Brooks; Jerry M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Brooks; Jerry M..The latest application filed is for "vertical surface mount assembly and methods".

Company Profile

0.112.106

Brooks; Jerry M. - Caldwell ID
Brooks; Jerry M. - Palmer AK
Brooks; Jerry M. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package having reduced interconnects Grant 8,115,269 - Farnworth , et al. February 14, 2	2012-02-14
Stackable ball grid array package Grant RE43,112 - Corisis , et al. January 17, 2	2012-01-17
Multi-chip module and methods Grant 8,048,715 - Corisis , et al. November 1, 2	2011-11-01
Semiconductor device and method of fabrication thereof Grant 8,049,342 - Mess , et al. November 1, 2	2011-11-01
Semiconductor device assemblies, electronic devices including the same and assembly methods Grant 7,998,792 - Mess , et al. August 16, 2	2011-08-16
Semiconductor devices including semiconductor dice in laterally offset stacked arrangement Grant 7,999,378 - Mess , et al. August 16, 2	2011-08-16
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,944,057 - Corisis , et al. May 17, 2	2011-05-17
Vertical Surface Mount Assembly And Methods App 20110101514 - Kinsman; Larry D. ; et al.	2011-05-05
Vertical surface mount assembly and methods Grant 7,871,859 - Kinsman , et al. January 18, 2	2011-01-18
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,851,922 - Corisis , et al. December 14, 2	2010-12-14
Semiconductor Devices Including Semiconductor Dice In Laterally Offset Stacked Arrangement App 20100148331 - Mess; Leonard E. ; et al.	2010-06-17
Integrated Circuit Package Having Reduced Interconnects App 20100148372 - Farnworth; Warren M. ; et al.	2010-06-17
Method of forming a semiconductor device Grant 7,704,794 - Mess , et al. April 27, 2	2010-04-27
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices App 20100078792 - Corisis; David J. ; et al.	2010-04-01
Semiconductor Device Assemblies, Electronic Devices Including The Same And Assembly Methods App 20100078793 - Mess; Leonard E. ; et al.	2010-04-01
Methods of forming an integrated circuit package Grant 7,674,652 - Farnworth , et al. March 9, 2	2010-03-09
Multi-chip Module And Methods App 20100055837 - Corisis; David J. ; et al.	2010-03-04
Stacked Mass Storage Flash Memory Package App 20090286356 - Mess; Leonard E. ; et al.	2009-11-19
Multi-chip module and methods Grant 7,619,313 - Corisis , et al. November 17, 2	2009-11-17
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices App 20090008797 - Corisis; David J. ; et al.	2009-01-08
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices Grant 7,423,336 - Corisis , et al. September 9, 2	2008-09-09
Stacked mass storage flash memory package Grant 7,375,419 - Mess , et al. May 20, 2	2008-05-20
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods Grant 7,372,138 - Corisis , et al. May 13, 2	2008-05-13
Routing element for use in semiconductor device assemblies Grant 7,372,131 - Corisis , et al. May 13, 2	2008-05-13
Multi-part lead frame Grant 7,321,160 - Hinkle , et al. January 22, 2	2008-01-22
Methods of making semiconductor fuses App 20080003712 - Moden; Walter L. ; et al.	2008-01-03
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element Grant 7,282,805 - Corisis , et al. October 16, 2	2007-10-16
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices Grant 7,282,397 - Corisis , et al. October 16, 2	2007-10-16
Method of fabricating a semiconductor die package having improved inductance characteristics Grant 7,268,013 - Brooks , et al. September 11, 2	2007-09-11
Stacked mass storage flash memory package Grant 7,262,506 - Mess , et al. August 28, 2	2007-08-28
Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation Grant 7,232,747 - Farnworth , et al. June 19, 2	2007-06-19
Vertical surface mount assembly and methods Grant 7,227,261 - Kinsman , et al. June 5, 2	2007-06-05
Stacked mass storage flash memory package App 20070065987 - Mess; Leonard E. ; et al.	2007-03-22
Multi-part lead frame with dissimilar materials App 20070057354 - Hinkle; S. Derek ; et al.	2007-03-15
