| Patent | Date |
|---|
Silicon-on-insulator Die Support Structures And Related Methods
App 20220301876 - SEDDON; Michael J. ; et al. | 2022-09-22 |
Multichip module supports and related methods
Grant 11,437,291 - Carney , et al. September 6, 2 | 2022-09-06 |
Substrate structures and methods of manufacture
Grant 11,437,304 - Lin , et al. September 6, 2 | 2022-09-06 |
Multidie supports for reducing die warpage
Grant 11,430,746 - Seddon , et al. August 30, 2 | 2022-08-30 |
Semiconductor Package Electrical Contacts And Related Methods
App 20220270884 - LIN; Yusheng ; et al. | 2022-08-25 |
Semiconductor Packages With Die Including Cavities And Related Methods
App 20220246434 - SEDDON; Michael J. ; et al. | 2022-08-04 |
Die sidewall coatings and related methods
Grant 11,404,277 - Carney , et al. August 2, 2 | 2022-08-02 |
Semiconductor packages with thin die and related methods
Grant 11,404,276 - Carney , et al. August 2, 2 | 2022-08-02 |
Backmetal Removal Methods
App 20220238342 - SEDDON; Michael J. ; et al. | 2022-07-28 |
Semiconductor package electrical contact structures and related methods
Grant 11,393,692 - Carney , et al. July 19, 2 | 2022-07-19 |
Semiconductor package electrical contacts and related methods
Grant 11,367,619 - Lin , et al. June 21, 2 | 2022-06-21 |
Silicon-on-insulator die support structures and related methods
Grant 11,361,970 - Seddon , et al. June 14, 2 | 2022-06-14 |
Backmetal removal methods
Grant 11,348,796 - Seddon , et al. May 31, 2 | 2022-05-31 |
Semiconductor packages with die including cavities and related methods
Grant 11,342,189 - Seddon , et al. May 24, 2 | 2022-05-24 |
Isolation in a semiconductor device
Grant 11,257,759 - Carney , et al. February 22, 2 | 2022-02-22 |
Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates
Grant 11,211,359 - Carney , et al. December 28, 2 | 2021-12-28 |
Supports For Thinned Semiconductor Substrates And Related Methods
App 20210343655 - SEDDON; Michael J. ; et al. | 2021-11-04 |
Non-planar Semiconductor Packaging Systems And Related Methods
App 20210343555 - SEDDON; Michael J. ; et al. | 2021-11-04 |
Multichip Module Supports And Related Methods
App 20210343612 - CARNEY; Francis J. ; et al. | 2021-11-04 |
Temporary Die Support Structures And Related Methods
App 20210343568 - CARNEY; Francis J. ; et al. | 2021-11-04 |
Curved Semiconductor Die Systems And Related Methods
App 20210343574 - SEDDON; Michael J. ; et al. | 2021-11-04 |
Laser Contact Ablation For Semiconductor Packages And Related Methods
App 20210343540 - CARNEY; Francis J. ; et al. | 2021-11-04 |
Multidie Supports And Related Methods
App 20210343657 - SEDDON; Michael J. ; et al. | 2021-11-04 |
Semiconductor Packages With Passivating Material On Die Sidewalls And Related Methods
App 20210343615 - CARNEY; Francis J. ; et al. | 2021-11-04 |
Semiconductor Packages With An Intermetallic Layer
App 20210327843 - SEDDON; Michael J. ; et al. | 2021-10-21 |
Direct Bonded Copper Substrates Fabricated Using Silver Sintering
App 20210225730 - TOLENTINO; Erik Nino Mercado ; et al. | 2021-07-22 |
Semiconductor packages with an intermetallic layer
Grant 11,049,833 - Seddon , et al. June 29, 2 | 2021-06-29 |
Through-substrate Via Structure And Method Of Manufacture
App 20210167002 - SEDDON; Michael J. ; et al. | 2021-06-03 |
Semiconductor baseplates
Grant 10,971,428 - Prajuckamol , et al. April 6, 2 | 2021-04-06 |
