Ion shield plate base for semiconductor manufacturing apparatus

Kouzuma , et al. July 13, 2

Patent Grant D924824

U.S. patent number D924,824 [Application Number D/677,728] was granted by the patent office on 2021-07-13 for ion shield plate base for semiconductor manufacturing apparatus. This patent grant is currently assigned to Hitachi High-Tech Corporation. The grantee listed for this patent is Hitachi High-Tech Corporation. Invention is credited to Kazuyuki Hirozane, Michiaki Kobayashi, Yutaka Kouzuma, Yoshifumi Ogawa.


United States Patent D924,824
Kouzuma ,   et al. July 13, 2021

Ion shield plate base for semiconductor manufacturing apparatus

Claims

CLAIM The ornamental design for an ion shield plate base for semiconductor manufacturing apparatus, as shown and described.
Inventors: Kouzuma; Yutaka (Tokyo, JP), Hirozane; Kazuyuki (Tokyo, JP), Kobayashi; Michiaki (Tokyo, JP), Ogawa; Yoshifumi (Tokyo, JP)
Applicant:
Name City State Country Type

Hitachi High-Tech Corporation

Tokyo

N/A

JP
Assignee: Hitachi High-Tech Corporation (Tokyo, JP)
Appl. No.: D/677,728
Filed: January 23, 2019

Foreign Application Priority Data

Jul 24, 2018 [JP] 2018-016189
Current U.S. Class: D13/184; D26/138; D13/182
Current International Class: 1303
Field of Search: ;D13/182,184,199 ;D26/72,74,36 ;D9/435,445,454 ;D15/126,144.1 ;250/496.1,489,492.1,492.2,492.21,506.1,515.1,423R,424

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Other References

US. Appl. No. 29/677,753, filed Jan. 23, 2019. cited by applicant .
U.S. Appl. No. 29/677,764, filed Jan. 23, 2019. cited by applicant .
Notice of Allowance issued in related U.S. Appl. No. 29/677,753, dated Jun. 26, 2020 (11 pages). cited by applicant .
Notice of Allowance issued in related U.S. Appl. No. 29/677,764, dated Jun. 26, 2020. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Crowell & Moring LLP

Description



FIG. 1 is a front, top and right side perspective view of an ion shield plate base for semiconductor manufacturing apparatus, showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 7;

FIG. 10 is an enlarged view of the portion shown in box, labeled, "FIG. 10," in FIG. 9; and,

FIG. 11 is an enlarged view of the portion shown in box, labeled, "FIG. 11," in FIG. 9.

The broken line boxes shown in FIG. 9 define the enlarged portion views shown in FIGS. 10 and 11 and form no part of the claimed design.

* * * * *


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