348,899 - Costa , et al. May 31, 2 | 2022-05-31 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,328,974 - Costa , et al. May 10, 2 | 2022-05-10 |
RF devices with enhanced performance and methods of forming the same
Grant 11,328,983 - Costa , et al. May 10, 2 | 2022-05-10 |
RF devices with enhanced performance and methods of forming the same
Grant 11,329,020 - Costa , et al. May 10, 2 | 2022-05-10 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20220139862 - Costa; Julio C. ; et al. | 2022-05-05 |
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
Grant 11,322,389 - Costa , et al. May 3, 2 | 2022-05-03 |
RF devices with enhanced performance and methods of forming the same
Grant 11,322,420 - Costa , et al. May 3, 2 | 2022-05-03 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,309,390 - Costa , et al. April 19, 2 | 2022-04-19 |
RF devices with enhanced performance and methods of forming the same
Grant 11,309,287 - Costa , et al. April 19, 2 | 2022-04-19 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20220108938 - Costa; Julio C. ; et al. | 2022-04-07 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,296,003 - Costa , et al. April 5, 2 | 2022-04-05 |
RF devices with enhanced performance and methods of forming the same
Grant 11,296,046 - Costa , et al. April 5, 2 | 2022-04-05 |
RF devices with enhanced performance and methods of forming the same
Grant 11,296,014 - Costa , et al. April 5, 2 | 2022-04-05 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,271,081 - Costa , et al. March 8, 2 | 2022-03-08 |
RF devices with enhanced performance and methods of forming the same
Grant 11,264,347 - Costa , et al. March 1, 2 | 2022-03-01 |
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
Grant 11,257,709 - Costa , et al. February 22, 2 | 2022-02-22 |
RF devices with enhanced performance and methods of forming the same
Grant 11,257,731 - Costa , et al. February 22, 2 | 2022-02-22 |
RF devices with enhanced performance and methods of forming the same
Grant 11,217,507 - Costa , et al. January 4, 2 | 2022-01-04 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,217,501 - Costa , et al. January 4, 2 | 2022-01-04 |
RF devices with enhanced performance and methods of forming the same
Grant 11,217,561 - Costa , et al. January 4, 2 | 2022-01-04 |
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
Grant 11,195,747 - Costa , et al. December 7, 2 | 2021-12-07 |
RF devices with enhanced performance and methods of forming the same
Grant 11,177,240 - Costa , et al. November 16, 2 | 2021-11-16 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,171,213 - Costa , et al. November 9, 2 | 2021-11-09 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,158,559 - Costa , et al. October 26, 2 | 2021-10-26 |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
Grant 11,152,363 - Costa , et al. October 19, 2 | 2021-10-19 |
Thermally Enhanced Semiconductor Package With At Least One Heat Extractor And Process For Making The Same
App 20210296199 - Costa; Julio C. ; et al. | 2021-09-23 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,127,648 - Costa , et al. September 21, 2 | 2021-09-21 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,127,821 - Costa , et al. September 21, 2 | 2021-09-21 |
RF devices with enhanced performance and methods of forming the same
Grant 11,121,057 - Costa , et al. September 14, 2 | 2021-09-14 |
Gallium-nitride-based Module With Enhanced Electrical Performance And Process For Making The Same
App 20210257464 - Costa; Julio C. ; et al. | 2021-08-19 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,081,418 - Costa , et al. August 3, 2 | 2021-08-03 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,081,552 - Costa , et al. August 3, 2 | 2021-08-03 |
RF devices with enhanced performance and methods of forming the same utilizing localized SOI formation
Grant 11,081,385 - Costa , et al. August 3, 2 | 2021-08-03 |
Wafer-level fan-out package with enhanced performance
Grant 11,069,590 - Hammond , et al. July 20, 2 | 2021-07-20 |
Microelectronics package with vertically stacked dies
Grant 11,063,021 - Costa , et al. July 13, 2 | 2021-07-13 |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
Grant 11,049,859 - Costa , et al. June 29, 2 | 2021-06-29 |
