U.S. patent number D459,706 [Application Number D/145,538] was granted by the patent office on 2002-07-02 for hybrid integrated circuit device.
This patent grant is currently assigned to Taiyo Yuden Co., Ltd.. Invention is credited to Hitoshi Ebihara, Tomohiro Igarashi, Tetsuya Ito, Hideki Kato, Naoki Tomaru, Yoshiyuki Wasada, Hideki Yoda.
United States Patent |
D459,706 |
Ebihara , et al. |
July 2, 2002 |
Hybrid integrated circuit device
Claims
The ornamental design for a hybrid integrated circuit device, as
shown and described.
Inventors: |
Ebihara; Hitoshi (Tokyo,
JP), Tomaru; Naoki (Tokyo, JP), Wasada;
Yoshiyuki (Tokyo, JP), Ito; Tetsuya (Tokyo,
JP), Kato; Hideki (Tokyo, JP), Igarashi;
Tomohiro (Tokyo, JP), Yoda; Hideki (Tokyo,
JP) |
Assignee: |
Taiyo Yuden Co., Ltd. (Tokyo,
JP)
|
Appl.
No.: |
D/145,538 |
Filed: |
July 26, 2001 |
Foreign Application Priority Data
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Apr 27, 2001 [JP] |
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2001-016231 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,123,133,180,184,199 ;D10/46,75 ;29/829-932,846
;174/250-251,253-255,260-261,268 ;216/13 ;292/314
;316/718,748,752-753,760,783-784,820 ;411/500 ;428/901 ;470/27 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Shooman; Ted
Assistant Examiner: Bui; Daniel
Attorney, Agent or Firm: Bacon & Thomas
Description
FIG. 1 is a perspective view of a hybrid integrated circuit device
showing an embodiment of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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