Earphone
Long Feb
U.S. patent number D875,711 [Application Number D/668,498] was granted by the patent office on 2020-02-18 for earphone. This patent grant is currently assigned to Dongguan City YongSheng electronics CO., LTD.. The grantee listed for this patent is Dongguan City YongSheng electronics CO., LTD.. Invention is credited to Fei Long.
| United States Patent | D875,711 |
| Long | February 18, 2020 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and described.
| Inventors: | Long; Fei (Dongguan, CN) | ||||||||||
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| Applicant: |
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| Assignee: | Dongguan City YongSheng electronics
CO., LTD. (Dongguan, CN) |
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| Appl. No.: | D/668,498 | ||||||||||
| Filed: | October 31, 2018 |
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/205,206,226,372 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,374 ;455/90.3,575.1,569.1 |
References Cited [Referenced By]
U.S. Patent Documents
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| D853988 | July 2019 | Wang |
| D856969 | August 2019 | Tang |
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| D866515 | November 2019 | Long |
| 2017/0019728 | January 2017 | Cochran |
| 303190057 | Apr 2015 | CN | |||
Attorney, Agent or Firm: ScienBiziP, P.C.
Description
FIG. 1 is a first perspective view of an earphone, showing my design.
FIG. 2 is a second perspective view of the earphone.
FIG. 3 is a front elevation view of the earphone.
FIG. 4 is a rear elevation view of the earphone.
FIG. 5 is a left side elevation view of the earphone.
FIG. 6 is a right side elevation view of the earphone.
FIG. 7 is a top plan view of the earphone; and,
FIG. 8 is a bottom plan view of the earphone.
The broken lines immediately adjacent the surface shading represents the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.
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