Through-substrate via structure and method of manufacture
Grant 10,950,534 - Seddon , et al. March 16, 2 | 2021-03-16 |
Semiconductor Device And Method Of Forming Micro Interconnect Structures
App 20210043553 - CARNEY; Francis J. ; et al. | 2021-02-11 |
Molded wafer level packaging
Grant 10,916,485 - Wang , et al. February 9, 2 | 2021-02-09 |
Semiconductor Package Stress Balance Structures And Related Methods
App 20210035807 - LIN; Yusheng ; et al. | 2021-02-04 |
Polymer Resin And Compression Mold Chip Scale Package
App 20210028133 - LIN; Yusheng ; et al. | 2021-01-28 |
Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
Grant 10,903,154 - Carney , et al. January 26, 2 | 2021-01-26 |
Method of making single reflow power pin connections
Grant 10,897,821 - Yao , et al. January 19, 2 | 2021-01-19 |
Pre-stacking Mechanical Strength Enhancement Of Power Device Structures
App 20210013176 - LIN; Yusheng ; et al. | 2021-01-14 |
Semiconductor Baseplates
App 20200402887 - PRAJUCKAMOL; Atapol ; et al. | 2020-12-24 |
Semiconductor Package Electrical Contact Structures And Related Methods
App 20200395217 - CARNEY; Francis J. ; et al. | 2020-12-17 |
Semiconductor Packages With Die Including Cavities And Related Methods
App 20200365408 - SEDDON; Michael J. ; et al. | 2020-11-19 |
Thinned Semiconductor Package And Related Methods
App 20200357751 - LIN; Yusheng ; et al. | 2020-11-12 |
Semiconductor device and method of forming micro interconnect structures
Grant 10,825,764 - Carney , et al. November 3, 2 | 2020-11-03 |
Polymer resin and compression mold chip scale package
Grant 10,825,786 - Lin , et al. November 3, 2 | 2020-11-03 |
Semiconductor device and method of forming a curved image sensor
Grant 10,818,587 - Seddon , et al. October 27, 2 | 2020-10-27 |
Semiconductor Packages With Thin Die And Related Methods
App 20200286735 - CARNEY; Francis J. ; et al. | 2020-09-10 |
Backmetal Removal Methods
App 20200286736 - SEDDON; Michael J. ; et al. | 2020-09-10 |
Die Sidewall Coatings And Related Methods
App 20200279747 - CARNEY; Francis J. ; et al. | 2020-09-03 |
Thinned semiconductor package and related methods
Grant 10,748,850 - Lin , et al. A | 2020-08-18 |
Silicon-on-insulator Die Support Structures And Related Methods
App 20200258751 - A1 | 2020-08-13 |
Semiconductor Package Electrical Contacts And Related Methods
App 20200258752 - A1 | 2020-08-13 |
Die Support Structures And Related Methods
App 20200258750 - A1 | 2020-08-13 |
Stacked semiconductor device structure and method
Grant 10,741,484 - Seddon , et al. A | 2020-08-11 |
Semiconductor Package With Elastic Coupler And Related Methods
App 20200194322 - LIN; Yusheng ; et al. | 2020-06-18 |
Molded Wafer Level Packaging
App 20200126880 - WANG; Soon Wei ; et al. | 2020-04-23 |
Semiconductor package with elastic coupler and related methods
Grant 10,607,903 - Lin , et al. | 2020-03-31 |
Molded wafer level packaging
Grant 10,559,510 - Wang , et al. Feb | 2020-02-11 |
Semiconductor Device And Method Of Forming Cantilevered Protrusion On A Semiconductor Die
App 20190378788 - CARNEY; Francis J. ; et al. | 2019-12-12 |
Through-substrate Via Structure And Method Of Manufacture
App 20190371721 - SEDDON; Michael J. ; et al. | 2019-12-05 |
Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
Grant 10,453,784 - Carney , et al. Oc | 2019-10-22 |
Through-substrate via structure and method of manufacture
Grant 10,446,480 - Seddon , et al. Oc | 2019-10-15 |
