Method of manufacturing a sealing cap for an integrated circuit carrying substrate
Hultmark May 7, 1
U.S. patent number T105,403 [Application Number 06/636,877] was granted by the patent office on 1985-05-07 for method of manufacturing a sealing cap for an integrated circuit carrying substrate. Invention is credited to Eric B. Hultmark.
| United States Patent | T105,403 |
| Hultmark | May 7, 1985 |
Method of manufacturing a sealing cap for an integrated circuit carrying substrate
Abstract
A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate. Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances.
| Inventors: | Hultmark; Eric B. (Wappingers Falls, NY) |
|---|---|
| Family ID: | 27022705 |
| Appl. No.: | 06/636,877 |
| Filed: | August 2, 1984 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 414764 | Sep 7, 1982 | ||||
| Current U.S. Class: | 257/697; 257/719; 257/724; 264/293; 428/45 |
| Current CPC Class: | H01L 21/4807 (20130101); H01L 23/04 (20130101); H01L 2224/16 (20130101); H01L 2224/73253 (20130101); Y10T 428/161 (20150115); H01L 2924/16152 (20130101); H01L 2924/15312 (20130101); H01L 2924/16152 (20130101); H01L 2224/73253 (20130101) |
| Current International Class: | H01L 21/48 (20060101); H01L 23/02 (20060101); H01L 23/04 (20060101); H01L 21/02 (20060101); B29C 017/08 () |
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