Headphone
He January 4, 2
U.S. patent number D940,107 [Application Number D/717,872] was granted by the patent office on 2022-01-04 for headphone. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Yanyao He.
| United States Patent | D940,107 |
| He | January 4, 2022 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and described.
| Inventors: | He; Yanyao (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Harman International Industries,
Incorporated (Northridge, CA) |
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| Appl. No.: | D/717,872 | ||||||||||
| Filed: | December 19, 2019 |
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/223,205 ;D24/174 ;128/864,865,866 ;D13/108 ;381/380,381 ;455/90.3,575.1,569.1 |
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Other References
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Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is a perspective view of a headphone showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view of another embodiment of the headphone, illustrating a mirror image of the headphone of FIGS. 1-7;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof;
FIG. 11 is a side elevational view thereof;
FIG. 12 is an opposite side elevational view thereof;
FIG. 13 is a top view thereof; and,
FIG. 14 is a bottom view thereof.
The broken lines illustrate portions of the headphone that form no part of the claimed design.
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