U.S. patent number RE46,466 [Application Number 12/712,934] was granted by the patent office on 2017-07-04 for method for fabricating low resistance, low inductance interconnections in high current semiconductor devices.
This patent grant is currently assigned to TEXAS INSTRUMENTS INCORPORATED. The grantee listed for this patent is Anthony L. Coyle, Bernhard P. Lange, Quang X. Mai. Invention is credited to Anthony L. Coyle, Bernhard P. Lange, Quang X. Mai.
United States Patent |
RE46,466 |
Lange , et al. |
July 4, 2017 |
Method for fabricating low resistance, low inductance
interconnections in high current semiconductor devices
Abstract
A method for fabricating a low resistance, low inductance device
for high current semiconductor flip-chip products. A structure is
produced, which comprises a semiconductor chip with metallization
traces, copper lines in contact with the traces, and copper bumps
located in an orderly and repetitive arrangement on each line so
that the bumps of one line are positioned about midway between the
corresponding bumps of the neighboring lines. A substrate is
provided which has elongated copper leads with first and second
surfaces, the leads oriented at right angles to the lines. The
first surface of each lead is connected to the corresponding bumps
of alternating lines using solder elements. Finally, the assembly
is encapsulated in molding compound so that the second lead
surfaces remain un-encapsulated.
Inventors: |
Lange; Bernhard P. (Freising,
DE), Coyle; Anthony L. (Allen, TX), Mai; Quang
X. (Sugarland, TX) |
Applicant: |
Name |
City |
State |
Country |
Type |
Lange; Bernhard P.
Coyle; Anthony L.
Mai; Quang X. |
Freising
Allen
Sugarland |
N/A
TX
TX |
DE
US
US |
|
|
Assignee: |
TEXAS INSTRUMENTS INCORPORATED
(Dallas, TX)
|
Family
ID: |
1000002508066 |
Appl.
No.: |
12/712,934 |
Filed: |
February 25, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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Reissue of: |
11218408 |
Sep 1, 2005 |
7335536 |
Feb 26, 2008 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
24/05 (20130101); H01L 24/13 (20130101); H01L
24/11 (20130101); H01L 23/528 (20130101); H01L
24/14 (20130101); H01L 23/53238 (20130101); H01L
23/528 (20130101); H01L 24/05 (20130101); H01L
24/13 (20130101); H01L 24/14 (20130101); H01L
24/11 (20130101); H01L 23/53238 (20130101); H01L
24/03 (20130101); H01L 2924/01082 (20130101); H01L
2224/05647 (20130101); H01L 2224/13155 (20130101); H01L
2924/01046 (20130101); H01L 2224/16225 (20130101); H01L
2924/01033 (20130101); H01L 2924/19043 (20130101); H01L
2224/0401 (20130101); H01L 2924/181 (20130101); H01L
2924/01022 (20130101); H01L 2224/13147 (20130101); H01L
2924/3841 (20130101); H01L 2224/0345 (20130101); H01L
2224/03912 (20130101); H01L 2924/10329 (20130101); H01L
2224/0239 (20130101); H01L 2224/02313 (20130101); H01L
2224/02331 (20130101); H01L 2224/11912 (20130101); H01L
2224/81191 (20130101); H01L 2924/14 (20130101); H01L
2224/13164 (20130101); H01L 2924/01047 (20130101); H01L
24/16 (20130101); H01L 2924/01006 (20130101); H01L
2924/01029 (20130101); H01L 2924/30107 (20130101); H01L
2224/05166 (20130101); H01L 2924/01032 (20130101); H01L
24/81 (20130101); H01L 2224/11462 (20130101); H01L
2224/81815 (20130101); H01L 2924/014 (20130101); H01L
23/3192 (20130101); H01L 2224/0235 (20130101); H01L
2224/1147 (20130101); H01L 2924/01074 (20130101); H01L
2224/02311 (20130101); H01L 2224/02375 (20130101); H01L
2224/13111 (20130101); H01L 2924/01013 (20130101); H01L
2224/81424 (20130101); H01L 23/3121 (20130101); H01L
24/94 (20130101); H01L 2224/13013 (20130101); H01L
2224/14133 (20130101); H01L 2224/94 (20130101); H01L
2924/01078 (20130101); H01L 2224/0361 (20130101); H01L
2224/81447 (20130101); H01L 2224/13082 (20130101); H01L
2224/13144 (20130101); H01L 2224/13099 (20130101); H01L
2924/01079 (20130101); H01L 2224/05024 (20130101); H01L
2224/05073 (20130101); H01L 2224/16245 (20130101); H01L
23/3121 (20130101); H01L 2224/02375 (20130101); H01L
2224/02311 (20130101); H01L 2224/03912 (20130101); H01L
2224/8146 (20130101); H01L 2224/16245 (20130101); H01L
2224/05073 (20130101); H01L 2224/81424 (20130101); H01L
2924/01022 (20130101); H01L 2224/13099 (20130101); H01L
2924/014 (20130101); H01L 24/81 (20130101); H01L
2224/94 (20130101); H01L 2924/01082 (20130101); H01L
2924/01078 (20130101); H01L 2924/01079 (20130101); H01L
24/03 (20130101); H01L 24/16 (20130101); H01L
2224/05166 (20130101); H01L 2224/13111 (20130101); H01L
2224/0361 (20130101); H01L 2924/01032 (20130101); H01L
2224/05647 (20130101); H01L 2224/02313 (20130101); H01L
2224/16225 (20130101); H01L 2224/0345 (20130101); H01L
2224/05024 (20130101); H01L 2224/13147 (20130101); H01L
2924/01046 (20130101); H01L 2224/14133 (20130101); H01L
2924/30107 (20130101); H01L 2224/0235 (20130101); H01L