Multi-part lead frame with dissimilar materials App 20070057353 - Hinkle; S. Derek ; et al.	2007-03-15
Cavity ball grid array apparatus having improved inductance characteristics App 20070007517 - Brooks; Jerry M. ; et al.	2007-01-11
Multi-part lead frame with dissimilar materials App 20070001274 - Hinkle; S. Derek ; et al.	2007-01-04
Assembly method for semiconductor die and lead frame App 20070000599 - Kinsman; Larry D. ; et al.	2007-01-04
Varied-thickness heat sink for integrated circuit (IC) package App 20060267184 - Kinsman; Larry D. ; et al.	2006-11-30
Multi-chip module and methods App 20060261492 - Corisis; David J. ; et al.	2006-11-23
Method of forming a stack of packaged memory dice App 20060252181 - King; Jerrold L. ; et al.	2006-11-09
Method for a low profile multi-IC chip package connector App 20060252180 - Moden; Walter L. ; et al.	2006-11-09
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 7,125,749 - Kinsman , et al. October 24, 2	2006-10-24
Assembly method for semiconductor die and lead frame Grant 7,112,252 - Kinsman , et al. September 26, 2	2006-09-26
Integrated circuit package electrical enhancement with improved lead frame design Grant 7,098,527 - Corisis , et al. August 29, 2	2006-08-29
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices Grant 7,094,631 - Corisis , et al. August 22, 2	2006-08-22
Method of forming a stack of packaged memory dice Grant 7,091,061 - King , et al. August 15, 2	2006-08-15
Multi-chip module and methods Grant 7,084,514 - Corisis , et al. August 1, 2	2006-08-01
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices App 20060166404 - Corisis; David J. ; et al.	2006-07-27
Multi-part lead frame with dissimilar materials App 20060125065 - Hinkle; S. Derek ; et al.	2006-06-15
High-density modularity for ICS Grant 7,061,092 - Akram , et al. June 13, 2	2006-06-13
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element App 20060113650 - Corisis; David J. ; et al.	2006-06-01
Semiconductor chip package Grant 7,038,315 - King , et al. May 2, 2	2006-05-02
Cavity ball grid array apparatus having improved inductance characteristics App 20060055040 - Brooks; Jerry M. ; et al.	2006-03-16
Methods for fabricating routing elements for multichip modules Grant 6,995,043 - Corisis , et al. February 7, 2	2006-02-07
Integrated circuit package having reduced interconnects App 20060014317 - Farnworth; Warren M. ; et al.	2006-01-19
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element Grant 6,987,325 - Corisis , et al. January 17, 2	2006-01-17
Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same Grant 6,982,486 - Brooks , et al. January 3, 2	2006-01-03
Method of fabricating a tape having apertures under a lead frame for conventional IC packages Grant 6,979,596 - Corisis , et al. December 27, 2	2005-12-27
Integrated circuit package having reduced interconnects Grant 6,979,904 - Farnworth , et al. December 27, 2	2005-12-27
Semiconductor assembly of stacked substrates and multiple semiconductor dice Grant 6,979,895 - Akram , et al. December 27, 2	2005-12-27
Semiconductor dice packages employing at least one redistribution layer Grant 6,965,160 - Cobbley , et al. November 15, 2	2005-11-15
Multi-part lead frame with dissimilar materials App 20050224928 - Hinkle, S. Derek ; et al.	2005-10-13
Multichip semiconductor package App 20050212143 - King, Jerrold L. ; et al.	2005-09-29
Multi-part lead frame with dissimilar materials Grant 6,946,722 - Hinkle , et al. September 20, 2	2005-09-20
Method of forming a stack of packaged memory dice App 20050170558 - King, Jerrold L. ; et al.	2005-08-04
Tape under frame for lead frame IC package assembly Grant 6,921,966 - Corisis , et al. July 26, 2	2005-07-26
Routing element for use in semiconductor device assemblies App 20050156295 - Corisis, David J. ; et al.	2005-07-21
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods App 20050156293 - Corisis, David J. ; et al.	2005-07-21
Low profile multi-IC chip package connector App 20050158912 - Moden, Walter L. ; et al.	2005-07-21
Multi-chip module and methods App 20050146009 - Corisis, David J. ; et al.	2005-07-07
