Headset

Skinner , et al. A

Patent Grant D857657

U.S. patent number D857,657 [Application Number D/638,424] was granted by the patent office on 2019-08-27 for headset. This patent grant is currently assigned to Hewlett-Packard Development Company, L.P.. The grantee listed for this patent is Hewlett-Packard Development Company, L.P.. Invention is credited to Siddhartha Bhat, Kevin L. Massaro, David N. Skinner, Glenn A. Wong.


United States Patent D857,657
Skinner ,   et al. August 27, 2019

Headset

Claims

CLAIM The ornamental design for a headset, as shown and described.
Inventors: Skinner; David N. (Palo Alto, CA), Bhat; Siddhartha (Palo Alto, CA), Wong; Glenn A. (Houston, TX), Massaro; Kevin L. (Houston, TX)
Applicant:
Name City State Country Type

Hewlett-Packard Development Company, L.P.

Houston

TX

US
Assignee: Hewlett-Packard Development Company, L.P. (Spring, TX)
Appl. No.: D/638,424
Filed: February 27, 2018

Current U.S. Class: D14/206; D14/226
Current International Class: 1401
Field of Search: ;D14/206,226,188,192,372 ;D29/112 ;2/209 ;181/129,130,135 ;379/430,431 ;381/380,381,374 ;455/90.3,575.1,569.1 ;345/7,8

References Cited [Referenced By]

U.S. Patent Documents
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Other References

Peak, S., Logitech Artemis Spectrum G933/G633 Headset Review, (Research Paper), Feb. 23, 2016. cited by applicant .
Enhance GX-H3 Computer Gaming Headset Microphone & In-Line Controls--Over Ear Design, Plush Earpads & Headband, & 3.5mm AUX--Great for League of Legends , PUBG , & More, (Research Paper), Jul. 26, 2017. cited by applicant .
Corden, J., Astro A50 (2016) wireless gaming headset review: life without wires is simply better, (Research Paper), Dec. 5, 2016. cited by applicant .
Acevedo, P., Corsair Void SE Wireless Gaming Headset Review, (Research Paper), Sep. 10, 2015. cited by applicant.

Primary Examiner: Greene; Paula Allen
Attorney, Agent or Firm: Morgan Lewis & Bockius

Description



FIG. 1 is a front perspective view of an embodiment of a headset in accordance with our new design;

FIG. 2 is a front elevational view of the headset shown in FIG. 1;

FIG. 3 is a rear elevational view of the headset shown in FIG. 1;

FIG. 4 is a right-side elevational view of the headset shown in FIG. 1;

FIG. 5 is a left-side elevational view of the headset shown in FIG. 1;

FIG. 6 is a top plan view of the headset shown in FIG. 1;

FIG. 7 is a bottom plan view of the headset shown in FIG. 1; and,

FIG. 8 is a front perspective view of the headset shown in FIG. 1 with the microphone boom in a lowered position.

The broken lines immediately adjacent the shaded area represent the bounds of the claimed design while all other broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.

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Patent Diagrams and Documents

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