2924/01047 (20130101); H01L 2924/01029 (20130101); H01L
2224/13082 (20130101); H01L 2224/81815 (20130101); H01L
2924/01006 (20130101); H01L 2224/0239 (20130101); H01L
2224/13155 (20130101); H01L 2224/81191 (20130101); H01L
2924/10329 (20130101); H01L 2224/11912 (20130101); H01L
2924/01033 (20130101); H01L 2924/3841 (20130101); H01L
2924/01013 (20130101); H01L 2924/01074 (20130101); H01L
2224/13164 (20130101); H01L 2924/19043 (20130101); H01L
2924/181 (20130101); H01L 23/3192 (20130101); H01L
2224/13144 (20130101); H01L 2224/8146 (20130101); H01L
2224/02331 (20130101); H01L 2224/1147 (20130101); H01L
2224/13013 (20130101); H01L 2924/14 (20130101); H01L
2224/0401 (20130101); H01L 2224/11462 (20130101); H01L
2224/81447 (20130101); H01L 24/94 (20130101); H01L
2224/05166 (20130101); H01L 2224/05166 (20130101); H01L
2924/01074 (20130101); H01L 2924/01074 (20130101); H01L
2224/05647 (20130101); H01L 2224/05647 (20130101); H01L
2924/00014 (20130101); H01L 2924/00014 (20130101); H01L
2224/13155 (20130101); H01L 2224/13155 (20130101); H01L
2924/00014 (20130101); H01L 2924/00014 (20130101); H01L
2224/13164 (20130101); H01L 2224/13164 (20130101); H01L
2924/00014 (20130101); H01L 2924/00014 (20130101); H01L
2224/13144 (20130101); H01L 2224/13144 (20130101); H01L
2924/00014 (20130101); H01L 2924/00014 (20130101); H01L
2224/13111 (20130101); H01L 2224/13111 (20130101); H01L
2924/01046 (20130101); H01L 2924/01046 (20130101); H01L
2224/94 (20130101); H01L 2224/94 (20130101); H01L
2224/11 (20130101); H01L 2224/11 (20130101); H01L
2224/94 (20130101); H01L 2224/94 (20130101); H01L
2224/03 (20130101); H01L 2224/03 (20130101); H01L
2224/8146 (20130101); H01L 2224/8146 (20130101); H01L
2924/01028 (20130101); H01L 2924/01028 (20130101); H01L
2224/05193 (20130101); H01L 2224/05193 (20130101); H01L
2924/01006 (20130101); H01L 2924/01006 (20130101); H01L
2224/0239 (20130101); H01L 2224/0239 (20130101); H01L
2924/01029 (20130101); H01L 2924/01029 (20130101); H01L
2224/0239 (20130101); H01L 2224/0239 (20130101); H01L
2924/01047 (20130101); H01L 2924/01047 (20130101); H01L
2224/0239 (20130101); H01L 2224/0239 (20130101); H01L
2924/01047 (20130101); H01L 2924/01047 (20130101); H01L
2924/013 (20130101); H01L 2924/013 (20130101); H01L
2224/0239 (20130101); H01L 2224/0239 (20130101); H01L
2924/01006 (20130101); H01L 2924/01006 (20130101); H01L
2224/0239 (20130101); H01L 2224/0239 (20130101); H01L
2924/01022 (20130101); H01L 2924/01022 (20130101); H01L
2924/01074 (20130101); H01L 2924/01074 (20130101); H01L
2224/05073 (20130101); H01L 2224/05073 (20130101); H01L
2224/13147 (20130101); H01L 2224/13147 (20130101); H01L
2224/05647 (20130101); H01L 2224/05647 (20130101); H01L
2224/05166 (20130101); H01L 2224/05166 (20130101); H01L
2924/01074 (20130101); H01L 2924/01074 (20130101); H01L
2224/16225 (20130101); H01L 2224/16225 (20130101); H01L
2224/13144 (20130101); H01L 2224/13144 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101); H01L
2224/16225 (20130101); H01L 2224/16225 (20130101); H01L
2224/13147 (20130101); H01L 2224/13147 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101); H01L
2224/16225 (20130101); H01L 2224/16225 (20130101); H01L
2224/13111 (20130101); H01L 2224/13111 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101); H01L
2224/16225 (20130101); H01L 2224/16225 (20130101); H01L
2224/13155 (20130101); H01L 2224/13155 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101); H01L
2224/16225 (20130101); H01L 2224/16225 (20130101); H01L
2224/13164 (20130101); H01L 2224/13164 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101); H01L
2924/181 (20130101); H01L 2924/181 (20130101); H01L
2924/00 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
H01L
21/82 (20060101); H01L 23/00 (20060101); H01L
23/532 (20060101); H01L 21/44 (20060101); H01L
23/528 (20060101); H01L 23/31 (20060101) |
Field of
Search: |
;438/613,612,129,106,687,666
;257/E21.507,734,787,666,E23.069,692,778 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1189279 |
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Mar 2001 |
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EP |
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EP 0061863 |
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Oct 1982 |
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JP |
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WO2007024587 |
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Mar 2007 |
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WO |
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WO2007027994 |
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Mar 2007 |
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WO |
|
Other References
Detailed Structural Analysis I of the Intel Pentium 3.0E GHz
Processor "Prescott," Seminconductor Insights Inc.. Mar. 2004, pp,
1-26. cited by applicant .