Microelectronics Package With Vertically Stacked Mems Device And Controller Device
App 20210188624 - Costa; Julio C. ; et al. | 2021-06-24 |
Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
Grant 11,043,439 - Costa , et al. June 22, 2 | 2021-06-22 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 11,043,562 - Costa , et al. June 22, 2 | 2021-06-22 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20210183693 - Costa; Julio C. ; et al. | 2021-06-17 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20210167031 - Costa; Julio C. ; et al. | 2021-06-03 |
Microelectronics package with vertically stacked dies
Grant 11,011,498 - Costa , et al. May 18, 2 | 2021-05-18 |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
Grant 11,004,853 - Costa , et al. May 11, 2 | 2021-05-11 |
Rf Devices With Nanotube Particles For Enhanced Performance And Methods Of Forming The Same
App 20210134699 - Costa; Julio C. ; et al. | 2021-05-06 |
Gallium-nitride-based module with enhanced electrical performance and process for making the same
Grant 10,998,407 - Costa , et al. May 4, 2 | 2021-05-04 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10,985,033 - Costa , et al. April 20, 2 | 2021-04-20 |
Microelectronics package with vertically stacked dies
Grant 10,964,672 - Costa , et al. March 30, 2 | 2021-03-30 |
Wafer-level fan-out package with enhanced performance
Grant 10,964,554 - Hammond , et al. March 30, 2 | 2021-03-30 |
Wafer-level fan-out package with enhanced performance
Grant 10,950,518 - Hammond , et al. March 16, 2 | 2021-03-16 |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
Grant 10,943,905 - Costa , et al. March 9, 2 | 2021-03-09 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10,943,797 - Costa , et al. March 9, 2 | 2021-03-09 |
Wafer-level fan-out package with enhanced performance
Grant 10,903,132 - Hammond , et al. January 26, 2 | 2021-01-26 |
Bulk CMOS devices with enhanced performance and methods of forming the same utilizing bulk CMOS process
Grant 10,896,908 - Costa , et al. January 19, 2 | 2021-01-19 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10,886,148 - Costa , et al. January 5, 2 | 2021-01-05 |
Wafer-level package with enhanced performance and manufacturing method thereof
Grant 10,882,740 - Costa , et al. January 5, 2 | 2021-01-05 |
Wafer-level package with enhanced performance
Grant 10,804,179 - Costa , et al. October 13, 2 | 2020-10-13 |
Microelectronics package with vertically stacked dies
Grant 10,804,246 - Costa , et al. October 13, 2 | 2020-10-13 |
Thermally enhanced semiconductor package and process for making the same
Grant 10,790,216 - Costa , et al. September 29, 2 | 2020-09-29 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10,784,233 - Costa , et al. Sept | 2020-09-22 |
Air-cavity module with enhanced device isolation
Grant 10,784,149 - Costa , et al. Sept | 2020-09-22 |
Wafer-level package with enhanced performance
Grant 10,773,952 - Costa , et al. Sept | 2020-09-15 |
Antenna on a device assembly
Grant 10,770,802 - Hietala , et al. Sep | 2020-09-08 |
Wireless communication network with wireless relays that serve data content to wireless user devices
Grant 10,764,172 - Costa , et al. Sep | 2020-09-01 |
Wafer-level packaging for enhanced performance
Grant 10,755,992 - Costa , et al. A | 2020-08-25 |
Stacked field-effect transistor switch
Grant 10,749,518 - Maxim , et al. A | 2020-08-18 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10734356 - | 2020-08-04 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200235040 - Costa; Julio C. ; et al. | 2020-07-23 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200235024 - Costa; Julio C. ; et al. | 2020-07-23 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200235054 - Costa; Julio C. ; et al. | 2020-07-23 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200234978 - Costa; Julio C. ; et al. | 2020-07-23 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200235066 - Costa; Julio C. ; et al. | 2020-07-23 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200235074 - Costa; Julio C. ; et al. | 2020-07-23 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10707095 - | 2020-07-07 |
Wafer-level package with enhanced performance
Grant 10676348 - | 2020-06-09 |
