U.S. patent number RE39,153 [Application Number 09/871,313] was granted by the patent office on 2006-07-04 for connector with integral transmission line bus.
This patent grant is currently assigned to Rambus Inc.. Invention is credited to John B. Dillon, Nancy David Dillon, James A. Gasbarro, Donald V. Perino.
United States Patent |
RE39,153 |
Perino , et al. |
July 4, 2006 |
Connector with integral transmission line bus
Abstract
A socket (14) includes a first bus conductor (22a) having two or
more contact regions (24) and a second bus conductor (22b) arranged
substantially parallel to the first bus conductor and having two or
more contact regions (24). The first and second bus conductors are
spaced relative to one another so as to provide a predetermined
electrical impedance and may be arranged to carry electrical
signals as transmission lines. A dielectric spacer (36) may be
disposed between the first and second bus conductors to provide the
spacing. Contact regions (24) of the first and second conductors
(22a, 22b) may provide compliant coupling regions for the socket
(14). The contact regions (24) of the first bus conductor (22a) may
be positioned within the socket (14) so as to contact a lead
disposed on a first side of a circuit element (16) and the contact
regions (24) of the second bus conductor (22b) may be positioned
within the socket (14) so as to contact the lead disposed on the
second side of the circuit element (16).
Inventors: |
Perino; Donald V. (N. Potomac,
MD), Gasbarro; James A. (Pittsburgh, PA), Dillon; Nancy
David (Palo Alto, CA), Dillon; John B. (Washington,
VA) |
Assignee: |
Rambus Inc. (Los Altos,
CA)
|
Family
ID: |
25408421 |
Appl.
No.: |
09/871,313 |
Filed: |
May 31, 2001 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
Reissue of: |
08897788 |
Jul 21, 1997 |
05908333 |
Jun 1, 1999 |
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Current U.S.
Class: |
439/631; 361/775;
174/72B |
Current CPC
Class: |
H01R
12/7076 (20130101); H01R 13/658 (20130101); H01R
12/712 (20130101) |
Current International
Class: |
H01R
9/00 (20060101) |
Field of
Search: |
;439/61,63
;361/785,775,788 ;174/71B,72B,88B |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Dillon, et al. "Rambus Channel Design Guide," Copyright Rambus
Inc., California, pp. ii-65, (1994). cited by other.
|
Primary Examiner: Abrams; Neil
Attorney, Agent or Firm: Vierra Magen Marcus Harmon &
DeNiro LLP
Claims
What is claimed is:
1. An electrical connector comprising a plurality of bus
conductors.Iadd., .Iaddend.each .Iadd.bus conductor of the
plurality of bus conductors .Iaddend.running through the length of
the connector .[.yet.]. .Iadd.and .Iaddend.being electrically
isolated from .[.one another and.]. .Iadd.other bus conductors of
the plurality of bus conductors, each bus conductor of the
plurality of bus conductors .Iaddend.having a number of compliant
contact regions .[.disposed at various positions along their
respective lengths so as.]. to provide electrical coupling points
for like contact regions of electrical devices to be received
within the connector, the .Iadd.plurality of .Iaddend.bus
conductors .[.being divided into.]. .Iadd.including .Iaddend.first
and second groups such that across the width of the connector
.[.a.]. .Iadd.each .Iaddend.bus conductor of the first group is
positioned .[.adjacent to.]. .Iadd.in an interleaved configuration
with each .Iaddend.bus .[.conductors.]. .Iadd.conductor .Iaddend.of
the second group .[.that is positioned adjacent to yet another bus
conductor of the first group, and so on for each of the plurality
of bus conductors, the.]. .Iadd.and having a predetermined
.Iaddend.transmission line impedance .[.of any pair of adjacent bus
conductors, one being chosen from the first group and the other
being chosen from the second group, being determinable.]. ,
.Iadd.and .Iaddend.wherein each of the bus conductors of the first
group are adapted to be electrically coupled to respective signal
paths associated with a circuit board on which the connector is to
be mounted through .[.only two.]. .Iadd.an .Iaddend.electrical
contact .[.elements regardless of the number of compliant contact
regions, the two electrical contact elements of each bus conductor
of the first group being arranged so that each is.]. .Iadd.element
.Iaddend.disposed substantially near .[.an.]. .Iadd.each
.Iaddend.end of .[.its.]. .Iadd.each .Iaddend.respective bus
conductor .Iadd.of the first group.Iaddend., and the bus conductors
of the second group each being adapted to be electrically coupled
to an electrical ground plane associated with the circuit board
through a number of electrical contact elements disposed along
.[.their respective lengths, the number of electrical contact
elements being irrespective of the number of compliant contact
regions.]. .Iadd.each bus conductor of the second
group.Iaddend..
2. A connector as in claim 1 wherein a dielectric spacer is
disposed between each adjacent bus conductor of the first and
second groups.
3. A connector as in claim 2 wherein said compliant contact regions
of said bus conductors comprise fingers offset from respective ones
of said bus conductors through a bend.
4. A connector as in claim 2 wherein said compliant contact regions
comprise elastomer-backed metal regions.
5. A connector as in claim 1 wherein said compliant contact regions
of said bus conductors are made of a Beryllium-Copper (Be--Cu)
alloy.
6. A connector as in claim 5 further comprising a dielectric spacer
disposed between each adjacent bus conductor of the first and
second groups.