Thinned Semiconductor Package And Related Methods
App 20190287913 - LIN; Yusheng ; et al. | 2019-09-19 |
Semiconductor Package With Elastic Coupler And Related Methods
App 20190252275 - LIN; Yusheng ; et al. | 2019-08-15 |
Polymer Resin And Compression Mold Chip Scale Package
App 20190221532 - LIN; Yusheng ; et al. | 2019-07-18 |
Semiconductor package with elastic coupler and related methods
Grant 10,319,652 - Lin , et al. | 2019-06-11 |
Polymer resin and compression mold chip scale package
Grant 10,283,466 - Lin , et al. | 2019-05-07 |
Single Reflow Power Pin Connections
App 20190116669 - YAO; Yushuang ; et al. | 2019-04-18 |
Single reflow power pin connections
Grant 10,231,340 - Yao , et al. | 2019-03-12 |
Molded Wafer Level Packaging
App 20190067143 - WANG; Soon Wei ; et al. | 2019-02-28 |
Semiconductor device and method of aligning semiconductor wafers for bonding
Grant 10,199,316 - Seddon , et al. Fe | 2019-02-05 |
Semiconductor Device And Method Of Forming A Curved Image Sensor
App 20190035718 - SEDDON; Michael J. ; et al. | 2019-01-31 |
Semiconductor Device And Method Of Forming A Curved Image Sensor
App 20190035717 - SEDDON; Michael J. ; et al. | 2019-01-31 |
Semiconductor Device And Method Of Forming Micro Interconnect Structures
App 20190013265 - CARNEY; Francis J. ; et al. | 2019-01-10 |
Die Bonding To A Board
App 20190013308 - SEDDON; Michael J. ; et al. | 2019-01-10 |
Stacked Semiconductor Device Structure And Method
App 20190013264 - SEDDON; Michael J. ; et al. | 2019-01-10 |
Stacked semiconductor device structure and method
Grant 10,163,772 - Seddon , et al. Dec | 2018-12-25 |
Through-substrate Via Structure And Method Of Manufacture
App 20180350733 - SEDDON; Michael J. ; et al. | 2018-12-06 |
Die bonding to a board
Grant 10,115,716 - Seddon , et al. October 30, 2 | 2018-10-30 |
Semiconductor device and method of forming a curved image sensor
Grant 10,115,662 - Seddon , et al. October 30, 2 | 2018-10-30 |
Semiconductor device and method of forming micro interconnect structures
Grant 10,090,233 - Carney , et al. October 2, 2 | 2018-10-02 |
Through-substrate via structure and method of manufacture
Grant 10,079,199 - Seddon , et al. September 18, 2 | 2018-09-18 |
Semiconductor Device And Method Of Forming Cantilevered Protrusion On A Semiconductor Die
App 20180240742 - CARNEY; Francis J. ; et al. | 2018-08-23 |
Embedded Stacked Die Packages And Related Methods
App 20180211939 - LIN; Yusheng ; et al. | 2018-07-26 |
Method for removing material from a substrate using in-situ thickness measurement
Grant 10,014,245 - Seddon , et al. July 3, 2 | 2018-07-03 |
Semiconductor Device And Method Of Forming Cantilevered Protrusion On A Semiconductor Die
App 20180182698 - CARNEY; Francis J. ; et al. | 2018-06-28 |
Embedded stacked die packages and related methods
Grant 9,941,257 - Lin , et al. April 10, 2 | 2018-04-10 |
Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
Grant 9,935,045 - Carney , et al. April 3, 2 | 2018-04-03 |
Semiconductor Device And Method Of Aligning Semiconductor Wafers For Bonding
App 20180076120 - SEDDON; Michael J. ; et al. | 2018-03-15 |
Method of manufacturing a semiconductor device having reduced on-state resistance and structure
Grant 9,893,058 - Seddon , et al. February 13, 2 | 2018-02-13 |
Embedded Stacked Die Packages And Related Methods
App 20180033777 - LIN; Yusheng ; et al. | 2018-02-01 |