Wafer-level package with enhanced performance
Grant 10679918 - | 2020-06-09 |
Thermally Enhanced Package And Process For Making The Same
App 20200176347 - Costa; Julio C. ; et al. | 2020-06-04 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10658202 - | 2020-05-19 |
Wafer-level packaging for enhanced performance
Grant 10658259 - | 2020-05-19 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10651152 - | 2020-05-12 |
Wafer-level package with enhanced performance
Grant 10636720 - | 2020-04-28 |
Wafer-level Fan-out Package With Enhanced Performance
App 20200115220 - Hammond; Jonathan Hale ; et al. | 2020-04-16 |
Wafer-level Fan-out Package With Enhanced Performance
App 20200118838 - Hammond; Jonathan Hale ; et al. | 2020-04-16 |
Wafer-level packaging for enhanced performance
Grant 10622271 - | 2020-04-14 |
Transmission line structure with high Q factor and low insertion loss for millimeter wave applications
Grant 10,622,309 - Maxim , et al. | 2020-04-14 |
Microelectronics package with vertically stacked dies
Grant 10615147 - | 2020-04-07 |
Wafer-level Package With Enhanced Performance
App 20200102217 - Costa; Julio C. ; et al. | 2020-04-02 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10600659 - | 2020-03-24 |
Wafer-level package with enhanced performance
Grant 10600711 - | 2020-03-24 |
Thermally enhanced semiconductor package and process for making the same
Grant 10600723 - | 2020-03-24 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10593646 - | 2020-03-17 |
Wafer-level package with enhanced performance
Grant 10589993 - | 2020-03-17 |
Wafer-level packaging for enhanced performance
Grant 10586747 - | 2020-03-10 |
Wafer-level package with enhanced performance
Grant 10549988 - | 2020-02-04 |
Thermally enhanced semiconductor package and process for making the same
Grant 10553521 - | 2020-02-04 |
Microelectronics package with vertically stacked dies
Grant 10553564 - | 2020-02-04 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10529691 - | 2020-01-07 |
Wafer-level package with enhanced performance
Grant 10529639 - | 2020-01-07 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same
App 20200006193 - Costa; Julio C. ; et al. | 2020-01-02 |
Microelectronics Package With Vertically Stacked Dies
App 20190378819 - Costa; Julio C. ; et al. | 2019-12-12 |
Microelectronics Package With Vertically Stacked Dies
App 20190378821 - Costa; Julio C. ; et al. | 2019-12-12 |
Thermally enhanced semiconductor package and process for making the same
Grant 10504818 - | 2019-12-10 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10504750 - | 2019-12-10 |
Wireless relay delivery of commercial mobile alert system (CMAS) information to wireless user devices
Grant 10,506,414 - Sippel, II , et al. Dec | 2019-12-10 |
Method for manufacturing an integrated circuit package
Grant 10,492,301 - Costa , et al. Nov | 2019-11-26 |
Wafer-level package with enhanced performance
Grant 10,486,965 - Vandemeer , et al. Nov | 2019-11-26 |
Wafer-level packaging for enhanced performance
Grant 10,490,471 - Costa , et al. Nov | 2019-11-26 |
Wafer-level package with enhanced performance
Grant 10,486,963 - Hatcher, Jr. , et al. Nov | 2019-11-26 |
Wafer-level package with enhanced performance
Grant 10490476 - | 2019-11-26 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10,468,329 - Costa , et al. No | 2019-11-05 |
Rf Devices With Enhanced Performance And Methods Of Forming The Same Utilizing Localized Soi Formation
App 20190326159 - Costa; Julio C. ; et al. | 2019-10-24 |
Wafer-level packaging for enhanced performance
Grant 10453765 - | 2019-10-22 |
Wafer-level package with enhanced performance
Grant 10442684 - | 2019-10-15 |
Method for manufacturing an integrated circuit package
Grant 10448516 - | 2019-10-15 |
Thermally enhanced semiconductor package and process for making the same
Grant 10446470 - | 2019-10-15 |
Gallium-nitride-based Module With Enhanced Electrical Performance And Process For Making The Same
App 20190312110 - Costa; Julio C. ; et al. | 2019-10-10 |
Bulk Cmos Devices With Enhanced Performance And Methods Of Forming The Same Utilizing Bulk Cmos Process
App 20190304977 - Costa; Julio C. ; et al. | 2019-10-03 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10431523 - | 2019-10-01 |
Wafer-level packaging for enhanced performance