7. A connector as in claim 1 wherein said compliant contact regions
of said bus conductors comprise elastomer-backed metal regions.
8. A connector as in claim 1 wherein the compliant contact regions
of bus conductors of the first group are arranged to contact a
first side of the electrical devices and the compliant contact
regions of bus conductors of the second group are arranged to
contact a second side of the electrical devices.
9. A connector as in claim 8 wherein the compliant contact regions
of the bus conductors are made of a Beryllium-Copper (Be--Cu)
alloy.
10. A connector as in claim 8 wherein the compliant contact regions
of the bus conductors comprise elastomer-backed metal regions.
11. A connector as in claim 8 wherein the compliant contact regions
of the bus conductors comprise fingers offset from respective ones
of the bus conductors through a bend.
12. A connector as in claim 1 wherein the signal paths comprise a
plurality of traces on the circuit board.
13. A connector as in claim 12 wherein the compliant contact
regions of the bus conductors comprise fingers offset from
respective ones of the conductors through a bend.
14. A connector as in claim 12 wherein the compliant contact
regions of the bus conductors comprise elastomer-backed metal
regions.
15. A connector as in claim 1 wherein said electrical contact
elements of said bus conductors of the first group comprise metal
posts.
16. A connector as in claim 15 wherein said electrical contact
elements of said bus conductors of the second group comprise metal
posts.
17. A connector as in claim 16 wherein said metal posts of said bus
conductors of the second group are disposed at approximately equal
intervals over the lengths of each of said bus conductors of said
second group.
.Iadd.18. A socket for providing an electrical interface between a
substrate and a plurality of removable electronic components, the
socket comprising: a socket housing adapted to receive the
plurality of removable electronic components; and a first group of
conductor lines interleaved with a second group of conductor lines,
wherein the first group of conductor lines includes a first signal
conductor extending through the socket housing and having a
predetermined impedance and first and second ends adapted to couple
respectively to first and second traces disposed on the substrate
such that the first signal conductor forms a signal transmission
line between the first and second traces, the first signal
conductor further having a plurality of electrical contact regions
to couple to counterpart electrical contact regions disposed on the
plurality of removable electronic components, and wherein the
second group of conductor lines includes a number of electrical
contact elements disposed along the length of each conductor line
of the second group of conductor lines, the number of electrical
contact elements being adapted to couple to a ground plane node of
the substrate..Iaddend.
.Iadd.19. The socket of claim 18 wherein additional signal
conductors of the first group of conductor lines extend through the
socket housing parallel to the first signal conductor, the
additional signal conductors each having the predetermined
impedance and first and second ends adapted to couple to a
respective additional pair of traces on the substrate such that
each of the additional signal conductors form a signal transmission
line between the additional pair of traces, each of the additional
signal conductors further having a plurality of electrical contact
regions to couple to additional counterpart electrical contact
regions disposed on the plurality of removable electronic
components, the first signal conductor and the additional signal
conductors forming a signaling bus that extends through the socket
housing..Iaddend.
.Iadd.20. The socket of claim 18 wherein the second group of
conductor lines includes a first ground conductor extending through
the socket housing and disposed adjacent the first signal
conductor, the first ground conductor having a plurality of contact
elements disposed along its length to couple the first ground
conductor to the ground plane of the substrate..Iaddend.
.Iadd.21. The socket of claim 20 wherein the first group of
conductor lines include: additional signal conductors extending
through the socket housing in a direction parallel to the first
signal conductor, the additional signal conductors each having the
predetermined impedance and first and second ends adapted to couple
to a respective additional pair of traces on the substrate such
that each of the additional signal conductors form a signal
transmission line between the respective additional pair of traces,
each of the additional signal conductors further having a plurality
of electrical contact regions to couple respectively to additional
counterpart electrical contact regions disposed on the plurality of
removable electronic components, the first signal conductor and the
additional signal conductors forming a signaling bus that extends
through the socket housing; wherein the second group of conductor
lines include additional ground conductors extending through the
socket housing parallel to the first ground conductor, each of the
additional ground conductors having a plurality of contact elements
located along its length to couple to a ground plane of the
substrate; and wherein signal conductors, including the first
signal conductor and the additional signal conductors, and ground
conductors, including the first ground conductor and the additional
ground conductors, are disposed within the socket housing such that
each of the signal conductors is adjacent a respective one of the
ground conductors..Iaddend.
.Iadd.22. The socket of claim 21 wherein each one of the signal
conductors is disposed adjacent another one of the signal
conductors..Iaddend.
.Iadd.23. The socket of claim 21 wherein the signal conductors and
the ground conductors are disposed within the socket housing such
that each signal conductor of a subset of the signal conductors is
positioned between a respective pair of the ground
conductors..Iaddend.
.Iadd.24. The socket of claim 21 wherein the signal conductors and
ground conductors are disposed within the socket housing such that
the contact regions of each signal conductor oppose the contact
regions of the adjacent ground conductor..Iaddend.
.Iadd.25. The socket of claim 21 wherein each signal conductor and
adjacent ground conductor form a signal-ground conductor pair
having opposing signal and ground contact regions, each pair of
opposing signal and ground contact regions being positioned to
contact respective electrical contact elements disposed on opposing
faces of a respective one of the removable electronic
components..Iaddend.
.Iadd.26. The socket of claim 25 wherein the contact regions of the
signal conductors of the signal-ground conductor pairs are
positioned to alternately contact each of the opposing faces of the
respective one of the removable electronic components..Iaddend.