Semiconductor device and method of aligning semiconductor wafers for bonding
Grant 9,852,972 - Seddon , et al. December 26, 2 | 2017-12-26 |
Method for insulating singulated electronic die
Grant 9,847,270 - Carney December 19, 2 | 2017-12-19 |
Flip chip bonding alloys
Grant 9,847,310 - Seddon , et al. December 19, 2 | 2017-12-19 |
Polymer Resin And Compression Mold Chip Scale Package
App 20170345779 - LIN; Yusheng ; et al. | 2017-11-30 |
Single Reflow Power Pin Connections
App 20170347456 - YAO; Yushuang ; et al. | 2017-11-30 |
Semiconductor Package With Elastic Coupler And Related Methods
App 20170294362 - LIN; Yusheng ; et al. | 2017-10-12 |
Stacked Semiconductor Device Structure And Method
App 20170271252 - SEDDON; Michael J. ; et al. | 2017-09-21 |
Die support for enlarging die size
Grant 9,748,163 - Wang , et al. August 29, 2 | 2017-08-29 |
Stacked semiconductor device structure and method
Grant 9,711,434 - Seddon , et al. July 18, 2 | 2017-07-18 |
Semiconductor package with elastic coupler and related methods
Grant 9,691,732 - Lin , et al. June 27, 2 | 2017-06-27 |
Embedded stacked die packages and related methods
Grant 9,679,878 - Lin , et al. June 13, 2 | 2017-06-13 |
Substrate Structures And Methods Of Manufacture
App 20170162481 - LIN; Yusheng ; et al. | 2017-06-08 |
Semiconductor Packages With An Intermetallic Layer
App 20170133341 - SEDDON; Michael J. ; et al. | 2017-05-11 |
Method Of Manufacturing A Semiconductor Device Having Reduced On-state Resistance And Structure
App 20170110452 - SEDDON; Michael J. ; et al. | 2017-04-20 |
Method For Removing Material From A Substrate Using In-situ Thickness Measurement
App 20170084505 - SEDDON; Michael J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Aligning Semiconductor Wafers For Bonding
App 20170084595 - SEDDON; Michael J. ; et al. | 2017-03-23 |
Stacked Semiconductor Device Structure And Method
App 20170084518 - SEDDON; Michael J. ; et al. | 2017-03-23 |
Through-substrate Via Structure And Method Of Manufacture
App 20170084527 - Seddon; Michael J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Forming An Alignment Structure In Backside Of A Semiconductor Die
App 20170084545 - SEDDON; Michael J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Forming Cantilevered Protrusion On A Semiconductor Die
App 20170084520 - CARNEY; Francis J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Forming Modular 3d Semiconductor Package
App 20170084577 - CARNEY; Francis J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Forming Micro Interconnect Structures
App 20170084517 - CARNEY; Francis J. ; et al. | 2017-03-23 |
Semiconductor Device And Method Of Forming A Curved Image Sensor
App 20170084661 - SEDDON; Michael J. ; et al. | 2017-03-23 |
Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel
Grant 9,564,409 - Seddon , et al. February 7, 2 | 2017-02-07 |
Die Bonding To A Board
App 20170018542 - SEDDON; Michael J. ; et al. | 2017-01-19 |
Flip Chip Bonding Alloys
App 20170018522 - SEDDON; Michael J. ; et al. | 2017-01-19 |
Semiconductor Package With Elastic Coupler And Related Methods
App 20160343683 - LIN; Yusheng ; et al. | 2016-11-24 |
Method For Insulating Singulated Electronic Die
App 20160276240 - CARNEY; Francis J. | 2016-09-22 |
Semiconductor package with elastic coupler and related methods
Grant 9,431,311 - Lin , et al. August 30, 2 | 2016-08-30 |
Semiconductor Package With Elastic Coupler And Related Methods
