Earphone

Description

FIG. 1 is a front elevational view of an earphone showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a bottom and rear side perspective view thereof; and,

FIG. 8 is a top, front and left side perspective view thereof.

The broken lines shown in FIGS. 1, 2 and 4-8 illustrate portions of the earphone that form no part of the claimed design.

Claims

CLAIM The ornamental design for an earphone, as shown and described.

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Inventors:	Li; Yongli (Shenzhen, CN)
Applicant:	Name City State Country Type SHENZHEN SHI KISB ELECTRONIC CO., LTD. Shenzhen N/A CN
Appl. No.:	D/700,618
Filed:	August 3, 2019

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Foreign Application Priority Data

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Jun 6, 2019 [CN]			2019 3 0292247

Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/223,205,206 ;D24/174 ;128/864,865,866 ;181/129,130,135 ;379/430,431 ;381/380,381,322-324,330 ;455/90.3,575,1,569.1

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References Cited [Referenced By]

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U.S. Patent Documents

D687021	July 2013	Yuen
D773439	December 2016	Walker
10104487	October 2018	Kingscott
D845932	April 2019	Lu
D847126	April 2019	Loermann
10455313	October 2019	Boesen
D868752	December 2019	Zhu
10582328	March 2020	Milevski
10587943	March 2020	Boesen
10598506	March 2020	Ilse
D883958	May 2020	Liu
D893461	August 2020	Gu
D895580	September 2020	Yu

Primary Examiner: Stofko; Katie Jane
Attorney, Agent or Firm: W&K IP

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