.Iadd.27. The socket of claim 26 wherein the contact regions of the
ground conductors of the signal-ground conductor pairs are
positioned to alternately contact each of the opposing faces of the
respective one of the removable electronic components..Iaddend.
.Iadd.28. The socket of claim 20 further comprising a dielectric
spacer disposed between the first signal conductor and the first
ground conductor..Iaddend.
.Iadd.29. The socket of claim 28 wherein the width of the
dielectric spacer is selected to achieve the predetermined
impedance of the first signal conductor..Iaddend.
.Iadd.30. The socket of claim 28 wherein the dielectric spacer is
bonded to at least one of the first ground conductor and the first
signal conductor..Iaddend.
.Iadd.31. The socket of claim 20 wherein the first signal conductor
and the first ground conductor are formed by respective conductive
plates..Iaddend.
.Iadd.32. The socket of claim 18 further comprising an elastomer
disposed underneath each of the plurality of electrical contact
regions of the first signal conductor..Iaddend.
.Iadd.33. The socket of claim 18 wherein additional signal
conductors of the first group of conductor lines extend through the
socket housing parallel to the first signal conductor, the
additional signal conductors each having the predetermined
impedance and first and second ends adapted to couple to a
respective additional pair of traces on the substrate such that
each additional signal conductor forms a signal transmission line
between the additional pair of traces, each additional signal
conductor further having a plurality of electrical contact regions
to couple to additional counterpart electrical contact regions on
the plurality of removable electronic components; and wherein the
socket further comprises a plurality of elastomers extending
through the socket housing in a direction transverse to the first
signal conductor and the additional signal conductors, each of the
elastomers extending beneath at least one electrical contact region
of each of the additional signal conductors and beneath at least
one electrical contact region of the first signal
conductor..Iaddend.
.Iadd.34. The socket of claim 33 wherein each of the elastomers of
the plurality of elastomers is formed from a dielectric material to
maintain electrical isolation between the signal conductors,
including the first signal conductor and the additional signal
conductors..Iaddend.
.Iadd.35. The socket of claim 18 wherein each of the removable
electronic components is a daughter card and the socket housing is
adapted to receive a plurality of the daughter cards..Iaddend.
.Iadd.36. The socket of claim 18 wherein each of the removable
electronic components is an integrated circuit device and the
socket housing is adapted to receive a plurality of the integrated
circuit devices..Iaddend.
.Iadd.37. The socket of claim 18 wherein the first and second ends
of the first signal conductor include posts adapted to fit into
respective holes in the substrate..Iaddend.
.Iadd.38. An electrical connector comprising: a connector housing
having a plurality of slots to receive removable electronic
components; signal conductors that extend through the connector
housing to form a signaling bus, the signal conductors including
contact regions to electrically couple the removable electronic
components to the signaling bus, each of the signal conductors
having first and second ends to couple to respective signal traces
on a substrate and having a predetermined impedance; and ground
conductors that extend through the connector housing parallel to
and interleaved with the signal conductors, the ground conductors
each including a plurality of contact regions to electrically
couple to a ground reference of the substrate, the ground
conductors and signal conductors being disposed within the
connector housing such that each of the signal conductors is
adjacent at least one of the ground conductors..Iaddend.
.Iadd.39. The electrical connector of claim 38 wherein a dielectric
spacer is positioned between each signaling conductor and adjacent
ground conductor..Iaddend.
.Iadd.40. The electrical connector of claim 38 wherein each of the
signal conductors forms a transmission line between the respective
signal traces when coupled thereto..Iaddend.
.Iadd.41. The electrical connector of claim 38 wherein each of the
signal conductors is adapted to be coupled to the substrate only at
the first and second ends, and wherein each of the ground
conductors includes at least three contact regions to couple to the
ground reference of the substrate..Iaddend.
.Iadd.42. The electrical connector of claim 38 wherein the contact
regions of the signal conductors and the contact regions of the
ground conductors each extend into the slots of the connector
housing to contact counterpart contact regions of the removable
electronic components when the removable electronic components are
inserted into the slots of the connector housing..Iaddend.
.Iadd.43. A signaling system comprising: a substrate including a
first plurality of signal conducting traces and a second plurality
of signal conducting traces; a socket mounted to the substrate and
including a housing with slots formed therein, the socket further
including a plurality of signal conductors that extend through the
housing in a direction transverse to the slots, each signal
conductor of the plurality of signal conductors having a
predetermined impedance and being coupled to form a transmission
line between a respective one of the first plurality of signal
conducting traces on the substrate and a respective one of the
second plurality of signal conducting traces on the substrate, and
wherein the plurality of signal conductors include a group of
signaling lines that are interleaved with a group of ground lines,
each ground line of the group of ground lines including a plurality
of electrical contact elements electrically coupled to a ground
plane; and a plurality of electronic components removably inserted
into the slots of the socket housing, each of the electronic
components including a plurality of contact regions that
respectively contact the plurality of signal
conductors..Iaddend.
.Iadd.44. The signaling system of claim 43 wherein each of the
plurality of electronic components comprises a printed circuit
board having an integrated circuit device mounted
thereon..Iaddend.
.Iadd.45. The signaling system of claim 44 wherein the integrated
circuit device is a semiconductor memory device..Iaddend.