"Intel Prescott Package, Die Connection Layer," UBM TechInsights,
Aug. 4, 2011, pp. 1-5. cited by applicant .
"Intel BX80545PG2800E Pentium.RTM. 4 Prescott Microprocessor
Structural Analysis," Inside Technology, Chipworks, Apr. 1, 2005,
www.chipworks.com, pp. 1-8. cited by applicant .
8039956 File History--11210066.pdf. cited by applicant .
EP1932173 File History--06814056.pdf. cited by applicant .
EP1938382 File History.pdf. cited by applicant .
PCT/US2006/031933 Search Report (WO2007024587). cited by applicant
.
"Multichip Assembly With Flipped Integrated Circuits," IEEE
Transactions on Components, Hybrids, and Manufacturing Technology,
vol. 12, No. 4, December 1989 (Heinen, et al.). cited by
applicant.
|
Primary Examiner: Deb; Anjan
Attorney, Agent or Firm: Perry, Jr.; Levis H. Brill; Charles
A. Cimino; Frank D.
Claims
We claim:
1. A method for fabricating a low resistance, low inductance
interconnection structure for high current semiconductor flip-chip
products, comprising the steps of: providing a semiconductor wafer
having metallization traces, the wafer surface protected by an
overcoat, and windows in the overcoat.Iadd., .Iaddend.to expose
portions of the metallization traces; forming copper lines on the
overcoat.[.,.]..Iadd.;.Iaddend. contacting the .Iadd.metallization
.Iaddend.traces by filling the windows with metal; depositing a
layer of photo-imageable insulation material over the .Iadd.copper
.Iaddend.lines and the remaining wafer surface; opening windows in
the .Iadd.photo-imageable .Iaddend.insulation material to expose
portions of the .Iadd.copper .Iaddend.lines, the locations of the
windows selected in an orderly and repetitive arrangement on each
.Iadd.copper .Iaddend.line so that the windows of one line are
positioned about midway between the corresponding windows of the
neighboring lines; and forming copper bumps in the windows.[.,.].
in contact with the lines.
2. The method according to claim 1 further comprising the step of
depositing a cap of solderable metal layers on each bump.
3. The method according to claim 1 wherein the number and locations
of the windows in the overcoat are selected as needed for the
devices employing the metallization traces.
4. The method according to claim 1 wherein the copper lines are
oriented parallel to the metallization traces.
5. The method according to claim 1 wherein the copper lines are
oriented at right angles to the metallization traces.
6. The method according to claim 1 wherein the step of forming
copper lines comprises the steps of: depositing a barrier metal
layer over the wafer surface; depositing a seed metal layer over
the barrier metal layer; depositing a first photoresist layer over
the seed metal layer in a height commensurate with the height of
intended copper lines; opening windows in the .Iadd.first
.Iaddend.photoresist layer so that the windows are shaped as the
intended lines; depositing copper to fill the photoresist windows
and form copper lines; removing the first photoresist layer; and
removing the portions of the adhesion and barrier layers, which are
exposed after removing the first photoresist layer.
7. The method according to claim 6, wherein the step of depositing
copper comprises an electroplating technique.
8. The method according to claim 1 wherein the step of forming
copper bumps comprises the steps of: depositing a barrier metal
layer over the wafer surface; depositing a seed metal layer over
the barrier metal layer; depositing a second photoresist layer over
the seed metal layer in a height commensurate with the height of
the intended copper bumps; opening windows in the .Iadd.second
.Iaddend.photoresist layer in locations intended for copper bumps,
and of a width commensurate with the width of the intended copper
bumps; filling the photoresist windows by depositing copper to form
copper bumps; removing the second photoresist layer; and removing
the portions of the adhesion and barrier layers, which are exposed
after removing the second photoresist layer.
9. The method according .[.the step.]. .Iadd.to claim
.Iaddend.8.[.,.]. wherein the step of depositing copper comprises
an electroplating technique.
10. The method according to claim 8 further comprising the step of:
depositing one or more solderable metal layers on the surface of
the copper .[.bump.]. .Iadd.bumps.Iaddend., before removing the
second photoresist layer.
11. The method according to claim 10 wherein said solderable metal
layers include a layer of nickel on the copper surface, followed by
a layer of palladium on the nickel layer.