Grant 10418297 - | 2019-09-17 |
Method for manufacturing an integrated circuit package
Grant 10405433 - | 2019-09-03 |
Thermally enhanced semiconductor package and process for making the same
Grant 10396011 - | 2019-08-27 |
Wafer-level package with enhanced performance
Grant 10377627 - | 2019-08-13 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10381289 - | 2019-08-13 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10373933 - | 2019-08-06 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10,366,972 - Costa , et al. July 30, 2 | 2019-07-30 |
Thermally enhanced semiconductor package and process for making the same
Grant 10347560 - | 2019-07-09 |
Method for manufacturing an integrated circuit package
Grant 10349529 - | 2019-07-09 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10340202 - | 2019-07-02 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10325896 - | 2019-06-18 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10304753 - | 2019-05-28 |
Thermally enhanced semiconductor package and process for making the same
Grant 10297529 - | 2019-05-21 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10283494 - | 2019-05-07 |
Transmission Line Structure With High Q Factor And Low Insertion Loss For Millimeter Wave Applications
App 20190131245 - Maxim; George ; et al. | 2019-05-02 |
Backside semiconductor die trimming
Grant 10,276,495 - Maxim , et al. | 2019-04-30 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10269680 - | 2019-04-23 |
Thermally enhanced semiconductor package with thermal additive and process for making the same
Grant 10,262,915 - Costa , et al. | 2019-04-16 |
Backside semiconductor die trimming
Grant 10242945 - | 2019-03-26 |
Microelectronics package with self-aligned stacked-die assembly
Grant 10236281 - | 2019-03-19 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10236235 - | 2019-03-19 |
Wafer-level package with enhanced performance
Grant 10227231 - | 2019-03-12 |
Thermally enhanced semiconductor package with thermal additive and process for making the same
Grant 10229860 - | 2019-03-12 |
Microelectronics Package With Self-aligned Stacked-die Assembly
App 20190074263 - Costa; Julio C. ; et al. | 2019-03-07 |
Microelectronics Package With Self-aligned Stacked-die Assembly
App 20190074271 - Costa; Julio C. ; et al. | 2019-03-07 |
Wafer-level Package With Enhanced Performance
App 20190057922 - Costa; Julio C. ; et al. | 2019-02-21 |
Wafer-level package with enhanced performance
Grant 10196260 - | 2019-02-05 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10199304 - | 2019-02-05 |
Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
Grant 10,199,301 - Leipold , et al. Fe | 2019-02-05 |
Thermally enhanced semiconductor package with thermal additive and process for making the same
Grant 10192803 - | 2019-01-29 |
Wafer-level Packaging For Enhanced Performance
App 20190013254 - Costa; Julio C. ; et al. | 2019-01-10 |
Wafer-level Packaging For Enhanced Performance
App 20190013255 - Costa; Julio C. ; et al. | 2019-01-10 |
Thermally Enhanced Semiconductor Package And Process For Making The Same
App 20180342439 - Costa; Julio C. ; et al. | 2018-11-29 |
Silicon-on-plastic semiconductor device with interfacial adhesion layer
Grant 10,134,627 - Costa November 20, 2 | 2018-11-20 |
Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
Grant 10,121,718 - Leipold , et al. November 6, 2 | 2018-11-06 |
Wafer-level package with enhanced performance
Grant 10,109,550 - Costa , et al. October 23, 2 | 2018-10-23 |
Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
Grant 10,109,548 - Leipold , et al. October 23, 2 | 2018-10-23 |
Semiconductor package with reduced parasitic coupling effects and process for making the same
Grant 10,109,502 - Costa , et al. October 23, 2 | 2018-10-23 |
Thermally enhanced semiconductor package with thermal additive and process for making the same
Grant 10,103,080 - Costa , et al. October 16, 2 | 2018-10-16 |
Microelectronics package with inductive element and magnetically enhanced mold compound component
Grant 10,090,262 - Costa , et al. October 2, 2 | 2018-10-02 |
Radio frequency (RF) switch
Grant 10,090,339 - Leipold , et al. October 2, 2 | 2018-10-02 |
Method for manufacturing an integrated circuit package