.Iadd.46. The signaling system of claim 45 wherein the
semiconductor memory device is a dynamic random access memory
device..Iaddend.
.Iadd.47. The signaling system of claim 45 further comprising a
memory controller mounted to the substrate and coupled to the first
plurality of signal conducting traces, the memory controller being
adapted to transmit signals to the semiconductor memory device via
the first plurality of signal conducting traces..Iaddend.
.Iadd.48. The signaling system of claim 43 wherein each of the
electronic components comprises an integrated circuit
device..Iaddend.
.Iadd.49. The signaling system of claim 48 wherein the integrated
circuit device is a semiconductor memory device..Iaddend.
.Iadd.50. The signaling system of claim 49 wherein the
semiconductor memory device is a dynamic random access memory
device..Iaddend.
.Iadd.51. The signaling system of claim 49 further comprising a
memory controller mounted to the substrate and coupled to the first
plurality of signal conducting traces, the memory controller being
adapted to transmit signals to the semiconductor memory device via
the first plurality of signal conducting traces..Iaddend.
.Iadd.52. The signaling system of claim 43 further comprising a
plurality of termination elements coupled respectively to the
second plurality of signal conducting traces..Iaddend.
.Iadd.53. The signaling system of claim 43 wherein each ground line
of the group of ground lines includes a plurality of contact
regions to contact the plurality of electronic
components..Iaddend.
.Iadd.54. The signaling system of claim 53 wherein each ground line
of the group of ground lines is disposed within the housing
adjacent at least one of the signaling lines of the group of
signaling lines, each ground line of the group of ground lines and
each signaling line of the group of signaling lines forming a
plurality of signal-ground conductor pairs..Iaddend.
.Iadd.55. The signaling system of claim 54 wherein each of the
signal-ground conductor pairs contacts a first electrical component
of the plurality of electrical components on opposing faces of the
first electrical component..Iaddend.
.Iadd.56. The signaling system of claim 55 wherein each of the
signal-ground conductor pairs are disposed within the socket
housing such that the plurality of signal conductors alternately
contact a first face and a second face of the opposing faces of the
first component..Iaddend.
.Iadd.57. The signaling system of claim 56 wherein each of the
signal-ground conductor pairs are disposed within the socket
housing such that the plurality of ground conductors alternately
contact the first face and the second face of the opposing faces of
the first component..Iaddend.
Description
FIELD OF THE INVENTION
The present invention relates to electrical interconnects and, in
particular, connectors for use in high speed electrical
interfaces.
BACKGROUND
In general, electrical connectors consist of two components, a
receptacle and a plug. The receptacle is the compliant part of the
connector. That is, the receptacle is fashioned in such a way that
it provides compliance (or "springiness"), either through the use
of a springy metal such as a Beryllium-Copper (Be--Cu) alloy or
some other means. The plug then forms the non-compliant part of the
connector.
Connectors are used in a variety of applications where electrical
coupling between components, e.g., integrated circuits, circuit
boards, etc., is desired. However, connectors for high speed
interfaces are required to present controlled impedance
interconnections. The interface between a Rambus DRAM (RDRAM.RTM.)
and a Rambus Channel is an example of a high speed interface that
requires a connector having particular electrical and physical
characteristics.
Since the early 1970s, the essential characteristics of a DRAM
interface have remained as a separate data bus and a multiplexed
address bus. However, a recent architecture pioneered by Rambus,
Inc. provides a new, high bandwidth DRAM interface. Originally, the
Rambus Channel, the heart of the new DRAM interface, comprised a
byte wide, 500 or 533 Mbytes/sec. bi-directional bus connecting a
memory controller with a collection of RDRAMs.RTM.. Among the many
innovative features of the Rambus Channel and of the RDRAM.RTM. is
the use of vertically or horizontally mounted RDRAMs.RTM. and a
physically constrained, bi-directional bus using terminated
surface-trace transmission lines on a circuit board. The physical
and electrical properties of both the RDRAMs.RTM. and bus on which
they are placed are rigidly defined because high frequency
operation relies on the careful physical design of both the printed
circuit board and the high speed components. Originally,
RDRAMs.RTM. were specified to include a 32-pin package, either a
surface horizontal package (SHP) or a surface vertical package
(SVP).
Electrical connectors of the past have generally been unsuitable
for use in high speed bus applications such as may be found with
the Rambus Channel. For example, as shown in FIG. 1, electrical
connectors of the past have employed compliant contact elements 2
to receive semiconductor devices and/or circuit boards to provide
electrical coupling to a circuit on a substrate 4 (e.g., a
motherboard). The electrical connectors may be contained within
housings 6 adapted to receive the semiconductor device or circuit
board and are electrically coupled to circuit elements on the
motherboard through a solder connection 8. Such a connector thus
requires a number of surface mount contacts (e.g., solder contacts
8) between the contact elements 2 and the substrate 4.
Such a connector is not suitable for use in a high speed electrical
bus because the contact elements 2 are individually soldered to
circuit elements (e.g., electrical traces) on the substrate 4, and
because the resulting solder joints 8 are generally not accessible
for inspection and repair. High speed bus design dictates that the
electrical signal path from device to device be kept at a minimum.
Further, electrical contacts on each device should be concentrated
into a small area. Together, these requirements lead to a high
density area array of separable contacts, whose corresponding
solder joints are made inaccessible due to interference from
adjacent contacts and/or the contact housing. Except for special
"ball grid array" soldering techniques, surface mount solder joints
are generally required to be accessible for inspection and repair.
