Earphone
Adams , et al. February 2, 2
U.S. patent number D909,336 [Application Number D/694,437] was granted by the patent office on 2021-02-02 for earphone. The grantee listed for this patent is Dragon Summit Group Inc.. Invention is credited to William Adams, Yu Ai, Chee Wei Jaren Goh.
| United States Patent | D909,336 |
| Adams , et al. | February 2, 2021 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Adams; William (La, CA), Ai; Yu (Beijing, CN), Goh; Chee Wei Jaren (Singapore, SG) | ||||||||||
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| Applicant: |
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| Appl. No.: | D/694,437 | ||||||||||
| Filed: | June 11, 2019 |
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,223,218 ;D24/174 ;128/864,865,866 ;381/380,381 ;455/90.3,575.1,569.1 ;D11/90,127,134 ;63/26 |
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Attorney, Agent or Firm: HYIP
Description
FIG. 1 is a perspective view of an earphone showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a back view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is an enlarged view of the selected portion in FIG. 2.
The broken lines shown in the drawings depict portions of the earphone in which the design is embodied that form no part of the claimed design.
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