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Patent applications and USPTO patent grants for Hultmark; Eric B..The latest application filed is for "technique for underfilling stacked chips on a cavity mlc module".
Patent | Date |
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Technique for underfilling stacked chips on a cavity MLC module Grant 6,599,774 - Hultmark , et al. July 29, 2 | 2003-07-29 |
Method for assembling a multi-layered ceramic package Grant 6,332,946 - Emmett , et al. December 25, 2 | 2001-12-25 |
Technique for underfilling stacked chips on a cavity MLC module App 20010021542 - Hultmark, Eric B. ;   et al. | 2001-09-13 |
Technique for underfilling stacked chips on a cavity MLC module Grant 6,232,667 - Hultmark , et al. May 15, 2 | 2001-05-15 |
Heat sink or similar article Grant D304,715 - Horvath , et al. November 21, 1 | 1989-11-21 |
Ceramic card assembly having enhanced power distribution and cooling Grant 4,771,366 - Blake , et al. September 13, 1 | 1988-09-13 |
Heat sink for electronic package Grant 4,546,405 - Hultmark , et al. October 8, 1 | 1985-10-08 |
Method of manufacturing a sealing cap for an integrated circuit carrying substrate Grant T105,403 - Hultmark May 7, 1 | 1985-05-07 |
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