Because connectors such as that illustrated in FIG. 1 are incapable
of meeting these requirements, they are unsuitable for use in high
speed bus applications.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide means for
electrically coupling a number of substantially similar electrical
devices in a substantially bus-like arrangement.
It is a further object of the present invention to provide an
electrical connector for use in high speed applications.
A socket is described. The socket may include a first conductor
having two or more contact regions and a second conductor arranged
substantially parallel to the first conductor and having two or
more contact regions. The first and second conductors are spaced
relative to one another so as to provide a predetermined electrical
impedance. A dielectric spacer may be disposed between the first
and second conductors to provide the spacing. Contact regions of
the first and second conductors may provide compliant coupling
regions for the socket. The first conductor may be further adapted
to be coupled to a substrate through only two electrical contact
elements over its length, regardless of the number of contact
regions of the first conductor. In addition, the second conductor
may be further adapted to be coupled to the substrate through a
number of electrical contact elements disposed along its length,
the number of contact elements being independent of the number of
contact regions of the second conductor.
Further described is an electrical connector that includes a socket
and a number of conductors disposed therein. The conductors are
arranged to carry electrical signals as transmission lines, and are
further arranged into a first group of conductors, each adapted to
be coupled to a substrate at only two electrical contact elements,
and a second group of conductors each adapted to be coupled to the
substrate at a plurality of electrical contact elements. The
conductors may each include compliant contact regions, each
arranged such that the contact regions of a first of the conductors
are positioned within the socket so as to contact a lead disposed
on a first side of a circuit element and the contact regions of a
second of the conductors are positioned within the socket so as to
contact a lead disposed on a second side of the circuit element. A
dielectric spacer may be disposed between the first and second
conductors.
Also described is a circuit board that includes a compliant
electrical connector having a plurality of conductors arranged into
a first group of conductors each adapted to be coupled to a
substrate at only two electrical contact elements and a second
group of conductors each adapted to be coupled to the substrate at
a plurality of electrical contact elements. The circuit board
further includes an electrical channel, which may include a number
of traces, coupled to the connector. Each of the electrical
conductors may further include two or more contact regions, the
number of contact regions of each conductor being independent of
the number of electrical contact elements of a respective
conductor.
In addition, a connector that includes a first electrical signal
path configured to provide a bus-like interconnection between
similar electrical couplings of two or more electrical components,
the bus-like interconnection adapted to be isolated from a circuit
board except for two electrical contact elements disposed near
opposite ends of said first electrical signal path; the connector
also including a ground signal path, is described. The ground
signal path may be configured as a second electrical signal path
arranged to provide a bus-like interconnection between similar
electrical couplings of said two or more electrical components.
Further, the ground signal path may be adapted to be electrically
coupled to a ground plane of the circuit board at a plurality of
points along said bus-like interconnection. The first electrical
signal path generally includes an electrical conductor having
compliant contact regions, which may include elastomer-backed metal
regions or may be made of a Beryllium-Copper (Be--Cu) alloy.
Additionally described is a socket that includes a conductive
signal bar having two or more contact regions, each adapted to
couple to a contact region on a respective electrical device, the
signal bar further adapted to be electrically coupled to a circuit
board through only two electrical contact elements regardless of
the number of contact regions of said signal bar. The socket also
includes a conductive ground bar arranged substantially parallel to
said signal bar and having two or more contact regions, each
adapted to couple to a contact region on said respective electrical
devices, and further being adapted to be electrically coupled to a
conductive reference region of the circuit board at a number of
electrical contact elements, the number of electrical contact
elements being independent of the number of contact regions of the
ground bar.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example, and not
limitation, in the Figures of the accompanying drawings, in
which:
FIG. 1 illustrates a conventional electrical connector requiring an
independent surface mount contact;
FIG. 2 illustrates a printed circuit board with a socket configured
in accordance with one embodiment of the present invention;
FIG. 3A illustrates a cross-sectional view of the printed circuit
board shown in FIG. 1 and includes features of the socket shown in
FIG. 1 according to one embodiment of the present invention;
FIG. 3B illustrates a cross-sectional view of a bus conductor
adapted to carry a ground signal in accordance with an embodiment
of the present invention;
FIG. 4 illustrates one means of providing a desired spacing for
electrical conductors within a socket according to one embodiment
of the present invention;
FIG. 5 illustrates an electrical channel according to a further
embodiment of the present invention;
FIG. 6A illustrates an alternative conductor with contact regions
for use according to a further embodiment of the present
invention;
FIG. 6B illustrates the conductor of FIG. 5A with contact regions
bent to provide desired electrical characteristics in accordance
with a further embodiment of the present invention;
FIG. 7 illustrates one embodiment of a Daughter card for use with a
socket configured according to one embodiment of the present
invention;
FIG. 8 illustrates a pair of conductors with contact regions
arranged in accordance with an alternative embodiment
invention;
FIG. 9 illustrates how the conductors shown in FIG. 7 provide some
mechanical support for an integrated circuit component in
accordance with one embodiment of the present invention;
FIG. 10 illustrates a further embodiment of a transmission line
socket configured in accordance with yet another embodiment of the
present invention; and
FIG. 11 illustrates a cut-away side-view of the transmission line
socket in FIG. 10.
