Mai; Quang X.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mai; Quang X..The latest application filed is for "method for fabricating low resistance, low inductance interconnections in high current semiconductor devices".

Company Profile

0.10.3

Mai; Quang X. - Sugar Land TX
Mai; Quang X. - Sugarland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE48,420 - Lange , et al. February 2, 2	2021-02-02
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE46,618 - Lange , et al. November 28, 2	2017-11-28
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant RE46,466 - Lange , et al. July 4, 2	2017-07-04
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Grant 7,335,536 - Lange , et al. February 26, 2	2008-02-26
Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices App 20070048996 - Lange; Bernhard P. ; et al.	2007-03-01
Wafer-level assembly method for chip-size devices having flipped chips App 20050151268 - Boyd, William D. ; et al.	2005-07-14
Integrated circuit with bonding layer over active circuitry Grant 6,683,380 - Efland , et al. January 27, 2	2004-01-27
Integrated circuit with bonding layer over active circuitry App 20030036256 - Efland, Taylor R. ; et al.	2003-02-20
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect Grant 6,140,702 - Efland , et al. October 31, 2	2000-10-31
Plastic encapsulation for integrated circuits having plated copper top surface level interconnect Grant 6,140,150 - Efland , et al. October 31, 2	2000-10-31
Method of forming improved thick plated copper interconnect and associated auxiliary metal interconnect Grant 6,025,275 - Efland , et al. February 15, 2	2000-02-15
Thick plated interconnect and associated auxillary interconnect Grant 6,020,640 - Efland , et al. February 1, 2	2000-02-01

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