Multi-part lead frame with dissimilar materials App 20050146002 - Hinkle, S. Derek ; et al.	2005-07-07
Multichip semiconductor package Grant 6,906,409 - King , et al. June 14, 2	2005-06-14
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,902,952 - Hinkle , et al. June 7, 2	2005-06-07
Stacked mass storage flash memory package Grant 6,900,528 - Mess , et al. May 31, 2	2005-05-31
Semiconductor assembly without adhesive fillets Grant 6,900,549 - Brooks May 31, 2	2005-05-31
Method of packaging semiconductor dice employing at least one redistribution layer Grant 6,897,096 - Cobbley , et al. May 24, 2	2005-05-24
Apparatus for forming a stack of packaged memory dice Grant 6,897,553 - King , et al. May 24, 2	2005-05-24
Tape under frame for lead frame IC package assembly Grant 6,894,372 - Corisis , et al. May 17, 2	2005-05-17
Method of forming a stack of packaged memory dice Grant 6,884,654 - King , et al. April 26, 2	2005-04-26
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods Grant 6,882,034 - Corisis , et al. April 19, 2	2005-04-19
Multi-chip module and methods Grant 6,867,500 - Corisis , et al. March 15, 2	2005-03-15
Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation App 20050032348 - Farnworth, Warren M. ; et al.	2005-02-10
Stacked mass storage flash memory package App 20050029645 - Mess, Leonard E. ; et al.	2005-02-10
Locking assembly for securing a semiconductor device to a carrier substrate Grant 6,837,731 - Corisis , et al. January 4, 2	2005-01-04
Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die Grant 6,831,353 - Schoenfeld , et al. December 14, 2	2004-12-14
High density modularity for IC's Grant 6,815,251 - Akram , et al. November 9, 2	2004-11-09
Cavity ball grid array apparatus having improved inductance characteristics App 20040207064 - Brooks, Jerry M. ; et al.	2004-10-21
Low profile multi-IC chip package connector App 20040168316 - Moden, Walter L. ; et al.	2004-09-02
Vertical surface mount apparatus with thermal carrier and method Grant 6,781,839 - Kinsman , et al. August 24, 2	2004-08-24
Low profile multi-IC chip package connector Grant 6,773,955 - Moden , et al. August 10, 2	2004-08-10
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices App 20040142506 - Corisis, David J. ; et al.	2004-07-22
Lead frame assemblies with voltage reference plane and IC packages including same Grant 6,747,344 - Corisis , et al. June 8, 2	2004-06-08
Cavity ball grid array apparatus having improved inductance characteristics Grant 6,740,971 - Brooks , et al. May 25, 2	2004-05-25
Stackable ball grid array package Grant 6,738,263 - Corisis , et al. May 18, 2	2004-05-18
Structure and method for securing bussing leads Grant 6,737,734 - Brooks , et al. May 18, 2	2004-05-18
Methods for stress reduction feature for LOC lead frame App 20040056336 - Kinsman, Larry D. ; et al.	2004-03-25
Semiconductor package with stacked substrates and multiple semiconductor dice App 20040053442 - Akram, Salman ; et al.	2004-03-18
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element App 20040036182 - Corisis, David J. ; et al.	2004-02-26
Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation, and method of forming semiconductor device assembly including same App 20040036156 - Farnworth, Warren M. ; et al.	2004-02-26
Method and apparatus for enabling a stitch wire bond in the absence of discrete bump formation, semiconductor device assemblies and electronic systems including same App 20040036171 - Farnworth, Warren M. ; et al.	2004-02-26
Vertical surface mount assembly and methods App 20040034997 - Kinsman, Larry D. ; et al.	2004-02-26
Method of forming a stack of packaged memory dice App 20040038450 - King, Jerrold L. ; et al.	2004-02-26
Semiconductor dice packages employing at least one redistribution layer and methods of fabrication App 20040032013 - Cobbley, Chad A. ; et al.	2004-02-19
Method of packaging semiconductor dice employing at least one redistribution layer App 20040033673 - Cobbley, Chad A. ; et al.	2004-02-19
Integrated circuit package electrical enhancement with improved lead frame design App 20040026774 - Corisis, David J. ; et al.	2004-02-12