DETAILED DESCRIPTION
Described herein is a socket which includes a first conductor
having two or more contact regions and second conductor arranged
substantially parallel to the first conductor and also having two
or more contact regions. The first and second conductors are spaced
relative to one another so as to provide a predetermined electrical
impedance. For one embodiment, a dielectric spacer may be disposed
between the first and second conductors to provide the spacing.
Embodiments of the present invention may find particular use as a
socket for accepting integrated circuit (IC) devices, e.g., memory
devices such as RDRAMs.RTM., or circuit boards which operate at
high frequency. High frequency operation requires careful physical
design and a robust electrical interface, both of which are
provided by the present invention.
Because the Rambus channel operates at very high frequency with
only limited voltage swings between logic levels, any new connector
system requires not only a careful physical design but a robust
electrical interface. Thus, embodiments of the present invention
provide the physical and electrical properties needed to maintain
signal integrity on the Rambus channel. At the same time,
embodiments of the present invention provide a more manufacturable
solution when compared with other means of coupling RDRAMs.RTM. to
a printed circuit board. Of course, further embodiments of the
present invention may also find application wherever a
semiconductor device is to be coupled to a substrate (e.g., a
motherboard) across a high speed electrical interface.
As shown in FIG. 2, a printed circuit board (PC board) 10 may
include an application specific integrated circuit (ASIC) or other
processing device 12. ASIC 12 may be mounted to PC board 10 using
any of number of conventional integrated circuit mounting
techniques. For some embodiments, ASIC 12 may be soldered directly
to traces on PC board 10. Also mechanically affixed to PC board 10
is a socket 14 configured in accordance with one embodiment of the
present invention. Socket 14 may be adapted to accept an RDRAM.RTM.
or other Daughter card 16. Socket 14, in addition to providing a
mechanical coupling for Daughter card 16, provides a electrical
interface between Daughter card 16 and channel 18. Channel 18
includes a number of metal traces laid out on printed circuit board
10 using conventional printed circuit board fabrication techniques
and may be configured in accordance with the Rambus Channel
physical and/or electrical specifications or other high speed
electrical interface requirements.
In general, printed circuit board 10 may include a number of
sockets 14. Each socket 14 may be adapted to accommodate two or
more Daughter cards 16. Within each socket 14, means of
electrically coupling a number of Daughter cards 16 in a
substantially bus-like arrangement are provided. In this context,
coupling means that there is a separable electrical contact between
each Daughter card 16 and the bus. The term bus, as used herein,
refers to the interconnect being such that each device (i.e., each
Daughter card 16) has an identical (or nearly identical) pinout
layout and substantially similar physical dimensions. For example,
socket 14 is configured so that each pin "n" of each device
contained within socket 14 is connected together. There may be
additional electrical connections other than the bus connections,
however, the remainder of this description will be directed to the
bus-like connections within socket 14.
It is important to recognize that the bus within socket 14 operates
at high frequency. That is, the edge rate of the signals present on
the electrical connections is comparable to the propagation delay
along at least one of the possible signal paths. In general, these
connections are referred to as transmission lines.
Proper signaling on transmission lines depends on proper
termination, which is commonly performed with resistors. The
resistors are selected to have values which match the
characteristic impedance of the transmission lines. Therefore, it
becomes necessary for the bus to have a known impedance.
Accordingly, the electrical conductors which make up the bus-like
connection for socket 14 provide a predetermined electrical
impedance.
The bus impedance is, in general, determined by the "unloaded"
impedance (i.e., the impedance when no Daughter cards 16 are
present) as well as the effect of device loading. In general, all
of the relevant pin connections of each of the devices to be
inserted in socket 14 have substantially similar loading effects
(typically this may be primarily input capacitance). Therefore, the
remaining parameter to be controlled is the "unloaded" impedance of
the bus connector mechanism. As discussed further below, it is this
impedance which is the predetermined impedance provided by the
electrical coupling means within socket 14.
FIG. 3A illustrates a cross sectional view of printed circuit board
10. Socket 14 is illustrated in dotted outline as is a Daughter
card 16. Notice that Daughter card 16 is accommodated in slots
within socket 14. The slots provide mechanical coupling and/or
support for Daughter card 16 although in other embodiments other
mechanical coupling and/or support means may be used. Along printed
circuit board 10 is a metal trace 20. Trace 20 forms part of
channel 18.
Within socket 14 is a plate 22. Plate 22 is made of metal and is
used as a signal conductor for electrical signals transmitted
between ASIC 12 and Daughter card 16 along trace 20 of channel 18.
As shown, plate 22 includes a number of contact regions 24, contact
regions 24 provide an electrical coupling between the associated
contact regions where pins of Daughter card 16 and plate 22 touch.
In this way, an electrical (i.e., signal) connection is provided
from ASIC 12, along trace 20, to plate 22 and contact region 24 to
Daughter card 16.
Also provided within socket 14 is an elastomer 26 which is disposed
underneath contact region 24. Elastomer 26 provides compliance so
that irregularities in plate 22 and/or Daughter card 16 are
accounted for. That is, the elastomer 26 provides a springiness so
that when Daughter card 16 is inserted in socket 14, contact
regions 24 are not broken (e.g., as may occur if the contact
regions 24 and/or the plates 22 are fabricated from a relatively
stiff material such as a Phosphor-Bronze alloy). In addition, the
springiness provided by elastomer 26 helps to support contact
regions 24 against corresponding contact regions or pins on
Daughter card 16 to maintain a good electrical connection. In this
way, proper electrical coupling is provided. Preferably, elastomer
26 is fabricated from a dielectric material so that proper
electrical isolation is maintained if a single elastomer 26 runs
through more than one contact region/plate junction.
