Wireless earphone
Wu , et al. November 16, 2
U.S. patent number D627,337 [Application Number D/353,516] was granted by the patent office on 2010-11-16 for wireless earphone. This patent grant is currently assigned to FIH (Hong Kong) Limited. Invention is credited to Li-Wen Tien, Kun-Tsan Wu.
| United States Patent | D627,337 |
| Wu , et al. | November 16, 2010 |
Wireless earphone
Claims
CLAIM The ornamental design for a wireless earphone, as shown and described.
| Inventors: | Wu; Kun-Tsan (Taipei Hsien, TW), Tien; Li-Wen (Taipei Hsien, TW) |
|---|---|
| Assignee: | FIH (Hong Kong) Limited
(Kowloon, HK) |
| Appl. No.: | D/353,516 |
| Filed: | January 11, 2010 |
Foreign Application Priority Data
| Dec 23, 2009 [CN] | 2009 3 0330566 | |||
| Current U.S. Class: | D14/223 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,206,223,192 ;181/129,130,135,158 ;381/380,381,360,375,385,322 ;379/430,431 ;455/90.3,575.1,575.2 |
References Cited [Referenced By]
U.S. Patent Documents
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| 5812680 | September 1998 | Glendon |
| D481709 | November 2003 | Solderits |
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| 7356362 | April 2008 | Chang et al. |
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| D603380 | November 2009 | Hutchieson |
Attorney, Agent or Firm: Reiss; Steven M.
Description
FIG. 1 is a perspective view of a wireless earphone showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines are for illustrative purposes only and form no part of the claimed design.
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