U.S. patent number D864,157 [Application Number D/698,081] was granted by the patent office on 2019-10-22 for headphone.
This patent grant is currently assigned to SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD. The grantee listed for this patent is SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD. Invention is credited to Zaihui Hu.
United States Patent |
D864,157 |
Hu |
October 22, 2019 |
Headphone
Claims
CLAIM The ornamental design for a headphone, as shown and
described.
Inventors: |
Hu; Zaihui (Shenzhen,
CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN QIANHAI PATUOXUN NETWORK AND TECHNOLOGY CO., LTD |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
SHENZHEN QIANHAI PATUOXUN NETWORK
AND TECHNOLOGY CO., LTD (Shenzhen, CN)
|
Appl.
No.: |
D/698,081 |
Filed: |
July 15, 2019 |
Current U.S.
Class: |
D14/206;
D14/226 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/206,226,372,218,433,138R ;D5/58,62 ;D29/112 ;2/209
;181/129,130,135 ;379/430,431 ;381/380,381,374,375
;455/90.3,575.1,569.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
004530848-0001 |
|
Dec 2017 |
|
EM |
|
Other References
"Letton L1 Camouflage Headset fur Gaming-Kopfhorer/Gaming-Kopfhorer
mit Mikrofon fur PS4, PC, Handy, Xbox One Tablet Gaming Headphones
1", Retrieved Jul. 15, 2019]. Retrieved from Internet,
https://www.amazon.de/Camouflage-Headset-Gaming-KopfhC3%B6rer-Mikrofon-He-
adphonesi/dp/B07QDWHJVR/. cited by applicant .
"Kinderkopfhorer mit Lautstarkebegrenzung (max. 90db), Headphone
fur Kinder, Kopfhorer mit absoluter Vorbeugung gegen Gehorschaden,
Keine schadhaften Materiallen fur Kinder", Retrieved Jul. 15,
2019]. Retrieved from Internet,
https://www.amazon.de/Kinderkopfh%C3%B6rer-Lautst%C3%A4rkebegrenzung-Geh%-
C3%B6rsch%C3%A4den-schadhaften-Materialien/dp/B00NXZBGRA/. cited by
applicant.
|
Primary Examiner: Greene; Paula Allen
Description
FIG. 1 is a perspective view of a headphone showing my new
design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
FIG. 9 is an enlarge view of portion 9 shown in FIG. 1; and,
FIG. 10 is an enlarge view of portion 10 shown in FIG. 1.
The broken lines in the drawings depict portions of the headphone
that form no part of the claimed design.
* * * * *
References