The multiple contact regions 24 of plate 22 will allow coupling
between similar pins of similar Daughter card 16. In this way, the
bus-like architecture described above is achieved. A termination
network 28 may be provided at the end of the bus for impedance
matching.
Plate 22 may be electrically coupled to trace 20 though soldered
connections 30 which form electrical contact elements. Other
electrical coupling means may also be used. Plate 22 may have one
or more associated posts 32 which may fit into associated holes 34
in PC board 10. In this way, mechanical stability for plate 22 is
provided. Plate 22 has only two electrical contact elements (e.g.,
solder connections 30) to couple to PC board 10 regardless of the
number of contact regions 24 disposed along its length. The contact
elements may correspond to posts 32 or may be other contact
elements.
Preferably, plates such as plate 22 which are signal (and not
ground) conductors are electrically coupled to metal traces 20 only
at the ends of plate 22. This is important so that only plate 22
acts as a signal carrying bus through socket 14. The reason for
isolating the signal carrying buses from the PC board 10 in this
fashion is to ensure that the impedance of the signal carrying bus
with respect to the ground busses is determinable. If the signal
carrying busses were soldered to the printed circuit board at
various points throughout the length of the bus (e.g., plate 22)
there would be no guarantee that all the solder connections were
made or that the connections were fabricated in the same fashion
and so the impedance of the signal bus could not be determined with
high accuracy.
In contrast, where plates 22 are used as ground (and not signal)
conductors, the plates 22 are preferably "stitched" or redundantly
connected (e.g., by solder connections) to the ground system of the
printed circuit board 10 by means of electrical contacts at variety
of intervals along the length of the plate 22. For example, for a
plate 22 which is used as a ground bus bar, the plate may have a
number of metal posts 32 at regularly spaced intervals along its
length, each being soldered to a ground trace or other reference
plane on PC board 10. Thus, the signal bus bars and the ground bus
bars (each of which may be fabricated as metal plates 22) are
physical opposites in that the signal bus bars are isolated from
the printed circuit board 10 over their signal carrying lengths
while the ground bus bars are intimately connected to the printed
circuit board 10 reference plane over their lengths.
FIG. 3B illustrates the ground contact design described above. A
plate 22 which is adapted to carry an electrical ground within
socket 14 (shown in dotted outline) has electrical contact
elements, e.g., solder connections 30, at either end and also has
several posts 32 which act as further electrical contact elements
coupled to a ground plane 35 at corresponding thru-hole connections
37 along the length of plate 22. The thru-hole connections 37
provide additional protection against excessive ground bounce and
further provide mechanical stability for plate 22. Note that the
number of electrical connections between plate 22 and ground plane
35 depends only on the number of electrical contact elements, such
as solder connections 30 and thru-hole connections 37, and not on
the number of contact regions 24 disposed along the length of plate
22. Notice also that, for this embodiment, contact regions 24
provide mechanical support for Daughter cards 16 in place of (or in
addition to) slots in socket 14.
A number of plates 22, disposed substantially parallel to one
another, will be provided within socket 14 to connect like pins of
various Daughter cards 16. The spacing of plates 22 is controlled
so as to provide the required unloaded electrical impedance to
ensure proper operation at high frequency. FIG. 4 illustrates in
more detail one means of providing the proper spacing and
electrical coupling between plates. As shown, a first plate 22a and
second plate 22b may be separated by a dielectric spacer 36. Each
of the plates 22a and 22b may be bonded to the dielectric spacer 36
and pressed together so as to achieve the desired spacing between
elements. Elastomer 26 is provided between contact regions 24 and
the remainder of the plate 26 to provide compliance as described
above. In other embodiments, the electrical properties provided by
dielectric spacer 36 may be achieved by using an air gap between
plates 22a and 22b.
In order to provide proper signal integrity, channel 18 and, hence,
plates 22 within socket 14, is/are organized so that cross-talk
between signal lines is reduced or eliminated. This may be
achieved, in one embodiment, as illustrated in FIG. 5. As shown,
the traces 20 on printed circuit board 10 which make up channel 18
are arranged in pairs of signal lines (S) and ground (AC) lines
(G). That is, the traces 20 are arranged as signal, signal; ground,
ground; signal, signal, etc. and are spaced at a desired distance
"d" to achieve desired electrical characteristics (e.g., a desired
impedance). The conductors within socket 14 carry the respective
signals or grounds from channel 18.
FIG. 6A illustrates an alternative embodiment for the electrical
conductors within socket 14. En this case, plates 22 have been
replaced with conductors 40. Conductors 40 include contact regions
42 which are formed as taps or fingers. In general, conductors 40
may be stamped from metal and may lie flat along the bottom of
socket 14. Appropriate electrical connection between traces 20 and
conductors 40 is provided (e.g., using a solder connection). As
shown in FIG. 6B, contact regions 42 are bent so as to form contact
pads 46. Contact pads 46 may then provide electrical coupling
between corresponding contact regions or pins on Daughter card 16
and conductor 40.