12. A method for fabricating a low resistance, low inductance
interconnection device for high current semiconductor flip-chip
products, comprising the steps of: providing a structure comprising
a semiconductor chip having metallization traces, copper lines in
contact with the traces, and copper bumps located in an orderly and
repetitive arrangement on each .Iadd.copper .Iaddend.line so that
the .Iadd.copper .Iaddend.bumps of one .Iadd.copper .Iaddend.line
are positioned about midway between the corresponding .Iadd.copper
.Iaddend.bumps of the neighboring .Iadd.copper .Iaddend.lines;
providing a substrate having elongated copper leads with first and
second surfaces, the leads oriented at right angles to the
.Iadd.copper .Iaddend.lines; connecting the first surface of each
.Iadd.copper .Iaddend.lead to the corresponding .Iadd.copper
.Iaddend.bumps of alternating .Iadd.copper .Iaddend.lines using
solder elements; and .Iadd.at least partially
.Iaddend.encapsulating the assembly in molding compound so that the
second lead surfaces remain un-encapsulated.
13. The method according to claim 12 wherein the substrate is a
leadframe including copper.
14. A method for fabricating a low resistance, low inductance
interconnection system for high current semiconductor flip-chip
devices, comprising the steps of: providing a low resistance, low
inductance interconnection device comprising: a semiconductor chip
structure including copper lines in contact with chip metallization
traces, and copper bumps located in an orderly and repetitive
arrangement on each .Iadd.copper .Iaddend.line, the .Iadd.copper
.Iaddend.bumps of one .Iadd.copper .Iaddend.line positioned about
midway between the corresponding .Iadd.copper .Iaddend.bumps of the
neighboring .Iadd.copper .Iaddend.lines; a substrate having
elongated copper leads with first and second surfaces, the
.Iadd.copper .Iaddend.leads at right angles to the .Iadd.copper
.Iaddend.lines, the first lead surfaces connected to the
corresponding .Iadd.copper .Iaddend.bumps of alternating
.Iadd.copper .Iaddend.lines by solder elements; and the chip
structure and substrate .Iadd.at least partially
.Iaddend.encapsulated so that the second lead surfaces remain
un-encapsulated; providing a circuit board having copper contact
pads parallel to the .Iadd.copper .Iaddend.leads; and attaching the
second surface of the device leads to the board pads using solder
layers.
.Iadd.15. A method comprising: providing a structure having: a
semiconductor chip having metallization traces; copper lines in
electrical contact with the traces; and copper bumps located in an
orderly and repetitive arrangement on each line so that the bumps
of one line are positioned about midway between the corresponding
bumps of the neighboring lines; providing a substrate having
elongated copper leads with first and second surfaces, each lead
oriented at an angle to the lines; connecting the first surface of
each lead to the corresponding bumps of alternating lines using
solder elements; and encapsulating portions of the structure and
the substrate using an encapsulation process that encapsulates a
plurality of assembled structure and substrate units..Iaddend.
.Iadd.16. A packaged integrated circuit (IC) product comprising: a
plurality of metallization traces formed on a first substrate,
wherein the metallization traces are generally in parallel to one
another; a plurality of conductive lines formed on the first
substrate, wherein each conductive lines is in contact with and is
at least partially coextensive with at least one of the
metallization traces; a plurality of conductive bumps formed on
each of the conductive lines, wherein the conductive bumps for each
line are arranged in an orderly and repetitive pattern such that
each conductive bump is positioned about midway between the
corresponding conductive bumps of each of its neighboring
conductive lines; a plurality of leads formed on a second
substrate, wherein each lead is electrically connected to
corresponding conductive bumps from alternating conductive lines on
the first substrate, wherein each lead is oriented at an angle to
each conductive line, and wherein each lead includes a second
surface that is opposite the first surface; and an encapsulation
layer covering portions of the first substrate and second
substrate..Iaddend.
.Iadd.17. The packaged IC product according to claim 16 wherein the
conductive lines, the conductive bumps, and the leads further
comprise copper..Iaddend.
.Iadd.18. The packaged IC product according to claim 17, wherein
the angle is a right angle..Iaddend.
.Iadd.19. The packaged IC product according to claim 18 further
comprising a solderable metal layer formed on the surface of the
copper bump..Iaddend.
.Iadd.20. The packaged IC product according to claim 19 wherein the
solderable metal layer includes a layer of nickel on the copper
surface, followed by a layer of palladium on the nickel
layer..Iaddend.
.Iadd.21. The packaged IC product according to claim 20 wherein the
first substrate is a semiconductor wafer..Iaddend.
.Iadd.22. The packaged IC product according to claim 21 wherein the
second substrate is a leadframe..Iaddend.
.Iadd.23. The packaged IC product according to claim 16, wherein
the second surface of each of the leads is exposed following the
formation of the encapsulation layer..Iaddend.
.Iadd.24. The method according to claim 12 wherein the copper lines
further comprise top and bottom surfaces, and wherein the bottom
surfaces are in contact with the traces, and wherein the step of
providing the structure further comprises the step of providing an
insulating layer that overlies the semiconductor chip between the
copper lines and at least extends between the top and bottom
surfaces of the copper lines..Iaddend.
.Iadd.25. The method according to claim 24 wherein the insulating
layer has a thickness between approximately 10 and 20
.mu.m..Iaddend.
