U.S. patent number D956,707 [Application Number D/729,267] was granted by the patent office on 2022-07-05 for circuit board. This patent grant is currently assigned to LAPIS SEMICONDUCTOR CO., LTD.. The grantee listed for this patent is LAPIS Semiconductor Co., Ltd.. Invention is credited to Shigeki Yamauchi.
United States Patent | D956,707 |
Yamauchi | July 5, 2022 |
Inventors: | Yamauchi; Shigeki (Yokohama, JP) | ||||||||||
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Applicant: |
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Assignee: | LAPIS SEMICONDUCTOR CO., LTD.
(Yokohama, JP) |
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Appl. No.: | D/729,267 | ||||||||||
Filed: | March 25, 2020 |
Sep 26, 2019 [JP] | 2019-21604 | |||
Sep 26, 2019 [JP] | 2019-21605 | |||
Sep 26, 2019 [JP] | 2019-21606 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;361/748,752,760,761,807,808,736,719,720 ;174/250,253,255,68.1 ;363/144,147 |
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Japanese Office Action dated May 12, 2020, for related Japanese Appln. No. 2019-021606 4 Pages. cited by applicant. |
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