U.S. patent number D881,142 [Application Number 35/506,563] was granted by the patent office on 2020-04-14 for light emitting diode package. The grantee listed for this patent is SEOUL SEMICONDUCTOR CO., LTD.. Invention is credited to SeMin Bang, SeungRi Choi, MyungHee Lee.
United States Patent | D881,142 |
Choi , et al. | April 14, 2020 |
Inventors: | Choi; SeungRi (Ansan-si, KR), Bang; SeMin (Ansan-si, KR), Lee; MyungHee (Ansan-si, KR) | ||||||||||
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Applicant: |
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Appl. No.: | 35/506,563 | ||||||||||
Filed: | October 12, 2018 |
Int'l Reg. No. | Int'l Reg. Date | Int'l Reg. Publication Date |
Hague Int'l Filing Date |
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DM/103810 | Oct 12, 2018 | Apr 12, 2019 | Oct 12, 2018 |
Current U.S. Class: | D13/180 |
Current International Class: | 1303 |
Field of Search: | ;D10/106.1,114.4 ;D13/180,182 ;D26/2,25,35,74,80,81 |
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