U.S. patent number D893,450 [Application Number D/651,722] was granted by the patent office on 2020-08-18 for headphone.
This patent grant is currently assigned to Audio-Technica Corporation. The grantee listed for this patent is Audio-Technica Corporation. Invention is credited to Sayo Matsubara, Takaya Nagamine, Naoto Nakamura, Takashi Nara, Stefan Wennerstrom.
United States Patent |
D893,450 |
Matsubara , et al. |
August 18, 2020 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Matsubara; Sayo (Kanagawa,
JP), Nagamine; Takaya (Tokyo, JP),
Wennerstrom; Stefan (Stockholm, SE), Nakamura;
Naoto (Stockholm, SE), Nara; Takashi (Kanagawa,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Audio-Technica Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Audio-Technica Corporation
(Tokyo, JP)
|
Appl.
No.: |
D/651,722 |
Filed: |
February 4, 2019 |
Foreign Application Priority Data
|
|
|
|
|
May 15, 2018 [JP] |
|
|
2018-017831 |
|
Current U.S.
Class: |
D14/205 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,188,192
;D29/112 ;2/209 ;181/129,130,135 ;379/430,431
;381/380,381,374,370,371 ;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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305485203 |
|
Feb 2019 |
|
CN |
|
006253605-0001 |
|
Feb 2019 |
|
EM |
|
006253605-0002 |
|
Feb 2019 |
|
EM |
|
006383576-0004 |
|
Apr 2019 |
|
EM |
|
D1602513 |
|
Mar 2018 |
|
JP |
|
Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: W&C IP
Description
The patent or application file contains at least one drawing
executed in color. Copies of this patent or patent application
publication with color drawings will be provided by the Office upon
request and payment of the necessary fee.
FIG. 1 is a perspective view of a headphone showing the new
design;
FIG. 2 is a front elevational view of the headphone;
FIG. 3 is a rear elevational view of the headphone;
FIG. 4 is a top plan view of the headphone;
FIG. 5 is a bottom plan view of the headphone;
FIG. 6 is a left side elevational view of the headphone;
FIG. 7 is a right side elevational view of the headphone; and,
FIG. 8 is a front elevational view with the headphone in a rotated
position.
The broken lines and ghosted areas depict environment that forms no
part of the claimed design.
* * * * *