FIG. 7 illustrates in more detail a Daughter card 16. As shown,
Daughter card 16 comprises an integrated circuit (IC) component 50,
for example a DRAM chip, and a plurality of leads 52. Leads 52
extend from IC component 50 in a fan out pattern to one edge of
Daughter card 16. The leads 52 may be metal traces on a suitable
flexible material overlaid over a rigid support member, e.g., a
metal plate. In general, leads 52 may be present on both sides of
Daughter card 16 and may terminate in larger contact pads or
pins.
For the situation where leads are present on both sides of Daughter
card 16, an alternative electrical connection within socket 14 may
be provided using conductors 60a and 60b as illustrated in FIG. 8.
Conductors 60a and 60b may be formed as metal plates as for the
embodiment illustrated in FIG. 3 or as essentially flat conductors
as for the embodiment shown in FIG. 6A. Contact regions 62a and 62b
are formed using tabs or fingers similar to the embodiment
illustrated in FIGS. 6A and 6B. As shown, conductor 60a may used
for a ground signal and conductor 60b may used as a signal carrying
conductor, for example, where traces 20 (not shown) are arranged as
signal, signal; ground, ground; etc. as discussed above.
In one embodiment, conductors 60a and 60b may be disposed within
socket 14 so that contact region 62a makes contact with a pin or
lead on one side of Daughter card 16 while conductor 62b makes
contact with a pin or lead (or other contact region) on the
opposite side of Daughter card 16. This arrangement is illustrated
in FIG. 9. Such an arrangement provides additional mechanical
support for Daughter card 16 within socket 14.
FIG. 10 illustrates a top view of a further embodiment of a
transmission line socket 70 in accordance with yet another
embodiment of the present invention. Socket 70 is illustrated as a
four-site socket with three signal lines 72, however, this is for
purposes of example only and the present invention is applicable to
a single or multiple-site socket having a plurality of signal
lines. Plug-in devices (e.g., Daughter cards 16) may be accepted
within any of the slots 74 and the electrical conductors 72 and 76
are arranged so that the plug-in devices are contacted by the
conductors on both the front and back sides, thereby reducing the
effective signal spacing on the plug-in device and easing
associated mechanical tolerance requirements. Electrical conductors
72 and 76 are configured as bus bar transmission lines with solder
connections at either end of socket 70.
In this embodiment, the electrical signals within socket 70 are
ordered as signal, ground, signal, etc. Such a distribution aids in
achieving uniform impedance and minimal crosstalk, however, it is
necessary that this same signal distribution pattern be maintained
not only between the conductors 72 and 76, but also between contact
areas on the plug-in devices. If the electrical contact areas of
the conductors 72 and 76 were arranged so as to alternate
connections between the front and back sides of a plug-in device,
all the signal connections (from conductors 72) would end up on one
side of the plug-in device while all the ground connections (form
conductors 76) would end up on the other side. This would yield
poor electrical qualities because the inductive loop area would be
increased, resulting in greater contact inductance.
This problem is solved in this embodiment by forming the contact
regions of the conductors 72 and 76 so that each row of contacts is
bent such that the point where the contact touches the plug-in
device is off-set by one-half of the pitch (i.e., the distance
between contact regions or pins on the plug-in device). That is,
each pair of adjacent signal and ground conductors, 72 and 76, have
respective contact regions bent towards one another in a vertical
plane. The result is illustrated in FIG. 11 which depicts a
cut-away side-view of socket 70, The effect of this forming pattern
is that both sides of the plug-in device will contact in a signal,
ground, signal, etc. pattern, which maintains good signal isolation
and inductance characteristics. The impedance of the transmission
line socket 70 may be selected by varying the width, thickness and
spacing of the conductors 72 and 76, as well as the ratio of socket
body material to air gap spacing separating the conductors.
To provide compliance, contact regions 62a and 62b (and conductors
60a and 60b, if desired) of FIG. 8 and/or conductors 72 and 76 of
FIG. 10 may be made from a springy metal such as a Beryllium-Copper
(Be--Cu) alloy or another metal. Alternatively, the contact regions
may be elastomer-backed metal regions as discussed with reference
to FIG. 3. In such a case, the elastomer may be supported by a wall
or other region of socket 14. In other embodiments, socket 14 may
be a plug (i.e., a non-compliant component of the coupling system)
and a compliant coupling region may be provided on Daughter card
14.
Embodiments of the present invention avoid the one-to-one
correspondence between the number of contact regions and contact
elements which were found in connectors of the past. The one-to-one
correspondence of contact regions to contact elements which
characterized previous connectors lead to a very high density of
contact elements to the substrate (i.e., the printed circuit
board). This, in turn, lead to a device which was not readily
manufacturable because there was no way to guarantee good
connections between the contact elements and the substrate. By
avoiding the one-to-one correspondence between contact elements and
contact regions, these embodiments of the present invention reduce
the density of the connections to the substrate, thereby achieving
a more manufacturable device.
In the foregoing specification, the invention has been described
with reference to specific exemplary embodiments thereof. It will,
however, be evident that various modifications and changes may be
made thereto without departing from the broader spirit and scope of
the invention as set forth in the appended claims. For example,
although RDRAMs.RTM. have been referred to in this application,
other types of devices are contemplated, including other DRAMs,
integrated circuits, memories, circuit boards, and other components
requiring an electrical connection to a substrate. The
specification and drawings are, accordingly, to be regarded in an
illustrative rather than a restrictive sense.
* * * * *