Apparatus for forming a stack of packaged memory dice App 20040026791 - King, Jerrold L. ; et al.	2004-02-12
Low profile multi-IC chip package connector Grant 6,686,655 - Moden , et al. February 3, 2	2004-02-03
Apparatus for forming a stack of packaged memory dice Grant 6,677,671 - King , et al. January 13, 2	2004-01-13
Stackable ball grid array package Grant 6,670,702 - Corisis , et al. December 30, 2	2003-12-30
Method of forming a stack of packaged memory dice Grant 6,656,767 - King , et al. December 2, 2	2003-12-02
Locking assembly for securing semiconductor device to carrier substrate Grant 6,648,663 - Corisis , et al. November 18, 2	2003-11-18
Locking assembly for securing semiconductor device to carrier substrate App 20030211769 - Corisis, David J. ; et al.	2003-11-13
Structure and method for securing bussing leads App 20030205789 - Brooks, Jerry M. ; et al.	2003-11-06
Multi-part lead frame with dissimilar materials App 20030205790 - Hinkle, S. Derek ; et al.	2003-11-06
Integrated Circuit Package Having Reduced Interconnects App 20030197281 - Farnworth, Warren M. ; et al.	2003-10-23
Vertical surface mount apparatus with thermal carrier and method App 20030198020 - Kinsman, Larry D. ; et al.	2003-10-23
Stress reduction feature for LOC lead frame Grant 6,635,954 - Kinsman , et al. October 21, 2	2003-10-21
Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die App 20030193081 - Schoenfeld, Aaron ; et al.	2003-10-16
Multi-chip module and methods App 20030189257 - Corisis, David J. ; et al.	2003-10-09
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods App 20030189256 - Corisis, David J. ; et al.	2003-10-09
Integrated circuit package electrical enhancement Grant 6,630,733 - Corisis , et al. October 7, 2	2003-10-07
Semiconductor assembly without adhesive fillets Grant 6,617,198 - Brooks September 9, 2	2003-09-09
Vertical surface mount assembly and methods Grant 6,611,058 - Kinsman , et al. August 26, 2	2003-08-26
Methods for stress reduction feature for LOC lead frame Grant 6,610,162 - Kinsman , et al. August 26, 2	2003-08-26
Stacked mass storage flash memory package App 20030137042 - Mess, Leonard E. ; et al.	2003-07-24
Semiconductor package with stacked substrates and multiple semiconductor dice Grant 6,583,503 - Akram , et al. June 24, 2	2003-06-24
Tape under frame for lead frame IC package assembly App 20030107115 - Corisis, David J. ; et al.	2003-06-12
Tape under frame for lead frame IC package assembly App 20030102539 - Corisis, David J. ; et al.	2003-06-05
Locking assembly for securing semiconductor device to carrier substrate Grant 6,565,374 - Corisis , et al. May 20, 2	2003-05-20
Semiconductor die with integral decoupling capacitor Grant 6,563,192 - Corisis , et al. May 13, 2	2003-05-13
Vertical surface mount assembly App 20030076667 - Kinsman, Larry D. ; et al.	2003-04-24
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages App 20030077853 - Kinsman, Larry D. ; et al.	2003-04-24
Stackable ball grid array package Grant 6,549,421 - Corisis , et al. April 15, 2	2003-04-15
Routing element for use in multichip modules, multichip modules including the routing element, and methods App 20030067060 - Corisis, David J. ; et al.	2003-04-10
High density modularity for IC's App 20030064547 - Akram, Salman ; et al.	2003-04-03
Redundancy mapping in a multichip semiconductor package Grant 6,531,339 - King , et al. March 11, 2	2003-03-11
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods App 20030042585 - Corisis, David J. ; et al.	2003-03-06
Tape under frame for lead frame IC package assembly Grant 6,518,650 - Corisis , et al. February 11, 2	2003-02-11
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,506,629 - Kinsman , et al. January 14, 2	2003-01-14
Stacked mass storage flash memory package App 20020195697 - Mess, Leonard E. ; et al.	2002-12-26
Locking assembly for securing semiconductor device to carrier substrate App 20020197900 - Corisis, David J. ; et al.	2002-12-26
Integrated circuit package electrical enhancement App 20020190372 - Corisis, David J. ; et al.	2002-12-19