.Iadd.26. The method according to claim 24 wherein the insulating
layer further comprises a first insulating layer, and wherein the
step of providing the structure further comprises providing a
second insulating layer formed over at least a portion of the top
surfaces of the copper lines..Iaddend.
.Iadd.27. The method according to claim 26 wherein the first
insulating layer has a thickness between approximately 10 and 20
.mu.m..Iaddend.
.Iadd.28. A method for fabricating a semiconductor flip-chip
product, comprising the steps of: providing a semiconductor chip
having metallization traces, copper lines connected to the traces,
and plated copper bump structures located in an orderly and
repetitive arrangement on each copper line; providing an insulating
layer that overlies the semiconductor chip and extends between the
top and bottom surfaces of the copper lines and over at least a
portion of the top surface of the copper lines; providing a
substrate having elongated copper leads with first and second
surfaces; electrically coupling the first surface of each copper
lead to corresponding ones of the plated copper bump structures
using solder elements; at least partially encapsulating the
semiconductor chip and the substrate; and providing un-encapsulated
portions of the second lead surfaces for further electrical
attachment..Iaddend.
.Iadd.29. The method of claim 28 wherein the substrate comprises a
metallic leadframe..Iaddend.
.Iadd.30. The method of claim 28 wherein the insulating layer is at
least 10 .mu.m thick..Iaddend.
Description
.Iadd.This application is an application for the reissue of U.S.
Pat. No. 7,335,536; moreover, more than one reissue patent
application has been filed for the reissue of U.S. Pat. No.
7,335,536, which includes reissue application Ser. No. 13/870,579,
filed on Aug. 20, 2013, which is a divisional of this pending
reissue application, and also continuation reissue application Ser.
No. 14/023,281, filed on Sep. 10, 2013, which claims priority to
the present reissue..Iaddend.
FIELD OF THE INVENTION
The present invention is related in general to the field of
semiconductor devices and processes and more specifically to a
fabrication method of high performance flip-chip semiconductor
devices, which have low electrical resistance and can provide high
power, low noise, and high speed.
DESCRIPTION OF THE RELATED ART
Among the ongoing trends in integrated circuit (IC) technology are
the drives towards higher integration, shrinking component feature
sizes, and higher speed. In addition, there is the relentless
pressure to keep the cost/performance ratio under control, which
translates often into the drive for lower cost solutions. Higher
levels of integration include the need for higher numbers of signal
lines and power lines, yet smaller feature sizes make it more and
more difficult to preserve clean signals without mutual
interference.
These trends and requirements do not only dominate the
semiconductor chips, which incorporate the ICs, but also the
packages, which house and protect the IC chips.
Compared to the traditional wire bonding assembly, the growing
popularity of flip-chip assembly in the fabrication process flow of
silicon integrated circuit (IC) devices is driven by several facts.
First, the electrical performance of the semiconductor devices can
commonly be improved when the parasitic inductances correlated with
conventional wire bonding interconnection techniques are reduced.
Second, flip-chip assembly often provides higher interconnection
densities between chip and package than wire bonding. Third, in
many designs flip-chip assembly consumes less silicon "real estate"
than wire bonding, and thus helps to conserve silicon area and
reduce device cost. And fourth, the fabrication cost can often be
reduced, when concurrent gang-bonding techniques are employed
rather than consecutive individual bonding steps.
The standard method of ball bonding in the fabrication process uses
solder balls and their reflow technique. These interconnection
approaches are more expensive than wire bonding. In addition, there
are severe reliability problems in some stress and life tests of
solder ball attached devices. Product managers demand the higher
performance of flip-chip assembled products, but they also demand
the lower cost and higher reliability of wire bonded devices.
Furthermore, the higher performance of flip-chip assembled products
should be continued even in miniaturized devices, which at present
run into severe technical difficulties by using conventional solder
ball technologies.
SUMMARY OF THE INVENTION
Applicants recognize a need to develop a technical approach which
considers the complete system consisting of semiconductor
chip--device package--external board, in order to provide superior
product characteristics, including low electrical resistance and
inductance, high reliability, and low cost. Minimum inductance and
noise is the prerequisite of high speed, and reduced resistance is
the prerequisite of high power. The system-wide method of
assembling should also provide mechanical stability and high
product reliability, especially in accelerated stress tests
(temperature cycling, drop test, etc.). The fabrication method
should be flexible enough to be applied for semiconductor product
families with shrinking geometries, including substrates and
boards, and a wide spectrum of design and process variations.
One embodiment of the invention is a method for fabricating a low
resistance, low inductance interconnection structure for high
current semiconductor flip-chip products. A semiconductor wafer is
provided, which has metallization traces, the wafer surface
protected by an overcoat, and windows in the overcoat to expose
portions of the metallization traces. Copper lines are formed on
the overcoat, preferably by electroplating; the lines are in
contact with the traces by filling the windows with metal. Next a
layer of photo-imageable insulation material is deposited over the
lines and the remaining wafer surface. Windows are opened in the
insulation material to expose portions of the lines, the locations
of the windows selected in an orderly and repetitive arrangement on
each line so that the windows of one line are positioned about
midway between the corresponding windows of the neighboring lines.
