Lange; Bernhard P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lange; Bernhard P..The latest application filed is for "device and method for inert gas cure for leadframe or substrate strips".

Company Profile

1.18.23

Lange; Bernhard P. - Freising DE
Lange; Bernhard P - Freising DE
Lange; Bernhard P. - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE48,420 - Lange , et al. February 2, 2	2021-02-02
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE46,618 - Lange , et al. November 28, 2	2017-11-28
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE46,466 - Lange , et al. July 4, 2	2017-07-04
Non-pull back pad package with an additional solder standoff Grant 8,232,144 - Lange , et al. July 31, 2	2012-07-31
High power integrated circuit device having bump pads Grant 8,154,117 - Wiktor , et al. April 10, 2	2012-04-10
Multi lead frame power package Grant 8,053,876 - Kummerl , et al. November 8, 2	2011-11-08
High current semiconductor device system having low resistance and inductance Grant 8,039,956 - Coyle , et al. October 18, 2	2011-10-18
Device and Method for Inert Gas Cure for Leadframe or Substrate Strips App 20110189383 - LANGE; Bernhard P.	2011-08-04
Flip chip package with advanced electrical and thermal properties for high current designs Grant 7,863,098 - Lange , et al. January 4, 2	2011-01-04
Semiconductor device with improved high current performance Grant 7,808,088 - Lange October 5, 2	2010-10-05
High Power Integrated Circuit Device App 20100164052 - WIKTOR; STEFAN W. ; et al.	2010-07-01
Non-Pull Back Pad Package with an Additional Solder Standoff App 20100006623 - LANGE; Bernhard P. ; et al.	2010-01-14
Semiconductor device having firmly secured heat spreader Grant 7,635,613 - Lange , et al. December 22, 2	2009-12-22
Non-pull back pad package with an additional solder standoff Grant 7,608,484 - Lange , et al. October 27, 2	2009-10-27
Bond capillary design for ribbon wire bonding Grant 7,578,422 - Lange , et al. August 25, 2	2009-08-25
Flip Chip Package With Advanced Electrical And Thermal Properties For High Current Designs App 20090087948 - LANGE; Bernhard P. ; et al.	2009-04-02
Flip chip package with advanced electrical and thermal properties for high current designs Grant 7,476,976 - Lange , et al. January 13, 2	2009-01-13
Non-Pull Back Pad Package with an Additional Solder Standoff App 20080102563 - Lange; Bernhard P. ; et al.	2008-05-01
Semiconductor assembly and packaging for high current and low inductance Grant 7,361,977 - Lange April 22, 2	2008-04-22
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant 7,335,536 - Lange , et al. February 26, 2	2008-02-26
Exposed top side copper leadframe manufacturing App 20080001264 - Lange; Bernhard P.	2008-01-03
Dual Leadframe Semiconductor Device Package App 20070290303 - Lange; Bernhard P.	2007-12-20
Apparatus for Grinding a Wafer App 20070287363 - Lange; Bernhard P.	2007-12-13
Semiconductor Device with Improved High Current Performance App 20070284709 - Lange; Bernhard P.	2007-12-13
Design and Method for Attaching a Die to a Leadframe in a Semiconductor Device App 20070273010 - Holloway; Jeffrey G. ; et al.	2007-11-29
Bond Capillary Design for Ribbon Wire Bonding App 20070181652 - Lange; Bernhard P. ; et al.	2007-08-09
Bond capillary design for ribbon wire bonding Grant 7,216,794 - Lange , et al. May 15, 2	2007-05-15
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices App 20070048996 - Lange; Bernhard P. ; et al.	2007-03-01
High current semiconductor device system having low resistance and inductance App 20070040237 - Coyle; Anthony L. ; et al.	2007-02-22
Semiconductor assembly and packaging for high current and low inductance App 20070034993 - Lange; Bernhard P.	2007-02-15
Semiconductor device having firmly secured heat spreader App 20060289971 - Lange; Bernhard P. ; et al.	2006-12-28
Bond capillary design for ribbon wire bonding App 20060278682 - Lange; Bernhard P. ; et al.	2006-12-14
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages App 20060211175 - Lange; Bernhard P.	2006-09-21
Flip chip package with advanced electrical and thermal properties for high current designs App 20060186551 - Lange; Bernhard P. ; et al.	2006-08-24
Mold cavity identification markings for IC packages App 20060166381 - Lange; Bernhard P.	2006-07-27
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages Grant 7,074,653 - Lange July 11, 2	2006-07-11
Mold compound interlocking feature to improve semiconductor package strength App 20060071351 - Lange; Bernhard P.	2006-04-06
Heatslug to leadframe attachment App 20060037995 - Lange; Bernhard P.	2006-02-23
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages App 20060038282 - Lange; Bernhard P.	2006-02-23
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages App 20060038202 - Lange; Bernhard P.	2006-02-23

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