Grant 10,085,352 - Costa , et al. September 25, 2 | 2018-09-25 |
Thermally enhanced semiconductor package having field effect transistors with back-gate feature
Grant 10,079,196 - Costa , et al. September 18, 2 | 2018-09-18 |
Semiconductor Package With Reduced Parasitic Coupling Effects And Process For Making The Same
App 20180261470 - Costa; Julio C. ; et al. | 2018-09-13 |
Thermally enhanced semiconductor package and process for making the same
Grant 10,068,831 - Costa , et al. September 4, 2 | 2018-09-04 |
Microelectronics package with inductive element and magnetically enhanced mold compound component
Grant 10,062,583 - Costa , et al. August 28, 2 | 2018-08-28 |
Method of manufacture for a semiconductor device
Grant 10,062,637 - Costa , et al. August 28, 2 | 2018-08-28 |
Method For Manufacturing An Integrated Circuit Package
App 20180228030 - Costa; Julio C. ; et al. | 2018-08-09 |
Substrate structure with embedded layer for post-processing silicon handle elimination
Grant 10,038,055 - Costa , et al. July 31, 2 | 2018-07-31 |
Thermally Enhanced Semiconductor Package With Thermal Additive And Process For Making The Same
App 20180197803 - Costa; Julio C. ; et al. | 2018-07-12 |
Encapsulated dies with enhanced thermal performance
Grant 10,020,206 - Morris , et al. July 10, 2 | 2018-07-10 |
Microelectronics package with integrated sensors
Grant 10,020,405 - Leipold , et al. July 10, 2 | 2018-07-10 |
Thermally Enhanced Semiconductor Package And Process For Making The Same
App 20180166358 - Costa; Julio C. ; et al. | 2018-06-14 |
Stacked Field-effect Transistor Switch
App 20180145678 - Maxim; George ; et al. | 2018-05-24 |
Air-cavity Module With Enhanced Device Isolation
App 20180138082 - Costa; Julio C. ; et al. | 2018-05-17 |
Flip chip module with enhanced properties
Grant 9,960,145 - Costa , et al. May 1, 2 | 2018-05-01 |
Radio Frequency (rf) Switch
App 20180114801 - Leipold; Dirk Robert Walter ; et al. | 2018-04-26 |
Semiconductor Package With Reduced Parasitic Coupling Effects And Process For Making The Same
App 20180076174 - Costa; Julio C. ; et al. | 2018-03-15 |
Printed Circuit Module Having A Semiconductor Device With A Protective Layer In Place Of A Low-resistivity Handle Layer
App 20180053704 - Leipold; Dirk Robert Walter ; et al. | 2018-02-22 |
Wafer-level Package With Enhanced Performance
App 20180047653 - Costa; Julio C. ; et al. | 2018-02-15 |
Wafer-level Package With Enhanced Performance
App 20180044177 - Vandemeer; Jan Edward ; et al. | 2018-02-15 |
Wafer-level Package With Enhanced Performance
App 20180044169 - Hatcher, JR.; Merrill Albert ; et al. | 2018-02-15 |
Thermally Enhanced Semiconductor Package Having Field Effect Transistors With Back-gate Feature
App 20180019185 - Costa; Julio C. ; et al. | 2018-01-18 |
Thermally Enhanced Semiconductor Package Having Field Effect Transistors With Back-gate Feature
App 20180019184 - Costa; Julio C. ; et al. | 2018-01-18 |
Encapsulated micro-electromechanical system switch and method of manufacturing the same
Grant 9,859,076 - Hammond , et al. January 2, 2 | 2018-01-02 |
Thermally Enhanced Semiconductor Package With Thermal Additive And Process For Making The Same
App 20170358511 - Costa; Julio C. ; et al. | 2017-12-14 |
Wafer-level Package With Enhanced Performance
App 20170334710 - Costa; Julio C. ; et al. | 2017-11-23 |
Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
Grant 9,824,951 - Leipold , et al. November 21, 2 | 2017-11-21 |
Microelectronics Package With Inductive Element And Magnetically Enhanced Mold Compound Component
App 20170323804 - Costa; Julio C. ; et al. | 2017-11-09 |
Microelectronics Package With Inductive Element And Magnetically Enhanced Mold Compound Component
App 20170323860 - Costa; Julio C. ; et al. | 2017-11-09 |
Method of manufacture for a silicon-on-plastic semiconductor device with interfacial adhesion layer
Grant 9,812,350 - Costa November 7, 2 | 2017-11-07 |
Suppression of back-gate transistors in RF CMOS switches built on an SOI substrate
Grant 9,806,192 - Mason , et al. October 31, 2 | 2017-10-31 |
Substrate Structure With Embedded Layer For Post-processing Silicon Handle Elimination
App 20170309709 - Costa; Julio C. ; et al. | 2017-10-26 |
Method for sharing satellite positioning system information among nearby base stations