Copper bumps are formed, preferably by electroplating, in the
windows, and are in contact with the lines.
Certain device features serve multiple purposes in the process
flow. The photo-imageable insulation layer doubles as protection
against running solder in the assembly process. The photoresist
layers needed to enable the electroplating steps double as
thickness controls for the copper elements being electroplated.
Another embodiment of the invention is a method for fabricating a
low resistance, low inductance device for high current
semiconductor flip-chip products. A structure is provided, which
comprises a semiconductor chip with metallization traces, copper
lines in contact with the traces, and copper bumps located in an
orderly and repetitive arrangement on each line so that the bumps
of one line are positioned about midway between the corresponding
bumps of the neighboring lines. Further, a substrate is provided
which has elongated copper leads with first and second surfaces,
the leads oriented at right angles to the lines. The first surface
of each lead is connected to the corresponding bumps of alternating
lines using solder elements. Finally, the assembly is encapsulated
in molding compound so that the second lead surfaces remain
un-encapsulated.
Another embodiment of the invention is a method for fabricating a
low resistance, low inductance interconnection system for high
current semiconductor flip-chip devices. An encapsulated device as
described above is provided, with lead surfaces un-encapsulated.
Further a circuit board is provided, which has copper contact pads
parallel to the leads. The device lead surfaces are attached to the
board pads using solder layers.
The technical advantages represented by certain embodiments of the
invention will become apparent from the following description of
the preferred embodiments of the invention, when considered in
conjunction with the accompanying drawings and the novel features
set forth in the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A through 15 illustrate a plurality of process steps in the
fabrication method of low resistance, low inductance
interconnections for high current semiconductor devices.
FIG. 1A is a schematic cross section of a portion of a
semiconductor wafer depicting the opening of a window in the wafer
overcoat to expose a portion of a metallization trace.
FIG. 1B is a schematic top view of patterned metallization traces
as an example to illustrate the number and location of the windows
selected to be opened as shown in FIG. 1A.
FIG. 1C is a schematic perspective view of patterned metallization
traces as an example to illustrate the number and location of the
windows selected to be opened as shown in FIG. 1A.
FIG. 2 is a schematic cross section of the wafer portion of FIG. 1
to depict the deposition of a harrier layer and a seed layer.
FIG. 3 is a schematic cross section of the wafer portion of FIG. 2
to depict the deposition and exposure of a first photoresist layer
over the seed layer.
FIG. 4 is a schematic cross section of the wafer portion of FIG. 3
to depict the opening of a window in the first photoresist layer to
expose a portion of the seed layer.
FIG. 5 is a schematic cross section of the wafer portion of FIG. 4
to depict the deposition of a copper line to the height of the
first photoresist layer.
FIG. 6A is a schematic cross section of the wafer portion of FIG. 5
to depict the removal of the first photoresist layer, the barrier
layer, and the seed layer.
FIG. 6B is a schematic top view of the portion of patterned
metallization traces of FIG. 1B as an example to illustrate the
number and location of the copper lines.
FIG. 6C is a schematic perspective view of the portion of patterned
metallization traces of FIG. 1C as an example to illustrate the
number and location of the copper lines.
FIG. 7 is a schematic cross section of the wafer portion of FIG. 6A
to depict the deposition and exposure of a layer of photo-imageable
insulation material over the wafer surface.
FIG. 8A is a schematic cross section of the wafer portion or FIG. 7
to depict the opening of a window in the insulation material to
expose a portion of the lines.
FIG. 8B is a schematic top view of the portion of patterned
metallization traces of FIG. 6B as an example to illustrate the
selection of the insulation window locations to be opened as shown
in FIG. 8A; the insulation material is not shown.
FIG. 8C is a schematic perspective view of the wafer portion of
FIG. 8B to illustrate the selection of the insulation window
locations; the insulation material is shown.
FIG. 9 is a schematic cross section of the wafer portion of FIG. 8A
to depict the deposition of a barrier layer and a seed layer.
FIG. 10 is a schematic cross section of the wafer portion of FIG. 9
to depict the deposition and exposure of a second photoresist layer
over the seed layer.
FIG. 11 is a schematic cross section of the wafer portion of FIG.
10 to depict the opening of the second photoresist layer to expose
a portion of the seed layer.
FIG. 12 is a schematic cross section of the wafer portion of FIG.
11 to depict the deposition of a copper bump and solderable layers
to the height of the second photoresist layer.
FIG. 13A is a schematic cross section of the wafer portion of FIG.
12 to depict the removal of the second photoresist layer, the
harrier layer, and the seed layer.
FIG. 13B is a schematic perspective view of the wafer portion of
FIG. 8C to illustrate the deposited copper bumps in the selected
insulation windows.
FIG. 14A is a schematic perspective view of the wafer portion of
FIG. 13B to illustrate the assembly of the copper bumps to
substrate leads.
FIG. 14B is a schematic cross section of the flipped assembly of
FIG. 14A.
FIG. 15 is a schematic cross section of the flipped assembly of
FIG. 14B to illustrate the encapsulation of the assembly in molding
compound.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention is related to U.S. patent application Ser.
No. 11/210,066, filed on Aug. 22, 2005. (Coyle et al., "High
Current Semiconductor Device System having Low Resistance and
Inductance"; TI-60885).