App 20160247735 - Lin; Yusheng ; et al. | 2016-08-25 |
Semiconductor Packages With An Intermetallic Layer And Related Methods
App 20160218074 - Seddon; Michael J. ; et al. | 2016-07-28 |
Method for insulating singulated electronic die
Grant 9,385,041 - Carney July 5, 2 | 2016-07-05 |
Method of forming an EM protected semiconductor die
Grant 9,299,664 - Seddon , et al. March 29, 2 | 2016-03-29 |
Method For Insulating Singulated Electronic Die And Structure
App 20160064282 - Carney; Francis J. | 2016-03-03 |
EM protected semiconductor die
Grant 9,275,957 - Seddon , et al. March 1, 2 | 2016-03-01 |
Semiconductor component that includes a protective structure
Grant 9,263,390 - Seddon , et al. February 16, 2 | 2016-02-16 |
Method of manufacturing a semiconductor component
Grant 9,219,010 - Seddon , et al. December 22, 2 | 2015-12-22 |
Em Protected Semiconductor Die
App 20140048917 - Seddon; Michael J. ; et al. | 2014-02-20 |
Method Of Manufacturing A Semiconductor Component
App 20130244418 - Seddon; Michael J. ; et al. | 2013-09-19 |
Semiconductor component that includes a protective structure
App 20130234311 - Seddon; Michael J. ; et al. | 2013-09-12 |
Method for manufacturing a semiconductor component
Grant 8,445,375 - Seddon , et al. May 21, 2 | 2013-05-21 |
Multi-chip semiconductor connector
Grant 8,253,239 - Carney , et al. August 28, 2 | 2012-08-28 |
Method of thinning a semiconductor wafer using a film frame
Grant 8,084,335 - Seddon , et al. December 27, 2 | 2011-12-27 |
Method Of Forming An Em Protected Semiconductor Die
App 20110175209 - Seddon; Michael J. ; et al. | 2011-07-21 |
Method Of Forming An Em Protected Semiconductor Die
App 20110175225 - Seddon; Michael J. ; et al. | 2011-07-21 |
Semiconductor package structure having enhanced thermal dissipation characteristics
Grant 7,944,044 - Carney , et al. May 17, 2 | 2011-05-17 |
Method Of Manufacturing A Semiconductor Component And Structure
App 20110074034 - Seddon; Michael J. ; et al. | 2011-03-31 |
Multi-chip Semiconductor Connector
App 20110068451 - Carney; Francis J. ; et al. | 2011-03-24 |
Multi-chip semiconductor connector and method
Grant 7,875,964 - Carney , et al. January 25, 2 | 2011-01-25 |
Method of forming a leaded molded array package
Grant 7,820,528 - Burghout , et al. October 26, 2 | 2010-10-26 |
Semiconductor package structure having enhanced thermal dissipation characteristics
Grant 7,755,179 - Carney , et al. July 13, 2 | 2010-07-13 |
Method Of Thinning A Semiconductor Wafer
App 20100009519 - Seddon; Michael J. ; et al. | 2010-01-14 |
Method Of Forming A Leaded Molded Array Package
App 20090298232 - Burghout; William F. ; et al. | 2009-12-03 |
Method of forming a leaded molded array package
Grant 7,588,999 - Burghout , et al. September 15, 2 | 2009-09-15 |
Semiconductor package structure for vertical mount and method
Grant 7,566,967 - St. Germain , et al. July 28, 2 | 2009-07-28 |
Multi-chip semiconductor connector assemblies
Grant 7,508,060 - Carney , et al. March 24, 2 | 2009-03-24 |
Multi-chip semiconductor connector assembly method
Grant 7,498,195 - Carney , et al. March 3, 2 | 2009-03-03 |
Semiconductor package structure having multiple heat dissipation paths and method of manufacture
Grant 7,495,323 - St. Germain , et al. February 24, 2 | 2009-02-24 |
Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics
App 20080246130 - Carney; Francis J. ; et al. | 2008-10-09 |