Stackable ball grid array package App 20020191383 - Corisis, David J. ; et al.	2002-12-19
Low profile multi-IC chip package connector App 20020185725 - Moden, Walter L. ; et al.	2002-12-12
Vertical surface mount assembly and methods App 20020187626 - Kinsman, Larry D. ; et al.	2002-12-12
Low profile multi-IC chip package connector App 20020182772 - Moden, Walter L. ; et al.	2002-12-05
Vertical surface mount apparatus with thermal carrier App 20020176230 - Kinsman, Larry D. ; et al.	2002-11-28
Methods for a low profile multi-IC chip package connector Grant 6,475,831 - Moden , et al. November 5, 2	2002-11-05
Multichip semiconductor package App 20020140077 - King, Jerrold L. ; et al.	2002-10-03
Stackable ball grid array package App 20020135066 - Corisis, David J. ; et al.	2002-09-26
Vertical surface mount assembly and methods Grant 6,455,351 - Kinsman , et al. September 24, 2	2002-09-24
Semiconductor package with stacked substrates and multiple semiconductor dice App 20020125558 - Akram, Salman ; et al.	2002-09-12
Method of forming a stack of packaged memory die and resulting apparatus Grant 6,445,063 - King , et al. September 3, 2	2002-09-03
Stress reduction feature for LOC lead frame App 20020113299 - Kinsman, Larry D. ; et al.	2002-08-22
Locking assembly for securing semiconductor device to carrier substrate App 20020111058 - Corisis, David J. ; et al.	2002-08-15
Method of forming a stack of packaged memory die and resulting apparatus App 20020109221 - King, Jerrold L. ; et al.	2002-08-15
Multichip semiconductor package Grant 6,429,528 - King , et al. August 6, 2	2002-08-06
Tape under frame for conventional-type IC package assembly App 20020098624 - Corisis, David J. ; et al.	2002-07-25
Semiconductor assembly without adhesive fillets App 20020094609 - Brooks, Jerry M.	2002-07-18
Semiconductor assembly without adhesive fillets App 20020094608 - Brooks, Jerry M.	2002-07-18
Low profile multi-IC chip package connector App 20020084520 - Moden, Walter L. ; et al.	2002-07-04
Locking assembly for securing semiconductor device to carrier substrate App 20020081886 - Corisis, David J. ; et al.	2002-06-27
Multi-part lead frame with dissimilar materials and method of manufacturing App 20020076857 - Hinkle, S. Derek ; et al.	2002-06-20
Locking Assembly For Securing Semiconductor Device To Carrier Substrate App 20020076967 - Corisis, David J. ; et al.	2002-06-20
Semiconductor package with stacked substrates and multiple semiconductor dice Grant 6,404,044 - Akram , et al. June 11, 2	2002-06-11
Locking assembly for securing semiconductor device to carrier substrate Grant 6,398,573 - Corisis , et al. June 4, 2	2002-06-04
Multichip Semiconductor Package App 20020053743 - KING, JERROLD L. ; et al.	2002-05-09
Stackable ball grid array package App 20020051352 - Corisis, David J. ; et al.	2002-05-02
Method of making a cavity ball grid array apparatus App 20020042160 - Brooks, Jerry M. ; et al.	2002-04-11
Locking assembly for securing semiconductor device to carrier substrate Grant 6,368,136 - Corisis , et al. April 9, 2	2002-04-09
Integrated circuit package electrical enhancement App 20020027280 - Corisis, David J. ; et al.	2002-03-07
Redundancy mapping in a multichip semiconductor package App 20020027813 - King, Jerrold L. ; et al.	2002-03-07
Vertical surface mount apparatus with thermal carrier App 20020003694 - Kinsman, Larry D. ; et al.	2002-01-10
Stackable ball grid array package Grant 6,331,939 - Corisis , et al. December 18, 2	2001-12-18
Method of forming a stack of packaged memory die and resulting apparatus App 20010049157 - King, Jerrold L. ; et al.	2001-12-06
Method of making a cavity ball grid array apparatus Grant 6,326,244 - Brooks , et al. December 4, 2	2001-12-04
Stackable ball grid array package App 20010040282 - Corisis, David J. ; et al.	2001-11-15
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die App 20010038142 - Schoenfeld, Aaron ; et al.	2001-11-08
Lead frame assemblies with voltage reference plane and IC packages including same App 20010035571 - Corisis, David J. ; et al.	2001-11-01
Redundancy mapping in a multichip semiconductor package App 20010030897 - King, Jerrold L. ; et al.	2001-10-18