FIGS. 1A through 15 illustrate certain process steps in the
fabrication method of low electrical resistance, low inductance
interconnections, which are suitable for high current semiconductor
devices and systems. FIG. 1A shows a portion of a semiconductor
wafer 101, which has a metallization trace 102 and is protected by
an overcoat layer 103. For many devices, the semiconductor wafer is
silicon or silicon germanium, but for other devices the wafer may
be gallium arsenide or any other compound used in semiconductor
product manufacture. The metallization trace for many devices is
aluminum or an aluminum alloy, for other devices it is copper or a
copper alloy; the thickness range is typically 0.5 to 1 .mu.m. In
many devices, the metallization level of trace 102 is the top level
out of several metallization levels of the device. The overcoat is
frequently silicon nitride or silicon oxynitride, in the thickness
range from about 0.7 to 1.2 .mu.m; in some devices the overcoat is
a stack of layers such as silicon dioxide over the semiconductor
and silicon nitride of oxynitride as the outermost layer. The
thickness of the stack is often between 0.7 and 1.5 .mu.m.
A window of width 104 is opened in overcoat 103 to expose a portion
of metallization trace 102. The top view of FIG. 1B gives an
example of parallel metallization traces 110, 111, . . . , 11n of a
device together with the number and distribution of the overcoat
openings 110a, 110b, . . . , 11na, 11nb, . . . to expose the
metallization traces. FIG. 1C repeats the metallization traces of
FIG. 1B in perspective view.
As FIG. 2 indicates, a couple of metal layers 201 and 202 are
deposited over the wafer surface, including window 104; the
preferred method of deposition is a sputtering technique. Layer 201
is a barrier metal such as titanium/tungsten alloy of approximately
0.5 .mu.m thickness or less. Layer 202 is a seed metal layer,
preferably copper, in the thickness range of about 0.5 to 0.8
.mu.m. The stack of layers 201 and 202 is suitable to provide
uniform potential for an electroplating step.
In FIG. 3, a first photoresist layer 301 is deposited over seed
metal layer 202 of the wafer. The thickness 301a of the photoresist
layer 301 is selected so that it is commensurate with the intended
height of the copper lines, which will be fabricated using
photoresist layer 301. FIG. 3 further indicates the photomask 302
with the opening 302a for defining the copper line width by
exposing the wafer under the mask.
FIG. 4 illustrates the exposed and developed photoresist layer 301.
A plurality of windows 401 is opened in first photoresist layer
301, exposing a portion of seed layer 202. FIG. 5 shows the next
process step, the deposition of copper 501 in the window.
Preferably using electroplating, copper or copper alloy is
deposited in the photoresist window to fill the window to the
thickness 301a of the photoresist, creating copper lines 501 of
height 501a. Alternatively, other conducting materials, preferably
of high electrical conductivity, may be deposited; examples are
silver or silver alloys, or carbon nano-tubes.
In the next process steps shown in FIG. 6A, the first photoresist
layer is removed. Using the plated copper structure 501 as an etch
mask, the barrier (or adhesion) metal layer 201 and the seed metal
layer 202 are subsequently etched off outside of copper line 501. A
portion of the plurality of the plated copper lines is shown in the
top view of FIG. 6B and in the perspective view of FIG. 6C. In the
examples of these figures, the copper lines are depicted to be at
right angles to wafer metallization traces 110 and 111. As stated
earlier, in other devices, copper lines 501 may be parallel to the
metallization traces, or at any other angle.
In FIG. 7, the wafer is coated with a photo-imageable insulation
material 701 such as polyimide, preferably using a spin-on
technique. With this technique, geometrical surface steps or
irregularities are smoothened, including the step caused by the
copper lines 501, as schematically indicated in FIG. 7. The
insulator thickness is between approximately 10 and 20 .mu.m. A
relatively thinner insulator layer is formed on the copper line
surface. The main function of the insulation material becomes
operable in the later assembly step of reflowing solder elements
for attachment; the insulation material prevents an accidental
electrical shortening of nearby conductors.
FIG. 7 further shows a photomask 702 applied to the insulator
layer. This photomask 702 has openings 702a, which allow the
exposure of portions of the lines 501. Openings 702a in photomask
702 are different from openings 302a in photomask 302. Openings
702a are intended to define the windows for forming copper bumps in
contact with copper lines 501.
The locations of the windows 702a are selected in an orderly and
repetitive arrangement on each line 501 so that the windows 702a of
one line 501 are positioned about midway between the corresponding
windows of the neighboring lines. FIG. 8A illustrates the
development of the insulating layer 701, the opened windows 801 in
the insulating layer 701, and the curing of the insulating material
(polyimide). In perspective view, FIG. 8C indicates the opened
windows 801 in the insulating layer 701. In FIG. 8B, representing
an X-ray view from the top, the positioning of the windows 801
relative to the array of copper lines 501 highlights the orderly
and repetitive arrangement: the windows 801 of one line 501 are
positioned about midway between the corresponding windows 802, 803
of the neighboring lines 502, 503.