Semiconductor package structure for vertical mount and method
Grant 7,397,120 - St. Germain , et al. July 8, 2 | 2008-07-08 |
Semiconductor Package Structure Having Multiple Heat Dissipation Paths And Method Of Manufacture
App 20080054438 - Germain; Stephen St. ; et al. | 2008-03-06 |
Multi-chip Semiconductor Connector Assemblies
App 20080006920 - Carney; Francis J. ; et al. | 2008-01-10 |
Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics
App 20070278664 - Carney; Francis J. ; et al. | 2007-12-06 |
Multi-chip semiconductor connector assemblies
Grant 7,298,034 - Carney , et al. November 20, 2 | 2007-11-20 |
Semiconductor package structure for vertical mount and method
App 20070138503 - Germain; Stephen St. ; et al. | 2007-06-21 |
Multi-chip Semiconductor Connector Assembly Method
App 20070126107 - Carney; Francis J. ; et al. | 2007-06-07 |
Multi-chip Semiconductor Connector And Method
App 20070126106 - Carney; Francis J. ; et al. | 2007-06-07 |
Method of forming a leaded molded array package
App 20070111393 - Burghout; William F. ; et al. | 2007-05-17 |
Multi-chip semiconductor connector and method
Grant 7,202,106 - Carney , et al. April 10, 2 | 2007-04-10 |
Multi-chip semiconductor connector assembly method
Grant 7,202,105 - Carney , et al. April 10, 2 | 2007-04-10 |
Semiconductor component and method of manufacture
App 20070035019 - Carney; Francis J. ; et al. | 2007-02-15 |
Robust power semiconductor package
Grant 7,135,761 - Carney , et al. November 14, 2 | 2006-11-14 |
Robust power semiconductor package
App 20060055011 - Carney; Francis J. ; et al. | 2006-03-16 |
Multi-chip semiconductor connector assemblies
App 20050285249 - Carney, Francis J. ; et al. | 2005-12-29 |
Multi-chip semiconductor connector assembly method
App 20050287703 - Carney, Francis J. ; et al. | 2005-12-29 |
Multi-chip semiconductor connector and method
App 20050285235 - Carney, Francis J. ; et al. | 2005-12-29 |
Microelectronic package including a polymer encapsulated die
Grant 6,093,972 - Carney , et al. July 25, 2 | 2000-07-25 |
Optoelectronic device and method of assembly
Grant 5,933,558 - Sauvageau , et al. August 3, 1 | 1999-08-03 |
Microelectronic package including a polymer encapsulated die, and method for forming same
Grant 5,895,229 - Carney , et al. April 20, 1 | 1999-04-20 |
Electronic component for aligning a light transmitting structure
Grant 5,883,996 - Knapp , et al. March 16, 1 | 1999-03-16 |
Interconnect system and method of fabrication
Grant 5,773,359 - Mitchell , et al. June 30, 1 | 1998-06-30 |
Polyimide optical waveguide having electrical conductivity
Grant 5,659,648 - Knapp , et al. August 19, 1 | 1997-08-19 |
Thermoplastic interconnect for electronic device and method for making
Grant 5,583,747 - Baird , et al. December 10, 1 | 1996-12-10 |
Electrical interconnect and method for forming the same
Grant 5,480,835 - Carney , et al. January 2, 1 | 1996-01-02 |
Semiconductor chip package and method of forming
Grant 5,467,253 - Heckman , et al. November 14, 1 | 1995-11-14 |
Semiconductor package having an exposed die surface
Grant 5,319,242 - Carney , et al. June 7, 1 | 1994-06-07 |
Apparatus for tape automated bonding
Grant 5,232,144 - Carney , et al. August 3, 1 | 1993-08-03 |
Plasma removal of unwanted material
Grant 4,975,146 - Knapp , et al. * December 4, 1 | 1990-12-04 |
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