Headphone
Meyer , et al. April 13, 2
U.S. patent number D916,048 [Application Number D/703,432] was granted by the patent office on 2021-04-13 for headphone. This patent grant is currently assigned to Harman International Industries, Incorporated. The grantee listed for this patent is Harman International Industries, Incorporated. Invention is credited to Axel Lorsold, Chenxi Lu, Anna Grace Meyer.
| United States Patent | D916,048 |
| Meyer , et al. | April 13, 2021 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and described.
| Inventors: | Meyer; Anna Grace (Hannibal, MO), Lu; Chenxi (Shenzhen, CN), Lorsold; Axel (Shenzhen, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Harman International Industries,
Incorporated (Northridge, CA) |
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| Appl. No.: | D/703,432 | ||||||||||
| Filed: | August 27, 2019 |
| Current U.S. Class: | D14/206; D14/226 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/206,225,226,205,188,192 ;D29/112 ;2/209 ;381/380,381,374 ;455/90.3,575.1,569.1 |
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Other References
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JBL Synchros S500 Spec Sheet dated 2013. cited by applicant . Design U.S. Appl. No. 29/631,227, filed Dec. 28, 2017. cited by applicant . Design U.S. Appl. No. 29/661,343, filed Aug. 27, 2018. cited by applicant . Design U.S. Appl. No. 29/661,346, filed Aug. 27, 2018. cited by applicant . Design U.S. Appl. No. 29/661,389, filed Aug. 27, 2018. cited by applicant . Design U.S. Appl. No. 29/675,542, filed Jan. 3, 2019. cited by applicant . Design U.S. Appl. No. 29/688,598, filed Apr. 23, 2019. cited by applicant . Design U.S. Appl. No. 29/703,423, filed Aug. 27, 2019. cited by applicant . Design U.S. Appl. No. 29/703,425, filed Aug. 27, 2019. cited by applicant . Design U.S. Appl. No. 29/703,437, filed Aug. 27, 2019. cited by applicant . Office Action dated Jul. 15, 2020 in Design U.S. Appl. No. 29/688,598. cited by applicant . Office Action dated Sep. 29, 2020 in Design U.S. Appl. No. 29/703,425. cited by applicant. |
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Plumsea Law Group, LLC
Description
FIG. 1 is a perspective view of a headphone showing the new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is an opposite side elevational view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines in the figures illustrate portions of the design that form no part of the claimed design.
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