As FIG. 9 indicates, a couple of metal layers 901 and 902 are
deposited over the wafer surface. including window 801; the
preferred method of deposition is a sputtering technique. Layer 901
is a barrier metal such as titanium/tungsten alloy of approximately
0.5 .mu.m thickness or less. Layer 902 is a seed metal layer,
preferably copper, in the thickness range of about 0.5 to 0.8
.mu.m. The stack of layers 901 and 902 is suitable to provide
uniform potential for an electroplating step.
In FIG. 10, a second photoresist layer 1001 is deposited over seed
metal layer 902 of the wafer. The thickness 1001a of the
photoresist layer 1001 is selected so that it is commensurate with
the intended height of the copper bumps, which will be fabricated
using photoresist layer 1001. FIG. 10 further indicates the
photomask 1002 with the opening 1002a for exposing the wafer under
the mask. Photomask 1002 is different from photomasks 302 and 702;
the openings 1002a define the length and width of the intended
copper bumps.
FIG. 11 illustrates the exposed and developed second photoresist
layer 1001. A plurality of windows 1101 is opened in photoresist
layer 1101, exposing a portion of seed layer 902. FIG. 12 shows the
next process step, the deposition of copper bump 1201 in the
window. Preferably using electroplating, copper or copper alloy is
deposited in the photoresist window, creating copper bumps 1201 of
height 1201a. Bump height 1201a may be equal to photoresist layer
thickness 1001a, or alternatively it may be slightly less, as
indicated in FIG. 12. In this case, one or more additional metal
layers 1202 may be deposited (preferably by electroplating), which
facilitate solder attachment. Examples of such metal layers are
nickel, palladium, and gold; these layers are thin compared to the
copper bump.
In the next process steps shown in FIG. 13A, the second photoresist
layer is removed. Using the plated copper bump structure 1201 as an
etch mask, the barrier (or adhesion) metal layer 901 and the seed
metal layer 902 are subsequently etched off outside of copper bump
1201. A portion of the plurality of the plated copper bumps 1201 is
shown in the perspective view of FIG. 13B. Each hump 1201 has a cap
1202 of at least one solderable metal layer, frequently with a tin
palladium layer as the outermost layer.
The next process step is a singulation step, preferably involving a
rotating diamond saw, by which the wafer is separated into
individual chips. Each chip can then be further processed by
assembling the chip onto a substrate or a leadframe.
In the next process step, a substrate is provided, which has
elongated copper leads with first and second surfaces. A preferred
example is a metallic leadframe with individual leads; preferred
leadframe metals are copper or copper alloys, but in specific
devices, iron/nickel alloys or aluminum may be used. Other examples
include insulating substrates with elongated copper leads. The
leads are oriented at right angles to the copper lines 501 shown in
FIGS. 6A to 6C. The first surface of each lead is then connected to
the corresponding bumps of alternating lines using solder elements.
This assembly is schematically illustrated in FIGS. 14A and
14B.
In FIG. 14A, chip 1401 is covered by insulation material 701 and
has a plurality of copper bumps 1201. The first surfaces 1410a of
substrate copper leads 1410 are shown to be attached to copper
bumps 1201 (not shown in FIG. 14A are copper lines 501 on the chip
surface; leads 1410 are at right angles to lines 501). The second
surfaces 1410b of leads 1410 are faced away from bumps 1201.
Flipping the assembly of FIG. 14A produces the orientation of FIG.
14B, which displays a cross section of the chip-on-substrate
assembly. Chip 1401 has copper lines 501 covered by insulation
material 701. On alternating lines, copper bumps 1201 are shown,
which are attached by solder elements 1420 to the first surface
1410a of lead 1410. Even if solder elements 1420 should creep along
the complete surfaces of bumps 1201, insulation material 701
prevents an electrical shortening to neighboring conductors.
The assembly of FIGS. 14A/14B is submitted to a block mold, in
which a plurality of assembled units is encapsulated in a batch
molding process. The second lead surfaces 1410b remain
un-encapsulated and exposed for further attachment, for instance
solder layers to a circuit board. A saw is finally employed to
separate the individual product units. FIG. 15 illustrates such
singulated device encapsulated in molding compound 1501. The side
walls 1501a of the device are straight, since they have been
created by the sawing process.
From lead surface 1410b to the chip circuitry, there is a
continuous electrical path through copper connectors (with the
exception of solder element 1420). Consequently, the electrical
resistance and the electrical inductance of the device displayed in
FIG. 15 are low. The device of FIG. 15 is thus suitable for high
current (30 A and higher) applications. This characteristic can be
further exploited by pressing or soldering second lead surfaces
1410b to a circuit board, which has copper contact pads parallel to
leads 1410 and matching their number and position. The preferred
method of attachment is soldering by using solder layers.
While this invention has been described in reference to
illustrative embodiments, this description is not intended to be
construed in a limiting sense. Various modifications and
combinations of the illustrative embodiments, as well as other
embodiments of the invention, will be apparent to persons skilled
in the art upon reference to the description. As an example, the
substrate may be an insulating tape with copper leads of first and
second surfaces. As another example, the copper bumps may be
considerably shorter than illustrated in the figures; there still
will be no risk of electrical shorts by creeping solder elements.
It is therefore intended that the appended claims encompass any
such modifications.
* * * * *
References