Grant 9,788,291 - Tracy , et al. October 10, 2 | 2017-10-10 |
Silicon-on-plastic Semiconductor Device With Interfacial Adhesion Layer
App 20170271200 - Costa; Julio C. | 2017-09-21 |
Microelectronics Package With Integrated Sensors
App 20170207350 - Leipold; Dirk Robert Walter ; et al. | 2017-07-20 |
Methods Of Manufacturing A Printed Circuit Module Having A Semiconductor Device With A Protective Layer In Place Of A Low-resistivity Handle Layer
App 20170098587 - Leipold; Dirk Robert Walter ; et al. | 2017-04-06 |
Encapsulated dies with enhanced thermal performance
Grant 9,613,831 - Morris , et al. April 4, 2 | 2017-04-04 |
Backside Semiconductor Die Trimming
App 20170077028 - Maxim; George ; et al. | 2017-03-16 |
Silicon-on-plastic semiconductor device and method of making the same
Grant 9,583,414 - Costa , et al. February 28, 2 | 2017-02-28 |
Method Of Manufacture For A Semiconductor Device
App 20170032957 - Costa; Julio C. ; et al. | 2017-02-02 |
Suppression Of Back-gate Transistors In Rf Cmos Switches Built On An Soi Substrate
App 20160380101 - Mason; Philip W. ; et al. | 2016-12-29 |
Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
Grant 9,530,709 - Leipold , et al. December 27, 2 | 2016-12-27 |
Substrate Structure With Embedded Layer For Post-processing Silicon Handle Elimination
App 20160343604 - Costa; Julio C. ; et al. | 2016-11-24 |
Flip Chip Module With Enhanced Properties
App 20160343592 - Costa; Julio C. ; et al. | 2016-11-24 |
Radio frequency (RF) microelectromechanical systems (MEMS) devices with gold-doped silicon
Grant 9,475,692 - Costa , et al. October 25, 2 | 2016-10-25 |
Encapsulated Dies With Enhanced Thermal Performance
App 20160284570 - Morris; Thomas Scott ; et al. | 2016-09-29 |
Encapsulated Dies With Enhanced Thermal Performance
App 20160284568 - Morris; Thomas Scott ; et al. | 2016-09-29 |
Antenna On A Device Assembly
App 20160134014 - Hietala; Alexander Wayne ; et al. | 2016-05-12 |
Methods Of Manufacturing A Printed Circuit Module Having A Semiconductor Device With A Protective Layer In Place Of A Low-resistivity Handle Layer
App 20160126111 - Leipold; Dirk Robert Walter ; et al. | 2016-05-05 |
Printed Circuit Module Having A Semiconductor Device With A Protective Layer In Place Of A Low-resistivity Handle Layer
App 20160126196 - Leipold; Dirk Robert Walter ; et al. | 2016-05-05 |
Method for allocating coverage area identifiers among nearby base stations
Grant 9,319,872 - Malreddy , et al. April 19, 2 | 2016-04-19 |
Method For Manufacturing An Integrated Circuit Package
App 20160100489 - Costa; Julio C. ; et al. | 2016-04-07 |
Printed Circuit Module Having Semiconductor Device With A Polymer Substrate And Methods Of Manufacturing The Same
App 20160079137 - Leipold; Dirk Robert Walter ; et al. | 2016-03-17 |
Integrated circuit switches, design structure and methods of fabricating the same
Grant 9,284,185 - Anderson , et al. March 15, 2 | 2016-03-15 |
Encapsulated Micro-electromechanical System Switch And Method Of Manufacturing The Same
App 20160027601 - Hammond; Jonathan Hale ; et al. | 2016-01-28 |
Radio Frequency (rf) Microelectromechanical Systems (mems) Devices With Gold-doped Silicon
App 20160023892 - Costa; Julio C. ; et al. | 2016-01-28 |
Soi With Gold-doped Handle Wafer
App 20150371905 - Carroll; Michael ; et al. | 2015-12-24 |
Rf Switch Structure Having Reduced Off-state Capacitance
App 20150340322 - Mason; Philip W. ; et al. | 2015-11-26 |
Silicon-on-plastic Semiconductor Device With Interfacial Adhesion Layer
App 20150255368 - Costa; Julio C. | 2015-09-10 |
Silicon-on-plastic Semiconductor Device And Method Of Making The Same
App 20150115416 - Costa; Julio C. ; et al. | 2015-04-30 |
Integrated circuit with a high speed narrow base width vertical PNP transistor
Grant 6,809,396 - Zdebel , et al. October 26, 2 | 2004-10-26 |
Integrated circuit with vertical PNP transistor and method
App 20040099896 - Zdebel, Peter J. ; et al. | 2004-05-27 |
Enhancement mode RF device and fabrication method
Grant 6,528,405 - Martinez , et al. March 4, 2 | 2003-03-04 |
Semiconductor transistor with stabilizing gate electrode
Grant 6,023,086 - Reyes , et al. February 8, 2 | 2000-02-08 |
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