Low profile multi-IC chip package connector App 20010020740 - Moden, Walter L. ; et al.	2001-09-13
Lead frame assemblies with voltage reference plane and IC packages including same Grant 6,284,571 - Corisis , et al. September 4, 2	2001-09-04
Method of constructing stacked packages App 20010015488 - Akram, Salman ; et al.	2001-08-23
Hybrid frame with lead-lock tape App 20010016373 - Brooks, Jerry M. ; et al.	2001-08-23
Tape under frame for conventional-type IC package assembly App 20010015479 - Corisis, David J. ; et al.	2001-08-23
Semiconductor chip package App 20010013645 - King, Jerrold L. ; et al.	2001-08-16
Vertical surface mount assembly and methods App 20010011769 - Kinsman, Larry D. ; et al.	2001-08-09
Locking assembly for securing semiconductor device to carrier substrate App 20010012716 - Corisis, David J. ; et al.	2001-08-09
Vertical surface mount assembly and methods App 20010010399 - Kinsman, Larry D. ; et al.	2001-08-02
Stackable ball grid array package Grant 6,268,649 - Corisis , et al. July 31, 2	2001-07-31
Vertical surface mount assembly and methods App 20010009781 - Kinsman, Larry D. ; et al.	2001-07-26
Low profile multi-IC chip package connector Grant 6,258,623 - Moden , et al. July 10, 2	2001-07-10
Low profile multi-IC chip package connector App 20010006829 - Moden, Walter L. ; et al.	2001-07-05
Redundancy mapping in a multichip semiconductor package Grant 6,246,615 - King , et al. June 12, 2	2001-06-12
Method of making a semiconductor chip package Grant 6,232,213 - King , et al. May 15, 2	2001-05-15
Method of making a multichip semiconductor package Grant 6,228,548 - King , et al. May 8, 2	2001-05-08
Low profile multi-IC chip package connector Grant 6,225,689 - Moden , et al. May 1, 2	2001-05-01
Method of constructing stacked packages Grant 6,222,265 - Akram , et al. April 24, 2	2001-04-24
Tape under frame for conventional-type IC package assembly Grant 6,215,177 - Corisis , et al. April 10, 2	2001-04-10
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,159,764 - Kinsman , et al. December 12, 2	2000-12-12
Method for supporting an integrated circuit die Grant 6,148,509 - Schoenfeld , et al. November 21, 2	2000-11-21
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,140,154 - Hinkle , et al. October 31, 2	2000-10-31
Coated semiconductor die/leadframe assembly and method for coating the assembly Grant 6,107,690 - Courtenay , et al. August 22, 2	2000-08-22
Vertical surface mount assembly and methods Grant 6,087,723 - Kinsman , et al. July 11, 2	2000-07-11
Stackable ball grid array package Grant 6,072,233 - Corisis , et al. June 6, 2	2000-06-06
Multi-part lead frame with dissimilar materials and method of manufacturing Grant 6,072,228 - Hinkle , et al. June 6, 2	2000-06-06
Hybrid frame with lead-lock tape Grant 6,008,531 - Brooks , et al. December 28, 1	1999-12-28
Method of constructing stacked packages Grant 5,994,166 - Akram , et al. November 30, 1	1999-11-30
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die Grant 5,973,935 - Schoenfeld , et al. October 26, 1	1999-10-26
Lead frame assemblies with voltage reference plane and IC packages including same Grant 5,955,777 - Corisis , et al. September 21, 1	1999-09-21
Reduced stress LOC assembly including cantilevered leads Grant 5,872,398 - King , et al. February 16, 1	1999-02-16
Tape under frame for conventional-type IC package assembly Grant 5,729,049 - Corisis , et al. March 17, 1	1998-03-17
Semiconductor chip package Grant 5,677,566 - King , et al. October 14, 1	1997-10-14
Lead frame surface finish enhancement Grant 5,616,953 - King , et al. April 1, 1	1997-04-01
Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby Grant 5,440,241 - King , et al. August 8, 1	1995-08-08
Anti-bow zip lead frame design Grant 5,150,194 - Brooks , et al. September 22, 1	1992-09-22
Semiconductor assembly utilizing elastomeric single axis conductive interconnect Grant 5,140,405 - King , et al. August 18, 1	1992-08-18

Company Registrations

SEC

0001240970

BROOKS JERRY M

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